CN105958957B - A kind of crystal resonator and preparation method thereof - Google Patents
A kind of crystal resonator and preparation method thereof Download PDFInfo
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- CN105958957B CN105958957B CN201610269246.8A CN201610269246A CN105958957B CN 105958957 B CN105958957 B CN 105958957B CN 201610269246 A CN201610269246 A CN 201610269246A CN 105958957 B CN105958957 B CN 105958957B
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- 239000013078 crystal Substances 0.000 title claims abstract description 228
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 230000010355 oscillation Effects 0.000 claims abstract description 143
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 29
- 241000826860 Trapezium Species 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 239000002178 crystalline material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 239000010453 quartz Substances 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 230000000694 effects Effects 0.000 description 16
- 230000035882 stress Effects 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000010358 mechanical oscillation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a kind of crystal resonators and preparation method thereof.The crystal resonator includes：Crystal oscillation chip and fixing device, wherein：Wafer orientation block structure is provided on the edge of crystal oscillation chip, the wafer orientation notch with crystal location structure Block- matching is provided in fixing device, by the way that wafer orientation block structure to be positioned in wafer orientation notch, being connected between crystal oscillation chip and fixing device is realized.Compared with the prior art, wafer orientation block structure is increased in crystal oscillation chip architecture in crystal resonator provided by the invention, and wafer orientation notch is correspondingly devised on the securing means, pass through the wafer orientation block structure and wafer orientation notch, realize being connected between crystal oscillation chip and fixing device, when solving the prior art and being fixed crystal oscillation chip and pedestal using conducting resinl, the problem that causes the working performance of crystal resonator relatively low due to the stress that the adhesive attraction of conducting resinl generates on crystal oscillation chip.
Description
Technical field
The present invention relates to electronic technology fields more particularly to a kind of crystal resonator and preparation method thereof.
Background technology
Currently, since quartz-crystal resonator can provide stable clock signal, can be applied to much lead
In domain, for example, computer, space flight, satellite positioning, TV, radio etc. utilize quartz-crystal resonator to provide clock signal.
Common quartz-crystal resonator includes the components such as quartz crystal oscillation chip, pedestal and shell, wherein quartz crystal
Oscillation chip is connected with pedestal by conducting resinl, i.e., quartz crystal is shaken by smearing conducting resinl on quartz oscillation chip
Chip is swung to be fixed on pedestal.
The operation principle of quartz-crystal resonator is realized using the piezoelectric effect of quartz crystal, piezoelectric effect here
It specifically refers to：Mechanical strain is generated on quartz crystal oscillation chip using mechanical means (stretching, compression etc.), so that brilliant
Internal portion generates polarization phenomena；It in turn, can also be by the way that electric field be added in the polarization direction in crystal, so that quartzy
Mechanical strain is generated on crystal oscillation chip.
The method that quartz crystal oscillation chip is connected with pedestal by conducting resinl by the prior art, operating procedure is more
Simply, it is convenient to be brought really to user.But when conducting resinl is held in the mouth quartz crystal oscillation chip and pedestal by adhesive attraction
When connecing, the adhesive attraction of conducting resinl can form internal stress on quartz crystal oscillation chip, and the internal stress can influence quartz-crystal
The piezoelectric effect of oscillation body chip causes the frequency of oscillation of chip to change；In addition, the adhesive attraction of conducting resinl equally also can
Stress is formed on pedestal, so that stress deformation occurs for the pedestal, which, can be to quartz because wanting recovery stress deformation
Crystal oscillation chip generates stress, also the frequency of oscillation of chip can be made to change, reduce the work of crystal resonator
Make performance.
Invention content
In view of the above problems, the present invention provides a kind of crystal resonators, and conducting resinl is utilized in the prior art for solving
Crystal oscillation chip is connected with pedestal, the problem for causing the working performance of crystal resonator relatively low.
A kind of crystal resonator, including：Crystal oscillation chip and fixing device, wherein：
It is provided with wafer orientation block structure on the edge of the crystal oscillation chip, is provided in the fixing device and institute
The wafer orientation notch for stating crystal location structure Block- matching, by the way that the wafer orientation block structure is positioned over the wafer orientation
In notch, being connected between the crystal oscillation chip and the fixing device is realized.
