CN103867914A - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN103867914A CN103867914A CN201210528843.XA CN201210528843A CN103867914A CN 103867914 A CN103867914 A CN 103867914A CN 201210528843 A CN201210528843 A CN 201210528843A CN 103867914 A CN103867914 A CN 103867914A
- Authority
- CN
- China
- Prior art keywords
- radiator
- led lamp
- circuit board
- flexible circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229920001651 Cyanoacrylate Polymers 0.000 abstract 2
- 239000004830 Super Glue Substances 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 6
- 239000004519 grease Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 3
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000017060 Arachis glabrata Nutrition 0.000 description 1
- 241001553178 Arachis glabrata Species 0.000 description 1
- 235000010777 Arachis hypogaea Nutrition 0.000 description 1
- 235000018262 Arachis monticola Nutrition 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 235000020232 peanut Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides an LED lamp and relates to the technical field of LED lamp manufacture. The LED lamp comprises a flexible circuit board and a radiator, wherein the circuit board is arranged under the radiator, and a super glue layer is arranged between the flexible circuit board and the radiator. The flexible circuit board, the LED lamp and the radiator are combined through super glue, a medium with low heat conducting coefficient between the LED lamp and the aluminum profile radiator is decreased as much as possible, the heat conducting performance is improved, the heat radiating speed of the radiator is accelerated, light attenuation is retarded, and the service life of the LED lamp is prolonged.
Description
Technical field
The present invention relates to a kind of manufacturing technology field of LED lamp.
Background technology
Nowadays the LED road lamp on market is all that LED light source is welded on aluminium base, fills heat-conducting silicone grease be fixed on loose device at the aluminium base back side.Such preparation method has several large drawbacks: one, cost is high, and every square metre of the high aluminium base of heat conductivility reaches 1,000 yuan of left and right, adds that heat superconducting silicone grease per kilogram reaches 2,000 yuan of left and right.Two, heat conductivity is poor, because put heat-conducting silicone grease between LED light source bottom and the combination of aluminium base, essential therebetween have a space, has space just to have air, and heat conduction just hinders to some extent.After the large area aluminium base back side fills heat-conducting silicone grease and radiator combination, just certainly have in conjunction with not close place between the two, also just have a lot of air, this brings very large obstruction just to heat conduction.Thereby cause lamp interior junction temperature very high, cause light decay.
Summary of the invention
In order to solve the shortcoming that existing LED lamp cost is high, heat transfer property is poor, the invention provides a kind of LED lamp.
The present invention includes flexible PCB, radiator, described circuit board is arranged on the below of described radiator, and powerful glue-line is set between described flexible PCB and radiator.
The present invention selects PCB FPC, LED lamp installing hole is set on FPC, after LED lamp is welded on FPC, at the good heat superconducting silicone grease of base point of LED lamp, after filling seccotine, the back side of flexible PCB is attached on radiator again, shelled peanut lens are set respectively below each LED lamp again, then load onto stainless steel reflector, stainless steel photophore and radiator are locked by self-tapping screw, with strong sealing glue, safety glass and radiator are cemented again, finally be loaded on sealing ring and aluminium die casting head sealing cover, the present invention uses seccotine to make FPC, LED lamp, radiator is combined closely, reduce the poor medium that obtains of thermal conductivity factor between LED lamp and aluminum profile heat radiator as far as possible, improve heat conductivility, radiator heat-dissipation speed is accelerated, slow down light decay, improve the service life of LED lamp.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present invention.
In figure, 1, flexible PCB, 2, radiator, 3, powerful glue-line.
The specific embodiment
As shown in Figure 1, the present invention includes flexible PCB 1, radiator 2, flexible PCB 1 is arranged on the below of radiator 2, and powerful glue-line 3 is set between flexible PCB 1 and radiator 2.
Claims (1)
1. a LED lamp, comprises flexible PCB, radiator, and described circuit board is arranged on the below of described radiator, it is characterized in that arranging powerful glue-line between described flexible PCB and radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210528843.XA CN103867914A (en) | 2012-12-10 | 2012-12-10 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210528843.XA CN103867914A (en) | 2012-12-10 | 2012-12-10 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103867914A true CN103867914A (en) | 2014-06-18 |
Family
ID=50906753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210528843.XA Pending CN103867914A (en) | 2012-12-10 | 2012-12-10 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103867914A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016161803A1 (en) * | 2015-04-09 | 2016-10-13 | 苏州晶品新材料股份有限公司 | Secondary optical design-based flexible fluorescent substrate and led light source |
| CN110319380A (en) * | 2019-06-21 | 2019-10-11 | 深圳市富高康电子有限公司 | LED decorative lamp |
-
2012
- 2012-12-10 CN CN201210528843.XA patent/CN103867914A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016161803A1 (en) * | 2015-04-09 | 2016-10-13 | 苏州晶品新材料股份有限公司 | Secondary optical design-based flexible fluorescent substrate and led light source |
| CN110319380A (en) * | 2019-06-21 | 2019-10-11 | 深圳市富高康电子有限公司 | LED decorative lamp |
| CN110319380B (en) * | 2019-06-21 | 2020-05-08 | 深圳市富高康电子有限公司 | LED decorative lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140618 |