CN102315239A - Optoelectronic component - Google Patents

Abstract

The present invention discloses a photoelectric element, which comprises a substrate; a plurality of semiconductor units electrically connected to each other and located on the substrate, wherein the semiconductor units comprise a first semiconductor layer, a second semiconductor layer, and an active region therebetween; a plurality of first electrodes respectively located on the first semiconductor layer; a connecting portion formed on the semiconductor units to electrically connect the semiconductor units in series; and a plurality of second electrodes respectively located on the second semiconductor layer, wherein one of the first electrodes comprises a first extension portion, and one of the second electrodes comprises a second extension portion.

Description

Photoelectric components

technical field

The present invention relates to a light emitting element.

Background technique

Because the light-emitting diodes in solid-state lighting components have good photoelectric characteristics such as low power consumption, low heat generation, long operating life, impact resistance, small size, fast response speed, and can emit color light with stable wavelengths, they have been widely used in home appliances and instruments. LED lights and photoelectric products, etc. In the development of optoelectronic technology, solid-state lighting components focus on their luminous efficiency, operating life and brightness, and thus are expected to become the mainstream of lighting applications in the near future.

At present, LEDs are used in the form of array light-emitting elements, which are mostly suitable for high driving voltage applications, and can reduce the volume and weight of LEDs. LED manufacturers design different electrode layouts for array light-emitting elements to meet customers' needs for high driving voltage LEDs, so as to reduce costs and improve production efficiency.

Contents of the invention

The present application proposes a photoelectric element, including a substrate; a plurality of semiconductor units electrically connected to each other and located on the substrate; wherein, each semiconductor unit includes a first semiconductor layer, a second semiconductor layer and an intermediate layer therebetween. source region; a plurality of first electrodes are respectively located on the first semiconductor layer; connecting parts are formed on the plurality of semiconductor units, electrically connecting the plurality of semiconductor units in series; and a plurality of second electrodes are respectively located in the second semiconductor layer above; wherein, a first electrode includes a first extension, and a second electrode includes a second extension.

The present application also proposes an optoelectronic element, comprising a substrate; a plurality of semiconductor units electrically connected to each other and located on the substrate; wherein each semiconductor unit comprises a first semiconductor layer, a second semiconductor layer, and a semiconductor unit between them. a plurality of first electrodes are respectively located on the first semiconductor layer; connecting parts are formed on the plurality of semiconductor units to electrically connect the plurality of semiconductor units in series; and a plurality of second electrodes are respectively located on the second On the semiconductor layer; wherein, a first electrode includes a first extension, and a second electrode includes a second extension, wherein the driving voltages of the plurality of semiconductor units are substantially the same.

The present application further proposes an optoelectronic element, which includes a substrate; a plurality of semiconductor units are electrically connected to each other and located on the substrate, wherein each semiconductor unit includes a first semiconductor layer, a second semiconductor layer, and an intervening semiconductor layer. In the active region, a plurality of first electrodes are respectively located on the first semiconductor layer; and a plurality of second electrodes are respectively located on the second semiconductor layer, wherein the plurality of semiconductor units includes a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit. In the semiconductor unit, at least one of the first electrodes includes a first electrode pad located on the first semiconductor unit at the outermost periphery of the substrate, and at least one of the second electrodes includes a second electrode pad located on the second semiconductor unit at the outermost periphery of the substrate, Wherein the first electrode and the second electrode including the first extension part and the second extension part are located on the third semiconductor unit without electrode pads.

The present application further proposes a photoelectric element, which includes a substrate; a plurality of semiconductor units are electrically connected to each other and located on the substrate, wherein each semiconductor unit includes a first semiconductor layer, a second semiconductor layer, and an organic layer interposed therebetween. source region; and a plurality of first electrodes and a plurality of second electrodes are respectively located on a plurality of semiconductor units, wherein each semiconductor unit includes a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit, and at least one of the first electrodes One comprising a first electrode pad is located on the second semiconductor layer of the first semiconductor unit, and at least one of the second electrodes comprises a second electrode pad located on the second semiconductor layer of the second semiconductor unit, wherein the first electrode and the second The electrode includes a first extension part and a second extension part located on the third semiconductor unit without electrode pad.

Description of drawings

FIG. 1 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 2 is a sectional view of the photoelectric element shown in Fig. 1;

Fig. 3 is a 3D perspective view of the photoelectric element shown in Fig. 1;

Fig. 4 is the equivalent circuit diagram of the photoelectric element shown in Fig. 1;

FIG. 5 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 6 is a 3D perspective view of the photoelectric element shown in Fig. 5;

Fig. 7 is the equivalent circuit diagram of the photoelectric element shown in Fig. 5;

FIG. 8 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 9 is a 3D perspective view of the photoelectric element shown in Fig. 8;

Fig. 10 is the equivalent circuit diagram of the photoelectric element shown in Fig. 8;

Fig. 11 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 12 is a 3D perspective view of the photoelectric element shown in Fig. 11;

Fig. 13 is an equivalent circuit diagram of the photoelectric element shown in Fig. 11;

Fig. 14 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 15 is a 3D perspective view of the photoelectric element shown in Fig. 14;

Fig. 16 is the equivalent circuit diagram of the photoelectric element shown in Fig. 14;

Fig. 17 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 18 is a 3D perspective view of the photoelectric element shown in Fig. 17;

Fig. 19 is an equivalent circuit diagram of the photoelectric element shown in Fig. 17;

FIG. 20 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 21 is a 3D perspective view of the photoelectric element shown in Fig. 20;

Fig. 22 is the equivalent circuit diagram of the photoelectric element shown in Fig. 20;

Fig. 23 is a top view of a photoelectric element according to an embodiment of the present application;

Fig. 24 is a 3D perspective view of the photoelectric element shown in Fig. 23;

FIG. 25 is a top view of an optoelectronic device according to an embodiment of the present application.

