TW201203533A - An optoelectronic device - Google Patents
An optoelectronic device Download PDFInfo
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- TW201203533A TW201203533A TW099134515A TW99134515A TW201203533A TW 201203533 A TW201203533 A TW 201203533A TW 099134515 A TW099134515 A TW 099134515A TW 99134515 A TW99134515 A TW 99134515A TW 201203533 A TW201203533 A TW 201203533A
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Abstract
Description
201203533 六、發明說明: 【發明所屬之技術領域】 本發明係關於一發光元件陣列。 【先前技術】201203533 VI. Description of the Invention: [Technical Field to Be Invented] The present invention relates to an array of light-emitting elements. [Prior Art]
1由於固態照明元件中的發光二極體具有低耗電 里、低熱產生、操作壽命長、耐撞擊、體積小、反應 速度快、以及可發出穩定波長的色光等良好光電特 性,因,已廣泛應用於家電、儀表之指示燈、以及光 電產品等。在光電技術發展中,固態照明元件著重於 其發光效率、操作壽命以及亮度,因 將來能成為照明剌的线。 夕目气LED以陣列型發光元件之形式被使用,其 夕於咼驅動電壓之應用,且可減少LED的體積 j畺LED製造者針對陣列型發光元件設計不同的 以滿足客戶對高驅動電壓LED的需求,以 降低成本進而提高生產效率。 【發明内容】 f置本案光電元件,包含一基板;複數個半導 早兀,彼此電性連接位於此基板 半導體單元皆包含一當一主道Ύ ]母個 ί於介於其之間;複數個第-電極分別 極包ί 一口;第-延伸部’以及有-個第二電 體單ί案ϊίΐίίί,’包含一基板’·複數個半導 電f生連接位於此基板上;其中,每一個 201203533 上含八一第一半導體層’ -第二半導體 位於第-半導體二=其之間’·複數個第一電極分別 導俨罝-ΐ導一連接部形成於此複數個半 激個以電性串接此複數個半導體單元;以及複 電極分別位於第二半導體層之上;其中,有 極勺j一:極包含一第一延伸部’以及有-個第二電 以⑵伸部,其中此複數個半導體單元之驅 單开本Λ提出Γ光電元件’包含一基板;複數個半導體 間電性連接且位於此基板上,其t :區ί於其r…固於= 疋兩一第二半導體單元,以及一第三半導體ί元,ΐ 圍的個包含一第一電極墊位於基板最外 【ίΊϊ:兀上*以及第二電極中的至少-個 上,ιΐίϊίίΐΐ最外圍的第二半導體單元 八第電極及第一電極包含一第一延伸部及一 太延上部:於沒有電極塾的第三半導體單元上。 單元彼此之間電性連接且二 活j區介於其之間;以及複數個第一 一電極分別位於複數個半導體單 單元包含-第-半導體單元,-第二半;導= 導體單元,第一電極中的至少-個包含-第一半導體單元之第二半導體層上, 二半導體單元之第二半導體層上,㈡ 201203533 含:i一延伸部及一第二延伸部位於沒有電 極墊的第二+導體單元上。 【實施方式】 J 1圖揭示—符合本案一實施例之光電元件1〇之 ^ 。光電元件10例如發光二極體(LED)、雷射二 、或太陽能電池,包含複數個半導體單元形 板U上,第-電極141,第二電極H2,以 形成於半導體單元上。於本實施例中, G圖ΐ光雷發光二極體(LED)。第2圖揭示 2體早1含—第一半導體層121,一第二半導體 ‘ 122,i乂及ί於第一、第二半導體層之間的一活性 ΐ ill一半導體層121的組成材料是一摻雜Ρ-型 Πΐ-ν半導體材料,第二半導體層123 ,,,才料疋一摻雜ρ-型或Π-型雜質的III-V半導體 :半導體層121及第二半導體層123的電 里質:構=Λ、122之結構可為單異質結構(SH)、雙 出部ί導ΐ而形成於半導體單元中,且暴露 於半ie-二半導體層121。複數個分割道⑴形成 if/ 間,暴露出部份基板11。光電元件10 f復數個第一電極141及第二電極142,其中第一 且ί1係形成於暴露出的第一半導體層121、之上, 一雷二ιί 3係形成於第二半導體層123之上。第 含一笛—匕3 一第一延伸部1411,第二電極142包 個半導=伸,^卜此外’複數半導體單元中的一 1412導其第一電極141包含-第-電極墊 第二電;=固2半導體單元上的第二電極鳴 201203533 動電電=特定面積、電流及驅 別設計原電貝Γ上,^T頁特 或(斧+1)加以設計’ *中疋:導 體早兀的數量,V代矣氺Φ - Μ ^ 丨〜衣千等1 Since the light-emitting diode in the solid-state lighting element has good photoelectric characteristics such as low power consumption, low heat generation, long operating life, impact resistance, small volume, fast reaction speed, and color light which can emit stable wavelength, it has been widely used. Used in home appliances, instrument indicators, and optoelectronic products. In the development of optoelectronic technology, solid-state lighting components focus on their luminous efficiency, operating life and brightness, which will become the line of lighting in the future. The Vision LED is used in the form of an array type illuminating element, which is applied to the 咼 driving voltage and can reduce the volume of the LED. The LED manufacturer has different designs for the array type illuminating element to satisfy the customer's high driving voltage LED. Demand to reduce costs and increase production efficiency. SUMMARY OF THE INVENTION The photo-electric component of the present invention comprises a substrate; a plurality of semi-conducting electrodes are electrically connected to each other, and the semiconductor unit is disposed on the substrate, and the semiconductor unit comprises a main channel; Each of the first electrodes is provided with a single opening; a first extension portion and a second electrical body sheet ϊ ΐ ΐ ί ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ; ; ; ; ; ; 201203533 includes the first semiconductor layer of the first one - the second semiconductor is located between the first semiconductor and the second semiconductor = 'the plurality of first electrodes respectively lead to - the first conductive portion is formed by a plurality of semi-excited ones The plurality of semiconductor units are connected in series; and the plurality of electrodes are respectively disposed on the second semiconductor layer; wherein the poles include a first extension portion and a second portion (2) extension portion, wherein The driving unit of the plurality of semiconductor units proposes that the photovoltaic element includes a substrate; a plurality of semiconductors are electrically