KR102134439B1 - Substrate treating apparatus and substrate treating method - Google Patents

Abstract

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes a housing, a conveying unit for conveying a substrate in a first direction, and a liquid supplying unit for supplying liquid onto the substrate, wherein the liquid supplying unit is inclined downward in the housing toward the first direction It has a discharge port provided, a first nozzle for supplying the liquid onto the substrate and a discharge port located at the rear of the first nozzle and provided in an inclined downward direction toward the first nozzle, the liquid on the substrate It may include a second nozzle for supplying.

Description

Substrate processing apparatus and substrate processing method using substrate processing apparatus {SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD}

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate using the substrate processing apparatus.

Contaminants such as particles remaining on the substrate surface, organic contaminants, and metal contaminants have a great influence on the properties and production yield of semiconductor devices. For this reason, a cleaning process for removing various contaminants attached to the surface of the substrate is very important in the semiconductor manufacturing process, and a process of cleaning the substrate at a stage before and after each unit process for manufacturing the semiconductor is being performed. In general, the cleaning of the substrate is a chemical treatment process for removing metal foreign substances, organic substances, or particles remaining on the substrate using chemicals, a cleaning process for removing chemicals remaining on the substrate using pure water, and nitrogen gas And a drying process of drying the substrate by using the like.

In general, when pure water is supplied to remove chemicals in the cleaning process, chemicals and pure water remaining on the substrate are mixed and thickly accumulated on the substrate. Therefore, there is a problem that the substrate is etched continuously and the force of the nozzle that supplies pure water is not effectively transmitted.

An object of the present invention is to provide a substrate processing apparatus and method capable of improving the cleaning efficiency of a substrate.

The problem to be solved by the present invention is not limited to the above-described problems, and the problems not mentioned can be clearly understood by a person having ordinary knowledge in the technical field to which the present invention pertains from this specification and the accompanying drawings. will be.

The present invention provides a substrate processing apparatus. A substrate processing apparatus according to an embodiment of the present invention includes a housing, a conveying unit for conveying a substrate in a first direction, and a liquid supplying unit for supplying liquid onto the substrate, wherein the liquid supplying unit includes the agent in the housing. A first nozzle for supplying the liquid onto the substrate and having a discharge port that is inclined downward in a direction toward one direction, and a discharge port which is located behind the first nozzle and is provided at an inclination downward in the direction toward the first nozzle And a second nozzle that supplies the liquid onto the substrate.

The liquid supply unit may further include a third nozzle that is disposed behind the second nozzle in the housing and supplies the liquid onto the substrate.

The length of the third nozzle may be provided in the first direction.

A plurality of the third nozzles may be provided.

The first nozzle may be disposed adjacent to the inlet in the housing.

The housing, vertically extending from a lower surface of the housing between the second nozzle and the third nozzle, partition walls partitioning a region below the transfer unit into the first region and the second region within the housing, the first A first discharge pipe connected to the region and a second discharge pipe connected to the second region may be further included.

The substrate processing apparatus further includes a liquid tank for storing the liquid, a supply line connecting the liquid tank and the liquid supply unit, and the second discharge pipe connects the second region and the liquid tank, The liquid in the second region can be recovered and reused.

In addition, the present invention provides a method for processing a substrate. In a method of processing a substrate according to an embodiment of the present invention, when the substrate is carried along a first direction in a housing, the substrate is firstly provided with a first nozzle having an outlet that is inclined downward in a direction toward the first direction. After supplying the liquid to the liquid, the liquid can be supplied to the substrate with a second nozzle disposed at the rear of the first nozzle and having a discharge port inclined in a direction toward the first nozzle.

After supplying the liquid on the substrate with the second nozzle, the liquid may be supplied to a third nozzle whose length direction is arranged along the first direction.

Between the second nozzle and the third nozzle in the housing, a region lower than the transfer unit is partitioned into a first region and a second region by a partition wall, and the liquid in the first region is discharged out of the housing, The liquid in the second region can be recovered and reused.

According to an embodiment of the present invention, it is possible to provide a substrate processing apparatus with improved cleaning efficiency.

The effects of the present invention are not limited to the above-described effects, and the effects not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a cross-sectional view of a substrate processing apparatus according to an exemplary embodiment of the present invention.
FIG. 2 is a view showing the cleaning chamber of FIG. 1.
FIG. 3 is a view of the conveying unit of FIG. 2 viewed from the top.
4 is a view schematically showing the first nozzle and the second nozzle of FIG. 2.
FIG. 5 is a view of the cleaning chamber of FIG. 2 viewed from the top.
6 is a view showing a state in which the chemical is removed in a conventional cleaning chamber.
7 and 8 are views illustrating a state in which the chemical is removed from the washing chamber of FIG. 2.
9 is a view showing a cleaning chamber according to another embodiment.
10 is a view showing a cleaning chamber according to another embodiment.