Preferably, the quantity of the crystal location structure block is four, and four crystal location structure block distinguishes position
In in two vertical direction in the crystal oscillation chip center of circle excessively.
Preferably, the shape of the crystal location structure block be trapezium structure, and the bottom of the trapezium structure with it is described
Crystal oscillation Waffer edge is connected.
Preferably, the bottom of the trapezium structure is connected with the crystal oscillation Waffer edge, wherein linking part is corresponding
The edge angle of the crystal oscillation chip is more than or equal to 5 degree, and is less than or equal to 45 degree.
Preferably, the fixing device includes：Top electrode and lower electrode, wherein：
The top electrode, for suppressing the crystal oscillation chip in the lower electrode；
The lower electrode, for carrying the crystal oscillation chip.
Preferably, the lower electrode is provided with wafer orientation notch, then the top electrode is by the crystal oscillation chip pressure
It is formed on the lower electrode and specifically includes：
Crystal location structure block in the crystal oscillation chip is suppressed the crystalline substance in the lower electrode by the top electrode
In piece locating notch.
Preferably, the top electrode is provided with top electrode locating notch and the lower electrode is provided with lower electrode positioning
Step, the lower electrode positioning step linking corresponding with the top electrode locating notch.
Preferably, lower electrode positioning step linking corresponding with the top electrode locating notch specifically includes：
The lower electrode positioning step is fixed with the top electrode locating notch using positioning fixture and is connected.
Preferably, the fixing device further includes pedestal, and by the electrode leads to client phase of the pedestal and the top electrode
Even.
A kind of preparation method of crystal resonator, including：
Crystalline material is processed according to preset size, obtains crystal oscillation chip, the crystal oscillation chip
Wafer orientation block structure is provided on edge；
The crystal oscillation chip is connected with fixing device, wherein be provided in the fixing device with it is described
The wafer orientation notch of crystal location structure Block- matching is lacked by the way that the wafer orientation block structure is positioned over the wafer orientation
In mouthful, being connected between the crystal oscillation chip and the fixing device is realized.
The present invention provides a kind of crystal resonator, which includes crystal oscillation chip and fixing device,
In, it is provided with wafer orientation block structure on the edge of the crystal oscillation chip, is provided in the fixing device and is positioned with the crystal
The matched wafer orientation notch of block structure, by the way that the wafer orientation block structure to be positioned in the wafer orientation notch, realizing should
Being connected between crystal oscillation chip and fixing device.Crystal oscillation chip in crystal resonator provided by the invention, is compared
In crystal oscillation chip in the prior art, wafer orientation block structure is increased, and correspondingly devise on the securing means
Wafer orientation notch realizes crystal oscillation chip and is filled with fixed using the crystal location structure block and the wafer orientation notch
Linking between setting, when solving the prior art and being fixed crystal oscillation chip and pedestal using conducting resinl, due to conducting resinl
The problem that the stress that adhesive attraction generates on crystal oscillation chip causes the working performance of crystal resonator relatively low.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and constitutes the part of the present invention, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is a kind of structural schematic diagram of crystal oscillation chip in the prior art provided by the invention；
Fig. 2 is a kind of structural schematic diagram of crystal resonator in the prior art provided by the invention；
Fig. 3 is a kind of structural schematic diagram of the positive oscillation chip of crystal provided by the invention；
Fig. 4 is a kind of structural schematic diagram of the positive oscillation chip of crystal provided by the invention；
Fig. 5 is a kind of structural schematic diagram of crystal resonator provided by the invention；
Fig. 6 is the structural schematic diagram of the fixing device in a kind of crystal resonator provided by the invention；
Fig. 7 is a kind of flow diagram making chip resonator provided by the invention.
Specific implementation mode
Stated in the background, the operation principle of quartz-crystal resonator is mainly to be imitated using the piezoelectricity of quartz crystal
It answers, piezoelectric effect here had both included direct piezoelectric effect and reversed piezoelcetric effect.Specifically, direct piezoelectric effect refers to：Crystal exists
When being generated stress deformation by the effect of external force along certain direction, the inside of the crystal will generate polarization phenomena, simultaneously
Positive and negative opposite charge is formed on two opposite surfaces of crystal；When effect disappears with the external force on crystal, the crystal
It will restore uncharged state.Reversed piezoelcetric effect refers to：When giving crystal additional polarizing electric field in polarization direction, so that the crystalline substance
Body deforms upon；When the polarized electric field disappears, which will restore deformation.
