CN105958957A - Crystal resonator and preparation method thereof - Google Patents
Crystal resonator and preparation method thereof Download PDFInfo
- Publication number
- CN105958957A CN105958957A CN201610269246.8A CN201610269246A CN105958957A CN 105958957 A CN105958957 A CN 105958957A CN 201610269246 A CN201610269246 A CN 201610269246A CN 105958957 A CN105958957 A CN 105958957A
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- wafer
- crystal
- crystal oscillation
- fixing device
- bottom electrode
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a crystal resonator and preparation method thereof. The crystal resonator comprises a crystal oscillation wafer and a fixing device wherein the edge of the crystal oscillation wafer is provided with a structure block for crystal wafer positioning, and the fixing device is provided with a wafer positioning notch matching the structure block for crystal wafer positioning. Through the placement of the structure block for crystal wafer positioning into the wafer positioning notch, a connection between the crystal oscillation wafer and the fixing device can be realized. Compared to the prior art, the crystal resonator of the invention is added by a structure block for crystal wafer positioning in a crystal oscillation wafer and a wafer positioning notch matching the structure block on a fixed device correspondingly. With the positioning notch, the crystal oscillation wafer and the fixing device can be connected so as to solve the problem that the workability of the crystal resonator is relatively low due to the stress generated on the crystal oscillation wafer by the adhesion effect of the conductive adhesive when the crystal oscillation wafer is fixed with the base through the use of conductive adhesive in the prior art.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of crystal resonator and preparation method thereof.
Background technology
At present, owing to quartz-crystal resonator can provide stable clock signal, therefore can be applied to
In a lot of fields, such as, computer, space flight, satellite fix, TV, radio etc. all utilize quartz-crystal
Body resonator provides clock signal.
Conventional quartz-crystal resonator comprises the parts such as quartz crystal oscillation chip, pedestal and shell, wherein,
Quartz crystal oscillation chip is connected by conducting resinl with pedestal, i.e. by smearing on quartz oscillation chip
Quartz crystal oscillation chip is fixed on pedestal by conducting resinl.
The operation principle of quartz-crystal resonator is that the piezoelectric effect utilizing quartz crystal realizes, pressure here
Electrical effect specifically refers to: use mechanical means (stretch, compression etc.) to produce on quartz crystal oscillation chip
Mechanical strain, so that crystals produces polarization phenomena；In turn, it is also possible to by crystal
Electric field is added, so that produce mechanical strain on quartz crystal oscillation chip in polarised direction.
Quartz crystal oscillation chip is carried out the method being connected, operation step by prior art with pedestal by conducting resinl
The most relatively simple, it is convenient really to bring to user.But, when conducting resinl by adhesive attraction by quartz-crystal
When oscillation body wafer is connected with pedestal, in the adhesive attraction of conducting resinl can be formed on quartz crystal oscillation chip
Stress, and this internal stress can affect the piezoelectric effect of quartz crystal oscillation chip, causes the frequency of oscillation of wafer
Change；It addition, the adhesive attraction of conducting resinl the most also can form stress on pedestal, so that should
Pedestal generation stress deformation, quartz crystal oscillation chip, because wanting recovery stress deformation, can be produced by this pedestal
Stress effect, also can make the frequency of oscillation of wafer change, reduce the service behaviour of crystal resonator.
Summary of the invention
In view of the above problems, the invention provides a kind of crystal resonator, be used for solving prior art utilizes
Crystal oscillation wafer is connected by conducting resinl with pedestal, causes relatively low the asking of service behaviour of crystal resonator
Topic.
A kind of crystal resonator, including: crystal oscillation wafer and fixing device, wherein:
It is provided with wafer orientation block structure on the edge of described crystal oscillation wafer, described fixing device is arranged
Have and the wafer orientation breach of described crystal location structure Block-matching, by described wafer orientation block structure is put
It is placed in described wafer orientation breach, it is achieved being connected between described crystal oscillation wafer and described fixing device.