connected and located on the substrate, and the t: region is fixed by the second semiconductor. Unit, and a third half a plurality of first electrode pads are located on the outermost surface of the substrate, and at least one of the second electrodes, the second semiconductor unit, the first electrode and the first electrode The first extension portion and the first extension portion are included on the third semiconductor unit without the electrode turns. The cells are electrically connected to each other with the second active j region interposed therebetween; and the plurality of first electrodes are respectively located in the plurality of semiconductor single cells including the -th semiconductor unit, the second half; the conduction = conductor unit, At least one of the electrodes includes a second semiconductor layer of the first semiconductor unit, and a second semiconductor layer of the second semiconductor unit. (2) 201203533 includes: an extension portion and a second extension portion are located on the electrodeless pad On the two + conductor unit. [Embodiment] J 1 is a diagram showing a photovoltaic element according to an embodiment of the present invention. The photovoltaic element 10, such as a light emitting diode (LED), a laser diode, or a solar cell, includes a plurality of semiconductor unit patterns U, a first electrode 141, and a second electrode H2 formed on the semiconductor unit. In this embodiment, G is a light-emitting diode (LED). 2 is a view showing a composition of a first semiconductor layer 121, a second semiconductor '122, and an active layer between the first and second semiconductor layers. a doped Ρ-type Πΐ-ν semiconductor material, a second semiconductor layer 123, a first-doped ρ-type or Π-type impurity III-V semiconductor: a semiconductor layer 121 and a second semiconductor layer 123 The structure of the structure: Λ, 122 can be formed in the semiconductor unit by a single heterostructure (SH), a double junction, and exposed to the semiconductor layer 121. A plurality of divided tracks (1) form if/, and a part of the substrate 11 is exposed. The photo-electric element 10f has a plurality of first electrodes 141 and second electrodes 142, wherein the first and the first electrodes are formed on the exposed first semiconductor layer 121, and the first and second layers are formed on the second semiconductor layer 123. on. The first includes a first extension 1411, and the second electrode 142 includes a semiconducting = extension. Further, a 1412 of the plurality of semiconductor units has a first electrode 141 including a -first electrode pad. Electricity; = solid 2 second electrode on the semiconductor unit 201203533 electromotive power = specific area, current and drive design on the original electric bellows, ^ T page special or (axe +1) to design ' * Lieutenant: conductor early 兀The number of V, 矣氺 Φ - Μ ^ 丨 ~ Yi Qian, etc.
主道舻ϋ M id戈表先電70件的驅動電壓,Vf代表 +導體早7C的驅動電壓。在本實施例中:J 3夕夕小二8285mi12,其驅動電壓為72v。每-半 :動,:因製程控制以及蟲晶層的一品質 化 般來說,在光電元件的電性效率上,半導體單 兀的驅動電壓越低越好。每一半導體單元的面積大致 :依照上述的公式’光電元件10包含24 個+導體早兀,分別配置於行105、106、107、1〇8、 以及109。第一行105包含五個半導體單元^卜^?、 153、154、以及155’朝一第一方向串接;第二行1〇6 包含五個半導體單元16卜162、163、164、以及165, 朝一第二方向串接;第三行107包含四個半導體單元 Π1、172、173、以及174,朝第一方向串接;第四 行108包含五個半導體單元ι81、ι82、ι83、ι84、 以及185 ’朝第二方向串接;第五行1〇9包含五個半 導體單元191、192、193、194、以及195 ’朝第一方 向串接。第一方向及第二方向相反,而不同行中包含 不同數量的半導體單元的佈局可使配置上更容易滿 足客戶的需求。 於第三行107中’半導體單元的外形是長方形 且與其他行中的半導體單元形狀不同,藉由這樣的設 計’可以使電極佈局上更容易。參考第1圖及第3圖, 於第一行105及第五行109中,除了位於基板11角 落區域的半導體單元151、155、191、以及195外, 其他半導體單元上的電極佈局是相似的。於第二行 201203533 106及第四行108中,除接近基板u邊緣的半導體 f元161、165、181、以及185外,其他位於半導體 單元上的電極佈局是相同的。第三行丨中的半導體 單元其電極佈局與其他行中的半導體單元相比差異 性,大,但其中之半導體單元172及173上的電極佈 局是相同的,而與位於基板11邊緣的半導體單元171 及174不同。 