CN105322077A - Light emitting diode packaging structure - Google Patents

Abstract

A light emitting diode packaging structure comprises a packaging shell, a fluorescent layer, a substrate and a light emitting diode chip. The packaging shell is provided with an accommodating space. The fluorescent layer is coated on one side of the packaging shell. The substrate is arranged in the accommodating space. The light emitting diode chip is arranged on the first surface of the substrate, wherein the surface of the light emitting diode chip is not directly covered with a colloid, and the light emitting diode chip and the packaging shell are separated from each other by a distance. The LED lamp has better overall luminous efficiency, better uniformity of reflected light and better luminous angle of all-round light.

Description

Light-emitting diode packaging structure

technical field

The present invention relates to a packaging structure of light emitting diodes, and in particular to a packaging structure of light emitting diodes with full-circumference light.

Background technique

Since Dr. Shuji Nakamura of Nichia in Japan successfully epitaxially grown GaN materials on sapphire substrates in 1995, he produced the first mass-producible blue light-emitting diode (blueLED), making up for the fact that LEDs previously only had red and green light. Lighting products, making LED officially enter full color. In 1996, the mixed-light packaging method using InGaN blue LEDs and phosphors was published, and after the development of white LEDs, various LED applications were opened, making LEDs vigorously penetrated into the living environment. One of the mainstream technologies.

The main purpose of LED packaging is to protect the LED from moisture and touch during use. The reliability and working life of LED products can be improved through the better heat dissipation structure of the bracket, and with the package appearance of good optical design, different light patterns and application methods can be produced. The main LED packaging products in the industry can be divided into cannonball or bracket type LED (Lamp LED), surface mount type LED (SMD LED), piranha LED (Paranha LED), plastic chip carrier package LED (PLCC LED) according to the appearance of the package. Dot-matrix packaged LED (Digital/DotMatrixDisplayLED), printed circuit board LED (PCBLED), high-power LED (HighPowerLED) and board-connected LED (COBLED) are the mainstream, and the package forms are various. Relatively, these packaged products are also blooming.

Because the LED is characterized by being light, thin and short, the above packaging forms are to fix the LED on a heat-conducting bracket. The LED is connected to the bracket with gold wires. In order to protect the connected gold wires, it is necessary to cover the LED with encapsulation glue to protect the LED. Avoid the risk of touching the LED body. Because of this structure, the LED has a strong directivity, and its luminous angle is only close to 140 degrees to 150 degrees at most. Therefore, the LED light source module developed based on this feature is used in lighting application design. On the face of it, the unsatisfactory luminous angle and unidirectional light source have different luminous characteristics from the traditional light source, which makes it not suitable for the use of traditional light source lamps. Therefore, in addition to widely accepting and promoting LED lighting products as jewelry lamps replacing halogen lamps and MR16 lamps for window decoration applications, the unsatisfactory LED lighting angle and price problems limit the market promotion of LED lighting products. If we can break through the optical technology of LEDs and develop a full-circle light package, it will greatly accelerate the power of LEDs to replace traditional light sources and enter traditional lighting applications.

The currently known packaging technology fixes single or several LEDs on the heat-conducting substrate with glue, uses gold wires to connect the positive and negative poles of the LEDs to the heat-conducting substrate, and finally seals the substrate with glue containing fluorescent powder. The light-emitting diode on the top is used to protect the light-emitting diode and mix light to form white light when conducting electricity. This packaging design uses glue to protect the light-emitting diodes, which makes the packaged light-emitting diodes easy to transport and can be changed according to customer needs. However, the glue is a material that is not easy to dissipate heat, and the light-emitting diodes will generate heat during operation. Heat, heat will cause problems such as low efficiency and shortened lifespan for semiconductor materials, and the adhesive material will cause heat accumulation, so the heat must be guided out through the bracket, and the packaging adhesive material will limit the angle of light emission, so it creates a problem after packaging. The characteristics of light-emitting diodes: directional, surface light source, this light type design will lead to different from traditional light sources in lighting use, in the use of some traditional lamps, the lighting effect cannot produce the same comfort as traditional light sources.