Preferably, the quantity of described crystal location structure block is four, and described four crystal location structure blocks
Laid respectively in two vertical direction in the described crystal oscillation wafer center of circle.
Preferably, described crystal location structure block be shaped as trapezium structure, and the going to the bottom of described trapezium structure
It is connected with described crystal oscillation Waffer edge.
Preferably, going to the bottom of described trapezium structure is connected with described crystal oscillation Waffer edge, wherein, and linking
The edge angle of the most corresponding described crystal oscillation wafer is more than or equal to 5 degree, and less than or equal to 45 degree.
Preferably, described fixing device includes: upper electrode and bottom electrode, wherein:
Described upper electrode, for suppressing described crystal oscillation wafer in described bottom electrode；
Described bottom electrode, is used for carrying described crystal oscillation wafer.
Preferably, described bottom electrode is provided with wafer orientation breach, and the most described upper electrode is by described crystal oscillation
Wafer is suppressed and is specifically included on described bottom electrode:
Crystal location structure block in described crystal oscillation wafer is suppressed in described bottom electrode by described upper electrode
In wafer orientation breach in.
Preferably, described upper electrode is provided with electrode locating notch, and described bottom electrode is provided with lower electricity
Pole positioning step, the linking corresponding with described upper electrode locating notch of described bottom electrode positioning step.
Preferably, the linking corresponding with described upper electrode locating notch of described bottom electrode positioning step specifically includes:
Utilize positioning fixture that described bottom electrode positioning step and described upper electrode locating notch are fixed rank
Connect.
Preferably, described fixing device also includes pedestal, and is drawn by the electrode of described pedestal with described upper electrode
Go out end to be connected.
A kind of preparation method of crystal resonator, including:
According to default size, crystalline material is processed, obtains crystal oscillation wafer, described crystal oscillation
Wafer orientation block structure it is provided with on the edge of wafer；
Described crystal oscillation wafer is connected with fixing device, wherein, described fixing device is provided with
With the wafer orientation breach of described crystal location structure Block-matching, by by described wafer orientation block structure place
In described wafer orientation breach, it is achieved being connected between described crystal oscillation wafer and described fixing device.
The invention provides a kind of crystal resonator, this crystal resonator includes crystal oscillation wafer and fixing dress
Put, wherein, the edge of this crystal oscillation wafer is provided with wafer orientation block structure, this fixing device sets
It is equipped with and the wafer orientation breach of this crystal location structure Block-matching, by this wafer orientation block structure is placed
In this wafer orientation breach, it is achieved being connected between this crystal oscillation wafer and fixing device.The present invention carries
Crystal oscillation wafer in the crystal resonator of confession, compared to crystal oscillation wafer of the prior art, increases
Wafer orientation block structure, and the most correspondingly devise wafer orientation breach, utilize this crystalline substance
Body location structure block and this wafer orientation breach, it is achieved that being connected between crystal oscillation wafer and fixing device,
Solve prior art when utilizing conducting resinl crystal oscillation wafer and pedestal to be fixed, due to the adhesion of conducting resinl
Act on the stress produced on crystal oscillation wafer and cause relatively low the asking of service behaviour of crystal resonator
Topic.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the present invention,
The schematic description and description of the present invention is used for explaining the present invention, is not intended that the improper limit to the present invention
Fixed.In the accompanying drawings:
The structural representation of the crystal oscillation wafer a kind of of the prior art that Fig. 1 provides for the present invention；
The structural representation of the crystal resonator a kind of of the prior art that Fig. 2 provides for the present invention；
The structural representation of the positive oscillation chip of a kind of crystal that Fig. 3 provides for the present invention；
The structural representation of the positive oscillation chip of a kind of crystal that Fig. 4 provides for the present invention；
The structural representation of a kind of crystal resonator that Fig. 5 provides for the present invention；
The structural representation of the fixing device in a kind of crystal resonator that Fig. 6 provides for the present invention；
A kind of schematic flow sheet making wafer resonator that Fig. 7 provides for the present invention.
