CN207977948U - A kind of compensation crystal oscillator - Google Patents
A kind of compensation crystal oscillator Download PDFInfo
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- CN207977948U CN207977948U CN201820403613.3U CN201820403613U CN207977948U CN 207977948 U CN207977948 U CN 207977948U CN 201820403613 U CN201820403613 U CN 201820403613U CN 207977948 U CN207977948 U CN 207977948U
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Abstract
The utility model provides a kind of compensation crystal oscillator, including：One pedestal, quartz oscillation, a temperature compensation oscillating circuit integrated chip；Pedestal is respectively substrate layer, integrated chip attachment layer, ticker electrode layer and kovar ring from the bottom to top；Integrated chip, which mounts, is arranged one first cavity on layer, temperature compensation oscillating circuit integrated chip is arranged in the first cavity；One second cavity is set on ticker electrode layer, and setting quartz oscillation is sub in the second cavity.The technical solution of the utility model advantageous effect is：A kind of compensation crystal oscillator is provided, using controlled collapsible chip connec-tion, temperature compensation oscillating circuit integrated chip, circuit simple and stable, production technology simplicity are set, further effectively shorten the production cycle, production efficiency, environmental protection and energy saving are improved, and simplify base construction, so that product more minimizes, while it also disclosure satisfy that the required precision under operating temperature.
Description
Technical field
The utility model is related to quartz oscillator technical field more particularly to a kind of compensation crystal oscillators.
Background technology
Currently, quartz products are applied to various electronic equipments as the frequency oscillator and clock devices most generally used
In, from simplest toy, household electrical appliances, clock and watch to complicated computer, mobile phone, satellite navigation and the communication at tip, air equipment
On largely use this quartz products, therefore with the continuous extension and development of application field, in operating temperature and frequency essence
It is no longer satisfied with traditional grade in terms of degree.
In the prior art, the rapidest with the market development of temp.-compensation type crystal oscillator, for example, by using high-precision
The annual growth of the GPS mobile phones of temperature compensating crystal oscillator also includes 4G cell phone or 5G mobile phones, GPS cameras, automobile just more than 30%
The rapid developments such as electronics and security device are staple market.But in traditional crystal oscillator mostly use chip welding and
The mode of gold thread welding mounts, and does not require nothing more than crystal oscillator factory and uses more auxiliary material, complicated production technology；And it requires to shake
It swings circuit and integrates IC manufactories specially treated its corresponding IC pin package.
Invention content
For the above-mentioned problems in the prior art, a kind of compensation crystal oscillator is now provided.
Specific technical solution is as follows：
A kind of compensation crystal oscillator, including：
One pedestal, quartz oscillation, a temperature compensation oscillating circuit integrated chip；
The pedestal is respectively substrate layer, integrated chip attachment layer, ticker electrode layer and kovar ring from the bottom to top；
One first cavity is set on the integrated chip attachment layer, the temperature compensation oscillating circuit is set in first cavity
Integrated chip；
One second cavity is set on the ticker electrode layer, and the setting quartz oscillation is sub in second cavity.
Preferably, it is arranged on the incline of four edges of every layer of the pedestal substrate and a pair of wider opposite side
One conductive trough, the substrate layer, integrated chip attachment layer and the ticker electrode layer realize electricity by the conductive trough
Road is connected.
Preferably, the bottom surface of the substrate layer is provided with external electrode pad.
Preferably, the temperature compensation oscillating circuit integrated chip mounts layer by so lder ball bonding in the integrated chip.
Preferably, quartz oscillation by conductive adhesive on the ticker electrode layer.
Preferably, the quartz oscillation attached bag includes positive electrode and negative electrode, is vibrated by the conductive trough and the temperature compensation
The pin electrode conduction of circuit integrated chip.
Preferably, further include an encapsulation upper cover, the encapsulation upper cover is metal flat cover board, by way of rolling welding
It is fixed on the kovar ring.