U.S. Patent No. US6,576,488 discloses that light-emitting diodes deposit a fluorescent layer on a conductive substrate or a non-conductive substrate through electrophoretic coating technology, or directly attach a fluorescent coating sheet to a chip to improve the performance of light-emitting diodes. Luminous efficacy purpose. However, the manufacturing cost of the electrophoretic coating technology disclosed in this patent is quite expensive, so the cost of the light-emitting diode cannot be reduced, so that the light-emitting diode manufactured by this method does not have a price advantage in the market. In addition, in the method of attaching the fluorescent coated sheet to the chip, the fluorescent coated sheet must be manufactured separately, resulting in a complicated material preparation process, and the steps of attaching the fluorescent coated sheet must be quite precise, and the yield rate is difficult to control, which is relatively cost-effective. Rise in manufacturing costs.

China Taiwan Patent Publication No. TW201222889 discloses the encapsulation method of separated phosphors. The main difference from the traditional encapsulation is that the multi-layer encapsulation colloid is used to coat the light-emitting diodes, because phosphors will have efficiency decay at high temperature, resulting in poor efficiency and color temperature deviation. shift and other phenomena, and the light-emitting diode itself is the main heat source, so this patent uses a multi-layer packaging method, placing phosphor powder on the outermost layer to improve the stability of white light efficiency, but this method will not solve the problem of traditional packaging of light-emitting diodes Directivity and other issues.

Chinese Patent Publication No. CN103322525 is an LED filament packaging method. The blue light emitting diode is placed on a transparent substrate, and the two ends of the transparent substrate are connected to the metal conductor. After the positive and negative electrodes of the light emitting diode are connected to the metal conductor in series, the mixed The encapsulation glue of the phosphor seals the entire transparent substrate, and this method is used to achieve a full-circle light-emitting effect, but the encapsulation glue is still attached to the entire light-emitting diode, which will cause the temperature to be difficult to escape, and the reliability is not good.

In view of the aforementioned problems and shortcomings, the inventors based on years of practical experience and research experiments, and mainly based on the principle of lighting requirements, redefine a new packaging structure, break through the limitations and shortcomings of traditional packaging, and develop a light-emitting diode packaging structure that meets lighting applications .

Contents of the invention

In order to solve the above-mentioned problems in the prior art, the main purpose of the present invention is to provide a light-emitting diode packaging structure, which has better overall luminous efficacy, better uniformity of reflected light and at least one of them.

The light emitting diode package structure of the present invention includes a package shell, a fluorescent layer, a substrate and a light emitting diode chip. The packaging shell has accommodating space. The fluorescent layer is coated on one side of the packaging shell. The substrate is arranged in the containing space. The light emitting diode chip is arranged on the first surface of the substrate, wherein the surface of the light emitting diode chip is not directly covered with a colloid, and the light emitting diode chip and the packaging shell are separated from each other by a distance.

In an embodiment of the present invention, the above-mentioned package housing includes an opening through which the substrate is disposed in the accommodating space, and a sealing element is disposed in the opening for sealing the substrate and the LED chip in the accommodating space.

In an embodiment of the present invention, the above LED packaging structure further includes a medium disposed between the LED chip and the fluorescent layer, wherein the refractive index of the medium is less than or equal to 1.2.

In an embodiment of the present invention, the above-mentioned medium is air.

In an embodiment of the present invention, the above-mentioned connector is electrically connected to the substrate and the LED chip, wherein the connector is disposed on the substrate and extends out of the opening.

In an embodiment of the present invention, the above LED package structure further includes a wire module formed on the substrate, wherein the two wires of the wire module are electrically connected to the LED chip and the two electrodes of the connector.

In an embodiment of the present invention, the material of the sealing element includes any one of plastic, ceramic and epoxy.

In an embodiment of the present invention, the aforementioned substrate is a transparent substrate.

In an embodiment of the present invention, the above-mentioned transparent substrate materials include sapphire (Sapphire), BK7, magnesium fluoride (MgF ₂ ), aluminum nitride (AlN), quartz (Quartz), SF11, LaSFN9, NSF8, selenium Zinc oxide (ZnSe), B270, polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), calcium fluoride (CaF ₂ ), silicon dioxide (SiO ₂ ) and aluminum oxide (Al ₂ O ₃ ) in any one.

In an embodiment of the present invention, the above-mentioned substrate has a second surface, the second surface is opposite to the first surface, and a plurality of microstructures are disposed on the second surface.

In an embodiment of the present invention, the above-mentioned microstructures are any of square microstructures, circular microstructures, triangular microstructures, hexagonal microstructures, cylindrical microstructures, conical microstructures and polygonal microstructures. .