It follows that the effect of applied force on the crystal in crystal resonator, it will influence the work of crystal resonator
Performance, and when quartz crystal oscillation chip of the prior art in fixed resonator and fixing device, it usually will using conducting resinl
Quartz crystal oscillation chip is adhered to each other with fixing device, is as shown in Figure 1 crystal oscillation chip usually used at present, figure
2 show the schematic diagram that crystal oscillation chip is fixed on pedestal by the prior art, wherein：110 be crystal oscillation chip, and 120 are
Pedestal, 130 be the stationary fixture of fixed crystal oscillation chip 110 and pedestal 120, and 140 be conducting resinl, is used for crystal oscillation
Chip 110 and 120 secure adhesion of pedestal.
Since the adhesive attraction power of conducting resinl 140 can generate crystal oscillation chip 110 effect of additional stress, in addition,
Conducting resinl 140 equally can also generate pedestal 120 effect of additional stress so that stress deformation occurs for pedestal 120, because of substrate
120 will restore the stress deformation, will generate a stress again to crystal oscillation chip 110.And generate this two additional answer
Force effect reduces the working performance of crystal resonator.In addition, because conducting resinl 140 is coated directly on chip oscillation chip 110,
So can be polluted to crystal oscillation chip 110, in this way, accelerating the aging speed of crystal oscillation chip 110, that is, shorten
Service life of crystal resonator.
In view of the above-mentioned problems, the present invention provides a kind of crystal resonators.To make the purpose of the present invention, technical solution and excellent
Point is clearer, is carried out to technical solution of the present invention below in conjunction with the specific embodiment of the invention and corresponding attached drawing clear, complete
Site preparation describes.Obviously, described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Below in conjunction with attached drawing, the technical solution for offer that the present invention will be described in detail.
The present invention provides a kind of crystal resonators, specifically include：Crystal oscillation chip and fixing device, wherein described
It is provided with wafer orientation block structure on the edge of crystal oscillation chip, is provided with to position with the crystal in the fixing device and tie
The matched wafer orientation notch of building block is realized by the way that the wafer orientation block structure to be positioned in the wafer orientation notch
Being connected between the crystal oscillation chip and the fixing device.
Specifically, the structure of crystal oscillation chip provided by the invention is as shown in figure 3, crystal in compared with the prior art
The edge of oscillation chip structure 110, crystal oscillation chip 210 provided by the invention is provided with wafer orientation block structure 211, the crystalline substance
The effect of piece location structure block 211 is：Crystal oscillation chip 210 is connected with fixing device.
In practical applications, the quantity of the wafer orientation block structure 211 is two or more, but in order to more securely
Fixation crystal oscillation chip 210, four wafer orientation block structures 211 may be used and fix crystal oscillation chips 210, and this four
A wafer orientation block structure 211 is located in two vertical direction of the crystal oscillation chip 210.
Being illustrated in figure 4 tool, there are four the crystal of wafer orientation block structure 211 (wafer orientation block structure A, B, C and D) to shake
Swing chip 210, wherein the line between wafer orientation block structure A and C in this four wafer orientation block structures 211, Yi Jijing
Line between piece location structure block B and D crosses the center of circle of crystal oscillation chip 210, and this two line is mutually perpendicular to.In this way
The purpose of design is：Four crystal location structure blocks 211 can be balanced fixation crystal oscillation chip 210 so that crystal oscillation
Chip 210 is more firmly connected with fixing device.
Moreover, there are many kinds of the shapes of wafer orientation block structure 211 provided by the invention, for example, crystal shown in Fig. 4 is fixed
The shape of bit architecture block 211 is trapezoidal, and the edge of the bottom and crystal oscillation chip 210 of the trapezoidal crystal location structure block
Linking.And linking part corresponds to the edge angle of crystal oscillation chip 210 more than or equal to 5 degree, and it is less than or equal to 45 degree.