Detailed description of the invention
Stated in the background, the operation principle of quartz-crystal resonator is mainly by the pressure of quartz crystal
Electrical effect, piezoelectric effect here had both included direct piezoelectric effect and reversed piezoelcetric effect.Specifically, positive piezoelectricity
Effect refers to: crystal when being produced stress deformation by the effect of external force along certain direction, this crystal
Inside will produce polarization phenomena, on two relative surfaces of crystal, form positive and negative contrary electric charge simultaneously；
When the external force in effect with crystal disappears, this crystal will recover uncharged state.Reversed piezoelcetric effect refers to:
When in polarised direction to the additional polarizing electric field of crystal so that this crystal deforms upon；When this polarized electric field
During disappearance, this crystal will recover deformation.
It follows that give the effect applying power on the crystal in crystal resonator, it will affect crystal resonator
Service behaviour, and when the quartz crystal oscillation chip that prior art is in fixed resonator and fixing device,
Generally utilize conducting resinl to be adhered to each other with fixing device by quartz crystal oscillation chip, be illustrated in figure 1 mesh
Front normally used crystal oscillation wafer, Fig. 2 show prior art and crystal oscillation wafer is fixed on pedestal
Schematic diagram, wherein: 110 is crystal oscillation wafer, 120 is pedestal, and 130 is fixing crystal oscillation wafer
110 with the stationary fixture of pedestal 120,140 be conducting resinl, is used for crystal oscillation wafer 110 and pedestal
120 secure adhesion.
Adhesive attraction power due to conducting resinl 140 can produce the effect of additional stress to crystal oscillation wafer 110,
It addition, conducting resinl 140 the most also can produce the effect of additional stress to pedestal 120 so that pedestal 120
Raw stress deformation, because substrate 120 to recover this stress deformation, will produce again crystal oscillation wafer 110
One stress effect.And this two additional stresses effect produced reduces the service behaviour of crystal resonator.Separately
Outward, because conducting resinl 140 is coated directly on wafer oscillation chip 110, so can be to crystal oscillation wafer 110
Pollute, so, accelerate the aging speed of crystal oscillation wafer 110, i.e. shortened crystal resonator
Life-span.
For the problems referred to above, the invention provides a kind of crystal resonator.For making the purpose of the present invention, technology
Scheme and advantage are clearer, below in conjunction with the specific embodiment of the invention and corresponding accompanying drawing to skill of the present invention
Art scheme is clearly and completely described.Obviously, described embodiment is only that a part of the present invention is implemented
Example rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
Have and make the every other embodiment obtained under creative work premise, broadly fall into the scope of protection of the invention.
Below in conjunction with accompanying drawing, describe the technical scheme that the present invention provides in detail.
The invention provides a kind of crystal resonator, specifically include: crystal oscillation wafer and fixing device, its
In, the edge of described crystal oscillation wafer is provided with wafer orientation block structure, described fixing device is arranged
Have and the wafer orientation breach of described crystal location structure Block-matching, by described wafer orientation block structure is put
It is placed in described wafer orientation breach, it is achieved being connected between described crystal oscillation wafer and described fixing device.
Specifically, the structure of the crystal oscillation wafer that the present invention provides is as it is shown on figure 3, compared to prior art
In crystal oscillation chip architecture 110, the edge of crystal oscillation wafer 210 that the present invention provides is provided with crystalline substance
Sheet location structure block 211, the effect of this wafer orientation block structure 211 is: by crystal oscillation wafer 210 with
Fixing device is connected.
In actual applications, the quantity of this wafer orientation block structure 211 is two or more, but in order to
Crystal oscillation wafer 210 is more firmly fixed, the fixing crystalline substance of four wafer orientation block structures 211 can be used
Oscillation body wafer 210, and these four wafer orientation block structures 211 are positioned at the two of this crystal oscillation wafer 210
In individual vertical direction.