第一延伸部1411包含一第一曲線延伸部The main channel 舻ϋ M id Ge table first 70 pieces of driving voltage, Vf represents + drive early 7C driving voltage. In this embodiment: J 3 Xiaxiao 2828mi12, the driving voltage is 72v. Every-half: moving, as the process control and the quality of the worm layer, the lower the driving voltage of the semiconductor unit is, the better the electrical efficiency of the photovoltaic element is. The area of each semiconductor unit is approximately: In accordance with the above formula, the photovoltaic element 10 includes 24 + conductors, which are disposed in rows 105, 106, 107, 1〇8, and 109, respectively. The first row 105 includes five semiconductor units, 153, 154, and 155' connected in series in a first direction; the second row 1 〇6 includes five semiconductor units 16 162, 163, 164, and 165. The first row 107 is connected in a second direction; the third row 107 includes four semiconductor units Π1, 172, 173, and 174 connected in series in a first direction; the fourth row 108 includes five semiconductor units ι81, ι82, ι83, ι84, and 185' is connected in series in the second direction; the fifth row 1〇9 includes five semiconductor units 191, 192, 193, 194, and 195' connected in series in the first direction. The first direction and the second direction are opposite, and the layout of the semiconductor unit, which does not include a different number of semiconductor units, makes it easier to configure the customer's needs. In the third row 107, the outer shape of the semiconductor unit is rectangular and different from the shape of the semiconductor unit in the other rows, and the design of the electrode can be made easier by such a design. Referring to Figs. 1 and 3, in the first row 105 and the fifth row 109, the electrode layouts on the other semiconductor units are similar except for the semiconductor units 151, 155, 191, and 195 located in the corner regions of the substrate 11. In the second row 201203533 106 and the fourth row 108, the arrangement of the electrodes on the semiconductor unit is the same except for the semiconductor elements f 161, 165, 181, and 185 which are close to the edge of the substrate u. The semiconductor cell in the third row has a different electrode layout than the semiconductor cells in the other rows, but the electrode layout on the semiconductor cells 172 and 173 is the same, and the semiconductor cell located at the edge of the substrate 11 171 and 174 are different. The first extension 1411 includes a first curved extension
Ha;第二延伸部1421包含一第二曲線延伸部 1421a,在行 105、1〇6、1〇8、及 1〇9 上 元的第二延伸部更包含一直線延伸部1421b 線延伸部1411&及/或第二曲線延伸部i42ia '、半導體單兀的任一邊都不互相平行。在第一、三、 行105、107、及1〇9的半導體單元上的第:延 伸邛1411位於溝槽17〇中,並且 :,對側的第二邊延伸,第二延伸二導 1 導的第二邊向第-邊延伸。心 半導體單亓體早兀上的第一延伸部1411是從 導 =第-邊向第二邊^ = ^緣設= :㈡ 疋溝槽170 t ’與第一半導體,121雷卜[击:導體: 部的數量可依半導:罝21電性連接。延伸 元的面積較大,if 積調整,若半導體單 成自第Hi!要較多的延伸部。延伸部亦可形 延伸邱線延伸部14213延伸出的一二階 ^H42ie’以增加電流分散。 於基板11 乂41·2及第二電極墊1422係分別位 的相對角落的半導體單元155及191上, 201203533 第一電極塾1412與半導體單元155上的第 1411相接觸’第二電極塾1422與半導體單元 的第二延伸部H21相接觸,·電極墊係 (w.e bon^ chip ^ b〇n^ if上的困難度’電極墊較佳地被分別 配置在基板11最外側上的不同的半導體單元上。 為了要電連接各個半導體單元,一連接 因此形成於各個半導體單元間,舉例來說,連接部 Γ第與:ϊί?體單元上的第一延伸部i4n及相鄰 J施例中’連接部⑷於第―、三、及7二本 L10:之間形成:第一方向的串接,而於第二及四行 及108之間形成一第二方向的反向串接。各 間藉由連接部143串接半導體單元151及161 及Π4、171及181、以及185及195。於第一二5 :^订1〇5、106、108、及109中每兩個半導體 間有兩個連接部143存在於其間,於第三行1〇7 母兩個半導體單元間有一個連接部143存在於盆 ^圖第4圖是第1圖中所示之光電元件1G的等效^ 光電元件10之第二半導體層123及第二電極 孫一 更可包含一透明導電層’透明導電層的材料 屬^氧化材料’例如氧化铜锡(IT〇)、氧化鎘錫 )、氧化銻錫、氧化銦鋅、氧化鋅鋁、或氧化鋅 錫。此外,當一金屬層具有能讓光透過的厚度時,也 可作為透明導電層。 一 於基板11及第一半導體層121之間,更可包含 二f合層,使得半導體單元與基板11接合。接合層 U —絕緣透明接合層或是導電透明接合層;若為絕 緣透明接合層,其材料可以是聚醯亞胺(p〇lyimide)、 201203533 i: ϊ : m λ?氟環丁擊cb);若為導電 屬,ιΐ才,其材料可以*金屬氧化材料或是! fCTm屬"氧化材料包含氧化銦錫(ΙΤ0)、氧化録鎘 錫.i厘化録錫、氧化_、氧化鋅1呂、或氧化錄 料包含錄、金、鈦、鉻、紹、或2 2 2 =於各個半導體單元之間,且暴露出部;i 時,透穿^合層。當接合層是導電接合iHa; the second extension portion 1421 includes a second curved extension portion 1421a, and the second extension portion on the rows 105, 1〇6, 1〇8, and 1〇9 further includes a linear extension portion 1421b, a line extension portion 1411& And/or the second curved extension i42ia ', either side of the semiconductor unit is not parallel to each other. The first extension 邛 1411 on the semiconductor units of the first, third, and rows 105, 107, and 1 位于 9 is located in the trench 17〇, and: the second side of the opposite side extends, and the second extension leads the second guide The second side extends toward the first side. The first extension 1411 on the first semiconductor of the core semiconductor is from the guide = the first side to the second side ^ = ^ edge = (2) 疋 trench 170 t ' with the first semiconductor, 121 Leib [h: Conductor: The number of parts can be semi-conductive: 罝21 is electrically connected. The area of the extension element is large, and the if product is adjusted. If the semiconductor is made from the Hi! The extension portion may also extend a second order ^H42ie' extending from the ridge line extension 14213 to increase current dispersion. On the semiconductor