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CN201160322Y - dustproof microphone - Google Patents

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Publication number
CN201160322Y
CN201160322Y CNU2008200924353U CN200820092435U CN201160322Y CN 201160322 Y CN201160322 Y CN 201160322Y CN U2008200924353 U CNU2008200924353 U CN U2008200924353U CN 200820092435 U CN200820092435 U CN 200820092435U CN 201160322 Y CN201160322 Y CN 201160322Y
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Prior art keywords
sound
back plate
dust
shell
microphone
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CNU2008200924353U
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Chinese (zh)
Inventor
周成军
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AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Abstract

本实用新型提供了一种防尘麦克风,包括底部设有入声孔的外壳及设于外壳内并与外壳底部相抵接的背极板,所述背极板上设有的通声孔与所述入声孔不重叠,所述背极板与外壳底部表面贴合的一面设有相互贯通的但不贯穿背极板的导声凹槽。导声凹槽用以将入声孔进入的声源导入到背极板上的通声孔内。与现有技术相比,本实用新型无需外加一层防尘网,而且适合表面贴装技术(SMT)的工艺要求,具有防尘效果好、产品性能好、成本低的优点。

Figure 200820092435

The utility model provides a dust-proof microphone, which comprises a shell with a sound inlet hole at the bottom and a back plate arranged in the shell and abutting against the bottom of the shell, the sound hole provided on the back plate is in contact with the The sound-incoming holes do not overlap, and the side of the back plate attached to the bottom surface of the housing is provided with sound-guiding grooves that penetrate each other but do not penetrate the back plate. The sound guide groove is used to guide the sound source entering the sound inlet hole into the sound passage hole on the back plate. Compared with the prior art, the utility model does not need to add a layer of dust-proof net, and is suitable for the technological requirements of surface mount technology (SMT), and has the advantages of good dust-proof effect, good product performance and low cost.

Figure 200820092435

Description

防尘麦克风 dustproof microphone

【技术领域】 【Technical field】

本实用新型涉及一种麦克风,尤其是一种防尘驻极体麦克风。The utility model relates to a microphone, in particular to a dust-proof electret microphone.

【背景技术】 【Background technique】

随着无线通讯的发展,全球移动电话用户越来越多,用户对移动电话的要求已不仅满足于通话,而且要能够提供高质量的通话效果,尤其是目前移动多媒体技术的发展,移动电话的通话质量更显重要,移动电话的麦克风作为移动电话的语音拾取装置,其设计好坏直接影响通话质量。With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality.

相关结构的驻极体麦克风10如图5所示,包括外壳11、收容于外壳11内且与外壳底部相隔的背极板12、垫片13、与背极板12相对且被垫片13分隔的振膜组14、用以收容振膜组14的绝缘环15、电性连接振膜组14的连接环16及电路板17。外壳11上设有入音孔110以接受外部声源,与外壳相邻的背极板12上设有通音孔120以接受从外壳上的入音孔进来的声源,以实现推动背极板12对面的振膜组14振动。The electret microphone 10 of related structure is as shown in Figure 5, comprises shell 11, is housed in shell 11 and is separated from the back pole plate 12 of shell bottom, gasket 13, is opposite to back pole plate 12 and is separated by spacer 13 The diaphragm group 14 , the insulating ring 15 for accommodating the diaphragm group 14 , the connecting ring 16 electrically connected to the diaphragm group 14 and the circuit board 17 . The shell 11 is provided with a sound hole 110 to receive an external sound source, and the back plate 12 adjacent to the shell is provided with a sound hole 120 to receive the sound source coming in from the sound hole on the shell, so as to push the back pole The diaphragm group 14 opposite the plate 12 vibrates.

