CN103917499B - The manufacture method of glass substrate - Google Patents
The manufacture method of glass substrate Download PDFInfo
- Publication number
- CN103917499B CN103917499B CN201280050824.9A CN201280050824A CN103917499B CN 103917499 B CN103917499 B CN 103917499B CN 201280050824 A CN201280050824 A CN 201280050824A CN 103917499 B CN103917499 B CN 103917499B
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- chemical
- glass
- glass substrate
- interarea
- glass baseplate
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- 239000011521 glass Substances 0.000 title claims abstract description 237
- 239000000758 substrate Substances 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 113
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 140
- 230000008569 process Effects 0.000 claims abstract description 98
- 238000000227 grinding Methods 0.000 claims abstract description 92
- 239000007788 liquid Substances 0.000 claims abstract description 65
- 238000002347 injection Methods 0.000 claims abstract description 27
- 239000007924 injection Substances 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims description 6
- 230000033228 biological regulation Effects 0.000 claims description 2
- 238000005728 strengthening Methods 0.000 claims 2
- 239000002253 acid Substances 0.000 description 31
- 238000005406 washing Methods 0.000 description 30
- 238000012545 processing Methods 0.000 description 26
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 239000010409 thin film Substances 0.000 description 21
- 238000002203 pretreatment Methods 0.000 description 16
- 239000012530 fluid Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 6
- 238000011068 loading method Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 206010018265 Gigantism Diseases 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides the manufacture method of a kind of glass substrate that the glass baseplate of 1 plate sheet shape can be divided in the chemical abrasive device of single chip mode multiple glass substrate.The present invention applies to the manufacture method of the glass substrate of the chemical abrasive device constituted in the way of the multiple glass substrates transported continuously are carried out chemical grinding process.Chemical abrasive device at least possesses conveying unit and milled processed portion.In this chemical abrasive device, by adjusting the amount of the chemical grinding liquid from the injection of upper lateral glass baseplate and the amount of the chemical grinding liquid from the injection of lower lateral glass baseplate respectively, and make be formed at the subregion groove of the first interarea and be formed at the subregion groove of the second interarea through from the position of the center of the thickness direction of glass baseplate deviation ormal weight.
Description
Technical field
The present invention relates to the manufacture method of the glass substrate of a kind of chemical abrasive device being applicable to and being constituted in the way of the multiple glass substrates transported continuously are carried out chemical grinding process.
Background technology
In order to by glass substrate slimming, in general need to use the chemical grinding liquid containing Fluohydric acid. that glass substrate is carried out chemical grinding process.Process as this kind of chemical grinding, the batch-type chemical grinding that the glass substrate that should process is impregnated in the groove adding chemical grinding liquid the stipulated time and the one chip chemical grinding spraying chemical grinding liquid while being transported successively by the glass substrate that should process carrying roller can be enumerated.
In the middle of the mode of these chemical grindings, for the grinding of batch mode, in lapping liquid bath, impregnate the stipulated time by the glass substrate that will should process and by thinning glass substrate to the most required thickness of slab, having can be with the advantage of the substantial amounts of glass substrate of single treatment.But, the grinding of batch mode at least has problem below.
First, in the grinding of batch mode, lapping liquid bath opens wide upward, thus structurally, has the problem that the surrounding of lapping liquid bath becomes dense Fluohydric acid. atmosphere.Particularly, in the case of the lapping liquid of lapping liquid bath is carried out bubbling process, there are gasiform Fluohydric acid. easily to the problem around spread.The operator carrying out operating in this kind of Fluohydric acid. atmosphere just operates without the suitable protection-gear of outfit with oneself, it is possible to cause damage health.Thus, the cost of the protection-gear paid for operator uprises.
It addition, in the grinding of batch mode, in order to the surrounding of lapping liquid bath being eliminated dense Fluohydric acid. atmosphere, it is desirable to have exhaust equipments such as the aircleaners of strength, thus increase equipment cost.Additionally, be also easy to produce the corrosion of equipment because of hydrofluoric acid gas, the most also can the appropriate anti-corrosion treatment of promising enforcement and strengthen cost, become problem that is big and that strengthen cost because the replacement frequency of equipment.
So, in recent years, there is the situation that the chemical grinding using single chip mode processes.Such as, in the middle of conventional art, there are the flat panel display glass substrate Etaching device of following composition, i.e., utilization can make the fixture longitudinally support glass substrate that glass substrate adheres to, to glass substrate injection chemical grinding liquid (referring for example to patent documentation 1 while transporting this fixture.).
Citation
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2008-266135 publication
Summary of the invention
The summary of invention
Invent problem to be solved
But, in technology described in patent documentation 1, due to be by by glass substrate with plumbness support while process in the way of constituted, thus while the slimming of glass substrate can be implemented rightly, but have the best situation being unsuitable for that the glass baseplate of 1 plate sheet shape is divided into the process of multiple glass substrate.Its reason is because, and in the case of being configured with plumbness by glass substrate, when glass is divided into multiple small pieces, the small pieces being partitioned into will fall because of gravity.Thus, it is impossible to be used for the technology described in patent documentation 1 obtaining from large-scale glass baseplate in the process of multiple glass substrate.
The present invention completes in view of the above-mentioned problems, it is provided that the manufacture method of a kind of glass substrate, in the chemical abrasive device of single chip mode, the glass baseplate of 1 plate sheet shape can be divided into multiple glass substrate.
For the method solving problem
The present invention provides the manufacture method of the glass substrate of a kind of chemical abrasive device being applicable to and being constituted in the way of the multiple glass substrates transported continuously are carried out chemical grinding process.Chemical abrasive device at least possesses conveying unit and milled processed portion.Conveying unit possesses multiple carrying rollers of following composition, i.e. by transport in the horizontal direction as being formed with the glass baseplate of resist layer at the first interarea and the second interarea in the way of the blueline of the position that should cut across opening.Milled processed portion from above-below direction to transported by conveying unit glass baseplate injection chemical grinding liquid and etch the blueline of glass baseplate.
In this kind of chemical abrasive device, by adjusting the amount of the chemical grinding liquid from the injection of upper lateral glass baseplate and the amount of chemical grinding liquid from the injection of lower lateral glass baseplate respectively, and make the subregion groove being formed in the first interarea and the subregion groove that is formed in the second interarea through from the position of the center of the thickness direction of glass baseplate deviation ormal weight.