Be illustrated in figure 4 have four wafer orientation block structures 211 (wafer orientation block structure A, B, C and
D) crystal oscillation wafer 210, wherein, the wafer orientation knot in these four wafer orientation block structures 211
Line between line between building block A and C, and wafer orientation block structure B and D, all crosses crystal
The center of circle of oscillation chip 210, and this two line is mutually perpendicular to.So purpose of design is: four crystal are fixed
The fixing crystal oscillation wafer 210 that bit architecture block 211 can equalize so that crystal oscillation wafer 210 is with solid
Determine device to be more firmly connected.
And, the shape of the wafer orientation block structure 211 that the present invention provides has a variety of, such as, and Fig. 4 institute
Being shaped as of the crystal location structure block 211 shown is trapezoidal, and this trapezoidal crystal location structure block go to the bottom with
The edge junction of crystal oscillation wafer 210.And the edge angle of the corresponding crystal oscillation wafer 210 of linking part is big
In equal to 5 degree, and less than or equal to 45 degree.
As the θ angle in Fig. 4 is: being connected between crystal location structure block 211 and crystal oscillation wafer 210
The edge angle of the corresponding crystal oscillation wafer 210 of part.Above-mentioned linking part correspondence crystal oscillation wafer 210
Edge angle is designed to the reason more than or equal to 5 degree: if less than 5 degree, may cause crystal location structure
Block 211 cannot stably fix crystal oscillation wafer 210；Above-mentioned linking part correspondence crystal oscillation wafer 210
The reason that is designed to less than or equal to 45 degree of edge angle be: if greater than 45 degree, other may be brought negative
Impact, reason is: crystal location structure block 211 here is for being connected with fixing device, i.e. brilliant
The size of body location structure block 211 has only to allow crystal oscillation wafer 210 fix with fixing device, as
Really crystal location structure block 211 design is too big, and crystal oscillation wafer can be hindered to do mechanical vibration, thus shadow
Ring the frequency of oscillation of crystal resonator.
Fig. 4 is the structure of exemplary explanation crystal oscillation wafer 210, and in actual applications, wafer is fixed
The number of bit architecture block 211, wafer orientation block structure 211 at the distributing position of crystal oscillation wafer 210,
And the shapes and sizes of wafer orientation block structure 211, all can be adjusted according to actual needs, such as,
Use three wafer orientation block structures 211 can also realize crystal oscillation wafer 210 etc. is relatively firmly fixed
Deng.
Compared to crystal oscillation wafer (such as Fig. 1) of the prior art, the crystal oscillation wafer that the present invention provides
Shape there occurs change, correspondingly, the fixing device of fixing crystal oscillation wafer also will change, and have
Body ground, is designed with the wafer mated with the wafer orientation block structure in crystal oscillation wafer fixed on the securing means
Position breach, by the wafer orientation block structure in crystal oscillation wafer is positioned in this wafer orientation breach,
Thus realize being connected between this crystal oscillation wafer and fixing device.
The fixing device that the present invention provides also has a variety of, the most exemplary explanation one of which fixing device,
Specific as follows:
The structure of the fixing device that the present invention provides is as it is shown in figure 5, specifically include: upper electrode 410 and lower electricity
Pole 420, wherein: described upper electrode 410, for suppressing described crystal oscillation wafer in described bottom electrode
On；Described bottom electrode 420, is used for carrying described crystal oscillation wafer.
Equally, the design of upper electrode 410 and bottom electrode 420 also has a variety of, such as, in one
In embodiment, this bottom electrode 420 is provided with wafer orientation breach, then goes up electrode by crystal location structure
Block 211 is suppressed in the crystal locating notch in this bottom electrode.
In another embodiment, bottom electrode 420 is provided with bottom electrode positioning step, and upper electrode 410 sets
It is equipped with electrode locating notch, the linking corresponding with upper electrode locating notch of bottom electrode positioning step.Specifically,
In order to stably make bottom electrode positioning step be connected with upper electrode locating notch, it is possible to use under positioning fixture is incited somebody to action
Electrode is fixing with upper electrode locating notch etc..