Explanation of reference signs

10, 20, 30, 40, 50, 60, 70, 80, 90 photoelectric components;

11, 21, 31, 41, 51, 61, 71, 81 substrates;

141, 241, 341, 441, 541, 641, 741, 841 first electrode;

142, 242, 342, 442, 542, 642, 742, 842 second electrodes;

143, 243, 343443, 543, 643, 743, 843 connecting parts;

121 a first semiconductor layer;

123 second semiconductor layer;

122 active area;

170 grooves;

111, 311 divide the road;

1411, 2411, 3411, 4411, 5411, 6411, 7411, 8411 first extension;

1421, 2421, 3421, 4421, 5421, 6421, 7421, 8421 second extension;

1412, 2412, 3412, 4412, 5412, 6412, 7412, 8412, 9412 first electrode pad;

1422, 2422, 3422, 4422, 5422, 6422, 7422, 8422, 9422 second electrode pads;

105, 106, 107, 108, 109, 205, 206, 207, 208, 209, 305, 306, 307, 308, 309, 405, 406, 407, 505, 506, 507, 605, 606, 607, 705, Lines 706, 707, 801, 802, 803, 804, 805, 806, 807;

151, 152, 153, 154, 155, 161, 162, 163, 164, 165, 171, 172, 173, 174, 181, 182, 183, 184, 185, 191, 192, 193, 194, 195, 251, 252, 253, 254, 255, 261, 262, 263, 264, 271, 272, 273, 274, 275, 281, 282, 283, 284, 291, 292, 293, 294, 295, 351, 352, 353, 354, 355, 361, 362, 363, 364, 371, 372, 373, 374, 375, 381, 382, 383, 384, 391, 392, 393, 394, 395, 451, 452, 453, 454, 455, 461, 462, 463, 464, 465, 466, 471, 472, 473, 474, 475, 551, 552, 553, 554, 561, 562, 563, 571, 572, 573, 574, 651, 652, 661, 662, 663, 664, 671, 672, 751, 752, 761, 762, 769, 771, 772, 811, 812, 871, 872 semiconductor units;

1411a, 2411a first curved extension;

1421a, 2421a second curved extension;

1421b, 2421b, 3411b, 4411a linear extension;

1411c, 1421c, 2411c, 3411c, 4411c second-order extensions;

3411a Curved extension.

Detailed ways

FIG. 1 discloses a top view of an optoelectronic device 10 according to an embodiment of the present application. The optoelectronic element 10 is, for example, a light emitting diode (LED), a laser diode (LD), or a solar cell, comprising a plurality of semiconductor units formed on a substrate 11, a first electrode 141, a second electrode 142 and a connecting portion 143 formed on the semiconductor unit . In this embodiment, the photoelectric element 10 is a light emitting diode (LED). FIG. 2 discloses a cross-sectional view of the photoelectric element 10 in FIG. 1 along line A-A'. Each semiconductor unit includes a first semiconductor layer 121 , a second semiconductor layer 123 , and an active region 122 between the first and second semiconductor layers. The constituent material of the first semiconductor layer 121 is a III-V semiconductor material doped with p-type or n-type impurities, and the constituent material of the second semiconductor layer 123 is a III-V semiconductor doped with p-type or n-type impurities materials, and the electrical properties of the first semiconductor layer 121 and the second semiconductor layer 123 are different. The structure of the active region 122 may be a single heterostructure (SH), a double heterostructure (DH), or a multiple quantum well structure (MQW). The trench 170 is formed in the semiconductor unit by etching the semiconductor unit, and exposes part of the first semiconductor layer 121 . A plurality of dividing lines 111 are formed between the semiconductor units, exposing part of the substrate 11 . There are a plurality of first electrodes 141 and second electrodes 142 on the photoelectric element 10 , wherein the first electrodes 141 are formed on the exposed first semiconductor layer 121 , and the second electrodes 142 are formed on the second semiconductor layer 123 . The first electrode 141 includes a first extension portion 1411 , and the second electrode 142 includes a second extension portion 1421 . In addition, the first electrode 141 on one of the semiconductor units includes a first electrode pad 1412 , and the second electrode 142 on the other semiconductor unit includes a second electrode pad 1422 .

或

加以设计，其中，n代表半导体单元的数量，V代表光电元件的驱动电压，V_f代表半导体单元的驱动电压。在本实施例中，光电元件10的大小是85×85mil²，其驱动电压为72V。每一半导体单元的驱动电压实质上为3V，但半导体单元的驱动电压会因工艺控制以及外延层的品质而有所变化。一般来说，在光电元件的电性效率上，半导体单元的驱动电压越低越好。每一半导体单元的面积大致上彼此相同。依照上述的公式，光电元件10包含24个半导体单元，分别配置于行105、106、107、108、以及109。第一行105包含五个半导体单元151、152、153、154、以及155，朝第一方向串接；第二行106包含五个半导体单元161、162、163、164、以及165，朝第二方向串接；第三行107包含四个半导体单元171、172、173、以及174，朝第一方向串接；第四行108包含五个半导体单元181、182、183、184、以及185，朝第二方向串接；第五行109包含五个半导体单元191、192、193、194、以及195，朝第一方向串接。第一方向及第二方向相反，而不同行中包含不同数量的半导体单元的布局可使配置上更容易满足客户的需求。In order to meet the customer's requirements for the specific area, current and driving voltage of the photoelectric element, the layout of the semiconductor unit and electrodes must also be specially designed. The number of semiconductor units is in principle according to the formula

or

To be designed, wherein, n represents the number of semiconductor units, V represents the driving voltage of the photoelectric element, and V _f represents the driving voltage of the semiconductor unit. In this embodiment, the size of the photoelectric element 10 is 85×85 mil ² , and its driving voltage is 72V. The driving voltage of each semiconductor unit is substantially 3V, but the driving voltage of the semiconductor unit may vary due to process control and the quality of the epitaxial layer. Generally speaking, in terms of the electrical efficiency of the photovoltaic element, the lower the driving voltage of the semiconductor unit, the better. The area of each semiconductor unit is substantially the same as each other. According to the above formula, the optoelectronic device 10 includes 24 semiconductor units, which are respectively arranged in rows 105 , 106 , 107 , 108 , and 109 . The first row 105 includes five semiconductor units 151, 152, 153, 154, and 155, connected in series toward the first direction; The third row 107 includes four semiconductor units 171, 172, 173, and 174, which are connected in series in the first direction; the fourth row 108 includes five semiconductor units 181, 182, 183, 184, and 185, which are connected in series toward The second direction is connected in series; the fifth row 109 includes five semiconductor units 191 , 192 , 193 , 194 , and 195 , which are connected in series in the first direction. The first direction and the second direction are opposite, and the layout of different numbers of semiconductor units in different rows can make the configuration easier to meet the needs of customers.