In this composition, it is possible to prevent the subregion groove being formed in the first interarea and the subregion groove that is formed in the second interarea through in the center of the thickness direction of glass baseplate.Thus, even if in the case of glass baseplate has been carried out the intensive treatment such as chemical intensification treatment in advance, it is also possible to do not produce and the ground such as rupture glass baseplate is divided into multiple glass substrate.Processing further, since the chemical abrasive device of one chip can be utilized to carry out this kind, the safety therefore operated improves.
The effect of invention
According to the above-mentioned present invention, in the chemical abrasive device of single chip mode, the glass baseplate of 1 plate sheet shape can be divided into multiple glass substrate.
Accompanying drawing explanation
Fig. 1 is the figure of the outward appearance of the one chip chemical abrasive device representing embodiments of the present invention.
Fig. 2 is the figure of the schematic configuration representing one chip chemical abrasive device.
Fig. 3 is the figure of the schematic configuration representing one chip chemical abrasive device.
Fig. 4 is the figure of the schematic configuration representing the first process chamber.
Fig. 5 is the figure of the schematic configuration representing treatment fluid feed mechanism.
Fig. 6 is the figure of the schematic configuration representing crank mechanism.
Fig. 7 is the figure that the process in pre-treatment room is described.
Fig. 8 is the figure representing and utilizing a chemical abrasive device example of the general survey of the glass baseplate of cutting process in addition.
Fig. 9 is the figure representing and utilizing a chemical abrasive device example of the general survey of the glass baseplate of cutting process in addition.
Figure 10 is the figure representing and utilizing chemical abrasive device another example of the general survey of the glass baseplate of cutting process in addition.
Figure 11 is the figure of the example of glass tray used in the embodiment of the manufacture method representing glass substrate.
Figure 12 is the figure representing the state housing glass baseplate in glass tray.
Figure 13 is the figure of the state that the glass tray representing and containing glass baseplate is transported.
Figure 14 is the figure representing the state by the subregion groove depth of the interarea of glass baseplate.
Figure 15 is the figure representing the state by the subregion groove depth of the interarea of glass baseplate.
Detailed description of the invention
Fig. 1 is the figure of the outward appearance of the chemical abrasive device 10 of the one chip of the example representing embodiments of the present invention.It addition, Fig. 2 and Fig. 3 is the figure of the schematic configuration representing chemical abrasive device 10.As shown in FIG. 1 to 3, chemical abrasive device 10 possesses loading unit 12, pre-treatment room the 14, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber the 22, first transhipment department the 28, second transhipment department the 30, the 3rd transhipment department 32, washing room 24, takes out of portion 26, treatment fluid resettlement section 42, treatment fluid supply unit 44 and water supply unit 46.
Loading unit 12 can receive the manual operation by operator or mechanical hand etc. be automatically brought into operation move into should slimming process glass substrate 100.Pre-treatment room 14 receives the glass substrate 100 moved from loading unit 12.First process chamber 16 to the top and bottom of glass substrate 100 injection chemical grinding liquid and by glass substrate slimming.Second process chamber 18, the 3rd process chamber 20 and fourth processing chamber 22 respectively to the injection of the top and bottom of glass substrate and the chemical grinding liquid of the first process chamber 16 same composition by further for glass substrate slimming.Multiple process chambers are linked up by first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 respectively.Glass substrate 100 via fourth processing chamber 22 is washed by washing room 24.Take out of portion 26 to take out have passed through the glass substrate 100 that chemical grinding processes and washing processes.Being automatically brought into operation of manual operation or mechanical hand etc. utilizing operator is moved out in the glass substrate 100 chemically lapping device 10 that arrival takes out of portion 26 and is reclaimed.Thereafter, in the case of the further slimming of needs, glass substrate 100 is imported again chemical abrasive device 10, and in the case of need not further slimming, then transfers to the operation of the back segments such as film formation process.
Treatment fluid resettlement section 42 is connected with first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber 22 by recovery line 420.Treatment fluid supply unit 44 is connected with first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber the 22, first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 by feed flow pipeline 440.Water supply unit 46 is connected with pre-treatment room 14 and washing room 24 by water supply line 460.And, in Fig. 1, the water supply line 460 for recovery line 420, feed flow pipeline 440 and the rinse water of chemical abrasive device 10 eliminates diagram.
In above-mentioned chemical abrasive device 10, in addition to importing the working place of a part for the introducing port 200 of pre-treatment room 14, the export mouth 300 derived from washing room 24 and crank mechanism described later 36, pre-treatment room the 14, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber the 22, first transhipment department the 28, second transhipment department the 30, the 3rd transhipment department and washing room 24 are closed as overall air-tightness and watertightness.Introducing port 200 and export mouth 300 present height slightly larger than the thickness of slab of glass substrate 100, width slightly larger than the shape of slit of width of glass substrate 100.It addition, ground, through each portion is configured with multiple carrying roller 50 at grade.Each carrying roller 50 is formed in the carrying channel transported while the bottom surface of support glass substrate 100 to diagram right.
Here, conveyance speed should be preferably set to 100～800mm/ minute, is more preferably set as 300～550mm/ minute.Additionally, the process time in first process chamber the 16, second process chamber the 18, the 3rd process chamber 20 and fourth processing chamber 22 is set as adding up to about 20 minutes in this embodiment, but it is not limited to this.It addition, if conveyance speed is the slowest beyond above-mentioned scope, the most not only production efficiency is poor, and chemical grinding liquid is easily detained over the glass substrate 100, thus hinders uniform chemical grinding, in worst case, it is possible to rupturing of induction glass substrate 100.On the other hand, under identical unit scale, want to improve conveyance speed, then the liquid composition realizing this purpose is just difficult to optimization, and result is to be difficult to uniform chemical grinding.
The glass substrate 100 utilizing chemical abrasive device 10 to carry out slimming process is not particularly limited, but open the large-size glass substrate such as (1080 × 1230mm) and G6 size (1500 × 1800mm) even for the four of G8 size, chemical abrasive device 10 can also grind its upper and lower surface equably.It addition, to be constituted chemical abrasive device 10 directly with carrying roller 50 in the way of transporting glass substrate 100 with not using fixture or carrier.