units 155 and 191 on the opposite corners of the substrate 11 乂 41·2 and the second electrode pad 1422, the 201203533 first electrode 塾 1412 is in contact with the 1411 on the semiconductor unit 155, and the second electrode 塾 1422 is The second extension portion H21 of the semiconductor unit is in contact with each other, and the electrode pads are preferably arranged on different outermost semiconductor units on the outermost side of the substrate 11. In order to electrically connect the individual semiconductor units, a connection is thus formed between the individual semiconductor units, for example, the connection portion Γ is connected to: the first extension i4n on the body unit and the adjacent J example The part (4) is formed between the first, third, and seventh L10: a series connection in the first direction, and a reverse connection in the second direction between the second and fourth lines and 108. The semiconductor units 151 and 161 and the Π4, 171 and 181, and 185 and 195 are connected in series by the connecting portion 143. There are two in each of the first two CMOS devices: 〇5, 106, 108, and 109. The connection portion 143 exists therebetween, between the two rows of the semiconductor unit between the first row and the first row A connecting portion 143 is present in the basin. FIG. 4 is a second semiconductor layer 123 and a second electrode of the equivalent photovoltaic element 10 of the photovoltaic element 1G shown in FIG. 1 and may further comprise a transparent conductive layer. The material of the transparent conductive layer is an oxidized material such as copper tin oxide (IT〇), cadmium tin oxide, lanthanum tin oxide, indium zinc oxide, zinc aluminum oxide, or zinc tin oxide. Further, when a metal layer has a thickness which allows light to pass therethrough, it can also function as a transparent conductive layer. Between the substrate 11 and the first semiconductor layer 121, a double-layered layer may be further included to bond the semiconductor unit to the substrate 11. The bonding layer U is an insulating transparent bonding layer or a conductive transparent bonding layer; if it is an insulating transparent bonding layer, the material may be p〇lyimide, 201203533 i: ϊ : m λ? fluororing butyl cb) If it is a conductive genus, ιΐ, its material can be * metal oxide material or! fCTm belongs to "Oxidation material contains indium tin oxide (ΙΤ0), oxidized cadmium tin. i PCT recording tin, oxidation _, zinc oxide 1 Lu, or oxidation recording material containing gold, titanium, chromium, sho, or 2 2 2 = between the individual semiconductor units, and the exposed portion; i, through the layer. When the bonding layer is a conductive junction i
各半穿料電接合層暴露ώ基板11使得 二導體 2〇 於;基板21上=複 以;5能二,開來’第—電極241、第二電極242、 連接邙243係形成於半導體單元半 的,構與先丄電元件10的相同,包含第以; 半導體層123,以及介於第-、 半導體單元形成於各 241 « ^ 九電凡件20上有複數個第一電極 露出的第第;Π1係形成於暴 mu極242包含—第二延伸部2421。 =包雷含:第一電極塾2412,且另-半㈡單 兀上的第一電極242包含一第二電極墊2422。 =本實施例中,光電元件2〇的大小是85χ 士 動電壓為72V ’每一半導體單元的面積 大致上彼此相同,依照上述的公式(专 光 2〇包含23個半導體單元,分別配置於行205、206、 201203533 2一〇7、208、及209巾。第-行205包含五 巧卜252、253、254、* 255朝一第一.方向口妾早 且其上的電極佈局與光電元件1〇第一行1〇5 導體單7L上的電極佈局相同;第二行2〇6 個 導,單元261、262、263、及264季月一第二方3向四串^+ 且其上的電極佈局與光電元件1〇第三行1〇7 導體單元上的電極佈局相同;第三行2〇7 侗 導體單元 27卜 272、273、274 '及 275 ;;二2 串接,且其上的電極佈局與光電元件1〇第一 中的半導體單元上的電極佈局相同;第 ::半導體單元 281、282、283、及 284 “〇]= 串接,且其上的電極佈局與光電元件1Q第三行1〇 中的半導體單元上的電極佈局相同;第五行 五個半導體單元29卜292、293、294、乂丁 229〇59U 方向串接,且其上的電極的佈局與光電元件1〇 一行105中的半導體單元上的電極佈局相同。 θ於第二及四行2〇6、208中,半導體單元的外形 是長方形且與其他行中的半導體單元形狀不同。參考; 第5圖及第6圖,第一行205、第三行207、以及第 五行209的半導體單元上的電極佈局,除了半導 元m 275、291、及295上卜早 其他半導體單元上的電極佈局彼此之間大致上相 似;第二行206及第四行208的半導體單元上的電極 佈局,除了半導體單元261、264、281、及284上的 電極外,其他半導體單元上的電極佈局彼此之間大致 上相同。第一延伸部2411包含一第一曲線延伸部 2411a,且第二延伸部包含一第二曲線延伸部 2421a。