Preferably, the substrate layer, integrated chip attachment layer and the ticker electrode layer are by ceramic material system
At.
Preferably, the size of the compensation crystal oscillator is 2.0mm*1.6mm.
The technical solution of the utility model advantageous effect is：A kind of compensation crystal oscillator is provided, using flip-chip
Temperature compensation oscillating circuit integrated chip is arranged in technique, and circuit simple and stable, production technology is easy, and the production that further effectively shortens is all
Phase improves production efficiency, environmental protection and energy saving, and simplifies base construction so that product more minimizes, while also disclosure satisfy that
Required precision under operating temperature.
Description of the drawings
Fig. 1 is the planar structure schematic diagram about pedestal in the utility model；
Fig. 2 is the planar structure schematic diagram about external electrode in the utility model；
Fig. 3 is in the utility model, about the planar structure schematic diagram for being bonded temperature compensation oscillating circuit integrated chip in pedestal；
Fig. 4 is in the utility model, about the planar structure schematic diagram for being bonded quartz oscillation in pedestal；
Fig. 5 is the overall structure diagram about compensation crystal oscillator in the utility model；
Fig. 6 is the planar structure schematic diagram at the back side about temperature compensation oscillating circuit integrated chip in the utility model；
Fig. 7 is the positive pin configuration schematic diagram about temperature compensation oscillating circuit integrated chip in the utility model；
Fig. 8 is the planar structure schematic diagram about quartz oscillation in the utility model；
Fig. 9 is the planar structure schematic diagram about encapsulation upper cover in the utility model.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can
To be combined with each other.
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but not as the utility model
It limits.
A kind of compensation crystal oscillator, including：
One pedestal 1, quartz oscillation 2, a temperature compensation oscillating circuit integrated chip 3；
Pedestal 1 is respectively substrate layer 10, integrated chip attachment layer 11, ticker electrode layer 12 and kovar ring from the bottom to top
13；
Integrated chip, which mounts, is arranged one first cavity 110 on layer 11, setting temperature compensation oscillating circuit is integrated in the first cavity 110
Chip 3；
One second cavity 120 is set on ticker electrode layer 12, quartz oscillation 2 is set in the second cavity 120.
By above-mentioned compensation crystal oscillator, as shown in Figure 1, pedestal 1 mounts layer 11 by substrate layer 10, integrated chip, shakes
12 3 laminar substrate of mover electrode layer, which is laminated from the bottom to top after sinter molding, to be plated kovar ring 13 and forms；
Further, compensation crystal oscillator is installed since bottom, first leads to temperature compensation oscillating circuit integrated chip 3
It crosses on the integrated chip attachment layer 11 that gold goal 6 is inverted in the first cavity 110, as shown in figure 3, then leading to quartz oscillation 2
It crosses on the ticker electrode layer 3 that conducting resinl 4 is bonded in the second cavity 120, as shown in figure 4, finally will encapsulation upper cover 5 and pedestal
1, it is fixed on kovar ring 13 by way of rolling welding, the overall structure diagram of compensation crystal oscillator is as shown in Figure 5.
In a kind of preferably embodiment, the side of four edges of every laminar substrate of pedestal 1 and a pair of wider opposite side
One conductive trough (not shown in FIG.) is set on rib, and substrate layer 10, integrated chip attachment layer 11 and ticker electrode layer 12 pass through
Conductive trough (not shown in FIG.) realizes circuit turn-on.
Specifically, as shown in Fig. 2, four edges of every laminar substrate of pedestal 1 also set up a via and (do not show in figure
Go out), it is connected to conductive trough (not shown in FIG.) by via (not shown in FIG.), and substrate layer 10, integrated chip are pasted
Dress layer 11 and ticker electrode layer 12 equally realize circuit turn-on by via (not shown in FIG.).
In a kind of preferably embodiment, the bottom surface of substrate layer 10 is provided with external electrode pad 100.