In another embodiment, bottom electrode 420 had both included wafer orientation breach, included again lower electricity
Pole positioning step, correspondingly, upper electrode 410 includes the upper electrode being mutually linked with bottom electrode positioning step
Locating notch.
It addition, upper electrode 410 and bottom electrode 420 must also meet the principle of conduction, therefore can power on
It is provided with upper electrode metal film on pole 410, and on bottom electrode 420, is provided with bottom electrode metal film.
Below by the structure of explanation bottom electrode 420 exemplary for Fig. 5, this bottom electrode 420 specifically includes:
Bottom electrode substrate 421, bottom electrode positioning step 422, bottom electrode wafer orientation breach 423, bottom electrode substrate
Film groove 424 and bottom electrode metal film 425, wherein, bottom electrode substrate 421 is used for carrying crystal oscillation wafer
210, bottom electrode positioning step 422 is connected for the locating notch of the upper electrode with upper electrode 410, lower electricity
Pole wafer orientation breach 423 is used for disposing the wafer orientation block structure 211 in crystal oscillation wafer 210, under
Electrode substrate film groove 424 makees the part of oscillating movement, bottom electrode gold for disposing in crystal oscillation wafer 210
Belong to film 425 to be used for conducting electricity.
Three of the above embodiment is exemplary explanation above electrode 410 and the structure of bottom electrode 420, in reality
In the application of border, according to the crystal oscillation chip architecture of design, correspondingly design for fixing this crystal oscillation
The fixing device of wafer, is not the most construed as limiting the structure of fixing device.
After crystal oscillation wafer 210 is fixed by electrode 410 and bottom electrode 420 on utilizing, base can be added
Seat, this pedestal is used for carrying this crystal oscillation wafer and upper and lower electrode.Specifically, can use for dispensing glue
The electrode leads to client of upper electrode 410 is connected by mode with pedestal, and wherein, particular location for dispensing glue meets support
The requirement of wafer；Upper electrode 410 uses with pedestal point glue mode be connected here, prior art can be avoided
In when utilizing conducting resinl directly crystal oscillation wafer and pedestal to be fixed, owing to the adhesive attraction of conducting resinl causes
The problem that the service behaviour of crystal resonator is relatively low.
After the making completing crystal resonator, this crystal resonator is added peripheral circuit, when giving peripheral electricity
In road after galvanization, electric current is passed to crystal oscillation wafer by the upper and lower pole in crystal resonator, forms electric field,
Thus excite crystal oscillation wafer to produce mechanical vibration.
Correspondingly, present invention also offers the preparation method of a kind of crystal resonator, the method includes:
According to default size, crystalline material is processed, obtains crystal oscillation wafer, described crystal oscillation
Wafer orientation block structure it is provided with on the edge of wafer；Described crystal oscillation wafer is held in the mouth with fixing device
Connect, wherein, described fixing device be provided with and the wafer orientation breach of described crystal location structure Block-matching,
By described wafer orientation block structure is positioned in described wafer orientation breach, it is achieved described crystal oscillation is brilliant
Being connected between sheet with described fixing device.
Preparation process in this crystal resonator in detail will be illustrated below, specific make step such as figure
Shown in 7, including:
Step S501: prepare crystal oscillation wafer.
Specifically, quartz crystal materials is entered as requested in terms of angle, size, thickness and radian etc.
Row cutting, grind and the operation such as polishing, to be cut complete after, quartz crystal oscillation chip is put into culture dish
In stand-by.
Step S502: prepare crystal location structure block.
Specifically, the structure of the quartz wafer after cutting according to step S501, design and this quartz wafer
The crystal location structure block joined, can position crystal according to dimensional requirement here in the way of using cut
Block structure is processed, it is thus achieved that have the crystal oscillation wafer of wafer orientation block structure, and by this crystal oscillation
Wafer is put in culture dish stand-by.
Step S503: clean crystal oscillation wafer and fixing device.