As the angles θ in Fig. 4 are：Linking part between crystal location structure block 211 and crystal oscillation chip 210 is corresponding brilliant
The edge angle of oscillation body chip 210.The edge angle that above-mentioned linking part corresponds to crystal oscillation chip 210 is designed to be more than or equal to 5
The reason of spending be：If it is less than 5 degree, it may cause crystal location structure block 211 that can not steadily fix crystal oscillation chip
210；The edge angle that above-mentioned linking part corresponds to crystal oscillation chip 210 is designed to that the reason of being less than or equal to 45 degree is：If big
In 45 degree, other negative effects may be brought, the reason is that：Here crystal location structure block 211 be for fixing device into
Row linking, the i.e. size of crystal location structure block 211 only need that crystal oscillation chip 210 is allowed to fix with fixing device, such as
Fruit crystal location structure block 211 designs too big, crystal oscillation chip can be hindered to do mechanical oscillation, to influence crystal resonator
Frequency of oscillation.
Fig. 4 is only exemplary the structure for illustrating crystal oscillation chip 210, in practical applications, wafer orientation block structure
211 number, wafer orientation block structure 211 crystal oscillation chip 210 distributing position and wafer orientation block structure 211
Shapes and sizes, can be adjusted according to actual needs, for example, can also using three wafer orientation block structures 211
It realizes and crystal oscillation chip 210 etc. is firmly fixed relatively.
Crystal oscillation chip (such as Fig. 1) in compared with the prior art, the shape of crystal oscillation chip provided by the invention
Changed, correspondingly, the fixing device of fixed crystal oscillation chip will also change, specifically, on the securing means
Be designed with the matched wafer orientation notch of wafer orientation block structure in crystal oscillation chip, by will be in crystal oscillation chip
Wafer orientation block structure be positioned in the wafer orientation notch, to realize between the crystal oscillation chip and fixing device
Linking.
Fixing device provided by the invention also there are many kinds of, illustratively illustrate one of which fixing device here, specifically
It is as follows：
The structure of fixing device provided by the invention is as shown in figure 5, specifically include：Top electrode 410 and lower electrode 420,
In：The top electrode 410, for suppressing the crystal oscillation chip in the lower electrode；The lower electrode 420, is used for
Carry the crystal oscillation chip.
Equally, top electrode 410 and the design method of lower electrode 420 also can there are many kinds of, for example, in a kind of embodiment
In, it is provided with wafer orientation notch on the lower electrode 420, then top electrode suppresses crystal location structure block 211 in the lower electrode
In crystal locating notch in.
In another embodiment, lower electrode 420 is provided with lower electrode positioning step, and top electrode 410, which is provided with, to be powered on
Pole locating notch, lower electrode positioning step linking corresponding with top electrode locating notch.Specifically, in order to steadily make lower electrode fixed
Position step is connected with top electrode locating notch, and positioning fixture can be utilized lower electrode and the fixation of top electrode locating notch etc..
In another embodiment, lower electrode 420 had not only included wafer orientation notch, but also included lower electrode positioning table
Rank, correspondingly, top electrode 410 include the top electrode locating notch being mutually linked with lower electrode positioning step.
In addition, top electrode 410 and lower electrode 420 must also meet conductive principle, therefore can be set in top electrode 410
It is equipped with upper electrode metal film, and is provided with lower electrode metal film on lower electrode 420.
Illustratively illustrate that the structure of lower electrode 420, the lower electrode 420 are specifically included below by Fig. 6：Lower electrode lining
Bottom 421, lower electrode positioning step 422, lower electrode wafer locating notch 423, lower electrode substrate film slot 424 and lower electrode metal film
425, wherein lower electrode substrate 421 is for carrying crystal oscillation chip 210, and lower electrode positioning step 422 is used for and top electrode
The locating notch of 410 top electrode is connected, and lower electrode wafer locating notch 423 is used to dispose the crystalline substance in crystal oscillation chip 210
Piece location structure block 211, lower electrode substrate film slot 424 be used for dispose make in crystal oscillation chip 210 vibration motion part, under
Electrode metal film 425 is for conduction.
Three of the above embodiment is only exemplary the structure for illustrating top electrode 410 and lower electrode 420, in practical application
In, according to the crystal oscillation chip architecture of design, the fixing device for fixing the crystal oscillation chip is correspondingly designed, this
In the structure of fixing device is not construed as limiting.
