CN103067798A - Sound cavity structure and electronic product with same - Google Patents

Abstract

A sound cavity structure, comprising: a sound cavity upper cover, a sound cavity lower cover and a loudspeaker; The sound cavity is spatially divided to form a plurality of sound cavities, and the plurality of sound cavities are communicated through through holes provided on the partition part, and the speaker is arranged in one of the plurality of sound cavities. Also disclosed is an electronic product using the sound cavity. The plurality of sound cavities are connected through the through holes on the partition between two adjacent sound cavities, which can make the originally small sound cavity larger, and make the sound cavity larger when the space of the electronic product is limited.

Description

A sound chamber structure and electronic products using it

technical field

The invention relates to the communication field, in particular to a sound chamber structure and electronic products using the same.

Background technique

Electronic products have become an indispensable electronic product in people's daily life and work. Consumers are paying more and more attention to the feeling when using it. Especially in recent years, music phones have become very popular, and the sound cavity has become the key to solve the sound quality.

With the advancement of science and technology, the current electronic products are showing a trend of thinner and thinner, and the corresponding result is that the volume of electronic products is getting smaller and smaller, but in order to maintain the beautiful sound of electronic products, a certain size of sound must be guaranteed. Therefore, increasing the sound cavity in the existing or even smaller electronic product space to achieve the purpose of optimizing the sound effect has attracted widespread attention in the industry.

Contents of the invention

The invention solves the problem that the sound chamber structure is small in the prior art, thereby providing a relatively large sound chamber structure and a mobile phone using the same.

In order to solve the above technical problems, the present invention provides the following technical solutions:

A sound cavity structure, comprising: a sound cavity upper cover, a sound cavity lower cover and a loudspeaker; The sound cavity is spatially divided to form a plurality of sound cavities, and the plurality of sound cavities are communicated through through holes provided on the partition part, and the speaker is arranged in one of the plurality of sound cavities.

The present invention also provides an electronic product, including the sound chamber structure described above.

Compared with the prior art, the present invention has the following beneficial effects: the present invention provides a sound chamber structure and an electronic product using it, and the plurality of sound chambers pass through the passage on the partition between two adjacent sound chambers. The holes are connected, which can make the originally small sound cavity larger, and make the sound cavity larger in the case of limited space for electronic products.

Description of drawings

Fig. 1 is an exploded view of the sound cavity structure of the embodiment of the present invention.

Fig. 2 is a perspective view of the sound cavity structure of the embodiment of the present invention.

Fig. 3 is a sectional view of A-A in Fig. 2 .

Fig. 4 is an assembly diagram of the sound cavity of the embodiment of the present invention.

Fig. 5 is a B-B sectional view in Fig. 4 .

Fig. 6 is a diagram of the internal structure of the upper cover of the sound cavity according to the embodiment of the present invention.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

Figure 1 is an exploded view of the sound cavity structure of the embodiment of the present invention, which discloses a sound cavity structure, including: a sound cavity upper cover 11, a sound cavity lower cover 12 and a speaker 14; the sound cavity upper cover 11 is provided with a partition 113, the sound cavity upper cover 11 and the sound cavity lower cover 12 constitute the sound cavity space and the sound cavity space is divided by the partition part 113 to form a plurality of sound cavities, and the plurality of sound cavities are arranged on the partition part The through holes communicate with each other, and the loudspeaker is arranged in one of the plurality of sound cavities. A plurality of sound cavities are connected through the through holes between two adjacent sound cavities, so that the original small sound cavity can be enlarged, and the sound cavity can be made larger when the space of the electronic product is limited.

Fig. 2 is the perspective view of the sound cavity structure of the embodiment of the present invention, Fig. 3 is A-A sectional view in Fig. Including a sealing member 13, the sealing member 13 is arranged between the sound cavity upper cover 11 and the sound cavity lower cover 12, and the sound cavity space forms a sealed space; in this embodiment, the sound cavity lower cover 12 includes a lower cover body 121 and the printed circuit board 122, the printed circuit board 122 and the body 121 are arranged side by side on the sealing member 13, and the loudspeaker 14 is electrically connected to the printed circuit board 122, where the printed circuit board 122 (hereinafter referred to as the PCB board 122) .

In some embodiments, the loudspeaker 14 is located in the sound chamber formed by the sound chamber upper cover 11, the sealing member 13, the PCB board 122 and the partition 113. In such a structure, the electrical connection end of the loudspeaker 14 is directly connected to the PCB board 122. electrical connection.