As mentioned above, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber the 22, first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 connect with the treatment fluid supply unit 44 having carried out temperature treatment via feed flow pipeline 440, are supplied to each room with about 40～42 DEG C by the chemical grinding liquid for the treatment of fluid supply unit 44.Here, the composition of chemical grinding liquid be preferably set to Fluohydric acid. 1～20 weight %, hydrochloric acid 0～10 weight %, remaining as water liquid form.
It addition, pre-treatment room 14 and washing room 24 connect with water supply unit 46 via water supply line 460, rinse water is supplied to each room.And, process chamber 14 is discharged to sewage treatment equipment with the cleaning waste water of discharge in washing room 24 in the past.
On the other hand, as it has been described above, the bottom of first process chamber the 16, second process chamber the 18, the 3rd process chamber 20 and fourth processing chamber 22 connects with treatment fluid resettlement section 42 via recovery line 420 so that milled processed water is recycled.Owing to the bottom of first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 is respectively provided with the bottom tilted towards adjacent process chamber, therefore the treatment fluid in first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 can be guided adjacent process chamber swimmingly.And, the milled processed water being recovered is after the precipitation and other process of reaction product, if the state that can recycle, then it is sent to treatment fluid supply unit 44, in the case of the state that can not recycle, is then transferred to liquid waste processing operation as thick waste liquid.
It addition, as it is shown on figure 3, pre-treatment room the 14, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber 22 and washing room 24 connect with exhaust portion 34 via exhaust line 340, the internal gas of each room is aspirated to exhaust portion 34.Here, owing to exhaust line 340 plays consistently effect, thus by import the introducing port 200 of pre-treatment room 14, the export mouth 300 derived from washing room 24, be formed at crank mechanism 36 a part opening be maintained negative pressure state, do not have and process the situation that gas spills through these openings.
As shown in Figures 4 and 5, in first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber 22 and washing room 24, the upper-lower position at carrying roller 50 is each configured with one group of (10) playpipe 444 (444U, 444L) extended along the conveyance direction of glass substrate 100.The hollow pitch tube that each playpipe 444 is vinyl chloride or Teflon (registered trade mark) is made, in a playpipe, is formed with multiple injection nozzle 446 with forming a line.Additionally, spray chemical grinding liquid to the above injection chemical grinding liquid of glass substrate 100, the downside playpipe 444L on the downside of being configured to the bottom surface of glass substrate 100 from the upside playpipe 444U being configured at upside.On the other hand, from the upside playpipe 242U being configured at washing room 24 to the above jet cleaning water of glass substrate, from downside playpipe 242L to the bottom surface jet cleaning water of glass substrate 100.And, in first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32, it is respectively equipped with playpipe 282 (282U, 282L), playpipe 302 (302U, 302L) and playpipe 322 (322U, 322L), sprays to the above of glass substrate 100 and bottom surface and first～the chemical grinding liquid of fourth processing chamber 18,20,22,24 same composition.
Be configured at playpipe 282 (282U, 282L), playpipe 302 (302U, 302L) and playpipe 322 (322U, 322L) in first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 and be configured at washing room 24 in playpipe (242U, 242L) be retained as stationary state.And each playpipe 444 being configured in first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber 22 utilizes crank mechanism 36 to swing.
As shown in Fig. 5 (A) and Fig. 5 (B), in this embodiment, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20 and fourth processing chamber 22 are each configured with 10 playpipes 444 (444U, 444L) in the upside of glass substrate 100 and downside.Fig. 5 (A) is the top view of playpipe 444 (444U, 444L), in each playpipe 444 (444U, 444L), is formed with such as 8 injection nozzles 446.
The head end side (on the downside of diagram) of each playpipe 444 (444U, 444L) is closed, and is provided with hydraulic control portion at its base end side.Hydraulic control portion is made up of the open and close valve 442 (442U, 442L) with playpipe 444 (444U, 444L) same number (10), by adjusting the aperture of each open and close valve 442 (442U, 442L), can at random set the hydraulic pressure of the chemical grinding liquid supplied to each playpipe 444 (444U, 444L).For example, it is possible to the hydraulic pressure of upside playpipe 444U Yu downside playpipe 444L is arranged hydraulic pressure difference, or in the playpipe 444 (444U, 444L) of end, hydraulic pressure is arranged hydraulic pressure difference at the playpipe 444 (444U, 444L) of central authorities.Furthermore, it is possible to utilize the above measuring instruments 38 being configured at chemical abrasive device 10 to confirm the hydraulic pressure of the chemical grinding liquid supplied to each playpipe 444 (444U, 444L).
In this embodiment, the hydraulic pressure of the playpipe 444 (444U, 444L) of middle position is set as more bigger than the playpipe 444 (444U, 444L) of peripheral position, contact pressure or the emitted dose of the middle position to glass substrate 100 are set as more slightly higher than the contact pressure of the peripheral position to glass substrate 100 or emitted dose.Thus, the chemical grinding liquid of the middle position being ejected into glass substrate 100 will move to the peripheral position of glass substrate swimmingly so that chemical grinding liquid is difficult to remain in above glass substrate 100.As a result of which it is, have approximately equal amounts of chemical grinding liquid in 100 whole effects of glass substrate, thus it is prone to whole of grinding glass substrate 100 equably.And, even if at the hydraulic pressure changing playpipe 444 (444U, 444L) the most in the direction of the width, chemical grinding liquid be also not detained in glass substrate 100 above in the case of, then it is not absolutely required to change in the direction of the width the hydraulic pressure of playpipe 444 (444U, 444L), the hydraulic pressure of all of playpipe 444 (444U, 444L) is set as homogeneous.
It addition, each playpipe 444 (444U, 444L) is because its two ends are by the rotatably shaft support such as bearing, and can be by crank mechanism 36 with about ± 30 ° of swings (oscillation) (with reference to Fig. 5 (B)).And, Fig. 5 (B) is to represent the figure of pendulum angle rather than represent the figure of spray regime of chemical grinding liquid.That is, due to from the injection nozzle 446 of playpipe 444 with horn-like ejection chemical grinding liquid, therefore its spray regime be more than pendulum angle.