After fixing crystal oscillation chip 210 using top electrode 410 and lower electrode 420, pedestal, the pedestal can be added
For carrying the crystal oscillation chip and upper and lower electrode.Specifically, mode for dispensing glue may be used by the electrode of top electrode 410
Exit is connected with pedestal, wherein specific location for dispensing glue meets the requirement of support chip；Here by top electrode 410 and pedestal
It is connected using dispensing mode, when can be to avoid utilizing conducting resinl directly to fix crystal oscillation chip and pedestal in the prior art,
The problem for causing the working performance of crystal resonator relatively low due to the adhesive attraction of conducting resinl.
After the making for completing crystal resonator, which is added peripheral circuit, is led in peripheral circuit
After electric current, electric current is transmitted to crystal oscillation chip by the upper and lower pole in crystal resonator, electric field is formed, to excite crystal oscillation
Chip generates mechanical oscillation.
Correspondingly, the present invention also provides a kind of preparation method of crystal resonator, this method includes：
Crystalline material is processed according to preset size, obtains crystal oscillation chip, the crystal oscillation chip
Wafer orientation block structure is provided on edge；The crystal oscillation chip is connected with fixing device, wherein the fixation
The wafer orientation notch with the crystal location structure Block- matching is provided on device, by putting the wafer orientation block structure
It is placed in the wafer orientation notch, realizes being connected between the crystal oscillation chip and the fixing device.
The preparation process in the crystal resonator in detail will be illustrated below, specific make step such as Fig. 7 institutes
Show, including：
Step S501：Prepare crystal oscillation chip.
Specifically, quartz crystal materials are cut from angle, size, thickness and radian etc. as requested,
The operations such as grinding and polishing, after the completion of to be cut, quartz crystal oscillation chip is put into culture dish for use.
Step S502：Prepare crystal location structure block.
Specifically, according to the structure of the quartz wafer after step S501 cuttings, design and the matched crystal of the quartz wafer
Location structure block, the mode that laser cutting may be used here are required to be processed crystal location structure block, be obtained according to size
The crystal oscillation chip with wafer orientation block structure is obtained, and the crystal oscillation chip is put into culture dish for use.
Step S503：Clean crystal oscillation chip and fixing device.
In step, the first step：Cleaning solution is added in the culture dish equipped with crystal oscillation chip, and is put into ultrasonic cleaning
Carry out ultrasonic cleaning in machine, when cleaning a length of 1~2min, or carry out sets itself scavenging period as needed；Second step：It waits for
It after crystal oscillation wafer cleaning, will be placed on electric furnace and be heated to after cleaning solution comes to life using supersonic cleaning machine, turn off electricity
Stove power supply makes crystal oscillation chip natural cooling；Third walks：Cleaning solution in culture dish is outwelled, is contained in usual cleaning solution
At this moment the surface of other basic solvent cleaning crystal oscillation chips such as sodium hydroxide solution may be used, to cleaning in acid flux material
Acid flux material in liquid is neutralized；4th step：Electroded crystal oscillation chip is filled with fixed with the pure water after boiling
(top electrode, lower electrode and pedestal) is set to be rinsed, then, then it is de- to crystal oscillation chip and fixing device with absolute ethyl alcohol
Water, finally, electricity consumption baking oven are dry.
Step S504：Crystal oscillation chip and fixing device are mounted to crystal resonator.
In step, first, by after cleaning crystal oscillation chip and fixing device be positioned over convenient on the position that picks and places,
It wears the upper and lower electrode of fingerstall taking-up to be put into culture dish, is used in combination clean tweezers to take out crystal oscillation chip and is put into lower electrode, have
Body, the wafer orientation block structure in crystal oscillation chip is placed in the wafer orientation notch of lower electrode；Then, in taking-up
Electrode and the top that top electrode is placed on to crystal oscillation chip so that the positioning step in lower electrode is placed in top electrode
In locating notch so that upper and lower contact conductor is parallel but misaligned, and utilizes positioning fixture by the locating notch of top electrode under
Electrode is fixed；Finally, it is packed into pedestal, specifically the electrode leads to client of top electrode can be made to be connected with the holder in pedestal, and even
Connect place's dispensing processing.
After fixing crystal oscillation chip and fixing device, the crystal resonator fixed is put into baking oven and is dried
Roasting processing so that the connection of entire crystal resonator is more secured.