In step, the first step: add cleanout fluid in the culture dish equipped with crystal oscillation wafer, and put into
Supersonic cleaning machine carries out ultrasonic cleaning, during cleaning a length of 1～2min, or sets the most voluntarily
Determine scavenging period；Second step: supersonic cleaning machine to be used, by after crystal oscillation wafer cleaning, places into electric furnace
On be heated to after cleanout fluid comes to life, turning off furnace power, making crystal oscillation wafer natural cooling；3rd
Step: outwelled by the cleanout fluid in culture dish, containing acid flux material in usual cleanout fluid, at this moment can use hydrogen
Other basic solvent such as sodium hydroxide solution cleans the surface of crystal oscillation wafer, to the acid flux material in cleanout fluid
It is neutralized；4th step: with the pure water after boiling to electroded crystal oscillation wafer and fixing device (on
Electrode, bottom electrode and pedestal) it is rinsed, then, then and fix crystal oscillation wafer with dehydrated alcohol
Device is dehydrated, and finally, electricity consumption baking oven is done.
Step S504: crystal oscillation wafer and fixing device are mounted to crystal resonator.
In step, first, crystal oscillation wafer after cleaning and fixing device are positioned over to be easy to pick and place
On position, wear the fingerstall upper and lower electrode of taking-up and put in culture dish, and take out crystal oscillation with clean tweezers
Wafer is put in bottom electrode, specifically, the wafer orientation block structure in crystal oscillation wafer is placed on lower electricity
In the wafer orientation breach of pole；Then, electrode upper electrode is placed on the upper of crystal oscillation wafer in taking-up
Side so that the positioning step in bottom electrode is placed in the locating notch in electrode so that upper and lower electrode
Go between parallel but misaligned, and utilize positioning fixture to be fixed with bottom electrode by the locating notch of upper electrode；Finally,
Loading pedestal, the electrode leads to client of pole that specifically can make to power on is connected with the support in pedestal, and in junction
Point glue processes.
After crystal oscillation wafer is fixed with fixing device, the crystal resonator fixed is put in baking oven
Carry out baking process so that the connection of whole crystal resonator is more firm.
The preparation process of above-mentioned crystal oscillator is exemplary explanation, in actual applications, according to design
The structure of crystal oscillator can adjust the preparation method of crystal oscillator, the system to crystal oscillator here
Preparation Method is not especially limited.
The invention provides a kind of crystal resonator, this crystal resonator includes crystal oscillation wafer and fixing dress
Put, wherein, the edge of this crystal oscillation wafer is provided with wafer orientation block structure, this fixing device sets
It is equipped with and the wafer orientation breach of this crystal location structure Block-matching, by this wafer orientation block structure is placed
In this wafer orientation breach, it is achieved being connected between this crystal oscillation wafer and fixing device.The present invention carries
Crystal oscillation wafer in the crystal resonator of confession, compared to crystal oscillation wafer of the prior art, increases
Wafer orientation block structure, and the most correspondingly devise wafer orientation breach, utilize this crystalline substance
Body location structure block and this wafer orientation breach, it is achieved that being connected between crystal oscillation wafer and fixing device,
Solve prior art when utilizing conducting resinl crystal oscillation wafer and pedestal to be fixed, due to the adhesion of conducting resinl
Act on the stress produced on crystal oscillation wafer and cause relatively low the asking of service behaviour of crystal resonator
Topic.
The foregoing is only embodiments of the invention, be not limited to the present invention.For this area skill
For art personnel, the present invention can have various modifications and variations.All institutes within spirit and principles of the present invention
Any modification, equivalent substitution and improvement etc. made, within should be included in scope of the presently claimed invention.
Claims (10)
1. a crystal resonator, it is characterised in that including:
Crystal oscillation wafer and fixing device, wherein:
It is provided with wafer orientation block structure on the edge of described crystal oscillation wafer, described fixing device is arranged
Have and the wafer orientation breach of described crystal location structure Block-matching, by described wafer orientation block structure is put
It is placed in described wafer orientation breach, it is achieved being connected between described crystal oscillation wafer and described fixing device.