Specifically, the pin electrode of external electrode pad 100 and quartz oscillation 2 by conductive trough (not shown in FIG.) or
Person's via (not shown in FIG.) realizes circuit turn-on.
In a kind of preferably embodiment, temperature compensation oscillating circuit integrated chip 3 is adhered to integrated chip by gold goal 6 and mounts
Layer 11.
Specifically, temperature compensation oscillating circuit integrated chip 3 includes six pins, in conjunction with shown in Fig. 6,7, each pin with it is integrated
The pin electrode of chip attachment layer 11 is corresponding, and a kind of design is arranged in temperature compensation oscillating circuit integrated chip 3
Precision height and integrated vibrating circuit easy to operate, select the upside-down mounting process of compensated oscillator, first plant gold goal 6 in collection successively
At on the pin electrode of chip 3, then by gold goal attachment to the attachment layer on the pin electrode of temperature compensation oscillating circuit integrated chip 3
On 11 pin, by ultrasonic bonding, temperature compensation oscillating circuit integrated chip 3 and ticker electrode layer 12 and substrate layer are realized
Connection between 10 external electrode pad 100；
Specifically, so lder ball bonding technique, which is the energy generated using high pressure arc discharge, makes gold thread fusing to form gold goal 6,
Gold goal 6 is placed between the external electrode of magnetic head and tabs electrode by tip again, face-down bonding is completed with shape using ultrasonic wave
At access；Particularly, 6 a diameter of prescribed level of gold goal is must assure that during ultrasonic bonding, and obtains specified welding
Intensity, therefore control forms the electric discharge high pressure of gold goal 6 and realizes that the ultrasonic energy of solid phase binding is extremely important.
In a kind of preferably embodiment, quartz oscillation 2 is adhered to by conducting resinl 4 on ticker electrode layer 12.
In a kind of preferably embodiment, quartz oscillation 2 includes positive electrode and negative electrode 20, (is being schemed by conductive trough
In be not shown) with the pin electrode conduction of temperature compensation oscillating circuit integrated chip 3.
Specifically, it as shown in figure 8, the electrode film forming using special quartz oscillation 2 controls fixture, is set by the plated film of profession
It is standby, effigurate electrode is plated on quartz oscillation 2, and then it is round and smooth, bent to form a kind of frequency curve at the working temperature
Small and stable quartz oscillation 2 with positive and negative electrode of line error, is adhered to by conducting resinl 4 on ticker electrode layer 12,
It is connected to the input and output electrode of temperature compensation oscillating circuit integrated chip 3 with realizing.
Further include an encapsulation upper cover 5 in a kind of preferably embodiment, encapsulation upper cover 5 is metal flat cover board, passes through rolling
The mode of side welding is fixed on kovar ring 13.
Specifically, as shown in figure 9, the selection of kovar ring 13 is the advantages of can cutting down (Kovar) alloy, in wider temperature range
The expansion coefficient similar of the interior coefficient of expansion and Bohemian glass, it is ensured that the matched seal of material is so that encapsulation upper cover 5 and base
The sealing effect of seat 1 is more preferable, and encapsulates upper cover 5 and can effectively reduce electromagnetic interference by that can cut down (Kovar) alloy ground, subtract
Few vibration.
In a kind of preferably embodiment, substrate layer 11, integrated chip attachment layer 12 and ticker electrode layer 13 are by pottery
Ceramic material is made.
In a kind of preferably embodiment, the size of compensation crystal oscillator is 2.0mm*1.6mm.
Specifically, it is 2.0mm*1.6mm to select the size of compensation crystal oscillator, further simplifies production technology, has
Effect shortens the production cycle, improves production efficiency, environmental protection and energy saving so that product more minimizes.
The technical solution of the utility model advantageous effect is：A kind of compensation crystal oscillator is provided, using flip-chip
Temperature compensation oscillating circuit integrated chip is arranged in technique, and circuit simple and stable, production technology is easy, and the production that further effectively shortens is all
Phase improves production efficiency, environmental protection and energy saving, and simplifies base construction so that product more minimizes, while also disclosure satisfy that
Required precision under operating temperature.