为阻止外界灰尘等颗粒进入到麦克风内部而影响麦克风的性能时,传统的防范措施是在麦克风10外壳11的外表面粘贴一层防尘网18。此措施虽然能达到阻止外界灰尘等颗粒进入到麦克风内部,但是却增加了麦克风的制造工艺流程,且耗费员工的大量工作时间,从而导致增加了麦克风产品的制造成本。In order to prevent particles such as external dust from entering the microphone and affecting the performance of the microphone, a traditional preventive measure is to paste a layer of dust-proof net 18 on the outer surface of the shell 11 of the microphone 10 . Although this measure can prevent particles such as external dust from entering the microphone, it increases the manufacturing process of the microphone and consumes a lot of working time of employees, thereby increasing the manufacturing cost of the microphone product.

另,目前的麦克风正逐步向满足兼容表面贴装技术(SMT)的生产工艺要求过渡,而在外壳外表面粘贴的防尘网材质不能承受兼容表面封装技术的生产工艺中存在的回流焊接高温;及影响兼容表面贴装技术的生产过程中的吸取操作。因此,目前,兼容表面贴装器件的SMD麦克风均不能在外壳的外表面粘贴一层防尘网。然而,无此防尘网,产品在回流焊的工艺过程中和使用过程中,均会出现外界灰尘等颗粒物进入到产品内部,从而导致产品性能下降的问题。In addition, the current microphone is gradually transitioning to meet the production process requirements of surface mount technology (SMT), and the dust-proof net material pasted on the outer surface of the shell cannot withstand the high temperature of reflow soldering in the production process compatible with surface mount technology; and affect the pick-up operation in the production process compatible with surface mount technology. Therefore, at present, none of the SMD microphones compatible with surface mount devices can paste a layer of dust-proof net on the outer surface of the housing. However, without this dust-proof net, particles such as external dust will enter the product during the reflow process and use of the product, resulting in a problem of product performance degradation.

因此,有必要研究一种能达到良好的防尘效果的新型麦克风。Therefore, it is necessary to study a new type of microphone that can achieve a good dust-proof effect.

【实用新型内容】【Content of utility model】

本实用新型需解决的技术问题是克服上述现有技术的不足,提供一种防尘效果好、成本低且性能良好的防尘麦克风。The technical problem to be solved by the utility model is to overcome the deficiencies of the above-mentioned prior art and provide a dust-proof microphone with good dust-proof effect, low cost and good performance.

根据上述需解决技术问题,设计了一种防尘麦克风,包括底部设有入声孔的外壳及设于外壳内并与外壳底部相抵接的背极板,所述背极板上设有的通声孔与所述入声孔不重叠,所述背极板与外壳底部表面贴合的一面设有相互贯通的但不贯穿背极板的导声凹槽。According to the above-mentioned technical problems to be solved, a dust-proof microphone is designed, which includes a shell with a sound inlet hole at the bottom and a back plate arranged in the shell and abutting against the bottom of the shell. The sound hole does not overlap with the sound inlet hole, and the side of the back plate attached to the bottom surface of the casing is provided with sound guide grooves that communicate with each other but do not penetrate the back plate.

作为本实用新型进一步改进,所述相互贯通的导声凹槽为相交的若干直线段凹槽构成。As a further improvement of the utility model, the interpenetrating sound guide grooves are composed of several intersecting straight line grooves.

本实用新型的背极板与外壳贴合,且两者的声孔不重叠,即不对准,用以防止外界灰尘等颗粒物进入到产品内部;同时,在背极板上设有的导声凹槽用以将从外壳上的入声孔进入的外部声源导入到背极板的通声孔内,从而实现使背极板对面的振膜组振动。与现有技术相比,本实用新型勿需外加一层防尘网,而且适合表面贴装技术(SMT)的工艺要求,具有防尘效果好、产品性能好、成本低的优点。The back plate of the utility model is bonded to the shell, and the sound holes of the two do not overlap, that is, they are not aligned, so as to prevent particles such as external dust from entering the interior of the product; The groove is used to guide the external sound source entering from the sound inlet hole on the shell into the sound passage hole of the back plate, so as to realize the vibration of the diaphragm group opposite to the back plate. Compared with the prior art, the utility model does not need to add a layer of dust-proof net, and is suitable for the technological requirements of surface mount technology (SMT), and has the advantages of good dust-proof effect, good product performance and low cost.