In the third row 107 , the shape of the semiconductor units is rectangular and different from that of the semiconductor units in other rows. Such a design can make electrode layout easier. Referring to FIG. 1 and FIG. 3 , in the first row 105 and the fifth row 109 , except for the semiconductor units 151 , 155 , 191 , and 195 located in the corner regions of the substrate 11 , the electrode layouts on other semiconductor units are similar. In the second row 106 and the fourth row 108 , except for the semiconductor units 161 , 165 , 181 , and 185 near the edge of the substrate 11 , the electrode layouts on other semiconductor units are the same. The electrode layout of the semiconductor units in the third row 107 is quite different from that of the semiconductor units in other rows, but the electrode layouts on the semiconductor units 172 and 173 are the same, and are different from those of the semiconductor units located on the edge of the substrate 11. 171 and 174 are different.

The first extension 1411 includes a first curved extension 1411a; the second extension 1421 includes a second curved extension 1421a, and the second extension 1421 of the semiconductor units on rows 105, 106, 108, and 109 also includes a straight line extension. The portion 1421b; the first curved extension portion 1411a and/or the second curved extension portion 1421a are not parallel to any side of the semiconductor unit. The first extension 1411 on the semiconductor units of the first, third, and fifth rows 105, 107, and 109 is located in the trench 170, and extends from the first side of the semiconductor unit to the second side of the opposite side, and the second extension The portion 1421 extends from the second side to the first side of the semiconductor unit. The first extension 1411 on the semiconductor units of the second and fourth rows 106 and 108 extends from the second side of the semiconductor unit to the first side, and the second extension 1421 extends from the first side of the semiconductor unit to the second side. edge extended. In this embodiment, the second extension portion 1421 is substantially disposed near the edge of the semiconductor unit, and the first extension portion 1411 is disposed in the semiconductor unit trench 170 and electrically connected to the first semiconductor layer 121 . The number of extensions can be adjusted according to the area of the semiconductor unit. If the area of the semiconductor unit is larger, more extensions are needed. The extension part can also form a second-order extension part 1411c extending from the first curved extension part 1411a and/or a second-order extension part 1421c extended from the second curved extension part 1421a to increase current dispersion.

The first electrode pad 1412 and the second electrode pad 1422 are respectively located on the semiconductor units 155 and 191 at opposite corners of the substrate 11, the first electrode pad 1412 is in contact with the first extension 1411 on the semiconductor unit 155, and the second electrode pad 1422 It is in contact with the second extension portion 1421 on the semiconductor unit 191; the electrode pad is used for wire bonding or flip chip type bonding. In order to reduce the difficulty of bonding, the electrode pads are preferably respectively arranged on different semiconductor units on the outermost side of the substrate 11 .

In order to electrically connect each semiconductor unit, the connecting portion 143 is therefore formed between each semiconductor unit. The extensions 1421 are connected. In this embodiment, the connecting portion 143 forms a connection in the first direction between the first, third, and fifth rows 105, 107, and 109, and forms a connection in the second direction between the second and fourth rows 106 and 108. Reverse concatenation. The semiconductor units 151 and 161 , 165 and 174 , 171 and 181 , and 185 and 195 are connected in series through the connecting portion 143 between the rows. In the first, second, fourth, and fifth rows 105, 106, 108, and 109, there are two connection portions 143 between every two semiconductor units, and there is one connection between every two semiconductor units in the third row 107. The portion 143 exists therebetween. FIG. 4 is an equivalent circuit diagram of the photovoltaic element 10 shown in FIG. 1 .

A transparent conductive layer may also be included between the second semiconductor layer 123 and the second electrode 142 of the photoelectric element 10, and the material of the transparent conductive layer is a metal oxide material, such as indium tin oxide (ITO), cadmium tin oxide (CTO), antimony oxide Tin, indium zinc oxide, zinc aluminum oxide, or zinc tin oxide. In addition, when the metal layer has a thickness that allows light to pass through, it can also serve as a transparent conductive layer.

A bonding layer may further be included between the substrate 11 and the first semiconductor layer 121 , so that the semiconductor unit is bonded to the substrate 11 . The bonding layer can be an insulating transparent bonding layer or a conductive transparent bonding layer; if it is an insulating transparent bonding layer, its material can be polyimide (polyimide), benzocyclobutene (BCB), or perfluorocyclobutane ( PFCB); if it is the material of the conductive bonding layer, the material can be metal oxide material or metal, and the metal oxide material includes indium tin oxide (ITO), cadmium tin oxide (CTO), antimony tin oxide, indium zinc oxide, zinc oxide Aluminum, or zinc tin oxide; metal materials include nickel, gold, titanium, chromium, aluminum, or platinum. The dividing line 111 is formed between each semiconductor unit and exposes part of the substrate 11 and/or the insulating transparent bonding layer. When the bonding layer is a conductive bonding layer, the dividing lines 111 pass through the conductive bonding layer to expose the substrate 11 to electrically insulate the semiconductor units. At this time, the substrate 11 is aluminum nitride (AlN), sapphire, or glass.