Crank mechanism 36 is as shown in Fig. 6 (A) and Fig. 6 (B), possess driving motor 362 and transmission mechanism portion 364, the revolving force driving motor 362 is converted to the power making playpipe 444 (444U, 444L) swing by this transmission mechanism portion 364, transmits to playpipe 444 (444U, 444L).The revolving force driving motor 362 is transmitted to swing arm 366 as the power making swing arm 366 swing via delivery arm.Swing arm 366 is supported by with rotary state by the support 368 of the inner wall part being located at chemical abrasive device 10.
On the other hand, the next door of the through process chamber in end of each playpipe 444 (444U, 444L), in the part in the outside being positioned at process chamber, it is provided with for transmission moment of torsion delivery arm 372,376 of necessary moment of torsion for the swing of playpipe 444 (444U, 444L).Moment of torsion delivery arm 372,376 is respectively by keeping arm 370,374 with rotary state support.Arm 370,374 is kept to link with swing arm 366 with the state that can rotate and can slide.
When utilizing the revolving force driving motor 362 to make swing arm 366 swing, keep arm 370,374 will swing the most as shown by the arrow with swing arm 366.The power carrying out self-sustaining arm 370 is transmitted as moment of torsion upwards side playpipe 444U via moment of torsion delivery arm 372.It addition, the power carrying out self-sustaining arm 374 is transmitted as moment of torsion downward side playpipe 444L via moment of torsion delivery arm 376.As a result of which it is, as shown in Fig. 6 (A) and Fig. 6 (B), upside playpipe 444U and downside playpipe 444L will be along the direction orthogonal with the conveyance direction of glass substrate 100 and rotate in opposite directions relative to one another about ± 30 °.And, drive the rotating speed of motor 362 to define the number of oscillations of playpipe 444 (444U, 444L), and in this embodiment, be 10～about 30rpm by the speed setting of driving motor.
In the playpipe 444U of upside, define injection nozzle 446U in its lower section, in the playpipe 444L of downside, it is formed thereon injection nozzle 446L, the most each injection nozzle is while rotating about ± 30 °, to the top and bottom of glass substrate injection chemical grinding liquid (with reference to Fig. 5 (B)).
Incidentally, in present embodiment, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20 and the fourth processing chamber 22 that perform identical chemical grinding by utilizing identical liquid to form mutually dividedly are arranged audaciously.Its reason is because, and by reducing the length of playpipe 444 (444U, 444L), prevents the bending of playpipe 444 (444U, 444L), and makes playpipe 444 (444U, 444L) swing swimmingly.Additionally also as, lower the impact that caused by the thermal expansion of playpipe 444 (444U, 444L).By taking this kind to constitute, it is possible to playpipe 444 (444U, 444L) and the distance of glass substrate 100 are remained homogeneous, is easily adjusted the hydraulic pressure of the chemical grinding liquid sprayed to glass substrate 100.It addition, because playpipe 444 (444U, 444L) swings swimmingly, and chemical grinding liquid can be made to flow down swimmingly from the above of glass substrate 100, thus chemical grinding liquid is just difficult to remain in above glass substrate 100.And, although the length of playpipe 444 (444U, 444L) is also relevant with caliber (liquor charging amount), but in general, it is preferred to be limited to below 2.5m, is more preferably limited to below 2m.
In order at high speed glass substrate 100 be carried out chemical grinding, the when of needing the liquor charging amount increasing the chemical grinding liquid of warm-up mode, by being suitable length by the length limitation of playpipe 444 (444U, 444L), just need not maximize driving motor 362 largely, and simple mechanism can be utilized to make multiple playpipe 444 (444U, 444L) swing swimmingly.
It follows that use Fig. 7 (A)～Fig. 7 (C) that the composition of pre-treatment room 14 is illustrated.As it was previously stated, in pre-treatment room 14, be closely configured with, with the first process chamber 16, the crank mechanism 36 making playpipe 444 (444U, 444L) swing.In addition to above-mentioned composition, in pre-treatment room 14, it is configured with the opposed roll 146 of receiving glass substrate 100 and the washing nozzle 142,144 to the top and bottom of glass substrate 100 injection water at glass substrate 100 to the introducing port that the first process chamber 16 imports.Zone Full in the direction (width) orthogonal with the conveyance direction of glass substrate 100 is equipped with multiple washing nozzle 142,144 at a prescribed interval.Here, set in the way of glass substrate 100 is gently remain importing the first process chamber 16 with opposed roll 146 and carrying roller 50 and contact pressure.
It addition, washing nozzle 142,144 to be set as the introducing port injection water imported towards glass substrate 100 to the first process chamber 16.Thus, importing to the glass substrate 100 in the first process chamber 16 is state moistening fully, is possible to prevent to produce uneven initial stage etching.I.e.; first process chamber 16 is hydrofluoric acid gas atmosphere; if therefore the surface of glass substrate 100 is drying regime; then have the danger corroded unevenly by hydrofluoric acid gas; but in the present embodiment; owing to the surface water conservation of glass substrate 100 being got up, uniform etching can be started the most thereafter in the first process chamber 16.
In present embodiment, as shown in Fig. 7 (A)～Fig. 7 (C), washing nozzle 142 is to be constituted in the way of underface injection water, and washing nozzle 144 is upward and to be constituted in the way of spraying water obliquely towards the upstream side of the carrying channel of glass substrate 100.The result that washing nozzle 144 is constituted in the way of spraying water obliquely upward is, when glass substrate 100 is close to washing nozzle 142,144, as shown in Fig. 7 (A) and Fig. 7 (B), feedwater can be supplied from washing nozzle 144 to the above of glass substrate 100.Thus, it is possible on glass substrate 100, rapidly form the film of the water of impact for protecteding from hydrofluoric acid gas.And, when glass substrate 100 is close to washing nozzle 144, from washing nozzle 144, the water of injection will get to the bottom surface of glass substrate 100, washing nozzle 144 therefore can be utilized to clean the bottom surface of glass substrate 100 rightly, and can be allowed to moisten rightly.
