CN106341759B

CN106341759B - Sound cavity structure and intelligent interphone comprising same

Info

Publication number: CN106341759B
Application number: CN201610739721.3A
Authority: CN
Inventors: 刘均; 廖其龙
Original assignee: Shenzhen Tyre Automobile Maintenance Technology Co Ltd
Current assignee: SHENZHEN GOLO CHELIAN DATA TECHNOLOGY Co.,Ltd.
Priority date: 2016-08-26
Filing date: 2016-08-26
Publication date: 2020-02-14
Anticipated expiration: 2036-08-26
Also published as: CN106341759A

Abstract

The invention is suitable for the technical field of loudspeakers and discloses a sound cavity structure and an intelligent interphone comprising the sound cavity structure, wherein the sound cavity structure comprises a sound cavity upper cover and a sound cavity lower cover which are connected with each other to form a containing cavity, and a loudspeaker placed in the containing cavity, a sound raising hole with the shape and the size matched with the shape and the size of a vibrating diaphragm of the loudspeaker is formed in the sound cavity upper cover, and a plurality of antenna spring pin through holes which penetrate through the sound cavity upper cover and the sound cavity lower cover and are positioned on one side of the containing cavity and used for embedding antenna spring pins are formed in one corner of the sound cavity structure. According to the intelligent interphone, the antenna on the lower shell of the intelligent interphone is electrically connected with the antenna feed point on the PCA by arranging the plurality of antenna elastic pin through holes, the problems that the structure is not compact and the whole interphone is difficult to thin and light due to the fact that a chip and an interface device are added to the traditional sound cavity structure are solved, the sound cavity and the antenna can be laminated in an embedded mode in the vertical direction, the requirement on the isolation degree of the antenna and a mainboard is met, and meanwhile the whole interphone has a good music effect.

Description

Sound cavity structure and intelligent interphone comprising same

Technical Field

The invention belongs to the technical field of loudspeakers, and particularly relates to a sound cavity structure and an intelligent interphone comprising the same.

Background

The intelligent interphone enriches the application function of talkback. The intelligent interphone is an intercom terminal based on a mobile phone scheme of an android system, and has the functions of photographing, shooting, storing, positioning and navigating, WIFI hot spots, a Bluetooth player and the like besides the traditional intercom application. The integrated function of so many has increased the quantity of chip and interface device for the piling up of complete machine needs compacter just can realize frivolousization, and especially loudspeaker and antenna need very big space and enough isolation like this and come the device of placing, need use range upon range of and imbed the mode of placing and realize the frivolousization of complete machine, and the intercom among the prior art can not satisfy above-mentioned its demand to frivolousization.

Disclosure of Invention

The invention aims to overcome the defect that the interphone in the prior art cannot meet the requirement of light and thin, and provides a sound cavity structure which enables the whole interphone to be compact in structure and realizes light and thin of the whole interphone.

The invention provides a sound cavity structure, which comprises a sound cavity upper cover, a sound cavity lower cover and a loudspeaker, wherein the sound cavity upper cover and the sound cavity lower cover are mutually connected to form a containing cavity, the loudspeaker is placed in the containing cavity, the sound cavity upper cover is provided with a sound raising hole, the shape and the size of the sound raising hole are matched with those of a vibrating diaphragm of the loudspeaker, one corner of the sound cavity structure is provided with a plurality of antenna spring pin through holes, the antenna spring pin through holes penetrate through the sound cavity upper cover and the sound cavity lower cover, and the antenna spring pin through holes are positioned on one side of the containing cavity and are used for.

The invention also provides an intelligent interphone which comprises an upper shell and a lower shell which are connected with each other, a front lens and a back lens which are respectively arranged on the side surfaces of the upper shell and the lower shell, a PCA (principal component analysis) installed between the upper shell and the lower shell and a plurality of sound cavity structures.

The implementation of the sound cavity structure of the invention has the following beneficial effects: through set up in the one corner of sound chamber structure and run through sound chamber upper cover and sound chamber lower cover, be located holding chamber one side and be used for imbedding a plurality of antenna bullet needle through-holes of antenna bullet needle, realize the electricity of antenna on the intelligent intercom inferior valve and PCA antenna feed point, solve traditional sound chamber structure and increase the structure that chip and interface device lead to and not compact, be difficult to realize the problem that the complete machine is frivolous, enable sound chamber and antenna stromatolite in the vertical direction, this sound chamber structure has guaranteed the isolation requirement of antenna and mainboard, also make the complete machine compact structure, finally realize the frivolousness of complete machine, the complete machine also has fine musical effect simultaneously.