Since the embodiments described in this specification are intended to clearly explain the spirit of the present invention to those skilled in the art to which the present invention pertains, the present invention is not limited by the embodiments described in the present specification. The scope of the present invention should be interpreted as including modifications or variations that do not depart from the spirit of the present invention. In addition, the terms used in the present specification and the accompanying drawings are for easy description of the present invention, and the present invention is not limited by the terms used in the present specification and the accompanying drawings. In addition, in describing the present invention, when it is determined that detailed descriptions of related well-known configurations or functions may obscure the subject matter of the present invention, detailed descriptions thereof will be omitted.

In the present embodiment, the substrate S will be described by taking as an example the substrate S used for manufacturing the flat panel display panel. However, unlike this, the substrate S may be a wafer used for semiconductor chip manufacturing.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

The present invention provides an apparatus for processing a substrate. 1 is a view showing a substrate processing apparatus 1000 according to an exemplary embodiment of the present invention. The first chamber 100 and the second chamber 200 may perform a variety of processes, but will be described below as an etching process.

Referring to FIG. 1, the substrate processing apparatus 1000 has a first chamber 100, a second chamber 200, and a cleaning chamber 300. Here, the direction in which the first chamber 100, the second chamber 200, and the washing chamber 300 are arranged is referred to as a first direction (X). In addition, the direction perpendicular to the first direction (X) when viewed from the top is referred to as the second direction (Y), and the direction perpendicular to the first direction (X) and the second direction (Y) is the third direction (Z) ). Inlets 12 and outlets 14 are provided in each chamber 100, 200, and 300. Inlet 12 is formed on one side of the housing (110, 210, 310). The substrate S is introduced into the housings 110, 210 and 310 through the inlet 12. An outlet 14 is provided on the other side facing this side. The substrate S is discharged from the housings 110, 210, 310 through the outlet 14.

The first chamber 100 performs a first etching process. The first chamber 100 has a first housing 110, a first nozzle unit 120, and a first transport unit 150. The first housing 110 provides a space for performing the first etching process. The first nozzle unit 120 supplies the first processing liquid on the substrate S. Each of the first nozzle units 120 is provided in a longitudinal direction (X). The first nozzle unit 120 is disposed on top of the shafts. The first nozzle unit 120 may be provided as a plurality of first nozzles 120a, 120b, and 120c. As an example, the first treatment liquid may be chemical. The first transport unit 150 has substantially the same or similar structure and function to the third transport unit 350 to be described later.

The second chamber 200 is disposed behind the first chamber 100. The second chamber 200 performs a second etching process. The second chamber 200 has a second housing 210, a second transfer unit 250, and a second nozzle unit 220. The second housing 210 provides a space for performing the second etching process. The second nozzle unit 220 has substantially the same or similar structure and function to the first nozzle unit 120 described above. Alternatively, the second nozzle unit 220 and the first nozzle unit 120 may alternatively be arranged to be offset from each other in a straight line. The second transport unit 250 has substantially the same or similar structure and function to the third transport unit 350 to be described later.

2 is a plan view of the inside of the washing chamber 300 of FIG. 1. 3 is a view showing the conveying unit 350 of FIG. 2. 4 is a view showing the first nozzle 320 and the second nozzle 330. 5 is a view of the washing chamber 300 of FIG. 2 as viewed from the top. The cleaning chamber 300 is disposed behind the second chamber 200. In the cleaning chamber 300, chemicals remaining on the substrate S are washed.

The washing chamber 300 includes a liquid tank 305, a housing 310, a first nozzle 320, a first supply line 325, a second nozzle 330, a second supply line 335, and a third nozzle 340, a third supply line 345, and a third transfer unit 350.

The third transport unit 350 transports the substrate S in the first direction X. The third transport unit 350 moves the substrate S in the first direction X between the process chambers 100, 200, 300 and within the process chambers 100, 200, 300. Referring to FIG. 3, the third transport unit 350 has a plurality of shafts 360, transport rollers 370, and a driving unit 380.

The shafts 360 are arranged along the first direction X. Each shaft 360 is provided in its longitudinal direction in the second direction (Y). The shafts 360 are arranged side by side with each other. The shafts 360 are provided from a position adjacent to the inlet 12 to a position adjacent to the outlet 14. A plurality of conveying rollers 370 are fixedly coupled to each shaft 360 along its longitudinal direction. The shafts 360 are rotated by the driving unit 380 about the central axis.