In an embodiment of the present invention, the above-mentioned LED chips are placed upside down on the substrate.

In an embodiment of the present invention, there are multiple light emitting diode chips, and these light emitting diode chips are electrically connected to each other in series, in parallel or in series and parallel.

In an embodiment of the present invention, the above-mentioned package housing includes a first opening and a second opening, and the substrate is disposed in the accommodating space through one of the first opening and the second opening.

In an embodiment of the present invention, the LED packaging structure above further includes a first connector and a second connector electrically connecting the substrate and the LED chip, wherein the first connector and the second connector are disposed on on the substrate and extend outside the first opening and the second opening respectively.

In an embodiment of the present invention, the LED packaging structure above further includes a wire module formed on the substrate, wherein a wire of the wire module is electrically connected to the LED chip and an electrode of the first connector, and a wire of the wire module is electrically connected to an electrode of the first connector. The other wire is electrically connected to the LED chip and an electrode of the second connector.

In an embodiment of the present invention, the above LED package structure further includes a first bonding element and a second bonding element respectively disposed in the first opening and the second opening for sealing the substrate and the LED chip in the in the accommodation space.

In an embodiment of the present invention, the material of the above-mentioned packaging shell includes polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), silicon dioxide (SiO ₂ ), BK7 and glass (Glass) of any kind.

Based on the above, since the surface of the LED chip of the embodiment of the present invention is not directly covered with a glue, and the LED chip and the packaging shell are separated by a distance, the overall luminous efficacy of the LED packaging structure and the uniformity of reflected light are improved. In addition, due to the arrangement of the package shell and the fluorescent layer coated on one side thereof, the package structure of the light emitting diode can provide a full-circle light emitting angle. Since the light emitting diode packaging structure can provide a complete full-circle light emitting angle, the light emitting diode packaging structure can replace traditional lamps and achieve non-inductive replacement.

Compared with the prior art, the embodiment of the present invention has at least the technical effect that the surface of the light-emitting diode chip of the above-mentioned embodiment is not directly covered with a colloid, and the light-emitting diode chip and the packaging shell are separated by a distance D, thereby improving the luminous The overall luminous efficacy of the diode package structure and the uniformity of reflected light. In addition, because the fluorescent layer is far away from the LED chip that generates heat, the fluorescent layer does not directly contact the LED chip, thus improving the reliability of the LED packaging structure and making the manufacturing cost of the LED packaging structure applicable to multiple LED chips , can be greatly reduced. Furthermore, by virtue of the package shell and the fluorescent layer coated on one side thereof, the package structure of the light emitting diode can provide a full-circle light emitting angle. Since the light emitting diode packaging structure can provide a complete full-circle light emitting angle, the light emitting diode packaging structure can replace traditional lamps and achieve non-inductive replacement. In addition, the fluorescent layer coated on one side of the packaging shell can make the light mixing of white light more uniform, and improve the phenomenon of color shift and other phenomena that occur near the critical point of the light emitting angle of the known light emitting diode packaging structure.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a light emitting diode packaging structure according to an embodiment of the present invention.

FIG. 2 is a schematic side view of the LED package structure in FIG. 1 .

FIG. 3 is a flow chart showing a manufacturing process of a light emitting diode packaging structure according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention.

FIG. 5 is a schematic side view of the LED package structure shown in FIG. 4 .

FIG. 6 is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention.

FIG. 7 is a schematic side view of a light emitting diode package structure according to another embodiment of the present invention.

FIG. 8 is a schematic side view of a light emitting diode packaging structure according to another embodiment of the present invention.

FIG. 9 is a schematic side view of a light emitting diode package structure according to another embodiment of the present invention.

FIG. 10 is a schematic diagram of an arrangement of LED chips according to another embodiment of the present invention.

Symbol Description

1, 2, 3: LED packaging structure

10: Encapsulation shell

101: Accommodating space

102: opening

103: First opening

104: Second opening

20: fluorescent layer

30: Substrate

301: First Surface

302: second surface

40, 41, 42, 43, 44: LED chips

45, 46: LED chipset

D: distance

50: connector

51: First connector

52: Second connector

60: wire module

601, 602, 603, 604, 605: wire

70: sealing element

71: first binding element

72: Second binding element

80: Medium

90: Microstructure

detailed description

FIG. 1 is a schematic cross-sectional view of a light emitting diode packaging structure according to an embodiment of the present invention. FIG. 2 is a schematic side view of the LED package structure in FIG. 1 . Please refer to FIG. 1 and FIG. 2 , in the present embodiment, the LED package structure 1 includes a package shell 10 , a fluorescent layer 20 , a substrate 30 and a LED chip 40 . The packaging case 10 has an accommodating space 101 . The fluorescent layer 20 is coated on one side of the packaging shell 10 . The substrate 30 is disposed in the containing space 101 . The LED chip 40 is disposed on a first surface 301 of the substrate 30 and separated from the fluorescent layer 20 by a distance D.