FIG. 5 shows a top view of a photoelectric device 20 according to the second embodiment of the present application. 5-6, the optoelectronic element 20 includes a plurality of semiconductor units formed on the substrate 21, and separated by a plurality of dividing roads 211, the first electrode 241, the second electrode 242, and the connecting portion 243 are formed on the semiconductor unit superior. The structure of the semiconductor unit is the same as that of the photoelectric element 10 , including a first semiconductor layer 121 , a second semiconductor layer 123 , and an active region 122 between the first and second semiconductor layers. A plurality of dividing streets 211 are formed between each semiconductor unit. There are a plurality of first electrodes 241 and second electrodes 242 on the photoelectric element 20 , wherein the first electrodes 241 are formed on the exposed first semiconductor layer 121 , and the second electrodes 242 are formed on the second semiconductor layer 123 . The first electrode 241 includes a first extension portion 2411 , and the second electrode 242 includes a second extension portion 2421 . In addition, the first electrode 241 on one semiconductor unit of the plurality of semiconductor units includes a first electrode pad 2412 , and the second electrode 242 on the other semiconductor unit includes a second electrode pad 2422 .

In this embodiment, the size of the photoelectric element 20 is 85×85mil ² , its driving voltage is 72V, and the area of each semiconductor unit is roughly the same as each other, according to the above formula The optoelectronic device 20 includes 23 semiconductor units arranged in rows 205 , 206 , 207 , 208 , and 209 . The first row 205 includes five semiconductor units 251, 252, 253, 254, and 255 connected in series toward the first direction, and the electrode layout on it is the same as the electrode layout on the semiconductor units in the first row 105 of the photoelectric element 10; The second row 206 includes four semiconductor units 261, 262, 263, and 264 connected in series in the second direction, and the electrode layout on it is the same as the electrode layout on the semiconductor units in the third row 107 of the photoelectric element 10; Row 207 includes five semiconductor units 271, 272, 273, 274, and 275 connected in series toward the first direction, and the electrode layout on it is the same as the electrode layout on the semiconductor units in the first row 105 of the photoelectric element 10; Row 208 includes four semiconductor units 281, 282, 283, and 284 connected in series toward the second direction, and the electrode layout on it is the same as the electrode layout on the semiconductor unit in the third row 107 of photoelectric element 10; the fifth row 209 includes The five semiconductor units 291 , 292 , 293 , 294 , and 295 are connected in series toward the first direction, and the layout of the electrodes thereon is the same as that of the semiconductor units in the first row 105 of the photoelectric element 10 .

In the second and fourth rows 206, 208, the shape of the semiconductor units is rectangular and different from that of the semiconductor units in the other rows. Referring to FIG. 5 and FIG. 6, the electrode layouts on the semiconductor units of the first row 205, the third row 207, and the fifth row 209, except the electrodes on the semiconductor units 251, 255, 271, 275, 291, and 295, other The electrode layouts on the semiconductor units are substantially similar to each other; the electrode layouts on the semiconductor units of the second row 206 and the fourth row 208, except for the electrodes on the semiconductor units 261, 264, 281, and 284, the electrodes on the other semiconductor units The electrode layouts are substantially identical to each other. The first extension portion 2411 includes a first curved extension portion 2411a, and the second extension portion 2421 includes a second curved extension portion 2421a. On the semiconductor units in rows 205, 207, and 209, the second extension 2421 further includes a straight extension 2421b; the first curved extension 2411a and the second curved extension 2421a are not parallel to any side of the semiconductor unit. The first extension 2411 on the first, third, and fifth row 205, 207, 209 semiconductor units is disposed on the first semiconductor layer 121, and extends from the first side of the semiconductor unit to the second side opposite to the first side, The second extension portion 2421 extends from the second side to the first side. The first extension 2411 on the second and fourth rows 206 and 208 of semiconductor units extends from the second side to the first side of the semiconductor unit, and the second extension 2421 extends from the first side to the second side. In this embodiment, the second extension 2421 is substantially disposed near the edge of the semiconductor unit, and the first extension 2411 is placed in the semiconductor unit and electrically connected to the first semiconductor layer. The extension portion can also form a second-order extension portion 2411c extending from the first curved extension portion 2411a to increase current dispersion.

The first electrode pad 2412 and the second electrode pad 2422 are respectively formed on the semiconductor unit 255 and 291. The second extension 2421 is in contact. The electrode pads are used for bonding, and are respectively arranged on different semiconductor units on the corner regions of the substrate 21 .

In this embodiment, the connecting portion 243 forms a connection in the first direction between the first, third, and fifth rows 205, 207, and 209, and forms a connection in the second direction between the second and fourth rows 206 and 208. Reverse concatenation. The semiconductor units 251 and 261 , 264 and 275 , 271 and 281 , and 284 and 295 are connected in series through the connecting portion 243 between each row. There are two connection portions 243 between every two semiconductor units in the first, third, and fifth rows 205, 207, and 209, and there is one connection portion 243 between every two semiconductor units in the second row 206 and the fourth row 208 . FIG. 7 is an equivalent circuit diagram of the photoelectric element 20 shown in FIG. 5 .

FIG. 8 shows a top view of a photoelectric device 30 according to the third embodiment of the present application. Referring to FIGS. 8-9 , the photoelectric element 30 includes a plurality of semiconductor units formed on a substrate 31 , and a first electrode 341 , a second electrode 342 , and a connection portion 343 are formed on the semiconductor unit. The structure of the semiconductor unit includes a first semiconductor layer 121 , a second semiconductor layer 123 , and an active region 122 between the first and second semiconductor layers. A plurality of dividing streets 311 are formed between each semiconductor unit. There are multiple first electrodes 341 and second electrodes 342 on the photoelectric element 30, wherein the first electrode 341 includes a first extension 3411 formed on a semiconductor unit other than the semiconductor unit 355, and the second electrode 342 includes a second extension 3421 . In addition, the first electrode 341 on the semiconductor unit 355 includes a first electrode pad 3412 , and the second electrode 342 on the semiconductor unit 391 includes a second electrode pad 3422 .