The intelligent interphone disclosed by the embodiment of the invention has the following beneficial effects: through setting up a plurality of sound cavity structure between epitheca and inferior valve, this sound cavity structure's frivolousization makes the volume of intercom reduce, and sets up a plurality of sound cavity structure and makes complete machine sound flood and bright, and can realize the stereo of dual track when the sound cavity structure is two, has improved the narrow shortcoming of traditional intercom list loudspeaker range for the intercom also has the effect of audio amplifier.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a cross-sectional view of an acoustic chamber configuration provided by an embodiment of the present invention;

FIG. 2 is a side view of a sound cavity structure provided by an embodiment of the present invention;

FIG. 3 is a top view of a sound cavity structure provided by an embodiment of the present invention;

FIG. 4 is a bottom view of the sound cavity structure provided by the embodiment of the present invention;

fig. 5 is an exploded view of the intelligent interphone provided by the embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.

As shown in fig. 1 to 4, the sound cavity structure provided by the embodiment of the present invention includes a sound cavity upper cover 1, a sound cavity lower cover 2, and a speaker 3. Wherein, sound chamber upper cover 1 and sound chamber lower cover 2 interconnect together form the holding chamber, and speaker 3 places in the holding intracavity. The upper cover 1 of the sound cavity is provided with a sound hole 11, and the shape and the size of the sound hole 11 are consistent with those of the vibrating diaphragm of the loudspeaker 3. In addition, a plurality of antenna spring pin through holes 7 which penetrate through the sound cavity upper cover 1 and the sound cavity lower cover 2 and are located on one side of the accommodating cavity are formed in one corner of the sound cavity structure, the antenna spring pin through holes 7 penetrate through the sound cavity upper cover 1 and the sound cavity lower cover 2 but are not communicated with the accommodating cavity, and the antenna spring pins are embedded into the through holes to realize electric connection of an antenna on the intelligent interphone lower shell and an antenna feed point on the PCA. The antenna spring needle is embedded into the sound cavity structure, so that the antenna can be arranged in most of the area above the sound cavity structure, and the whole machine is lighter and thinner. In the embodiment of the present invention, the PCA is referred to as including a PCB and a component mounted on the PCB.

According to the embodiment of the invention, one corner of the sound cavity structure is provided with the upper sound cavity cover 1, the lower sound cavity cover 2 and the plurality of antenna spring pin through holes 7 which are positioned on one side of the accommodating cavity and used for embedding antenna spring pins, so that the electric connection between the antenna on the lower intelligent interphone shell and the antenna feed point on the PCA is realized, the problems that the structure is not compact and the whole machine is difficult to realize light and thin due to the fact that a chip and an interface device are added in the traditional sound cavity structure are solved, the sound cavity and the antenna can be embedded and laminated in the vertical direction, the isolation requirement of the antenna and a mainboard is met by the sound cavity structure, the whole machine structure is compact, the light and thin of the whole machine is finally realized, and meanwhile, the whole.

In an embodiment of the present invention, three antenna pogo pin through holes 7 are formed in the sound cavity structure, and the diameter of each antenna pogo pin through hole 7 is 1.5mm, and the pitch is 1 mm.

Furthermore, a dust screen 4 with a size slightly larger than the sound-emitting hole 11 is attached to the upper cover 1 of the sound cavity above the sound-emitting hole 11 to protect the speaker 3.

Further, a protrusion 21 is provided inside the sound chamber lower cover 2, the protrusion 21 is used for supporting the speaker 3, and when the sound chamber upper cover 1 and the sound chamber lower cover 2 are connected, the sound chamber upper cover 1 and the protrusion 21 fix the speaker 3 together, so that the speaker 3 does not move and does not vibrate.

Further, be equipped with a square trompil 22 on sound chamber lower cover 2, this trompil 22 department fills electrically conductive bubble cotton 5, and this electrically conductive bubble cotton 5 and speaker 3's metal casing electric connection realize speaker 3 metal casing's ground connection demand to reduce the interference that realizes the antenna performance. Specifically, the opening 22 may penetrate through the sound cavity lower cover 2, so that the conductive foam 5 is in direct contact with the metal shell of the speaker 3, thereby achieving electrical connection.