In detail, in this embodiment, the material of the packaging shell 10 includes polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), silicon dioxide (SiO ₂ ), BK7 and glass (Glass) of any kind. The packaging case 10 includes an opening 102 , and the substrate 30 is disposed in the accommodating space 101 through the opening 102 .

In this embodiment, the substrate has a first surface 301 and a second surface 302 , and the second surface 302 is opposite to the first surface 301 . The substrate 30 can be a transparent substrate, the first surface 301 of which is used to carry the LED chips 40 . Transparent substrate materials include sapphire (Sapphire), BK7, magnesium fluoride (MgF ₂ ), aluminum nitride (AlN), quartz (Quartz), SF11, LaSFN9, NSF8, zinc selenide (ZnSe), B270, polymethyl Any one of methyl acrylate (PMMA), polycarbonate (Polycarbonate, PC), calcium fluoride (CaF ₂ ), silicon dioxide (SiO ₂ ), and aluminum oxide (Al ₂ O ₃ ).

The number of LED chips 40 may be multiple, and these LED chips 40 are electrically connected in series, in parallel or in series and parallel. In this embodiment, the LED chips 40 are electrically connected in series, but the invention is not limited thereto. The dominant wavelength of light emitted by the LED chip 40 ranges from greater than or equal to 400 nm to less than or equal to 700 nm. The phosphor layer 20 is coated on the inner surface of the package shell 10 , and the emission wavelength of the phosphor layer 20 is within a range of greater than or equal to 400 nm to less than or equal to 700 nm.

The LED package structure 1 of this embodiment further includes a connector 50 , a wire module 60 , a sealing element 70 and a medium 80 . The connector 50 is electrically connected to the substrate 30 and the LED chip 40 , wherein the connector 50 is disposed on the substrate 30 and extends outside the opening 102 of the packaging case 10 . In one embodiment, the opening 102 is disposed on one end of the packaging case 10 . The wire module 60 is formed on the substrate 30 , wherein the two wires 601 and 602 of the wire module 60 are electrically connected to the LED chip 40 and the two electrodes of the connector 50 . The sealing element 70 is disposed in the opening 102 for sealing the substrate 30 and the LED chip 40 in the accommodating space 101 to protect the substrate 30 and the LED chip 40 from external moisture. The sealing protection of the sealing element 70 can completely isolate water vapor. The material of the sealing element 70 includes any one of plastic, ceramic and epoxy. The medium 80 is disposed between the LED chip 40 and the fluorescent layer 20 , wherein the refractive index of the medium 80 is less than or equal to 1.2. In one embodiment, medium 80 is air.

In addition, please refer to FIG. 2 , in this embodiment, when the light-emitting diode chip 40 is operated by passing an electric current, the light-emitting diode chip 40 is used to emit light L. At this time, since the surface of the LED chip 40 is not directly covered with a colloid, and the LED chip 40 and the packaging shell 10 are separated by a distance D, the overall luminous efficacy of the LED packaging structure 1 and the uniformity of reflected light are improved. In addition, since the fluorescent layer 20 is far away from the light-emitting diode chip 40 of the heat source, the fluorescent layer 20 does not directly contact the light-emitting diode chip 40, thereby improving the reliability of the light-emitting diode packaging structure 1 and making it applicable to the light emission of multiple light-emitting diode chips 40 The manufacturing cost of the diode package structure 1 can be greatly reduced. Furthermore, by means of the package shell 10 and the fluorescent layer 20 coated on one side thereof, the light L emitted by the light emitting diode chip 40 reacts with the fluorescent layer 20 to be converted into white light, and the light emitting diode package structure 1 can provide 360 A white light emitting diode chip 40 with a full-circle light emitting angle of 100 degrees. Since the light emitting diode packaging structure 1 can provide a complete full-circle light emitting angle, the light emitting diode packaging structure 1 can replace traditional lamps and achieve non-inductive replacement. In addition, the fluorescent layer 20 coated on one side of the packaging shell 10 can make the white light mix more uniform, and improve the phenomenon of color shift and the like that occur near the critical point of light emitting angle in the known LED packaging structure.

