CN104851955A - Flexible fluorescent substrate based on secondary optical design and LED light source - Google Patents
Flexible fluorescent substrate based on secondary optical design and LED light source Download PDFInfo
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- CN104851955A CN104851955A CN201510164400.0A CN201510164400A CN104851955A CN 104851955 A CN104851955 A CN 104851955A CN 201510164400 A CN201510164400 A CN 201510164400A CN 104851955 A CN104851955 A CN 104851955A
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- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 230000003287 optical effect Effects 0.000 title claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 9
- 239000002096 quantum dot Substances 0.000 claims abstract description 9
- 238000004381 surface treatment Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000741 silica gel Substances 0.000 claims abstract description 5
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 4
- 239000010931 gold Substances 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract
本发明提供一种基于二次光学设计的柔性荧光基板及LED光源，其中柔性荧光基板包括荧光粉或量子点，所述荧光粉或量子点中掺杂有如下组分中的一种：PET、PI、或硅胶；所述柔性荧光基板的一面设置有发光电路，所述柔性荧光基板的另一面进行二次光学设计；所述发光电路与LED芯片的正装或倒装相对应，所述二次光学设计包括表面处理或印制微透镜。本发明的基于二次光学设计的柔性荧光基板柔韧性好，可作为LED芯片的基板，本发明的柔性荧光基板上设置有发光电路，从而使得LED的电气连接不必挑金线。此外，本发明的柔性荧光基板上进行二次光学设计，提供了相应LED光源的发光效率。
The present invention provides a flexible fluorescent substrate and LED light source based on secondary optical design, wherein the flexible fluorescent substrate includes fluorescent powder or quantum dots, and the fluorescent powder or quantum dots are doped with one of the following components: PET, PI or silica gel; one side of the flexible fluorescent substrate is provided with a light-emitting circuit, and the other side of the flexible fluorescent substrate is subjected to secondary optical design; Optical design includes surface treatment or printed microlenses. The flexible fluorescent substrate based on the secondary optical design of the present invention has good flexibility and can be used as a substrate of an LED chip. The flexible fluorescent substrate of the present invention is provided with a light-emitting circuit, so that the electrical connection of the LED does not need to use gold wires. In addition, secondary optical design is carried out on the flexible fluorescent substrate of the present invention to improve the luminous efficiency of the corresponding LED light source.
Description
技术领域technical field
本发明涉及照明技术领域，尤其是一种基于二次光学设计的柔性荧光基板、以及使用该柔性荧光基板的LED光源。The invention relates to the technical field of lighting, in particular to a flexible fluorescent substrate based on secondary optical design and an LED light source using the flexible fluorescent substrate.
背景技术Background technique
发光二极管(Light-Emitting Diode，LED)是一种能发光的半导体电子元件。这种电子元件早在1962年出现，早期只能发出低光度的红光，之后发展出其他单色光的版本，时至今日能发出的光已遍及可见光、红外线及紫外线，光度也提高到相当的光度。而用途也由初时作为指示灯、显示板等；随着技术的不断进步，发光二极管已被广泛的应用于显示器、电视机采光装饰和照明。A light-emitting diode (Light-Emitting Diode, LED) is a semiconductor electronic component that can emit light. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. And the use is also used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting.
然而，现有的使用发光二极管的光源往往发光面积较小、柔韧性较差、且发光效率不高，无法充分满足人们的使用需求。However, the existing light sources using light-emitting diodes often have small light-emitting areas, poor flexibility, and low luminous efficiency, which cannot fully meet people's needs for use.
因此，为解决上述问题，有必要提出进一步的解决方案。Therefore, in order to solve the above problems, it is necessary to propose further solutions.
发明内容Contents of the invention
本发明的目的在于提供一种基于二次光学设计的柔性荧光基板、以及使用该柔性荧光基板的LED光源，以克服现有技术中存在的不足。The object of the present invention is to provide a flexible fluorescent substrate based on secondary optical design and an LED light source using the flexible fluorescent substrate, so as to overcome the shortcomings in the prior art.