在行205、207、及209的半導體單元上,第 二延伸部2421更包含一直線延伸部2421b;第一曲 線延伸部241 la與第二曲線延伸部2421a不平行於半 201203533Each of the semi-through electrical bonding layers exposes the germanium substrate 11 such that the two conductors 2 are folded; the substrate 21 is multiplexed; 5 can be two, and the first electrode 241, the second electrode 242, and the connection 243 are formed in the semiconductor unit. The same as the pre-electrical device 10, including the first; the semiconductor layer 123, and the first and the semiconductor unit formed on each of the 241 «^9 electric components 20 having a plurality of first electrodes exposed The first 形成1 is formed in the violent mu pole 242 and includes a second extension portion 2421. = Bao Lei contains: a first electrode 塾 2412, and the first electrode 242 on the other - half (two) 兀 includes a second electrode pad 2422. In the present embodiment, the size of the photo-electric element 2 is 85 volts and the voltage is 72 V. The area of each semiconductor unit is substantially the same as each other. According to the above formula (special light 2 〇 includes 23 semiconductor units, respectively arranged in a row 205, 206, 201203533 2 〇 7, 208, and 209 巾. The first line 205 contains the five 252, 253, 254, * 255 toward a first. The direction of the mouth is early and the electrode layout and the photoelectric element 1 thereon 〇The first row 1〇5 The conductors on the conductor single 7L have the same layout; the second row is 2〇6 guides, the units 261, 262, 263, and 264 are the second month, the third is the three-way four-string ^+ and The electrode layout is the same as the electrode layout on the third row 1〇7 conductor unit of the photovoltaic element 1; the third row 2〇7 侗 conductor unit 27 272, 273, 274 ' and 275 ;; 2 2 in series, and above The electrode layout is the same as the electrode layout on the semiconductor unit in the first component of the photo-electric element 1; the:: semiconductor unit 281, 282, 283, and 284 "〇" = serially connected, and the electrode layout and the photo-electric component 1Q thereon The electrode layout on the semiconductor unit in the third row 1〇 is the same; the fifth row is five semiconductor sheets Yuan 29 292, 293, 294, 〇 〇 〇 59U direction is connected in series, and the layout of the electrodes thereon is the same as the electrode layout on the semiconductor unit in the row 105 of the photovoltaic element 1 θ in the second and fourth rows In 2, 6, 208, the outer shape of the semiconductor unit is rectangular and different from the shape of the semiconductor unit in other rows. Reference; FIGS. 5 and 6, the semiconductor of the first row 205, the third row 207, and the fifth row 209 The electrode layout on the cell, except for the semiconductors m 275, 291, and 295, the electrode layouts on other semiconductor cells are substantially similar to each other; the electrode layout on the semiconductor cells of the second row 206 and the fourth row 208 The electrode layouts on the other semiconductor units are substantially identical to each other except for the electrodes on the semiconductor units 261, 264, 281, and 284. The first extension portion 2411 includes a first curved extension portion 2411a, and the second extension portion A second curved extension 2421a is included. On the semiconductor units of rows 205, 207, and 209, the second extension 2421 further includes a linear extension 2421b; the first curved extension 241la is uneven from the second curved extension 2421a. On the half 201203533
導體單元的任一邊。第一、三、及五行2〇5、2〇7、 209半導體單元上的第一延伸部2411係設置於第一 ,導體層121上,且自半導體單元的第一邊向相對於 第一邊的第二邊延伸,第二延伸部2421則是從第二 ,,第一邊延伸。於第二、及四行2〇6、2〇8半導體 單元上的第一延伸部2411係自半導體單元的第二邊 向第一邊延伸,第二延伸部2421則是自第一邊向第 延伸。於本實施例中,第二延伸部2421大致上 係靠近半導體單元的邊緣設置,而第一延伸部MU ,置於半導體單元中,與第一半導體層電性連接。延 伸部亦可形成自第一曲線延伸部24Ua延伸出的一二 階延伸部2411c,以增加電流分散。 弟一 電極墊2412及第 ….冤極墊2422係分別形 體!ί 255②291上,第一電極墊2412與 導體早7L 255上的第一延伸部2411相接 電=2422與半導體單元291上的第二=部^ 】美板。21 電】亟,係作為接合(—a用’且分別配置 在基板21角洛區域上的不同的半導體單元上。 於本實施例中,連接部243於第一、二、月τ =〇5、2〇7、及209之間形成一第一方向:串;五 由^ 一及四行2〇6及2〇8之間形成一第二方向的反 ill 2。61各^藉由連接部243串接半導體單元 2= 275、271 * 281、以及 284 及 295。 導體單元間有兩個連接部243 702? ; ^ ^ ^ ^ ^ i , 62^3 " Ϊ 第ΚΙ所示之光電元件2〇的等效電路圖 個半導體單元形成於一基板31上,7一3;=數 201203533 體T元:ίΐ” 343形成於半導體單元 半導構包含第一半導體層12卜第二 牛導體層123,以及介於第―、第二半導體 1Either side of a conductor unit. The first extensions 2411 on the first, third, and fifth rows 2〇5, 2〇7, 209 semiconductor units are disposed on the first, conductor layer 121, and from the first side of the semiconductor unit to the first side The second side extends, and the second extension 2421 extends from the second, first side. The first extension portion 2411 on the second and fourth rows of the second, second, and second semiconductor units extends from the second side of the semiconductor unit toward the first side, and the second extension portion 2421 is from the first side to the first side. extend. In this embodiment, the second extension portion 2421 is disposed substantially adjacent to the edge of the semiconductor unit, and the first extension portion MU is disposed in the semiconductor unit to be electrically connected to the first semiconductor layer. The extension may also form a second-order extension 2411c extending from the first curved extension 24Ua to increase current dispersion. The first electrode pad 2412 and the first electrode pad 2422 are respectively shaped; ί 2552291, the first electrode pad 2412 is connected to the first extension 2411 on the conductor 7L 255, and the second electrode pad 2412 is connected to the semiconductor unit 291. Two = Department ^ 】 US board. 