As it has been described above, by arranging washing nozzle 142,144 in pre-treatment room 14, be possible to prevent the glass substrate 100 of drying regime to be exposed in hydrofluoric acid gas and etched unevenly.Furthermore it is also possible to prevent glass substrate 100 from being sandwiched by opposed roll 146 and carrying roller 50 in the dry state, therefore it is possible to prevent by time between opposed roll 146 and carrying roller 50, in glass substrate 100, generation damages or glass substrate 100 is stained.
It follows that first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 are illustrated.In first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32, the upper-lower position at carrying channel is configured with the playpipe 282 of stationary state, playpipe 302 and playpipe 322 respectively.Additionally, spray chemical grinding liquid from playpipe 282, playpipe 302, playpipe 322 to the top and bottom of glass substrate 100.In this embodiment, playpipe 282, playpipe 302 and playpipe 322 respectively constitute the lapping liquid injection equipment of the present invention.
Here, the white space in although first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32 can also being processed as glass grinding, but in these the first transhipment department 28, second transhipment departments 30 and the 3rd transhipment department 32, also spray the chemical grinding liquid of same composition the most audaciously to glass substrate 100.Thus, just do not worry that when by first transhipment department the 28, second transhipment department 30 and three transhipment departments 32 chemical grinding liquid is detained that glass substrate 100 becomes to be dried a little, such that it is able to realize the glass grinding of high-quality on the glass substrate or on the contrary when by first transhipment department the 28, second transhipment department 30 and three transhipment departments 32.And, although first transhipment department the 28, second transhipment department 30 and the playpipe 282 of the 3rd transhipment department 32, playpipe 302 and playpipe 322 are stationary state, but may not be fixed, but take shuttle-type composition.
Glass substrate 100 passes sequentially through first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber the 22, first transhipment department the 28, second transhipment department 30 and the 3rd transhipment department 32, by turn chemical grinding.Hereafter, the glass substrate 100 of the chemical grinding finishing multiple stage is being carried out after discharge opeing above processes by the air knife 244 of the outlet being configured at fourth processing chamber 22, is cleaned by from the rinse water that receives of one group of playpipe 242 being configured in washing room 24.The playpipe 242 cleaned is stationary state, but can also take the composition being allowed to swing.
In any case, at the latter end of cleaning treatment, it is configured with upper and lower a pair air knife 246, utilizes the air sprayed from which promptly to be dried the top and bottom of glass substrate 100.Hereafter, from washing room 24 export mouth 300 discharge glass substrate by etc. stay in the portion of taking out of 26 operator take out, complete a series of processed.Air knife 244 is configured separately, it is possible to above from glass substrate 100 promptly removes chemical grinding liquid, therefore can be effectively prevented the above of glass substrate 100 and be etched unevenly by leading portion at upper and lower a pair air knife 246 like this.
As mentioned above, chemical abrasive device 10 according to present embodiment, owing to carrying out chemical grinding in the space enclosed, being reclaimed with utilizing the exhaust gear almost all such as aircleaner by the poisonous gases such as the hydrofluoric acid gas produced in device, therefore hydrofluoric acid gas is essentially without being diffused into around chemistry monolithic devices 10.As a result of which it is, the operating environment around chemical abrasive device 10 is significantly improved compared with the situation that batch-type chemical grinding processes.So, do not worry the healthy deterioration of operator, and also without spending cost in protection-gear.
Additionally, due to be possible to prevent the equipment of the surrounding of chemical abrasive device 10 to be corroded by hydrofluoric acid gas, the maintenance cost of equipment therefore can also be reduced.That is, it may be said that having can be with cheap maintenance expense for providing the biggest benefit of operating environment good for operator.
Additionally, in the case of the chemical abrasive device 10 using single chip mode, compared with the milled processed of batch mode, there is the advantage that can improve operating efficiency, product quality.And, according to chemical abrasive device 10, owing to thickness of slab precision improves, it is therefore contemplated that yield rate during scribing is stable.It addition, for facet planar strength, can be allowed to be better than the milled processed of batch mode.Additionally, due to the Fluohydric acid. loss not caused by bubbling, therefore can expect to obtain the effect of Fluohydric acid. cost cutting about 15%.
It follows that be divided into the process of multiple glass substrate illustrate using chemical abrasive device 10 to cut the glass baseplate of 1 plate sheet shape.Fig. 8 (A) and Fig. 8 (B) represents the general survey of the glass baseplate 102 utilizing chemical abrasive device 10 to carry out processing.Glass baseplate 102 is imported into chemical abrasive device 10 while the first glass support part 70 being made up of with clathrate the component that polrvinyl chloride etc. such as has hydrofluoric acid resistance and the second supporting member 72 support.As the raw-material example of glass baseplate 102, can enumerate by the slim alumina silicate glass turning to thickness of slab about 0.5mm～1.2mm.In the potassium nitrate fuse salt of about 350～450 DEG C, glass baseplate 102 is carried out chemical intensification treatment.
After glass baseplate is carried out chemical intensification treatment; form multiple chip areas (use region) and the cover layer (overcoatlayer) of protection chip area of the sensor element etc. with touch panel in the first interarea side, form acid proof resist layer at the first interarea and the second interarea the most again.Resist layer is to be formed across opening in the way of live width 1mm in subregion said chip region～the partitioned area of about 5mm.For hydrofluoric acid resistant etching resist used in resist layer, it is possible to use various resists, employ Nippon Paint Co., Ltd.'s system " オ プ ト " (registered trade mark) the most in this embodiment.
By glass baseplate 102 first glass support part 70 and the second supporting member 72 are sandwiched, import loading unit 12, and by glass baseplate 102 via pre-treatment room 14, first～fourth processing chamber 16,18,20,22 and washing room 24, guide discharge portion 26.Assume, in the case of glass baseplate 102 is not to strengthen complete glass, to process by the first interarea of glass baseplate 102 and the second interarea are implemented identical chemical grinding, it is possible to split glass baseplate 102 rightly with partitioned area.
But, in the case of glass baseplate 102 is chemical enhanced complete glass, when the first interarea and the second interarea being implemented identical chemical grinding and processing, the subregion groove depth of the first interarea and the second interarea will be made because of chemical grinding, likely produce in glass baseplate 102 when they occur through and rupture.For its reason, although illustrate the most exactly, however according to multiple experiments as a result, it is possible to be considered following reason.I.e., as a rule, in the case of etching the first interarea and second interarea of glass baseplate 102 at the same time, subregion groove is at the through of the thickness direction of glass baseplate 102.