The foregoing is merely the utility model preferred embodiment, be not intended to limit the utility model embodiment and
Protection domain should can appreciate that all in the utility model specification and diagram to those skilled in the art
Hold made equivalent replacement and obviously change obtained scheme, the protection model of the utility model should all be included in
In enclosing.
Claims (9)
1. a kind of compensation crystal oscillator, which is characterized in that including：
One pedestal, quartz oscillation, a temperature compensation oscillating circuit integrated chip；
The pedestal is respectively substrate layer, integrated chip attachment layer, ticker electrode layer and kovar ring from the bottom to top；
One first cavity is set on the integrated chip attachment layer, and the setting temperature compensation oscillating circuit is integrated in first cavity
Chip；
One second cavity is set on the ticker electrode layer, and the setting quartz oscillation is sub in second cavity.
2. compensation crystal oscillator according to claim 1, which is characterized in that the four of every layer of substrate of the pedestal
One conductive trough is set on the incline of a edge and a pair of wider opposite side, the substrate layer, integrated chip attachment layer and
The ticker electrode layer realizes circuit turn-on by the conductive trough.
3. compensation crystal oscillator according to claim 1, which is characterized in that the bottom surface of the substrate layer is provided with dispatch from foreign news agency
Pole pad.
4. compensation crystal oscillator according to claim 1, which is characterized in that the temperature compensation oscillating circuit integrated chip is logical
It crosses so lder ball bonding and mounts layer in the integrated chip.
5. compensation crystal oscillator according to claim 1, which is characterized in that quartz oscillation passes through conductive gluing
It is connected on the ticker electrode layer.
6. compensation crystal oscillator according to claim 1, which is characterized in that the quartz oscillation attached bag include positive electrode with
Negative electrode passes through the pin electrode conduction of the conductive trough and the temperature compensation oscillating circuit integrated chip.
7. compensation crystal oscillator according to claim 1, which is characterized in that further include an encapsulation upper cover, the encapsulation
Upper cover is metal flat cover board, is fixed on the kovar ring by way of rolling welding.
8. compensation crystal oscillator according to claim 1, which is characterized in that the substrate layer, integrated chip patch
Dress layer and the ticker electrode layer are made of ceramic materials.
9. compensation crystal oscillator according to claim 1, which is characterized in that the size of the compensation crystal oscillator is
2.0mm*1.6mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820403613.3U CN207977948U (en) | 2018-03-23 | 2018-03-23 | A kind of compensation crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820403613.3U CN207977948U (en) | 2018-03-23 | 2018-03-23 | A kind of compensation crystal oscillator |
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| Publication Number | Publication Date |
|---|---|
| CN207977948U true CN207977948U (en) | 2018-10-16 |
Family
ID=63764556
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| CN201820403613.3U Active CN207977948U (en) | 2018-03-23 | 2018-03-23 | A kind of compensation crystal oscillator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109672407A (en) * | 2018-12-20 | 2019-04-23 | 北京无线电计量测试研究所 | A kind of temperature compensating crystal oscillator |
-
2018
- 2018-03-23 CN CN201820403613.3U patent/CN207977948U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109672407A (en) * | 2018-12-20 | 2019-04-23 | 北京无线电计量测试研究所 | A kind of temperature compensating crystal oscillator |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 2880, Moganshan Road, Liangzhu street, Yuhang District, Hangzhou, Zhejiang 310000 Patentee after: Hongxing Technology (Group) Co.,Ltd. Address before: No. 2880, Moganshan Road, Liangzhu Street, Hangzhou, Zhejiang, 310000 Patentee before: HANGZHOU HOSONIC ELECTRONICS Co.,Ltd. |
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| CP03 | Change of name, title or address |