In this embodiment, the size of the photoelectric element 30 is 50×50 mil ² , its driving voltage is 72V, the driving voltage of the semiconductor units is about 3V, and the area of each semiconductor unit is substantially the same as each other. The optoelectronic device 30 includes 23 semiconductor units arranged in rows 305 , 306 , 307 , 308 , and 309 . The first row 305 includes five semiconductor units 351, 352, 353, 354, and 355 connected in series toward the first direction; the second row 306 includes four semiconductor units 361, 362, 363, and 364 connected in series toward the second direction; The third row 307 includes five semiconductor units 371, 372, 373, 374, and 375 connected in series toward the first direction; the fourth row 308 includes four semiconductor units 381, 382, 383, and 384 connected in series toward the second direction; The fifth row 309 includes five semiconductor units 391 , 392 , 393 , 394 , and 395 connected in series in the first direction.

In the second and fourth rows 306, 308, the shape of the semiconductor units is different from that of the semiconductor units in the other rows. Referring to FIG. 8 and FIG. 9, the electrode layouts on the semiconductor units of the first row 305, the third row 307, and the fifth row 309, except the electrodes on the semiconductor units 351, 355, 371, 375, 391, and 395, other The electrode layouts on the semiconductor units are substantially similar to each other; the electrode layouts on the semiconductor units of the second row 306 and the fourth row 308, except for the electrodes on the semiconductor units 361, 364, 381, and 384, are different from each other. roughly the same. The first extension 3411 can be a curved extension 3411a, which is arranged on the semiconductor units 361, 375, 381, 391, and 394 close to the periphery of the substrate 31; the first extension 3411 can also be a straight extension 3411b, which is arranged on other on the semiconductor unit. The second extension part 3421 may be a curved extension part.

In the first, third, and fifth rows 305, 307, and 309, except for the semiconductor units 375 and 395, the first extensions 3411 on other semiconductor units extend from the first side of the semiconductor unit to the second side opposite to the first side. side, and the second extension portion 3421 extends from the second side to the first side. The first extension portion 3411 on the semiconductor units 375 and 395 extends from the third side to the second side of the semiconductor unit. In the second and fourth rows 306, 308, except for the semiconductor units 361, 381, the first extension 3411 on other semiconductor units extends from the second side to the first side, and the second extension 3421 extends from the first side to the first side. Extended on both sides. The first extension portion 3411 on the semiconductor units 361 and 381 extends from the third side to the first side of the semiconductor units 361 and 381 . The curved extension portion of the first extension portion 3411 and the second extension portion 3421 are not parallel to any side of the semiconductor unit. In this embodiment, the second extension portion 3421 is substantially disposed near the edge of the semiconductor unit, and the first extension portion 3411 is placed in the semiconductor unit and electrically connected to the first semiconductor layer. The extension portion can also form a second-order extension portion 3411c extending from the curved extension portion 3411a and the straight extension portion 3411b to increase current dispersion.

The first electrode pad 3412 and the second electrode pad 3422 are respectively formed on the semiconductor units 355 and 391 , and the second electrode pad 3422 is in contact with the second extension portion 3421 on the semiconductor unit 391 . The electrode pads are used for wire bonding or flip-chip bonding, and are respectively arranged on different semiconductor units on the corner region of the substrate 31 .

In this embodiment, the connecting portion 343 forms a connection in the first direction between the first, third, and fifth rows 305, 307, and 309, and forms a connection in the second direction between the second and fourth rows 306 and 308. Reverse concatenation. The semiconductor units 351 and 361 , 364 and 375 , 371 and 381 , and 384 and 395 are connected in series through the connecting portion 343 between the rows. A connecting portion 343 exists between every two semiconductor units. FIG. 10 is an equivalent circuit diagram of the photoelectric element 30 shown in FIG. 8 .

FIG. 11 shows a top view of an optoelectronic device 40 according to the fourth embodiment of the present application. Referring to FIGS. 11-12 , the photoelectric element 40 includes a plurality of semiconductor units formed on a substrate 41 , and a first electrode 441 , a second electrode 442 , and a connecting portion 443 are formed on the semiconductor unit. The structure of the semiconductor unit includes a first semiconductor layer 121 , a second semiconductor layer 123 , and an active region 122 between the first and second semiconductor layers. A plurality of dividing streets 411 are formed between each semiconductor unit. There are a plurality of first electrodes 441 and second electrodes 442 on the photoelectric element 40, wherein the first electrodes 441 include first extensions 4411 formed on semiconductor units other than semiconductor unit 455, and formed on semiconductor units other than semiconductor unit 471 The second electrode 442 on the top includes a second extension 4421 . In addition, the first electrode 441 formed on the semiconductor unit 455 includes a first electrode pad 4412 , and the second electrode 442 on the semiconductor unit 471 includes a second electrode pad 4422 .

In this embodiment, the size of the photoelectric element 40 is 45×45mil ² , its driving voltage is 48V, and the driving voltage of the semiconductor unit is about 3V; according to the above formula, the photoelectric element 40 includes 16 semiconductor units, arranged in rows 405, 406 and 407. The first row 405 includes five semiconductor units 451, 452, 453, 454, and 455 connected in series toward the first direction; the second row 406 includes six semiconductor units 461, 462, 463, 464, 465, and 466 toward the second Direction in series; the third row 407 includes five semiconductor units 471 , 472 , 473 , 474 , and 475 in series in the first direction.

The shape of the semiconductor units in the second row 402 is different from that of the semiconductor units in other rows; referring to FIG. 11 and FIG. Except for the electrodes on 455, 471, and 475, the electrode layouts of other semiconductor units are substantially similar to each other. The first extension 4411 includes a straight extension 4411a and a second extension 4411c, and all the second extensions 4421 are curved extensions. The first extension 4411 on the semiconductor units in the first and second rows 405, 407 extends from the first side of the semiconductor unit to the third side and the fourth side adjacent to the first side, and the second extension 4421 extends from The second side extends toward the third side and the fourth side. The first extension 4411 on the semiconductor unit in the second row 406 extends from the second side to the third side and the fourth side of the semiconductor unit, and the second extension 4421 extends from the first side to the third side and the fourth side extend. Curved extensions 4411 and 4421 are not parallel to either side of the semiconductor unit.

The first electrode pad 4412 and the second electrode pad 4422 are located on the semiconductor units 455 and 471 respectively, and the connecting portion 443 forms a serial connection between the semiconductor units. FIG. 13 is an equivalent circuit diagram of the photoelectric element 40 shown in FIG. 11 .