21 亟 亟 系 系 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Between 2, 7, and 209, a first direction is formed: a string; five is formed by a ^ and four rows, 2 〇 6 and 2 〇 8 to form a second direction of the opposite ill 2. 61 each by the connecting portion 243 is connected in series with semiconductor unit 2 = 275, 271 * 281, and 284 and 295. There are two connecting portions 243 702? between the conductor units; ^ ^ ^ ^ ^ i , 62^3 " 光电2〇 equivalent circuit diagram, a semiconductor unit is formed on a substrate 31, 7-3; = number 201203533 body T element: ΐ ΐ 343 formed in the semiconductor unit semi-conductor including the first semiconductor layer 12, the second bobbin layer 123 And between the first and second semiconductors 1
ί ” °一複數個分割道31】形成於各半i體C 電極342,其中第一雷梅λ41 4341及第二 形成於丰導 ^ ,才.1匕各一第一延伸部3411 於丰導體早兀355之外的半 導第J電 包含一第一電極墊3412,且半 S早 的第二電極342包含-第二電極ί W ·丨f ^實施例_,光電元件30的大小是50Χ ?動電壓為72V,半導體單元的驅動電壓 ίί-Γ母一半導料元的面積大致上彼此相同。 305 ^ 3〇包含23個半導體單元,分別配置於行 07; 308、及3〇9t。第一行_包含五 22旱凡351、352、353、354、及355朝一第 1串接;第二行306包含四個半導體單元36ι、 、63、及364朝一第二方向串接;第三行3 匕個半導體單元 371、372、373、374、乂丁37〇;二 1 ^串接;第四行308包含四個半導體單元 包人、7; 2 i23、及384朝第二方向串接;第五行309 J Ϊ半導體單元 391、392、393、394、及 395 朝第一方向串接。 於第二及四行3〇6、3〇8中,半導體單元的外形 〇、ί他行中的半導體單元形狀不同。參考第8圖及第 车i雜行305、第三行3〇7、以及第五行309的 导體皁兀上的電極佈局,除了半導體單元351、 ' 371 ' 375、391、及395上的電極外,其他半導 早70上的電極佈局彼此之間大致上相似;第二行 201203533 306及第四行308的半導體單元上的電極佈局,除了 半導體單元361、364、381、及384上的電極外,其 他的彼此之間大致上相同。第一延伸部3411可以是 一曲線延伸部3411a,其係設置於接近基板31外圍^ 半導體單元361、375、381、391、及394上;第一 延伸部3411也可以是一直線延伸部3411b,係設置 於其他半導體單元上。第二延伸部3421可一 延伸部。 ’ί "° a plurality of divided tracks 31] are formed on each of the half-body C electrodes 342, wherein the first Leimei λ41 4341 and the second are formed in the Feng guide ^, only one of the first extensions 3411 in the Feng conductor The semiconductor J-electrode other than the early 355 includes a first electrode pad 3412, and the second electrode 342 of the half-S early includes a second electrode ί W · 丨f ^ Embodiment _, the size of the photovoltaic element 30 is 50 Χ The driving voltage is 72V, and the driving voltage of the semiconductor unit is substantially the same as the area of the semiconductor element. 305 ^ 3〇 contains 23 semiconductor units, which are respectively arranged in row 07; 308, and 3〇9t. One row _including five 22 351, 352, 353, 354, and 355 are connected in series one; the second row 306 includes four semiconductor units 36, 63, and 364 connected in a second direction; 3 semiconductor units 371, 372, 373, 374, 〇 〇 37〇; two 1 ^ series; fourth row 308 includes four semiconductor units, 7; 2 i23, and 384 connected in series in the second direction; The fifth row 309 J Ϊ semiconductor units 391, 392, 393, 394, and 395 are connected in series in the first direction. In the second and fourth rows, 3〇6, 3〇8, The shape of the conductor unit is different from that of the semiconductor unit in the row. Refer to Figure 8 and the electrode layout on the conductor saponite of the third row 307, the third row 3〇7, and the fifth row 309, except Outside the electrodes on the semiconductor unit 351, '371' 375, 391, and 395, the electrode layouts on the other semiconductors 70 are substantially similar to each other; the electrodes on the semiconductor cells of the second row 201203533 306 and the fourth row 308 The layout is substantially identical to each other except for the electrodes on the semiconductor units 361, 364, 381, and 384. The first extension portion 3411 may be a curved extension portion 3411a disposed adjacent to the periphery of the substrate 31. The first extending portion 3411 may be a linear extending portion 3411b provided on the other semiconductor unit. The second extending portion 3421 may be an extending portion.