A plurality of conveying rollers 370 are provided on each shaft 360. The transport roller 370 supports the bottom surface of the substrate S. The conveying roller 370 has a hole formed in its central axis, and the shaft 360 is fitted into the hole. The conveying roller 370 is rotated together with the shaft 360.

The drive unit 380 has pulleys 382, belts 384, and a motor 386. Pulleys 382 are respectively coupled to both ends of each shaft 360. Pulleys 382 coupled to different shafts 360 and disposed adjacent to each other are connected to each other by a belt 384. One of the pulleys 382 is coupled with a motor 386 that rotates it. The shafts 360 and the conveying rollers 370 are rotated by the assembly of the pulley 382, the belt 384, and the motor 386 described above, and the lower surface of the substrate S is the conveying roller 370 ), it is linearly moved along the shafts 360. Each shaft 360 is disposed horizontally so that the substrate S can be transferred in a horizontal state. Optionally, one end and the other end of each shaft 360 are provided at different heights, so that the substrate S can be transferred in an inclined state.

The liquid tank 305 stores liquid. The housing 310 has a partition 312, a first discharge pipe 314, and a second discharge pipe 316. The partition 312 extends vertically from the lower surface of the housing 310 between the second nozzle 330 and the third nozzle 340. The partition 312 divides the area below the transport unit 350 in the housing 310 into a first area D1 and a second area D2. The first area D1 is an area corresponding to the first nozzle 320 and the second nozzle 330. In the first region D1, the liquid used for the process treatment is discharged outside the housing 310. The second area D2 is an area corresponding to the third nozzle 340. The second region D2 recovers and reuses the liquid used in the process treatment. The first discharge pipe 314 is connected to the first region D1. The first discharge pipe 314 discharges the liquid in the first region D1 to the outside of the housing 310. The second discharge pipe 316 is connected to the second region D2. Referring again to FIG. 2, the second discharge pipe 316 may connect the second region D2 and the liquid tank 305. The liquid in the second region D2 may be recovered and reused through the second discharge pipe 316.

The first nozzle 320 sprays the cleaning liquid onto the substrate S. For example, the washing liquid may be pure water. The first nozzle 320 may be disposed adjacent to the inlet 12 in the cleaning chamber 300. As shown in FIG. 5, the first nozzle 320 may be provided in the longitudinal direction along the second direction (Y). The first nozzle 320 has a discharge port that is provided downwardly inclined in a direction away from the second housing 200. The first nozzle 320 supplies pure water on the substrate S to push the chemicals remaining on the substrate S in the first direction X. The first supply line 325 connects the liquid tank 305 and the first nozzle 320.

The second nozzle 330 is disposed downstream of the first nozzle 320. The second nozzle 330 may be disposed adjacent to the first nozzle 320 behind the first nozzle 320. The second nozzle 330 may be provided in the longitudinal direction along the second direction (Y). The second nozzle 330 sprays the cleaning liquid onto the substrate S. For example, the washing liquid may be pure water. The second nozzle 330 has an outlet that is provided to be inclined downward in the direction toward the inlet 12. The second supply line 335 connects the liquid tank 305 and the second nozzle 330.

The third nozzle 340 is disposed in the third housing 300. The third nozzle 340 is disposed downstream of the first nozzle 320 and the second nozzle 330. The third nozzle 340 supplies the cleaning liquid to the substrate S. For example, the washing liquid may be pure water. The third nozzle 340 is provided in the longitudinal direction along the first direction (X). Referring to FIG. 5, a plurality of third nozzles 340 may be provided. The plurality of third nozzles 340 are disposed along the second direction Y when viewed from the top. The plurality of third nozzles 340 may be spaced apart from each other. The third supply line 435 connects the liquid tank 405 and the third nozzle 440. Referring to FIG. 2 again, the third nozzle 340 has a discharge port provided at an inclined downward direction toward the second chamber 200. By purely supplying pure water on the substrate S, pure water can be pushed out on the substrate S. Therefore, it is prevented that pure water remains on the substrate S. Accordingly, the force of the third nozzle 340 can be directly transferred to the substrate S. Therefore, the washing process can be effectively performed.