Here, for chemically reinforced glass, two ends (surface) at thickness direction form compressive stress layers, and when the central part (internal) of thickness direction forms tension stress layer, it is believed that the centre pull stress at thickness direction is the strongest.If subregion groove is through at the position that this tensile stress is the strongest, then can make the change gigantism of the internal stress produced while through, it is contemplated that glass baseplate 102 ruptures.
Here, utilize the function of chemical abrasive device 10, as shown in Fig. 9 (A) and Fig. 9 (B), make subregion groove through in the position of the side-play amount 106 of the centrage 105 deviation regulation the strongest from tensile stress.For this side-play amount 106, for in principle, σ c is set to compression stress [MPa], DOL is set to the thickness [μm] of chemical enhanced layer, T is set to thickness of slab [μm] and σ T is set to CT value (CalculatedTensileStress) [MPa] time, utilization experiment illustrates, needs are set as raising along with CT value and becoming big, and described CT value is the value of the σ T utilizing following formula to calculate.
[several 1]
For its reason it is believed that be because, increase side-play amount 106 and away from centrage, the tensile stress of the inside of glass baseplate 102 the most reduces.And on the other hand, in the case of side-play amount 106 increases to more than required degree, intensity or design are likely to decrease, accordingly, it can be said that preferably side-play amount 106 is set to the least in the scope ruptured being possible to prevent generation glass baseplate 102.Such as, if the thickness of slab of glass baseplate 10 is 0.5mm～about 1.2mm and within CT value is about 30, then by side-play amount 106 is set as 50 μm～100 μm it is prevented that the rupturing of glass baseplate 102.
In chemical abrasive device 10, in order to adjust above-mentioned side-play amount 106, such as, the extent of the hydraulic pressure of upside playpipe 444U and downside playpipe 444L can be adjusted, or playpipe 444L on the downside of utilizing is only below to carry out chemical grinding process in the way of the in-depth of the amount propelling subregion groove being equivalent to side-play amount 106.Generally speaking, by suitably adjusting the aperture of each open and close valve 442 (442U, 442L) constituting hydraulic control portion, it is possible to prevent the subregion groove of the first interarea of glass baseplate 102 and the subregion groove of the second interarea at the through of the thickness direction of glass baseplate 102.
The glass substrate completing end face processing is immersed in the peel groove of the alkalescence strippers such as the mixed liquor that adds sodium hydroxide or TMAH (Tetramethylammonium hydroxide) with DMI (DMI), resist layer is peeled off.By carrying out above process, it is possible to as shown in Fig. 9 (C), chemically strengthen in complete glass baseplate stably and effectively obtain multiple glass substrate 104.
It follows that use Figure 10, the glass baseplate 102 cutting 1 plate sheet shape in chemical abrasive device 10 is divided into other examples of the embodiment of the process of multiple glass substrate 104 and illustrates.In this embodiment, do not use the first glass support part 70 and the second supporting member 72.First, glass baseplate 102 is directly placed on carrying roller 50, first interarea and the second interarea two sides is carried out chemical grinding process.Hereafter, in the desired amount of stage in the subregion groove depth by the subregion groove of the first interarea and the second interarea, acid resistance thin film 64 is attached in the face of the side contacted with carrying roller 50.Hereafter, when the interarea being pasted with acid resistance thin film 64 being set to downside, by glass baseplate 102 placing on carrying roller 50.
Preferably acid resistance thin film 64 is attached in the way of not being mixed into air between itself and glass baseplate.In this embodiment, use glass laminated machine to carry out the attaching of acid resistance thin film, but be not limited to this.It addition, here, as acid resistance thin film 64, employ the resin film that the PET (polyethylene terephthalate) about by thick 50～150 μm makes, but other raw-material thin film can also be used.In the interarea that addition of acid resistance thin film 64, even if the injection being ground liquid further also will not cause the in-depth of subregion groove, therefore create a difference in terms of the degree of depth of the subregion groove of the first interarea and the subregion groove of the second interarea.And, after additional acid resistance thin film 64, the injection upper and lower which side to carry out chemical grinding liquid from is the most no problem, but from the viewpoint of minimizing makes fluid volume, the most only carries out the injection of chemical grinding liquid from upside.
According to this embodiment, the subregion groove of the first interarea and the subregion groove of the second interarea can be prevented rightly at the through of the thickness direction of glass baseplate 102.Thus, it is possible to prevent the subregion groove of the first interarea and the subregion groove of the second interarea from producing situation about rupturing in glass baseplate 102 when occurring through.Additionally, also can be close to acid resistance thin film 64 due to glass substrate 104 each after glass component 102 is divided into multiple glass substrate 104 and can be disposed as 1 plate sheet on apparent, the most easily carry out the disposal of the glass substrate 104 discharged in chemically lapping device 10.And, acid resistance thin film 64 used in this embodiment uses the material with toughness the most as far as possible.Its reason is because, and in the case of the toughness of acid resistance thin film 64 is low, the acid resistance thin film 64 on carrying roller 50 will bend, and multiple glass substrates 104 likely scatter.In the case of the toughness of acid resistance thin film 64 is low, it is also possible to attach plank or the framework etc. for adding obdurability on acid resistance thin film 64.
Additionally, use Figure 11～Figure 15, the glass baseplate 102 cutting 1 plate sheet shape in chemical abrasive device 10 is divided into other examples of the embodiment of the process of multiple glass substrate 104 and illustrates.In this embodiment, for glass baseplate 102, being directly to be placed on glass baseplate 102, on carrying roller 50, first interarea and the second interarea two sides carry out chemical grinding process at first, this point is identical with embodiment above.In this embodiment, also it is the desired amount of stage in the subregion groove depth by the subregion groove of the first interarea and the second interarea, attaches acid resistance thin film 64 at the first interarea or the second interarea.