FIG. 3 is a flow chart showing a manufacturing process of a light emitting diode packaging structure according to an embodiment of the present invention. The present embodiment follows the reference numerals and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar components, and descriptions of the same technical contents are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated. Please refer to FIG. 1 to FIG. 3 . In this embodiment, the manufacturing process of the LED package structure 1 is described as follows. In step (1), firstly, a substrate 30 is provided. In step (2), then, the LED chip 40 is disposed on the first surface 301 of the substrate 30 . In step (3), the fluorescent layer 20 is coated on one side of the packaging shell 10 . In step (4), the substrate 30 is placed in the accommodating space 101 of the packaging case 10, wherein the surface of the light-emitting diode chip 40 is not directly covered with a glue, and the light-emitting diode chip 40 and the packaging case 10 are separated by a distance D, Therefore, the overall luminous efficiency of the LED package structure 1 and the uniformity of reflected light are improved. . In another embodiment, step (1) and step (3) can be interchanged, that is, step (3) is performed first, then step (2), then step (1) and then step (4).

In detail, in one embodiment, in step (2), a plurality of LED chips 40 can be attached to the substrate 30 by using a die bonding machine. In addition, in one embodiment, step (a1) may be performed after step (1) and before step (4). In step (a1), the wire 601 of the wire module 60 is fabricated on the substrate 30 . The production method of the wire 601 can be carried out by printing, electroplating, vacuum electroplating or chemical electroplating, or it can also use semiconductor yellow light lithography process, vacuum evaporation, etching or film removal process to complete the fine line process for precise crystal bonding process . After the step (a1), proceed to the step (a2). In the step (a2), the connector 50 is provided, and the connector 50 is disposed on the substrate 30 to be connected to an external power source.

In addition, step (b) can be performed after step (2). In step (b), a plurality of LED chips 40 are connected with wires 603 through a wire bonding process. In one embodiment, the wire 603 can be a gold wire or an aluminum wire, and the wire 603 can connect a plurality of LED chips 40 in different series and parallel, and the connection method can be adjusted according to different usage conditions. In one embodiment, step (c) can be performed after step (b) and step (a2). In step (c), wire bonding process is used to connect the connector with wire 602 and connect wire 601 with wire 604 . Step (5) can be carried out after step (4). In step (5), a sealing element 70 is provided to seal the substrate 30 and the LED chip 40 in the accommodating space 101 to protect the substrate 30 and the LED chip 40 Not affected by external moisture. The sealing protection of the sealing element 70 can completely isolate water vapor. The arrangement of the packaging shell 10 and the sealing element 70 also protects the light emitting diode chip 40 from the risk of touching the light emitting diode chip 40, so the light emitting diode packaging structure 1 of this embodiment does not need to be provided with known encapsulant to cover the light emitting diode chip 40 , so this embodiment solves the known problems such as poor heat dissipation of the LED packaging structure, directivity of the light source and surface light source caused by the packaging glue.

FIG. 4 is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention. FIG. 5 is a schematic side view of the LED package structure shown in FIG. 4 . The present embodiment follows the reference numerals and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar components, and descriptions of the same technical contents are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated. Please refer to FIG. 4 and FIG. 5 at the same time. The main difference between the LED packaging structure 2 of this embodiment and the LED packaging structure 1 of the previous embodiment is that the LED chip 40 is placed on the substrate 30 upside down. In detail, the process of making loop wires is carried out on the substrate 40 , the wire loops will define the serial-parallel mode of the LED chips 40 , and the inverted LED chips 40 are connected to emit light by wires. Using the packaging process of flip-chip placement, the light-emitting diode chip 40 is placed upside down on the substrate 30. This process can solve the problem of heat storage in the die-bonding glue in the known technology after using the die-bonding glue to fix the light-emitting diode and the substrate. . In this embodiment, the light-emitting diode chip 40 is designed to be placed upside down on the substrate 30 so that the heat dissipation capability of the light-emitting diode chip 40 is faster, the luminous efficiency is better, and the lifetime performance is better.