Crystal resonator the most according to claim 1, it is characterised in that described crystal location structure
The quantity of block is four, and described four crystal location structure blocks laid respectively at described crystal oscillation wafer circle
In two vertical direction of the heart.
Crystal resonator the most according to claim 1, it is characterised in that described crystal location structure
Block be shaped as trapezium structure, and going to the bottom of described trapezium structure is connected with described crystal oscillation Waffer edge.
Crystal resonator the most according to claim 3, it is characterised in that under described trapezium structure
The end, is connected with described crystal oscillation Waffer edge, wherein, and the limit of the linking corresponding described crystal oscillation wafer of part
Edge angle is more than or equal to 5 degree, and less than or equal to 45 degree.
Crystal resonator the most according to claim 1, it is characterised in that described fixing device includes:
Upper electrode and bottom electrode, wherein:
Described upper electrode, for suppressing described crystal oscillation wafer in described bottom electrode；
Described bottom electrode, is used for carrying described crystal oscillation wafer.
Crystal resonator the most according to claim 5, it is characterised in that described bottom electrode is provided with
Wafer orientation breach, described crystal oscillation wafer is suppressed and is specifically wrapped on described bottom electrode by the most described upper electrode
Include:
Crystal location structure block in described crystal oscillation wafer is suppressed in described bottom electrode by described upper electrode
In wafer orientation breach in.
Crystal resonator the most according to claim 5, it is characterised in that described upper electrode is provided with
Upper electrode locating notch, and described bottom electrode is provided with bottom electrode positioning step, described bottom electrode positioning table
Rank linking corresponding with described upper electrode locating notch.
Crystal resonator the most according to claim 7, it is characterised in that described bottom electrode positioning table
Rank linking corresponding with described upper electrode locating notch specifically includes:
Utilize positioning fixture that described bottom electrode positioning step and described upper electrode locating notch are fixed rank
Connect.
9. according to the crystal resonator described in any one of claim 1～8, it is characterised in that described fixing
Device also includes pedestal, and is connected by the electrode leads to client of described pedestal with described upper electrode.
10. the preparation method of a crystal resonator, it is characterised in that including:
According to default size, crystalline material is processed, obtains crystal oscillation wafer, described crystal oscillation
Wafer orientation block structure it is provided with on the edge of wafer；
Described crystal oscillation wafer is connected with fixing device, wherein, described fixing device is provided with
With the wafer orientation breach of described crystal location structure Block-matching, by by described wafer orientation block structure place
In described wafer orientation breach, it is achieved being connected between described crystal oscillation wafer and described fixing device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610269246.8A CN105958957B (en) | 2016-04-27 | 2016-04-27 | A kind of crystal resonator and preparation method thereof |
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| CN201610269246.8A CN105958957B (en) | 2016-04-27 | 2016-04-27 | A kind of crystal resonator and preparation method thereof |
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| CN105958957B CN105958957B (en) | 2018-07-17 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326266A (en) * | 2000-05-26 | 2001-12-12 | 威廉·比华 | Surface mount quartz crystal resonator and manufacturing method |
| US20090195126A1 (en) * | 2008-02-06 | 2009-08-06 | Nihon Dempa Kogyo Co., Ltd. | Crystal unit |
| CN202841076U (en) * | 2012-09-25 | 2013-03-27 | 铜陵晶越电子有限公司 | High fundamental frequency quartz-crystal resonator |
-
2016
- 2016-04-27 CN CN201610269246.8A patent/CN105958957B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326266A (en) * | 2000-05-26 | 2001-12-12 | 威廉·比华 | Surface mount quartz crystal resonator and manufacturing method |
| US20090195126A1 (en) * | 2008-02-06 | 2009-08-06 | Nihon Dempa Kogyo Co., Ltd. | Crystal unit |
| CN202841076U (en) * | 2012-09-25 | 2013-03-27 | 铜陵晶越电子有限公司 | High fundamental frequency quartz-crystal resonator |
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| CN105958957B (en) | 2018-07-17 |
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