Additionally, in this embodiment, employ the glass tray 60 it supported from the lower section of glass baseplate 102.Glass tray 60 is made by possessing acid proof resin raw material (being polrvinyl chloride in this embodiment), possesses the main body 600 housing glass baseplate 102 and the point 604 being fixed on main body 600.Main body 600 possesses base plate and the side plate arranged with erecting from the periphery of this base plate.Side plate has a height of about 2～5 times of the thickness of glass baseplate 102, generally throughout base plate periphery Zone Full configure, but be provided with notch part 602 in a part.Point 604 is installed on a side of main body 600, presents along with the shape that head end attenuates away from main body 600.Point 604 plays and makes glass tray 60 in carrying roller and the effect that moves smoothly through between the opposed roll etc. of carrying roller 50 ground configuration.
As mentioned above, glass baseplate 102 is in the subregion groove depth the desired amount of stage of the subregion groove of the first interarea and the second interarea, acid resistance thin film 64 is attached at the first interarea or the second interarea, and as shown in Figure 12 (A), this has attached the glass baseplate 102 of acid resistance thin film 64 by placing in the way of making the face of acid resistance thin film 64 side contact with glass tray 60 in the main body 600 of glass tray 60.Thereafter, glass baseplate 102 is fixed in the main body 600 of glass tray 60 by acid resistance adhesive tape 62.Hereafter, contain the glass tray 60 of glass baseplate 102 as shown in Figure 12 (B), by so that point 604 towards the state placing in the downstream of conveyance direction on carrying roller 50.
Glass tray 60 passes sequentially through loading unit 12, pre-treatment room the 14, first process chamber the 16, second process chamber the 18, the 3rd process chamber 20, fourth processing chamber the 22, first transhipment department the 28, second transhipment department the 30, the 3rd transhipment department 32, washing room 24, takes out of portion 26, treatment fluid resettlement section 42, treatment fluid supply unit 44 and water supply unit 46, and manages the chemical grinding liquid supplied from upside in room and each transhipment department throughout and accumulate main body 600.Thus, the glass baseplate 102 on glass tray 60, as shown in Figure 13 (A) and Figure 13 (B), is immersed in the chemical grinding liquid accumulated in main body 600.Now, owing to always supplying chemical grinding liquid from upper direction main body 600, therefore a part for the chemical grinding liquid in main body 600 is crossed and is overflowed above side plate, and flows out through notch part 602 to outside.As a result of which it is, owing to the chemical grinding liquid in main body 600 is always replaced into newly supplied chemical grinding liquid, be thus susceptible to the hydrofluoric acid concentration stabilisation always made in chemical grinding liquid, it is ensured that constant grinding rate.And, although in this embodiment, the bottom surface sections in main body 600 is not provided with hole, but by arranging one or more little holes in the bottom surface sections of main body 600, can also promote the circulation of chemistry lapping liquid.
In addition, owing to being when glass baseplate 102 is immersed in the chemical grinding liquid accumulated in main body 600, the subregion groove of the first interarea and the subregion groove of the second interarea are through, therefore, compared with through with the subregion groove of the first interarea when spraying chemical grinding liquid and the subregion groove of the second interarea situation, through position is not easy to become sharp-pointed.Additionally, by after the subregion groove of the first interarea and the subregion groove of the second interarea are through, also glass baseplate 102 is immersed in the chemical grinding liquid accumulated in main body 600, it is possible to suppress the sharp-pointed of through position, makes the end of glass substrate 104 close to arc-shaped under section view.
It follows that use Figure 14 (A)～Figure 14 (D) and Figure 15 (A)～Figure 15 (D), the change to the glass baseplate 102 when processing in this embodiment or the shape of glass substrate 104 illustrates.First, as shown in Figure 14 (A)～Figure 14 (C), the first interarea of glass baseplate 102 and the subregion groove being formed without resist layer of the second interarea are deepened by from the etching of the chemical grinding liquid sprayed up and down.In the stage of the required amount of the subregion groove depth of the first interarea and the second interarea, as shown in Figure 14 (D), at any one interarea attaching acid resistance thin film 64 of the first interarea or the second interarea.
Then, as shown in Figure 15 (A), by downward for the interarea being pasted with acid resistance thin film 64, glass baseplate 102 is housed in glass tray 60, continues executing with chemical grinding and process.Now, owing to glass baseplate 102 described above is submerged in chemical grinding liquid, therefore as shown in Figure 15 (B), the subregion groove of the interarea simply not attaching the upside of acid resistance thin film 64 is gradually deepened.
Hereafter, according to this embodiment, owing to, as shown in Figure 15 (C), making subregion groove through while the point of the tensile stress maximum at the center as thickness direction of glass baseplate 102 can be avoided, being therefore possible to prevent the glass baseplate 102 when subregion groove is through to rupture.In addition, by glass baseplate 102 being immersed in after making subregion groove through in the chemical grinding liquid of the main body 600 of glass tray 60, just can remove, as shown in Figure 15 (D), the tip produced when subregion groove is through, make the end face of each glass substrate close to arc-shaped under section view.
The glass substrate utilizing above-mentioned manufacture method to obtain can use as the glass substrate of the user side constituting the one-piece type liquid crystal display of touch panel.Alternatively, it is also possible to the protection glass as the liquid crystal display of portable phone uses.
The most thermo-labile owing to being located at the sensor element of chip area, therefore it is difficult to the glass being formed with chip area is carried out chemical intensification treatment, but according to above-mentioned embodiment, the chemical enhanced complete large glass base material 104 that can will be formed with chip area stably cuts and obtains multiple glass substrate, the most particularly can improve productivity ratio in being equipped with the glass substrate of sensor element of touch panel significantly.
It is believed that the explanation of above-mentioned embodiment is all illustrative, and not restrictive at all of aspect.The scope of the present invention is not to be given by above-mentioned embodiment, but is given by the scope of technical scheme.Additionally, it is it is intended that within the scope of this invention, comprise all changes in the meaning of equal value of the scope with technical scheme and scope.