Further, a speaker contact positioning column 23, a sound cavity positioning column 24 and a plurality of step avoiding positions 25 are arranged on the sound cavity lower cover 2. The step avoidance positions 25 are used for assembling and avoiding components or interface devices on the PCA; the sound cavity positioning column 24 is used for positioning and fixing the sound cavity on the PCA; the speaker contact positioning posts 23 are used to position speaker FPC contact locations. The positive and negative poles of the loudspeaker arranged in the accommodating cavity are led out of the accommodating cavity from the joint of the upper sound cavity cover 1 and the lower sound cavity cover 2 through FPC flat cables 6, and are bonded on the lower sound cavity cover 2 after being positioned through the loudspeaker contact positioning columns 23, so that the assembly is simple and easy to implement, and the assembly efficiency is improved. The distance between the speaker positive contact 31 and the speaker negative contact 32 is 1 mm.

As shown in fig. 5, the present invention further provides an intelligent interphone, which comprises an upper shell 10 and a lower shell 20 connected to each other, a front lens 70 disposed at the front side of the upper shell 10, a back lens 80 disposed at the back side of the lower shell 20, a PCA100 mounted between the upper shell 10 and the lower shell 20, a plurality of the above-mentioned sound cavity 90 structures mounted between the upper shell 10 and the lower shell 20, and a function key 30, a power key 40, a volume key 50 and a dome sheet key 60 disposed on the PCA 100. In an embodiment of the present invention, two sound cavities 90 are symmetrically disposed between the upper shell 10 and the lower shell 20, so that the sound of the whole interphone is surging, and a two-channel stereo is realized, thereby overcoming the disadvantage of narrow range of a single speaker of the conventional interphone, and enabling the interphone to have the effect of a sound box.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. An intelligent interphone is characterized by comprising an upper shell and a lower shell which are connected with each other, a front lens and a back lens which are respectively arranged on the side surfaces of the upper shell and the lower shell, a PCA (principal component analysis) installed between the upper shell and the lower shell and a plurality of sound cavity structures, wherein the sound cavity structures are positioned between the PCA and the lower shell and used for isolating an antenna on the lower shell and the PCA, the sound cavity structures comprise a sound cavity upper cover and a sound cavity lower cover which are connected with each other to form an accommodating cavity and a loudspeaker placed in the accommodating cavity, the sound cavity upper cover is provided with a sound raising hole of which the shape and the size are matched with those of a vibrating diaphragm of the loudspeaker, one corner of the sound cavity structures is provided with a plurality of antenna spring needle through holes which penetrate through the sound cavity upper cover and the sound cavity lower cover and are positioned on one side of the accommodating cavity and are used for embedding antenna spring needles, and the antenna spring needle through holes are isolated from the accommodating cavity, the antenna is elastically embedded into the antenna elastic pin through hole and used for realizing the electric connection between the antenna on the lower shell and the antenna feed point on the PCA.

2. The intelligent interphone according to claim 1, characterized in that the sound cavity structure is provided with three antenna spring pin through holes arranged in parallel.

3. The intelligent interphone of claim 1, wherein the diameter of the antenna spring pin through hole is 1.5mm, and the pitch of the holes is 1 mm.

4. The intelligent interphone according to claim 1, wherein the speaker hole top cover is provided with a dust screen with a size larger than the speaker hole.

5. The intelligent interphone according to claim 1, characterized in that a protrusion for supporting the speaker is arranged inside the lower sound cavity cover, and the speaker is fixed between the upper sound cavity cover and the protrusion.

6. The intelligent interphone according to claim 1, wherein the sound cavity lower cover is provided with an opening, the opening is filled with conductive foam, and the conductive foam is electrically connected with the metal shell of the speaker.

7. The intelligent interphone according to claim 1, wherein the sound cavity lower cover is provided with a sound cavity positioning column for positioning and fixing the sound cavity structure on the PCA, a speaker contact positioning column for positioning the FPC contact position of the speaker, and a plurality of step avoidance positions for assembling and avoiding components or interface components on the PCA.

8. The intelligent interphone of claim 7, wherein the positive and negative electrodes of the speaker are led out of the accommodating cavity from the connection of the upper audio cavity cover and the lower audio cavity cover by FPC cables, and are bonded to the lower audio cavity cover after being positioned by the speaker contact positioning columns.

9. The intelligent interphone according to claim 1, characterized in that two sound cavity structures are symmetrically placed between the upper and lower shells.