FIG. 6 is a schematic cross-sectional view of a light emitting diode packaging structure according to another embodiment of the present invention. The present embodiment follows the reference numerals and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar components, and descriptions of the same technical contents are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated. Please refer to FIG. 6 , the main difference between the light emitting diode packaging structure 3 of this embodiment and the light emitting diode packaging structure 1 of the previous embodiment is that the packaging shell 10 includes a first opening 103 and a second opening 104, and the substrate 30 passes through the first opening 104. One of the opening 103 and the second opening 104 is disposed in the accommodating space 101 . In one embodiment, the first opening 103 and the second opening 104 may be respectively disposed on two opposite ends of the packaging case 10 , but the invention is not limited thereto. The first connector 51 and the second connector 52 are electrically connected to the substrate 30 and the light emitting diode chip 40, wherein the first connector 51 and the second connector 52 are disposed on the substrate 30 and respectively extend to the first opening 103 and the second outside the opening 104 . The wire module 60 is formed on the substrate 30, wherein a wire 602 of the wire module 60 is electrically connected to the LED chip 40 and an electrode of the first connector 51, and another wire 605 of the wire module 60 is electrically connected to the LED chip 40 and an electrode of the second connector 52 . In this embodiment, the first connector 51 and the second connector 52 are, for example, a DC power supply, and the electrodes of the first connector 51 and the second connector 52 are, for example, positive and negative poles or negative and positive poles of the DC power supply, respectively. The light-emitting diode chip 40 is connected to the positive and negative poles of the DC power supply to emit light by means of the above-mentioned two-terminal connection method of this embodiment, so that the light-emitting diode packaging structure 3 can have more changes and convenience. A first combining element 71 and a second combining element 72 are arranged in the first opening 103 and the second opening 104 respectively, and are used to seal the substrate 30 and the LED chip 40 in the accommodation space 101, so as to protect the substrate 30 and the second opening 104. The light emitting diode chip 40 is not damaged by external moisture. The sealing protection of the first combining element 71 and the second combining element 72 can completely isolate moisture. The arrangement of the packaging shell 10, the first combination element 71 and the second combination element 72 also protects the light emitting diode chip 40 from the risk of touching the light emitting diode chip 40, so the light emitting diode packaging structure 3 of this embodiment does not need to be provided with The known encapsulation glue is used to cover the light emitting diode chip 40, so this embodiment solves the known problems of heat dissipation of the light emitting diode packaging structure, light source directivity and surface light source caused by the known encapsulation glue.

FIG. 7 is a schematic side view of a light emitting diode package structure according to another embodiment of the present invention. FIG. 8 is a schematic side view of a light emitting diode packaging structure according to another embodiment of the present invention. FIG. 9 is a schematic side view of a light emitting diode package structure according to another embodiment of the present invention. The present embodiment follows the reference numerals and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar components, and descriptions of the same technical contents are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated. Referring to FIG. 7 , FIG. 8 and FIG. 9 , a plurality of microstructures 90 are disposed on the second surface of the substrate 30 . These microstructures 90 can be square microstructures (as shown in Figure 7), circular microstructures (as in Figure 8), triangular microstructures (as in Figure 8), hexagonal microstructures, cylindrical microstructures, conical microstructures and polygonal microstructures. Any kind of microstructure. The distribution of these microstructures 90 can be arranged periodically. When the light L passes through different materials, because the refraction values of the two materials are different, there will be a problem with the light exit angle. When the light exit angle is greater than this, the light L will be limited inside the material. Make different planes to facilitate the escape of light L. With the arrangement of these microstructures 90, changing the critical angle problem faced by the light L when passing through the substrate 30 can increase the light extraction efficiency and light mixing efficiency.

FIG. 10 is a schematic diagram of an arrangement of LED chips according to another embodiment of the present invention. In this embodiment, the LED chips are electrically connected in series and parallel, but the invention is not limited thereto. In other embodiments, the LED chips can be electrically connected to each other in series or in parallel. Specifically, in this embodiment, the LED chips 41 and 42 are connected in series to form a LED chip group 45, the LED chips 43 and 44 are connected in series to form a LED chip group 46, and the LED chip group 45 and 46 are connected in parallel with each other. By virtue of the serial connection, parallel connection or series-parallel connection of the light emitting diode chips, the packaging structure of the light emitting diode can have more changes and convenience in terms of design requirements.