【附图说明】 【Description of drawings】

图1是本实用新型防尘麦克风的立体分解图;Fig. 1 is a three-dimensional exploded view of the dust-proof microphone of the present invention;

图2是本实用新型防尘麦克风的立体示意图;Fig. 2 is a three-dimensional schematic diagram of the dust-proof microphone of the present invention;

图3是本实用新型防尘麦克风的剖视示意图;Fig. 3 is a schematic cross-sectional view of the dust-proof microphone of the present invention;

图4是本实用新型防尘麦克风中背极板设有通声凹槽的一面的正视图;Fig. 4 is a front view of the side of the back plate provided with sound-through grooves in the dust-proof microphone of the present invention;

图5是相关结构驻极体麦克风的剖视示意图。Fig. 5 is a schematic cross-sectional view of an electret microphone with a related structure.

【具体实施方式】 【Detailed ways】

下面结合附图和实施方式对本实用新型作进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.

如图1、图2和图3所示,本实用新型防尘麦克风20包括外壳21、与外壳21相连并与之形成一容腔200的电路PCB板27。该容腔200内设有一绝缘环25,绝缘环25内收容有与外壳21底部表面贴合的背极板22、垫片23、与背极板22相对且被垫片23分隔的振膜组24、与振膜组24和电路PCB板27相连并使两者电性导通的连接环26。As shown in FIG. 1 , FIG. 2 and FIG. 3 , the dustproof microphone 20 of the present invention includes a housing 21 , and a circuit PCB board 27 connected to the housing 21 and forming a cavity 200 therewith. The cavity 200 is provided with an insulating ring 25, and the insulating ring 25 accommodates a back plate 22 attached to the bottom surface of the housing 21, a gasket 23, and a diaphragm group opposite to the back plate 22 and separated by the spacer 23. 24. A connection ring 26 connected with the diaphragm group 24 and the circuit PCB board 27 and electrically conducting the two.

外壳21底部上设有入声孔210,以接受外部声源。A sound inlet hole 210 is provided on the bottom of the shell 21 to receive an external sound source.

背极板22是一种能长久保持电极化状态的电介质,这种电介质是一种高分子聚合物,背极板22上分布有自由电荷。背极板22上设有通声孔220,通声孔220与外壳21上的入声孔210不对准,即不重叠在一起,以防止外界灰尘等颗粒进入产品内部。如图4所示,背极板22与外壳21底部表面贴合的一面设有导声凹槽221,导声凹槽221由相交的若干条直线段凹槽构成,直线段凹槽均相互贯通,但不贯穿背极板22。由于直线段凹槽均相互贯通,所以,即使通声孔与入声孔不重叠,从入声孔进入的声源也可通过导声凹槽221进入到背极板上通声孔内,从而实现推动振膜组24振动。The back plate 22 is a dielectric that can maintain the electric polarization state for a long time. This dielectric is a high molecular polymer, and free charges are distributed on the back plate 22 . The back plate 22 is provided with a sound hole 220 , and the sound hole 220 is not aligned with the sound inlet hole 210 on the shell 21 , that is, they are not overlapped, so as to prevent particles such as external dust from entering the product. As shown in Fig. 4, the surface of the back plate 22 and the bottom surface of the casing 21 is provided with a sound guide groove 221, and the sound guide groove 221 is composed of several intersecting straight line grooves, and the straight line grooves are all connected to each other. , but not through the back plate 22. Since the straight line grooves are all connected to each other, even if the sound hole and the sound inlet hole do not overlap, the sound source entering from the sound inlet hole can also enter the sound hole on the back plate through the sound guide groove 221, thereby Realize pushing the diaphragm group 24 to vibrate.