为实现上述目的，本发明提供一种基于二次光学设计的柔性荧光基板，其包括荧光粉或量子点，所述荧光粉或量子点中掺杂有如下组分中的一种：PET、PI、或硅胶；In order to achieve the above object, the present invention provides a flexible fluorescent substrate based on secondary optical design, which includes fluorescent powder or quantum dots, and the fluorescent powder or quantum dots are doped with one of the following components: PET, PI , or silicone;
所述柔性荧光基板的一面设置有发光电路，所述柔性荧光基板的另一面进行二次光学设计；One side of the flexible fluorescent substrate is provided with a light-emitting circuit, and the other side of the flexible fluorescent substrate is subjected to secondary optical design;
所述发光电路与LED芯片的正装或倒装相对应，所述二次光学设计包括表面处理或印制微透镜。The light-emitting circuit corresponds to the front-mounted or inverted-mounted LED chips, and the secondary optical design includes surface treatment or printed micro-lenses.
作为本发明的基于二次光学设计的柔性荧光基板的改进，所述发光电路可通过压制、打印、或溅射的方式设置于所述柔性荧光基板上。As an improvement of the flexible fluorescent substrate based on the secondary optical design of the present invention, the light-emitting circuit can be disposed on the flexible fluorescent substrate by pressing, printing, or sputtering.
作为本发明的基于二次光学设计的柔性荧光基板的改进，所述表面处理包括：化学清洗、或等离子体清洗、或真空镀膜。As an improvement of the flexible fluorescent substrate based on the secondary optical design of the present invention, the surface treatment includes: chemical cleaning, or plasma cleaning, or vacuum coating.
为实现上述目的，本发明还提供一种LED光源，其特征在于，所述LED光源包括基板、以及设置于所述基板上的若干LED芯片；In order to achieve the above object, the present invention also provides an LED light source, which is characterized in that the LED light source includes a substrate and several LED chips arranged on the substrate;
所述基板为如上所述柔性荧光基板，所述若干LED芯片以阵列形式分布于所述柔性荧光基板上，所述若干LED芯片与所述发光电路进行电性连接。The substrate is a flexible fluorescent substrate as described above, the plurality of LED chips are distributed in an array on the flexible fluorescent substrate, and the plurality of LED chips are electrically connected to the light emitting circuit.
作为本发明的LED光源的改进，所述若干LED芯片与所述柔性荧光基板之间的固定方式可以为：导电胶、回流焊、共晶焊。As an improvement of the LED light source of the present invention, the fixing methods between the plurality of LED chips and the flexible fluorescent substrate may be: conductive glue, reflow soldering, and eutectic soldering.
作为本发明的LED光源的改进，所述LED芯片的厚度为100～150um。As an improvement of the LED light source of the present invention, the thickness of the LED chip is 100-150um.
作为本发明的LED光源的改进，所述LED光源的厚度为300～350um。As an improvement of the LED light source of the present invention, the thickness of the LED light source is 300-350um.
与现有技术相比，本发明的有益效果是：本发明的基于二次光学设计的柔性荧光基板柔韧性好，可作为LED芯片的基板，本发明的柔性荧光基板上设置有发光电路，从而使得LED的电气连接不必挑金线。此外，本发明的柔性荧光基板上进行二次光学设计，提供了相应LED光源的发光效率。Compared with the prior art, the beneficial effects of the present invention are: the flexible fluorescent substrate based on the secondary optical design of the present invention has good flexibility and can be used as a substrate for LED chips. The flexible fluorescent substrate of the present invention is provided with a light-emitting circuit, thereby It makes it unnecessary to pick gold wires for the electrical connection of the LED. In addition, secondary optical design is carried out on the flexible fluorescent substrate of the present invention to improve the luminous efficiency of the corresponding LED light source.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明中记载的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为本发明的基于二次光学设计的柔性荧光基板的一具体实施方式的平面示意图。FIG. 1 is a schematic plan view of a specific embodiment of the flexible fluorescent substrate based on the secondary optical design of the present invention.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明中的技术方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
如图1所示，本发明的所述柔性荧光基板10包括荧光粉或量子点，所述荧光粉或量子点中掺杂有如下组分中的一种：PET、PI、或硅胶。从而，柔性荧光基板10可以包括掺杂有PET、PI、或硅胶的荧光粉，也可以包括掺杂有PET、PI、或硅胶的量子点。如此设置，使得本发明的基板就有柔性和荧光性。As shown in FIG. 1 , the flexible fluorescent substrate 10 of the present invention includes phosphor powder or quantum dots, and the phosphor powder or quantum dots are doped with one of the following components: PET, PI, or silica gel. Therefore, the flexible fluorescent substrate 10 may include fluorescent powder doped with PET, PI, or silica gel, or may include quantum dots doped with PET, PI, or silica gel. Such arrangement makes the substrate of the present invention flexible and fluorescent.