In summary, the surface of the LED chip 40 in the above embodiment is not directly covered with a glue, and the LED chip 40 and the packaging shell 10 are separated by a distance D, thus improving the overall luminous efficacy and reflected light of the LED packaging structure 1 uniformity. In addition, since the fluorescent layer 20 is far away from the light-emitting diode chip 40 of the heat source, the fluorescent layer 20 does not directly contact the light-emitting diode chip 40, thereby improving the reliability of the light-emitting diode packaging structure 1 and making it applicable to the light emission of multiple light-emitting diode chips 40 The manufacturing cost of the diode package structure 1 can be greatly reduced. Furthermore, by virtue of the packaging shell 10 and the fluorescent layer 20 coated on one side thereof, the LED packaging structure 1 can provide a full-circle light emitting angle. Since the light emitting diode packaging structure 1 can provide a complete full-circle light emitting angle, the light emitting diode packaging structure 1 can replace traditional lamps and achieve non-inductive replacement. In addition, the fluorescent layer 20 coated on one side of the packaging shell 10 can make the white light mix more uniform, and improve the phenomenon of color shift and the like that occur near the critical point of light emitting angle in the known LED packaging structure.

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

Claims (17)

1. A light-emitting diode packaging structure, characterized in that, comprising: An encapsulating shell with an accommodating space; a fluorescent layer coated on one side of the packaging shell; a substrate disposed in the accommodating space; and A light-emitting diode chip is arranged on a first surface of the substrate, wherein the surface of the light-emitting diode chip is not directly covered with a colloid, and the light-emitting diode chip and the packaging shell are separated by a distance. 2. The light-emitting diode packaging structure according to claim 1, wherein the package housing includes an opening, the substrate is disposed in the accommodating space through the opening, and a sealing element is disposed in the opening for sealing The substrate and the light-emitting diode chip are in the accommodating space. 3 . The LED packaging structure according to claim 2 , further comprising a medium disposed between the LED chip and the fluorescent layer, wherein the refractive index of the medium is less than or equal to 1.2. 4. The LED packaging structure according to claim 3, wherein the medium is air. 5. The light emitting diode packaging structure according to claim 2, further comprising a connector electrically connecting the substrate and the light emitting diode chip, wherein the connector is disposed on the substrate and extends outside the opening . 6. The light emitting diode packaging structure according to claim 5, further comprising a wire module formed on the substrate, wherein the two wires of the wire module are electrically connected to the light emitting diode chip and the two connectors. electrode. 7. The LED package structure according to claim 2, wherein the material of the sealing element comprises any one of plastic, ceramic and epoxy resin. 8. The LED packaging structure according to claim 1, wherein the substrate is a transparent substrate. 9. The LED packaging structure according to claim 8, wherein the material of the transparent substrate comprises sapphire, BK7, magnesium fluoride, aluminum nitride, quartz, SF11, LaSFN9, NSF8, zinc selenide, B270, Any of polymethyl methacrylate, polycarbonate, calcium fluoride, silica, and alumina. 10 . The light emitting diode packaging structure according to claim 8 , wherein the substrate has a second surface, the second surface is opposite to the first surface, and a plurality of microstructures are disposed on the second surface. 11 . 11. The LED packaging structure according to claim 10, wherein the plurality of microstructures are square microstructures, circular microstructures, triangular microstructures, hexagonal microstructures, cylindrical microstructures, conical microstructures Any of microstructures and polygonal microstructures. 12. The LED package structure according to claim 1, wherein the LED chip is placed upside down on the substrate. 13 . The LED packaging structure according to claim 1 , wherein there are multiple LED chips, and the multiple LED chips are electrically connected in series, in parallel or in series and parallel. 14. The light emitting diode package structure according to claim 1, wherein the package housing comprises a first opening and a second opening, and the substrate is disposed on the substrate through one of the first opening and the second opening. in the accommodation space. 15. The light emitting diode packaging structure according to claim 14, further comprising a first connector and a second connector electrically connecting the substrate and the light emitting diode chip, wherein the first connector and the The second connector is disposed on the substrate and extends outside the first opening and the second opening respectively. 16. The light emitting diode packaging structure according to claim 14, further comprising a first bonding element and a second bonding element respectively disposed in the first opening and the second opening for sealing the The substrate and the light-emitting diode chip are in the accommodating space. 17. The light emitting diode package structure according to claim 1, wherein the material of the package shell comprises any one of polymethyl methacrylate, polycarbonate, silicon dioxide, BK7 and glass.