FIG. 14 shows a top view of a photoelectric device 50 according to the fifth embodiment of the present application. FIG. 15 is a 3D perspective view of the photoelectric element 50 . The size of the photoelectric element 50 is 40×40mil ² , its driving voltage is 36V, and the driving voltage of the semiconductor unit is about 3V; according to the formula In this embodiment, the optoelectronic device 50 includes 11 semiconductor units, which are respectively arranged in rows 505 , 506 , and 507 . The first row 505 includes four semiconductor units 551, 552, 553, and 554 connected in series toward the first direction; the second row 506 includes three semiconductor units 561, 562, and 563 connected in series toward the second direction; the third row 507 It includes four semiconductor units 571 , 572 , 573 , and 574 connected in series in the first direction. The first electrode 541 having the first extension 5411 is formed on the semiconductor units other than the semiconductor unit 554, and the second electrode 542 having the second extension 5421 is formed on all the semiconductor units. The first electrode 541 on the semiconductor unit 554 includes a first electrode pad 5412 , and the second electrode 542 on the semiconductor unit 571 includes a second electrode pad 5422 . The connection portion 543 forms a series connection between the semiconductor units. FIG. 16 is an equivalent circuit diagram of the photoelectric element 50 shown in FIG. 14 .

在本实施例中，光电元件60包含8个半导体单元，分别配置于行605、606、及607中。第一行605包含二个半导体单元651及652朝第一方向串接；第二行606包含四个半导体单元661、662、663、及664朝第二方向串接；第三行607包含二个半导体单元671及672朝第一方向串接。第一电极641包含第一延伸部6411，第二电极642包含第二延伸部6421。此外，多个半导体单元中的一个半导体单元上的其第一电极641包含二个第一电极垫6412，且另一半导体单元上的第二电极642包含二个第二电极垫6422。连接部643于半导体单元之间形成串接。图19是图17中所示的光电元件60的等效电路图。FIG. 17 shows a top view of a photoelectric device 60 according to the sixth embodiment of the present application. FIG. 18 is a 3D perspective view of the photoelectric element 60 . The size of the photoelectric element 60 is 120×120mil ² , its driving voltage is 24V, and the driving voltage of the semiconductor unit is about 3V; according to the formula

In this embodiment, the optoelectronic device 60 includes 8 semiconductor units arranged in rows 605 , 606 , and 607 . The first row 605 includes two semiconductor units 651 and 652 connected in series in the first direction; the second row 606 includes four semiconductor units 661, 662, 663, and 664 connected in series in the second direction; the third row 607 includes two The semiconductor units 671 and 672 are connected in series in the first direction. The first electrode 641 includes a first extension 6411 , and the second electrode 642 includes a second extension 6421 . In addition, the first electrode 641 of one semiconductor unit includes two first electrode pads 6412 , and the second electrode 642 of the other semiconductor unit includes two second electrode pads 6422 . The connection portion 643 forms a series connection between the semiconductor units. FIG. 19 is an equivalent circuit diagram of the photoelectric element 60 shown in FIG. 17 .

FIG. 20 shows a top view of a photoelectric device 70 according to the seventh embodiment of the present application. FIG. 21 is a 3D perspective view of the photoelectric element 70 . The size of the photoelectric element 70 is 120×120mil ² , its driving voltage is 24V, and the driving voltage of the semiconductor unit is about 3V; according to the formula In this embodiment, the optoelectronic element 70 includes seven semiconductor units, which are respectively arranged in rows 705 , 706 , and 707 . The first row 705 includes two semiconductor units 751 and 752 connected in series toward the first direction; the second row 606 includes three semiconductor units 761, 762, and 769 connected in series toward the second direction; the third row 707 includes two semiconductor units 771 and 772 are connected in series towards the first direction. The first electrode 741 includes a first extension portion 7411 , and the second electrode 742 includes a second extension portion 7421 . In addition, the first electrode 741 on one of the semiconductor units includes two first electrode pads 7412 , and the second electrode 742 on the other semiconductor unit includes two second electrode pads 7422 . The connection portion 743 forms a series connection between the semiconductor units. FIG. 22 is an equivalent circuit diagram of the photoelectric element 70 shown in FIG. 20 .

在本实施例中，光电元件80包含48个半导体单元配置于行801、802、803、804、805、806及807中。行801、803、805、及807中分别包含七个半导体单元朝第一方向串接；行802及806中包含七个半导体单元朝第二方向串接；第四行804包含六个半导体单元朝第一方向串接。多个半导体单元中的一个半导体单元上的第一电极841包含第一电极垫8412位于半导体单元811的第一半导体层121上，且半导体单元871上的第二电极842包含第二电极垫8422，其位于第二半导体层123上。此外，具有第一延伸部8411的第一电极841位于第一电极垫8412所置的半导体单元之外的半导体单元上；具有第二延伸部8421的第二电极842位于所有半导体单元上。连接部843于半导体单元之间形成串接。第一电极垫8412所位于的半导体单元811上的第二电极842位于第二半导体层123上，通过连接部843与半导体单元812的第一电极841连接；第二电极垫8422所位于的半导体单元871上的第一电极841位于第一半导体层121上，通过连接部843与半导体单元872的第二电极842连接。FIG. 23 shows a top view of an optoelectronic device 80 according to the eighth embodiment of the present application. FIG. 24 is a 3D perspective view of the photoelectric element 80 . The size of the photoelectric element 80 is 85×85mil ² , its driving voltage is 144V, and the driving voltage of the semiconductor unit is about 3V; according to the formula

In this embodiment, the optoelectronic device 80 includes 48 semiconductor units arranged in rows 801 , 802 , 803 , 804 , 805 , 806 and 807 . Rows 801, 803, 805, and 807 respectively include seven semiconductor units connected in series toward the first direction; rows 802 and 806 include seven semiconductor units connected in series toward the second direction; row 804 includes six semiconductor units connected in series toward the second direction; Connect in the first direction. The first electrode 841 on one of the plurality of semiconductor units includes a first electrode pad 8412 located on the first semiconductor layer 121 of the semiconductor unit 811, and the second electrode 842 on the semiconductor unit 871 includes a second electrode pad 8422, It is located on the second semiconductor layer 123 . In addition, the first electrode 841 with the first extension 8411 is located on semiconductor units other than the semiconductor unit where the first electrode pad 8412 is located; the second electrode 842 with the second extension 8421 is located on all semiconductor units. The connection portion 843 forms a series connection between the semiconductor units. The second electrode 842 on the semiconductor unit 811 where the first electrode pad 8412 is located is located on the second semiconductor layer 123, and is connected to the first electrode 841 of the semiconductor unit 812 through the connection portion 843; the semiconductor unit where the second electrode pad 8422 is located The first electrode 841 on 871 is located on the first semiconductor layer 121 and is connected to the second electrode 842 of the semiconductor unit 872 through the connection part 843 .