进一步地，所述柔性荧光基板10的一面设置有发光电路，所述柔性荧光基板10的另一面进行二次光学设计。其中，发光电路的设计取决于位于柔性荧光基板10上的LED为正装或倒装。所述发光电路可通过压制、打印、或溅射的方式设置于所述柔性荧光基板上。同时，通过设置发光电路则不必另行布设金线。所述二次光学设计包括在柔性荧光基板10的表面进行表面处理或印制微透镜。其中，所述表面处理包括：化学清洗、或等离子体清洗、或真空镀膜。Further, one side of the flexible fluorescent substrate 10 is provided with a light-emitting circuit, and the other side of the flexible fluorescent substrate 10 is provided with a secondary optical design. Wherein, the design of the light-emitting circuit depends on whether the LEDs on the flexible fluorescent substrate 10 are upside-down or upside-down. The light-emitting circuit can be disposed on the flexible fluorescent substrate by pressing, printing, or sputtering. At the same time, by setting the light emitting circuit, it is not necessary to lay additional gold wires. The secondary optical design includes performing surface treatment or printing microlenses on the surface of the flexible fluorescent substrate 10 . Wherein, the surface treatment includes: chemical cleaning, or plasma cleaning, or vacuum coating.
基于如上所述的柔性荧光基板10，本发明还提供一种使用该柔性荧光基板的LED光源。具体地，所述LED光源包括如上所述的柔性荧光基板10、以及设置于所述柔性荧光基板10上的若干LED芯片20。Based on the flexible fluorescent substrate 10 described above, the present invention also provides an LED light source using the flexible fluorescent substrate. Specifically, the LED light source includes the above-mentioned flexible fluorescent substrate 10 and several LED chips 20 disposed on the flexible fluorescent substrate 10 .
其中，所述若干LED芯片20以阵列形式分布于所述柔性荧光基板10上，且所述若干LED芯片20与所述发光电路进行电性连接。当发光电路通电后，与发光电路电性连接的LED芯片可发光并提供照明。所述若干LED芯片20可以采用正装，也可采用倒装的方式设置于柔性荧光基板10上。此外，所述若干LED芯片20与所述柔性荧光基板10之间的固定方式可以为：导电胶、回流焊、共晶焊等。Wherein, the plurality of LED chips 20 are distributed on the flexible fluorescent substrate 10 in an array, and the plurality of LED chips 20 are electrically connected to the light emitting circuit. When the light emitting circuit is powered on, the LED chip electrically connected to the light emitting circuit can emit light and provide illumination. The plurality of LED chips 20 can be arranged on the flexible fluorescent substrate 10 in a front-mounted manner or in a reverse-chip manner. In addition, the fixing method between the plurality of LED chips 20 and the flexible fluorescent substrate 10 may be: conductive glue, reflow soldering, eutectic soldering and the like.
进一步地，所述若干LED芯片中任一LED芯片的厚度优选为100～150um；本发明LED光源的总厚度优选为300～350um。Further, the thickness of any LED chip among the plurality of LED chips is preferably 100-150 um; the total thickness of the LED light source of the present invention is preferably 300-350 um.
此外，本发明的LED光源的两端还引出有导电电极。In addition, conductive electrodes are drawn from both ends of the LED light source of the present invention.
综上所示，本发明的基于二次光学设计的柔性荧光基板柔韧性好，可作为LED芯片的基板，本发明的柔性荧光基板上设置有发光电路，从而使得LED的电气连接不必挑金线。此外，本发明的柔性荧光基板上进行二次光学设计，提供了相应LED光源的发光效率。In summary, the flexible fluorescent substrate based on the secondary optical design of the present invention has good flexibility and can be used as a substrate for LED chips. The flexible fluorescent substrate of the present invention is provided with a light-emitting circuit, so that the electrical connection of the LED does not need to pick gold wires . In addition, secondary optical design is carried out on the flexible fluorescent substrate of the present invention to improve the luminous efficiency of the corresponding LED light source.