口。於第一、三、及五行305、307、309,除了半導 體單元375、395外,其他的半導體單元其上的第一 延伸部3411係自半導體單元的第一邊向相對於第一 ,的=二邊延伸,第二延伸部3421則係自第二邊向 第一邊延伸。半導體單元375及395上的 3411係自半導體單元的第三邊向第二邊延伸。於^ 二及四行306、308,除了半導體單元361、381外, 導體單元上的第一延伸部3411係自第二邊向 延伸丄且第二延伸部3421係自第-邊向第二 邊延伸。於半導體單元361及381上的第一 =係導體單元361及381的第三邊向第—i 一延伸部3411的曲線延伸部及第二延伸部 第^半導體單元的任—邊。於本實施例中, 致上係靠近半導體單元的邊緣設 一半導㉟Μ φ H ΐ 3411係置於半導體單元中,與第 34nam連接。延伸部亦可形成自曲線延伸部 3411c,伸/卩34Ub延伸出的—二階延伸部 ,以增加電流分散。 成於塾及第二電極墊3422係分別形 半導- 1〇疋55及391上,第二電極墊3422與 平導體早7C 391上的第-由ϋβ 上 墊係作Ah綠社Γ Γί 一延伸3 21相接觸。電極 '、、妾s或覆晶式接合用,且分別配置在基 13 201203533 板31角落區域上的不同的半導體單元上。 ^ 於本實施例中’連接部343於第一、三、及五 行305、307、及309之間形成一第一方向的串接, 而於第二及四行306及3〇8之間形成一第二方向的反 向串接。各行之間藉由連接部343串接半導體單元 ^ 及 361、364 及 375、371 及 381、以及 384 及 395。 於母兩個半導體單元間有一個連接部343存在於其 =圖第10圖是第8圖中所示之光電元件3〇的等效電 第11圖揭示一付合本案第四實施例之光電元件 ΓΛ上視圖。。參考第1M2圖,光電元件含ί 第:元形成於一基板41上’第-電極44卜 :以及連接部443形成於半導體單元 。半導體單元的結構包含第一半導體層- 及介於第一、第二導半體導二t J 2電/Λ 有複數個第一電極441及第二 形成於半導體單元455之外的半導體#單元上/ 1 於半導體單元471以外的丰藤^且开4 442包含一筮…J +導體早70上的第二電極 元455上的第外’形成於半導體單 且於半導體單元471上的’ 極墊4422。 上旳弟一電極442吐含一第二電 ,本實施例中,光電元件4〇的大小是叫 約Γ 3 v r&m48 w半導體單元的驅動電壓 導體單元,配置;元件4〇包含16個半 55朝-第-方向串接;第二行條包含六個半導體 201203533 單元 461、462、463、464、465、及 466 朝一第二方 向串接;第三行407包含五個半導體單元47丨、472、 473、474、及475朝第一方向串接。 第一 402中的半導體單元的外形與其他行中的 半導體單元形狀不同;參考第11圖及第圖,第一 行405以及第三行407的半導體單元上的電極佈局, 除了位於半導體單元451、455、471、及475上的電 極外,其他半導體單元的電極佈局彼此之間大致上相 似。第一延伸部4411包含一直線延伸部44Ua以及 ❿ 一二階延伸部4411c,其中所有的第二延伸部4421 都是曲線的延伸部。於第一及二行4〇5、4〇7的半導 體單元上的第一延伸部4411係自半導體單元的第一 邊向相鄰於第一邊的第三邊及第四邊延伸,而第二延 ^部4421係自第二邊向第三邊及第四邊延伸。於第 二行=06的半導體單元上的第一延伸部4411係自半 導體單元的第二邊向第三邊及第四邊延伸,而第二延 伸部4421係自第一邊向第三邊及第四邊延伸。曲線 延伸部4411及4421不平行於半導體單元的任一邊。 ,一,極墊4412及第二電極墊4422係分別位 於半導體單元455及471上,連接部443於半導體單 形成—串接。第13圖是第11圖中所示之光電 兀件40的等效電路圖。 so夕?公国圖揭不一符合本案第五實施例之光電元件 丄=上視圖。第15圖係光電元件50的3〇立體圖。 36, 的大小是4〇X4〇mU2,其驅動電壓為 36V,+導體單元的驅動電壓約 (”?,於本實施射’光電元件5〇包含 體早兀,分別配置於行505、5〇6、及5〇7 含四個半導體單元551、552、553、及554 方向串接,第二行506包含三個半導體單元 15 201203533 561、562、及563朝一第二方向串接; 半導體單元57卜 。具有第一延伸部5411的第一電極54 ) ί伸Ϊ=單mV54之外的半導體單元上,具有“ 542係形成於所有的半導體 +導體早兀554上的第一電極541包含一第 [含體單元571上的第二_542 ,間形成-串接。第16圖是第14圖中所 件5〇的等效電路圖。 電疋 第17圖揭示-符合本案第六實施 160〇 ί ,18f ® ^ ^ ^ .60^ 3D 4, « 24V,半導體軍-的疋l2〇Xl2〇mi12,其驅動電壓為 Λ) ’ ^本實施例中電元件60包含8個半導體 二疋,为別配置於行605、6〇6、及6〇7中。 605包含二個半導體單元651及652朝一·第一方向^ Ϊ 行6〇6包含四個半導體單元66〗、662、663、 ^ f,—第二方向串接;第三行6G7包含二個半導 含一第一延神邻64' /向串接。第一·電極641包 伸部6切。此°外,複數包含-第二延 單元卜Μ饮馇=數+導體早兀中的一個半導體 上的其第一電極641包含二個第一電極墊 楚带且另一半導體單元上的第二電極642包含二個 第二電極塾6422。連接部 成一串接。第19圖是第17圖由:等锻早:之間形 的等效電路圖。第17圖中所不之光電元件60 7 〇之ί i。圖圖揭ί j第七實施例之光電元件 光電元件70社小是牛.;2〇的::體圖。 疋120xl20mil,其驅動電壓為 16 201203533 ;4V ’半導體單元的驅動電壓約v昭 ==施例中,光電元件7〇包含,二ί 體=j別配置於行7〇5、观、及7〇7中。第一 t 3二個半導體單元751及752朝一第一方向 606包含三個半導體單元76卜762、 體單元?串接;第三行707包含二個半導 二L朝第一方向串接。第-電極741包 “ /外74ii數第4口 =含-第二^ 電極整H體早鱼疋上的第二電極742包含二個第二 串接。㊣22岡ΪΪ部743於半導體單元之間形成一 效電路L θ 〇圖中所示之光電元件70的等 肋H圖揭:一符合本案第八實施例之光電元件 光電元ί 8〇° ii4”光電元件80的3〇立體圖。mouth. In the first, third, and fifth rows 305, 307, and 309, except for the semiconductor units 375, 395, the first extension portion 3411 on the other semiconductor unit is from the first side of the semiconductor unit to the first side. The two sides extend, and the second extending portion 3421 extends from the second side toward the first side. The 3411 on the semiconductor cells 375 and 395 extends from the third side of the semiconductor cell to the second side. In the second and fourth rows 306, 308, in addition to the semiconductor