FIG. 25 shows a top view of a photoelectric device 90 according to the ninth embodiment of the present application. The optoelectronic device 90 includes 48 semiconductor units arranged in rows 801 , 802 , 803 , 804 , 805 , 806 and 807 . Its appearance and electrode configuration are similar to the photoelectric element 80, the difference is that the first electrode pad 9412 is formed on the second semiconductor layer 123 of the semiconductor unit 811, and is connected in series with the first electrode 841 of the semiconductor unit 812 through the connection part 843; The electrode pad 9422 is formed on the second semiconductor layer 123 of the semiconductor unit 871 , and is connected in series with the second electrode 842 of the semiconductor unit 872 through the connection portion 843 . When an external power supply current is injected from the second electrode pad 9422 and then output from the first electrode pad 9412, the resistance of the semiconductor unit 871 under the second electrode pad 9422 is greater than that of the connecting portion 843 and the first electrode 841 of the semiconductor unit 812. Therefore, the current directly flows from the second electrode pad 9422 to the first electrode 841 of the semiconductor unit 812 through the connection portion 843, and does not flow to the first semiconductor layer 121, the active region 122, and the second semiconductor unit 871 under the semiconductor unit 871. Second semiconductor layer 123 . After the same current flows to the first electrode 841 of the semiconductor unit 812 and flows to the first electrode pad 9412 through the connection portion 843, it will not flow to the first semiconductor layer 121, the active region 122, and the second electrode pad 9412 below the semiconductor unit 811. semiconductor layer 123, but directly output to an external power source. Therefore, the semiconductor units 811 and 871 under the first electrode pad 9412 and the second electrode pad 9422 will not generate light. In order to further electrically isolate the electrode pads and the semiconductor units below, an insulating layer can be formed between the electrode pads and the semiconductor units to prevent the current from penetrating through the semiconductor layer below the electrode pads to form a short circuit due to high current.

Since the semiconductor unit under the first electrode pad 9412 and the second electrode pad 9422 does not emit light, the area of the first electrode pad 9412 can be approximately equivalent to the area of the semiconductor unit 811, and the area of the second electrode pad 9422 can be approximately the same as the area of the semiconductor unit 871. Quite, in order to improve the yield rate of the lead process. In addition, the first electrode pad 9412 in the photoelectric element 90 can also be matched with the second electrode pad 8422 in the photoelectric element 80. At this time, the first electrode pad 9412 covers almost the entire surface of the second semiconductor layer 123 of the semiconductor unit 811, and The second electrode pad 8422 is located on part of the second semiconductor layer 123 of the semiconductor unit 871; the semiconductor unit below the first electrode pad 9412 has no current injection, so it does not emit light, and the semiconductor unit 871 on which the second electrode pad 8422 is located The first electrode 841 is connected to the second electrode 842 of the semiconductor unit 872 through the connection portion 843 , and when a current is injected, the semiconductor unit 871 where the second electrode pad 8422 is located will emit light. Similarly, the second electrode pad 9422 in the photoelectric element 90 can also be matched with the first electrode pad 8412 in the photoelectric element 80. At this time, the first electrode pad 8412 is located on part of the first semiconductor 121 of the semiconductor unit 811, and the second The electrode pad 9422 covers substantially the entire surface of the second semiconductor layer 123 of the semiconductor unit 871; the second electrode 842 on the semiconductor unit 811 where the first electrode pad is located is connected to the first electrode 841 of the semiconductor unit 812 through the connecting portion 843 connection, when the current is injected, the semiconductor unit 811 where the first electrode pad 8422 is located will emit light, and the current injected into the second electrode pad 9422 does not flow through the active region 122 of the semiconductor unit 871, but directly passes through the connection part 843 flows to the semiconductor unit 872, so the semiconductor unit 871 where the second electrode pad 9422 is located does not emit light.

The materials of the first semiconductor layer, the active layer, and the second semiconductor layer include one or more elements selected from the group consisting of Ga, Al, In, As, P, N, and Si, such as GaN, AlGaN, InGaN , AlGaInN, GaP, GaAs, GaAsP, GaNAs, or Si; the material of the substrate includes sapphire, GaAs, GaP, SiC, ZnO, GaN, AlN, Cu, or Si.

The various embodiments listed in the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the present invention. Any obvious modifications or changes made by anyone to the present invention will not depart from the spirit and scope of the present invention.