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only contains an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510164400.0A CN104851955A (en) | 2015-04-09 | 2015-04-09 | Flexible fluorescent substrate based on secondary optical design and LED light source |
| PCT/CN2015/093843 WO2016161803A1 (en) | 2015-04-09 | 2015-11-05 | Secondary optical design-based flexible fluorescent substrate and led light source |
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| CN201510164400.0A CN104851955A (en) | 2015-04-09 | 2015-04-09 | Flexible fluorescent substrate based on secondary optical design and LED light source |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016161803A1 (en) * | 2015-04-09 | 2016-10-13 | 苏州晶品新材料股份有限公司 | Secondary optical design-based flexible fluorescent substrate and led light source |
| CN108321281A (en) * | 2018-03-30 | 2018-07-24 | 南方科技大学 | micro-L ED display panel and micro-L ED display device |
| CN108987382A (en) * | 2018-07-27 | 2018-12-11 | 京东方科技集团股份有限公司 | A kind of electroluminescent device and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071232A (en) * | 2006-05-10 | 2007-11-14 | 奇美电子股份有限公司 | Surface light source device, manufacturing method thereof, and liquid crystal display with the surface light source device |
| CN102379050A (en) * | 2009-02-04 | 2012-03-14 | 应用材料公司 | Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors |
| CN102881802A (en) * | 2011-07-11 | 2013-01-16 | 隆达电子股份有限公司 | Light emitting diode packaging structure |
| CN203705097U (en) * | 2013-11-22 | 2014-07-09 | 沈阳工业大学 | Flexible three-dimensional contact force matrix sensing device |
| EP2760057A1 (en) * | 2013-01-28 | 2014-07-30 | Harvatek Corporation | White light emitting diodes package containing plural blue light-emitting diodes |
| CN203840632U (en) * | 2014-03-25 | 2014-09-17 | 许振宇 | Modularized flexible circuit structure |
| CN204651352U (en) * | 2015-04-09 | 2015-09-16 | 苏州晶品新材料股份有限公司 | Based on flexible fluorescence substrate and the LED light source of secondary optical design |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762211A (en) * | 2011-12-31 | 2014-04-30 | 苏州晶品光电科技有限公司 | Flexible circuit substrate double-sided light-emitting LED array light source |
| CN103867914A (en) * | 2012-12-10 | 2014-06-18 | 西安君协光电科技有限公司 | LED lamp |
| CN104851955A (en) * | 2015-04-09 | 2015-08-19 | 苏州晶品新材料股份有限公司 | Flexible fluorescent substrate based on secondary optical design and LED light source |
-
2015
- 2015-04-09 CN CN201510164400.0A patent/CN104851955A/en active Pending
- 2015-11-05 WO PCT/CN2015/093843 patent/WO2016161803A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071232A (en) * | 2006-05-10 | 2007-11-14 | 奇美电子股份有限公司 | Surface light source device, manufacturing method thereof, and liquid crystal display with the surface light source device |
| CN102379050A (en) * | 2009-02-04 | 2012-03-14 | 应用材料公司 | Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors |
| CN102881802A (en) * | 2011-07-11 | 2013-01-16 | 隆达电子股份有限公司 | Light emitting diode packaging structure |
| EP2760057A1 (en) * | 2013-01-28 | 2014-07-30 | Harvatek Corporation | White light emitting diodes package containing plural blue light-emitting diodes |
| CN203705097U (en) * | 2013-11-22 | 2014-07-09 | 沈阳工业大学 | Flexible three-dimensional contact force matrix sensing device |
| CN203840632U (en) * | 2014-03-25 | 2014-09-17 | 许振宇 | Modularized flexible circuit structure |
| CN204651352U (en) * | 2015-04-09 | 2015-09-16 | 苏州晶品新材料股份有限公司 | Based on flexible fluorescence substrate and the LED light source of secondary optical design |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016161803A1 (en) * | 2015-04-09 | 2016-10-13 | 苏州晶品新材料股份有限公司 | Secondary optical design-based flexible fluorescent substrate and led light source |
| CN108321281A (en) * | 2018-03-30 | 2018-07-24 | 南方科技大学 | micro-L ED display panel and micro-L ED display device |
| CN108987382A (en) * | 2018-07-27 | 2018-12-11 | 京东方科技集团股份有限公司 | A kind of electroluminescent device and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| WO2016161803A1 (en) | 2016-10-13 |
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