此结构的防尘麦克风20,背极板22通过外壳21电联接电路PCB板27,振膜组24通过连接环26电联接电路PCB板27,而膜片组24与背极板22之间通过垫片23分隔不导通。通过上述的电连接关系以及不导通关系,背极板22与膜片组24之间可实现电容效应。由于背极板24上分布有自由电荷,在电容器的两极之间就有了电荷量。声波从外壳21的入声孔210进入,再通过导声凹槽221导入而进到背极板22上的通音孔210内,从而使膜片组24振动而产生位移时,改变了电容器的电容量,电容量的改变使电容器的输出端产生了相应的交变电场,就形成了与声波信号对应的电信号,于是就完成了声电转换的功能。In the dust-proof microphone 20 of this structure, the back plate 22 is electrically connected to the circuit PCB board 27 through the shell 21, the diaphragm group 24 is electrically connected to the circuit PCB board 27 through the connecting ring 26, and the diaphragm group 24 and the back plate 22 are passed through The spacer 23 is separated and not conducted. Through the above-mentioned electrical connection relationship and non-conduction relationship, a capacitive effect can be realized between the back plate 22 and the diaphragm group 24 . Due to the free charge distributed on the back plate 24, there is a charge between the two poles of the capacitor. The sound wave enters from the sound inlet hole 210 of the casing 21, and then is introduced into the sound hole 210 on the back plate 22 through the sound guide groove 221, so that when the diaphragm group 24 vibrates and generates displacement, the capacitor's capacitance is changed. Capacitance, the change of capacitance makes the output terminal of the capacitor generate a corresponding alternating electric field, which forms an electrical signal corresponding to the acoustic wave signal, thus completing the function of acoustic-electric conversion.

与现有技术相比,本实用新型勿需外加一层防尘网,而且适合表面贴装技术(SMT)的工艺要求,具有防尘效果好、产品性能好、成本低的优点。Compared with the prior art, the utility model does not need to add a layer of dust-proof net, and is suitable for the technological requirements of surface mount technology (SMT), and has the advantages of good dust-proof effect, good product performance and low cost.

以上所述的仅是本实用新型较佳的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。What has been described above is only a preferred embodiment of the utility model, and it should be pointed out that, for those of ordinary skill in the art, improvements can also be made without departing from the inventive concept of the utility model, but these All belong to the protection scope of the present utility model.

Claims (2)

1, a kind of dustproof microphone, comprise the back pole plate that the bottom is provided with the shell of tone-entering hole and is located in the shell and connects with outer casing bottom, sound hole that described back pole plate is provided with and described tone-entering hole are not overlapping, it is characterized in that: that the one side of fitting in described back pole plate and outer casing bottom surface is provided with mutual perforation but do not run through the groove of leading of back pole plate.
2, dustproof microphone according to claim 1 is characterized in that: the groove of leading of described mutual perforation constitutes for the some straightway grooves that intersect.
CNU2008200924353U 2008-02-29 2008-02-29 dustproof microphone Expired - Lifetime CN201160322Y (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013045749A1 (en) * 2011-09-29 2013-04-04 Nokia Corporation Dust protection of sound transducer
CN103281660A (en) * 2013-05-06 2013-09-04 山东共达电声股份有限公司 Double-bottom gasket and MEMS (Micro Electro Mechanical System) microphone

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013045749A1 (en) * 2011-09-29 2013-04-04 Nokia Corporation Dust protection of sound transducer
US8644530B2 (en) 2011-09-29 2014-02-04 Nokia Corporation Dust protection of sound transducer
CN103931210A (en) * 2011-09-29 2014-07-16 诺基亚公司 Dust Protection for Acoustic Transducers
US9473838B2 (en) 2011-09-29 2016-10-18 Nokia Technologies Oy Dust protection of sound transducer
CN103931210B (en) * 2011-09-29 2017-05-17 诺基亚技术有限公司 Dust protection of sound transducer
CN103281660A (en) * 2013-05-06 2013-09-04 山东共达电声股份有限公司 Double-bottom gasket and MEMS (Micro Electro Mechanical System) microphone
CN103281660B (en) * 2013-05-06 2015-11-18 山东共达电声股份有限公司 A kind of Double bottom pad and a kind of MEMS microphone

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Granted publication date: 20081203