In some other embodiments, as shown in FIG. 2 , the speaker 14 is located in the sound chamber formed by the sound chamber upper cover 11 , the sealing member 13 , the lower cover body 121 and the partition 113 , and the electric circuit of the speaker 14 is The connecting end is electrically connected to the PCB board 122 through the through hole 112 . Specifically, the PCB board 122 includes a pad 123 connected to the speaker 14, and the wire 141 passes through the through hole 112 and is welded to the pad 123 and is connected to the speaker 14. The speaker 14 communicates with the outside of the sound chamber through the wire 141 and the pad 123. Signal transmission. In this embodiment, the lower cover body 121 of the sound cavity 20 for accommodating the speaker 14 has a groove, which is just used to place the speaker 14. The signal of the speaker 14 can pass through the through hole 112 through the wire 141, and then through the pad 123 of the PCB 122. Connected with external signals, this structure makes the thickness of the entire sound cavity relatively thin, further meeting the needs of electronic products for space miniaturization.

Fig. 4 is an assembly diagram of the sound cavity of the embodiment of the present invention, and Fig. 5 is a cross-sectional view of B-B in Fig. 4; as can be seen from the figure, the loudspeaker 14 is placed in the sound cavity 20, and the signal is connected to the PCB board in the sound cavity 30 by a wire 141 The pad 123 is connected to external signals through the PCB board 122 . The wire 141 passes through the through hole 112 between the two sound chambers. The sealing part 13 can seal the sound chamber upper cover 11 and the sound chamber lower cover 12, and the sealing part 13 is preferably foam; one foam can be used, which can effectively reduce the cost; the sealing part 13 can also be black glue or the sound chamber. The cover 11 and the sound cavity lower cover 12 are sealed by ultrasonic welding.

Fig. 6 is an internal structure diagram of the upper cover of the sound cavity according to the embodiment of the present invention. The upper cover of the sound cavity 11 is provided with a partition 113, and the partition 113 is provided with the through hole 112, which can communicate with two adjacent sound cavities , to increase the cavity space.

The present invention also provides an electronic product, including the sound cavity structure described above. The structure of the sound cavity is the structure described above, which will not be repeated here. The electronic product may be a mobile phone, a personal digital assistant, an MP3, etc., which have a loudspeaker cavity structure.

In order to save space, the shell of the electronic product can be used as the upper cover 11 or the lower cover body 121 of the sound cavity; the shell of the electronic product can also be used as the upper cover 11 and the lower cover body 121 of the sound cavity at the same time, which can effectively save space and cost .

The sound chamber structure of the electronic product provided by the present invention can maximize the space of the sound chamber in the limited internal space of the electronic product, while maintaining a good sealing effect of the sound chamber, and the separate sound chamber structure also has good compatibility sex.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.

Claims (9)

1. a sound cavity structure, is characterized in that, comprises: sound cavity loam cake, sound cavity lower cover and loudspeaker; Described sound cavity loam cake is provided with partition, and described sound cavity loam cake and sound cavity lower cover form sound cavity Space and divide the sound cavity space by the partition to form a plurality of sound cavities, the plurality of sound cavities are connected through the through holes arranged on the partition part, and the speaker is arranged in one of the plurality of sound cavities Inside. 2. The sound cavity structure according to claim 1, characterized in that, the sound cavity structure also includes a sealing member, the sealing component is arranged between the sound cavity upper cover and the sound cavity lower cover, and the sound cavity space forms Sealed space. 3. The sound cavity structure according to claim 2, wherein the lower cover of the sound cavity comprises a lower cover body and a printed circuit board, and the printed circuit board and the body are arranged side by side on the sealing member, and the speaker and The printed circuit board is electrically connected. 4 . The sound cavity structure according to claim 3 , wherein the speaker is located in the sound cavity formed by the sound cavity upper cover, the sealing component, the printed circuit board and the partition. 5. The sound chamber structure according to claim 3, wherein the loudspeaker is located in the sound chamber formed by the sound chamber upper cover, the sealing member, the lower cover body and the partition, and the electrical connection of the loudspeaker is The terminal is electrically connected with the printed circuit board through the through hole. 6. An electronic product, characterized by comprising the sound chamber structure according to any one of claims 1 to 2. 7. An electronic product, characterized by comprising the sound chamber structure according to any one of claims 3 to 5. 8. The electronic product according to claim 6 or 7, wherein the electronic product is a mobile phone. 9. The sound chamber structure according to claim 8, characterized in that, the sound chamber upper cover and/or the lower cover body is a mobile phone casing.

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