The explanation of symbol
10 chemical abrasive devices
12 loading unit
14 pre-treatment rooms
16 first process chambers
18 second process chambers
20 the 3rd process chambers
22 fourth processing chamber
24 washing rooms
26 take out of portion
28 first transhipment departments
30 second transhipment departments
32 the 3rd transhipment departments
60 glass trays
102 glass baseplates
104 glass substrates
Claims (3)
1. the manufacture method of a glass substrate, apply to the manufacture method of the glass substrate of the chemical abrasive device of one chip, the chemical abrasive device of described one chip is the chemical abrasive device constituted in the way of the multiple glass substrates transported continuously are carried out chemical grinding process, possesses:
Conveying unit, it has multiple carrying roller, the plurality of carrying roller by the first interarea and the second interarea to transport in the horizontal direction across opening the chemical enhanced complete glass baseplate as being formed with resist layer in the way of the blueline of the position that should cut；
Milled processed portion, its chemical enhanced complete glass baseplate to being transported by described conveying unit is the blueline of the glass baseplate that etching chemistry strengthening is complete from above-below direction injection chemical grinding liquid,
This manufacture method is characterised by,
By adjusting the amount of the chemical grinding liquid from upper lateral chemical enhanced complete glass baseplate injection and the amount of the chemical grinding liquid from lower lateral chemical enhanced complete glass baseplate injection respectively, and make to be formed at the subregion groove of the first interarea and to be formed at the subregion groove of the second interarea through in the position of the center deviation ormal weight of the thickness direction chemically strengthening complete glass baseplate.
The manufacture method of glass substrate the most according to claim 1, it is characterised in that
Including:
First chemical grinding step: the first interarea and the second interarea both sides are implemented chemical grinding and processes；And
Second chemical grinding step: only the first interarea is implemented chemical grinding with the one side amount of grinding of regulation and process.
The manufacture method of glass substrate the most according to claim 2, it is characterised in that
In described second chemical grinding step, use glass tray, have placing the described glass tray of described chemical enhanced complete glass baseplate to transport；
Described glass tray possesses the main body that can house chemical enhanced complete glass baseplate and the point constituted in the way of the downstream head end towards conveyance direction attenuates.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011237611A JP5334216B2 (en) | 2011-10-28 | 2011-10-28 | Manufacturing method of glass substrate |
| JP2011-237611 | 2011-10-28 | ||
| PCT/JP2012/076095 WO2013061764A1 (en) | 2011-10-28 | 2012-10-09 | Method for producing glass substrate |
Publications (2)
| Publication Number | Publication Date |
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| CN103917499A CN103917499A (en) | 2014-07-09 |
| CN103917499B true CN103917499B (en) | 2016-08-03 |
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| CN201280050824.9A Expired - Fee Related CN103917499B (en) | 2011-10-28 | 2012-10-09 | The manufacture method of glass substrate |
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| JP (1) | JP5334216B2 (en) |
| KR (1) | KR101988998B1 (en) |
| CN (1) | CN103917499B (en) |
| TW (1) | TWI601600B (en) |
| WO (1) | WO2013061764A1 (en) |
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| CN104253023B (en) * | 2013-06-27 | 2017-05-17 | 细美事有限公司 | Substrate processing apparatus |
| KR102134439B1 (en) * | 2013-08-30 | 2020-07-15 | 세메스 주식회사 | Substrate treating apparatus and substrate treating method |
| JP5789889B2 (en) * | 2014-01-10 | 2015-10-07 | 株式会社Ｎｓｃ | Method for manufacturing glass substrate with end face protective layer |
| US9321677B2 (en) | 2014-01-29 | 2016-04-26 | Corning Incorporated | Bendable glass stack assemblies, articles and methods of making the same |
| JP6376462B2 (en) * | 2014-10-23 | 2018-08-22 | 大日本印刷株式会社 | Cover glass manufacturing method and display device with cover glass |
| US20160347643A1 (en) * | 2015-05-29 | 2016-12-01 | Asahi Glass Company, Limited | Glass substrate manufacturing method |
| JP6853520B2 (en) * | 2018-09-20 | 2021-03-31 | 株式会社Ｎｓｃ | Floating transfer device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1391139A (en) * | 2001-06-08 | 2003-01-15 | 住友精密工业株式会社 | Substrate processing devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6452629A (en) * | 1987-08-25 | 1989-02-28 | Asahi Glass Co Ltd | Production of glass product |
| US5228949A (en) * | 1991-11-07 | 1993-07-20 | Chemcut Corporation | Method and apparatus for controlled spray etching |
| JP2005219960A (en) * | 2004-02-05 | 2005-08-18 | Nishiyama Stainless Chem Kk | Cutting and separation method of glass, glass substrate for flat panel display, and flat panel display |
| JP4071220B2 (en) * | 2004-03-17 | 2008-04-02 | 西山ステンレスケミカル株式会社 | Manufacturing method of glass substrate |
| JP3981393B2 (en) * | 2005-12-02 | 2007-09-26 | 西山ステンレスケミカル株式会社 | Chemical polishing apparatus and glass substrate manufacturing method |
| KR101387711B1 (en) | 2007-04-10 | 2014-04-23 | 에프엔에스테크 주식회사 | Glass substrate etching apparatus of flat panel display |
| JP2010195600A (en) * | 2009-02-23 | 2010-09-09 | Nishiyama Stainless Chemical Kk | Methods for manufacturing glass substrate for electronic device and electronic device |
| JP4775829B2 (en) * | 2009-04-03 | 2011-09-21 | 株式会社Ｎｓｃ | Glass substrate for electronic device and method for manufacturing electronic device |
-
2011
- 2011-10-28 JP JP2011237611A patent/JP5334216B2/en not_active Expired - Fee Related
-
2012
- 2012-10-09 KR KR1020147010976A patent/KR101988998B1/en not_active Expired - Fee Related
- 2012-10-09 CN CN201280050824.9A patent/CN103917499B/en not_active Expired - Fee Related
- 2012-10-09 WO PCT/JP2012/076095 patent/WO2013061764A1/en active Application Filing
- 2012-10-12 TW TW101137730A patent/TWI601600B/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1391139A (en) * | 2001-06-08 | 2003-01-15 | 住友精密工业株式会社 | Substrate processing devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5334216B2 (en) | 2013-11-06 |
| CN103917499A (en) | 2014-07-09 |
| KR20140093934A (en) | 2014-07-29 |
| TW201341119A (en) | 2013-10-16 |
| JP2013095617A (en) | 2013-05-20 |
| WO2013061764A1 (en) | 2013-05-02 |
| KR101988998B1 (en) | 2019-06-13 |
| TWI601600B (en) | 2017-10-11 |
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