The preparation process of above-mentioned crystal oscillator is only exemplary explanation, in practical applications, according to the crystal of design
The structure of oscillator can adjust the preparation method of crystal oscillator, not limit specifically the preparation method of crystal oscillator here
It is fixed.
The present invention provides a kind of crystal resonator, which includes crystal oscillation chip and fixing device,
In, it is provided with wafer orientation block structure on the edge of the crystal oscillation chip, is provided in the fixing device and is positioned with the crystal
The matched wafer orientation notch of block structure, by the way that the wafer orientation block structure to be positioned in the wafer orientation notch, realizing should
Being connected between crystal oscillation chip and fixing device.Crystal oscillation chip in crystal resonator provided by the invention, is compared
In crystal oscillation chip in the prior art, wafer orientation block structure is increased, and correspondingly devise on the securing means
Wafer orientation notch realizes crystal oscillation chip and is filled with fixed using the crystal location structure block and the wafer orientation notch
Linking between setting, when solving the prior art and being fixed crystal oscillation chip and pedestal using conducting resinl, due to conducting resinl
The problem that the stress that adhesive attraction generates on crystal oscillation chip causes the working performance of crystal resonator relatively low.
Example the above is only the implementation of the present invention is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.It is all within spirit and principles of the present invention made by any modification, equivalent
Replace, improve etc., it should be included within scope of the presently claimed invention.
Claims (6)
1. a kind of crystal resonator, which is characterized in that including：
Crystal oscillation chip and fixing device, wherein：
It is provided with wafer orientation block structure on the edge of the crystal oscillation chip, is provided in the fixing device and the crystalline substance
The wafer orientation notch of piece location structure Block- matching, by the way that the wafer orientation block structure is positioned over the wafer orientation notch
In, realize being connected between the crystal oscillation chip and the fixing device；
The fixing device includes：Top electrode and lower electrode, wherein：
The lower electrode is provided with wafer orientation notch, the top electrode will be described for carrying the crystal oscillation chip
Wafer orientation block structure in crystal oscillation chip is suppressed in the wafer orientation notch in the lower electrode；
The top electrode is provided with top electrode locating notch, and the lower electrode is provided with lower electrode positioning step, utilizes locating clip
The lower electrode positioning step is fixed tool with the top electrode locating notch is connected.
2. crystal resonator according to claim 1, which is characterized in that
The quantity of the wafer orientation block structure is four, and four wafer orientation block structures were located at the crystal
In two vertical direction in the oscillation chip center of circle.
3. crystal resonator according to claim 1, which is characterized in that
The shape of the wafer orientation block structure is trapezium structure, and the bottom of the trapezium structure and the crystal oscillation chip
Edge junction.
4. crystal resonator according to claim 3, which is characterized in that
The bottom of the trapezium structure is connected with the crystal oscillation Waffer edge, wherein the corresponding crystal in linking part shakes
The edge angle for swinging chip is more than or equal to 5 degree, and is less than or equal to 45 degree.
5. according to claim 1-4 any one of them crystal resonators, which is characterized in that
The fixing device further includes pedestal, and the pedestal is connected with the electrode leads to client of the top electrode.
6. a kind of preparation method of crystal resonator as described in any one in claim 1-5, which is characterized in that including：
Crystalline material is processed according to preset size, obtains crystal oscillation chip, the edge of the crystal oscillation chip
On be provided with wafer orientation block structure；
The crystal oscillation chip is connected with fixing device, wherein be provided in the fixing device and the chip
The wafer orientation notch of location structure Block- matching, by the way that the wafer orientation block structure is positioned over the wafer orientation notch
In, realize being connected between the crystal oscillation chip and the fixing device.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326266A (en) * | 2000-05-26 | 2001-12-12 | 威廉·比华 | Surface mount quartz crystal resonator and manufacturing method |
| CN202841076U (en) * | 2012-09-25 | 2013-03-27 | 铜陵晶越电子有限公司 | High fundamental frequency quartz-crystal resonator |
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| JP2009188718A (en) * | 2008-02-06 | 2009-08-20 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326266A (en) * | 2000-05-26 | 2001-12-12 | 威廉·比华 | Surface mount quartz crystal resonator and manufacturing method |
| CN202841076U (en) * | 2012-09-25 | 2013-03-27 | 铜陵晶越电子有限公司 | High fundamental frequency quartz-crystal resonator |
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