Claims (22)

1. A photoelectric element, comprising: Substrate; A plurality of semiconductor units, electrically connected to each other and located on the substrate, wherein each of the plurality of semiconductor units includes a first semiconductor layer, a second semiconductor layer, and an interlayer between the first and second semiconductor layers active area; a plurality of first electrodes respectively located on the first semiconductor layer; a connecting portion formed on the plurality of semiconductor units to electrically connect the plurality of semiconductor units in series; and A plurality of second electrodes are respectively located on the second semiconductor layer, wherein at least one of the plurality of first electrodes includes a first extension, and at least one of the plurality of second electrodes includes a second extension. 2. The photovoltaic device according to claim 1, wherein the driving voltage and/or area of the plurality of semiconductor units are substantially the same. 3. The photovoltaic element of claim 2, wherein the plurality of semiconductor units comprise at least two different shapes. 4. The photoelectric element according to claim 1, wherein at least one of the first extension and the second extension comprises a linear extension, and/or at least one of the first extension and the second extension comprises Second-order extension. 5. The photoelectric device according to claim 1, wherein the plurality of first electrodes respectively comprise first extensions, and the plurality of second electrodes respectively comprise second extensions. 6. The photoelectric element according to claim 5, wherein the plurality of first extensions respectively comprise first curved extensions, and the plurality of second extensions respectively comprise second curved extensions; The first curved extension and the second curved extension are not parallel to any side of the plurality of semiconductor units. 7. The photoelectric device as claimed in claim 5, wherein the plurality of first electrodes respectively comprise linear extensions, and the plurality of second electrodes respectively comprise linear extensions. 8. The photoelectric element according to claim 1, wherein the plurality of semiconductor units comprises a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit, Wherein, one of the plurality of first electrodes includes a first electrode pad, the first electrode pad is located on the first semiconductor unit, and the first semiconductor unit is located on the corner region of the substrate; One of the plurality of second electrodes includes a second electrode pad located on the second semiconductor unit located on another corner region of the substrate; and The first extension part and the second extension part are located on the third semiconductor unit without electrode pads. 9. The optoelectronic element according to claim 8, wherein the first electrode on the first semiconductor unit further comprises an extension in contact with the first electrode pad, and/or the second electrode on the second semiconductor unit It also includes an extension part in contact with the second electrode pad. 10. The photovoltaic device of claim 1, wherein at least one of the first extension and the second extension includes a curved extension, and the curved extension is not parallel to any side of the plurality of semiconductor units. 11. The photoelectric element according to claim 1, wherein the first extension on any of the plurality of semiconductor units extends from a first side of the semiconductor unit to a second side opposite to the first side, and the second The extension part extends from the second side of the semiconductor unit to the first side, and the first extension part is located between the second extension parts. 12. The optoelectronic element according to claim 1, wherein said plurality of semiconductor units comprises first, second, third and fourth semiconductor units, said first and second semiconductor units are arranged in a first row, and said third and The fourth semiconductor unit is arranged in a second row adjacent to the first row. 13. The photoelectric element according to claim 12, wherein the first extension and the second extension are located on the first semiconductor unit, the first electrode located on the third semiconductor unit includes a third extension, the first An extension extends from the first side of the first semiconductor unit to the second side of the first semiconductor unit, and the second extension extends from the second side to the first side, wherein the first side of the first semiconductor unit closest to the first side of the substrate, the second side of the first semiconductor unit is closest to a second side opposite to the first side of the substrate; The third extension extends from the second side of the third semiconductor unit to the first side of the third semiconductor unit, wherein the second side of the third semiconductor unit is closest to the second side of the substrate, and the third semiconductor unit The first side of is closest to the first side of the substrate. 14. The photoelectric element according to claim 13, wherein the first electrode comprises a fourth extension formed on the third semiconductor unit, the fourth extension extends from the first edge of the third semiconductor unit to the third semiconductor unit. The second side of the cell is extended. 15. The photoelectric element according to claim 13, wherein the plurality of electrode layouts on the first semiconductor unit are the same as the plurality of electrode layouts on the second semiconductor unit, and/or the plurality of electrode layouts on the third semiconductor unit An electrode layout is the same as the plurality of electrode layouts on the fourth semiconductor unit. 16. The photoelectric element according to claim 13, wherein the plurality of electrode layouts of the first row are different from the plurality of electrode layouts of the second row, and/or the number of semiconductor units in the first row The number of the plurality of semiconductor units is different from that of the second row. 17. The photoelectric device of claim 13, wherein a plurality of the first row and the second row are repeatedly arranged on the substrate. 18. The photoelectric element according to claim 13, wherein the plurality of semiconductor units in the first row are connected in series in the first direction through the first connecting portion, and the plurality of semiconductor units in the second row are connected in series through the second connecting portion connected in series towards the second direction, wherein the first direction and the second direction are opposite. 19. The photovoltaic device of claim 1, further comprising a bonding layer formed between the substrate and the plurality of semiconductor layer units. 20. An optoelectronic component, comprising: Substrate; A plurality of semiconductor units are electrically connected to each other and located on the substrate, wherein each of the plurality of semiconductor units includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers. source area; a plurality of first electrodes respectively located on the first semiconductor layer; and A plurality of second electrodes are respectively located on the second semiconductor layer, Wherein, at least one of the plurality of first electrodes includes a first extension portion, and at least one of the plurality of second electrodes includes a second extension portion, wherein the driving voltages of the plurality of semiconductor units are substantially the same. 21. An optoelectronic component, comprising: Substrate; A plurality of semiconductor units are electrically connected to each other and located on the substrate, wherein each of the plurality of semiconductor units includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers. source area, a plurality of first electrodes respectively located on the first semiconductor layer; and A plurality of second electrodes are respectively located on the second semiconductor layer, Wherein the plurality of semiconductor units include a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit, at least one of the plurality of first electrodes includes a first electrode pad located on the first semiconductor unit at the outermost periphery of the substrate , and at least one of the plurality of second electrodes includes a second electrode pad located on the second semiconductor unit at the outermost periphery of the substrate, Wherein the first electrode and the second electrode including the first extension part and the second extension part are located on the third semiconductor unit without electrode pads. 22. An optoelectronic component comprising: Substrate; A plurality of semiconductor units are electrically connected to each other and located on the substrate, wherein each of the plurality of semiconductor units includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers. the source zone; and A plurality of first electrodes and a plurality of second electrodes are respectively located on the plurality of semiconductor units, Wherein the plurality of semiconductor units comprises a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit, at least one of the plurality of first electrodes comprises a first electrode pad located on the second semiconductor layer of the first semiconductor unit on, and at least one of the plurality of second electrodes comprising a second electrode pad is located on the second semiconductor layer of the two semiconductor units, Wherein the first electrode and the second electrode including the first extension part and the second extension part are located on the third semiconductor unit without electrode pads.

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