6 is a view showing a process of removing chemicals in a conventional general substrate processing apparatus. 7 and 9 are views illustrating a process of removing chemicals from the cleaning chamber 300 of FIG. 2 to the first nozzle 320, the second nozzle 330, and the third nozzle 340. When only the first nozzle 320 and the third nozzle 340 are provided as shown in FIG. 6, the chemical on the substrate S is pushed out in the first direction X due to the first nozzle 320. Therefore, when the third nozzle 340 supplies the washing liquid on the substrate S, the force of the third nozzle 340 transferred on the substrate S is reduced due to the thickly formed chemical layer. In addition, the chemical remaining on the substrate S and the washing liquid supplied on the substrate S are mixed and remain, so that the etching of the substrate S proceeds. In contrast, referring to FIG. 7, the chemical pushed by the first nozzle 320 cannot flow along the first direction X by the second nozzle 330. Therefore, the chemical layer on the substrate S is thinned, so that the third nozzle 340 can effectively transmit the force on the substrate S. . In addition, since the amount of residual chemical mixed with the washing liquid on the substrate S is reduced, the amount of the substrate S etched can be reduced. 8, the substrate S is continuously transported along the first direction X, and the chemical is separated and removed from the substrate S.

Alternatively, alternatively, as illustrated in FIG. 9, the first nozzle 420, the second nozzle 430, and the third nozzle 440 may be provided in a plurality of adjacent chambers 400 and 500. In addition, as shown in FIG. 10, only the first nozzle 420 and the second nozzle 430 may be provided in the cleaning chamber 600.

In the above examples, it has been described that a cleaning process is performed after the etching process for the substrate S. However, the timing of the process and the number of process chambers may differ. In addition, in the above-described examples, it has been described that the nozzle unit is provided in a continuously made apparatus. However, unlike this, a steam member or a brush member may be further provided to the substrate S. The present invention described above, as the person skilled in the art to which the present invention pertains, various modifications, substitutions, and modifications are possible without departing from the technical spirit of the present invention. It is not limited by the drawings. In addition, the embodiments described herein are not limitedly applicable, and all or part of each embodiment may be selectively combined to be configured so that various modifications can be made.

100: first chamber 200: second chamber
300: cleaning chamber 310: housing
312: bulkhead 314: first discharge pipe
316: second discharge pipe 320: first nozzle
330: second nozzle 340: third nozzle
12: inlet 14: outlet

Claims (10)

In the substrate processing apparatus,
housing;
A conveying unit for conveying the substrate in a first direction; And
Having a liquid supply unit for supplying a liquid onto the substrate;
The liquid supply unit,
A first nozzle having an outlet provided in an inclined downward direction in the direction toward the first direction in the housing, and supplying the liquid onto the substrate;
A second nozzle positioned at the rear side of the first nozzle and having an outlet provided inclined downward in a direction toward the first nozzle to supply the liquid onto the substrate; And,
Included in the housing is disposed behind the second nozzle, the third nozzle for supplying the liquid onto the substrate; includes,
The third nozzle,
A substrate processing apparatus having a discharge port provided obliquely downward in a direction toward the first nozzle. delete According to claim 1,
The third nozzle, the substrate processing apparatus, the longitudinal direction is provided in the first direction. According to claim 1,
The third nozzle is provided with a plurality of substrate processing apparatus. According to claim 1,
The first nozzle,
And disposed adjacent to the inlet in the housing. According to claim 1,
The housing,
A partition wall extending vertically from a lower surface of the housing between the second nozzle and the third nozzle and dividing an area below the transfer unit into the first area and the second area within the housing;
A first discharge pipe connected to the first region;
And a second discharge pipe connected to the second region. The method of claim 6,
The substrate processing apparatus,
A liquid tank for storing the liquid;
Further comprising a supply line connecting the liquid tank and the liquid supply unit,
The second discharge pipe,
A substrate processing apparatus that connects the second region and the liquid tank and recovers and reuses the liquid in the second region. In the method of processing the substrate,
When the substrate is carried along the first direction in the housing, after supplying the liquid onto the substrate with a first nozzle having a discharge port provided in an inclined downward direction in the direction toward the first direction, it is disposed behind the first nozzle After supplying the liquid onto the substrate with a second nozzle having a discharge port provided obliquely in a direction toward the first nozzle,
A method of processing a substrate, wherein the liquid on the substrate is removed out of the substrate by supplying the liquid to a third nozzle having an ejection opening provided obliquely in a direction toward the first nozzle. delete The method of claim 8,
Between the second nozzle and the third nozzle in the housing, an area below the transport unit is partitioned into partitions into first and second areas, and the liquid in the first area is discharged out of the housing, and the A method of processing a substrate, wherein the liquid in the second region is recovered and reused.

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