units 361, 381, the first extension 3411 on the conductor unit extends from the second side and the second extension 3421 is from the first side to the second side. extend. The first side of the first conductors 361 and 381 on the semiconductor units 361 and 381 extend to the curved portion of the first-i-th extension portion 3411 and the second extension portion of the semiconductor unit. In the present embodiment, the upper portion is adjacent to the edge of the semiconductor unit, and a half lead 35? φ H ΐ 3411 is placed in the semiconductor unit to be connected to the 34 nam. The extension may also be formed from a curved extension 3411c, a second-order extension extending from the extension/卩34Ub to increase current dispersion. The enthalpy and the second electrode pad 3422 are respectively shaped on the semi-conductors - 1 〇疋 55 and 391, and the second electrode pad 3422 and the flat conductor are on the 7C 391, and the ϋβ upper pad is used as the Ah green community Γί Extend 3 21 contact. The electrodes ', 妾s or flip-chip bonding are respectively disposed on different semiconductor units on the corner regions of the substrate 13 201203533. In the present embodiment, the 'connecting portion 343 forms a first direction of tandem between the first, third, and fifth rows 305, 307, and 309, and forms between the second and fourth rows 306 and 3〇8. A reverse connection in a second direction. The semiconductor units ^ and 361, 364 and 375, 371 and 381, and 384 and 395 are connected in series between the rows by the connecting portion 343. Between the two semiconductor units of the mother, there is a connection portion 343 present in the same figure. FIG. 10 is an equivalent electric power of the photovoltaic element 3A shown in FIG. 8. FIG. 11 is a view showing a photoelectric method according to a fourth embodiment of the present invention. The component is on the top view. . Referring to Fig. 1M2, the photovoltaic element is formed on the substrate 41 by the first electrode 41 and the connection portion 443 is formed on the semiconductor unit. The structure of the semiconductor unit includes a first semiconductor layer - and a first and a second semiconductor body with a plurality of first electrodes 441 and a second semiconductor unit formed outside the semiconductor unit 455 The upper / 1 of the semiconductor unit 471 and the opening 4 442 include a 筮 ... J + conductor early 70 on the second electrode element 455 on the outer 'formed on the semiconductor single and on the semiconductor unit 471 'pole Pad 4422. The upper electrode 442 is fused with a second electric power. In this embodiment, the size of the photoelectric element 4 是 is a driving voltage conductor unit of about Γ 3 v r & m48 w semiconductor unit, and the configuration is 4; The half line 55 is connected in series with the first direction; the second line includes six semiconductors 201203533, units 461, 462, 463, 464, 465, and 466 are connected in series in a second direction; the third line 407 includes five semiconductor units 47. 472, 473, 474, and 475 are connected in series in the first direction. The outer shape of the semiconductor unit in the first 402 is different from the shape of the semiconductor unit in the other rows; referring to FIG. 11 and FIG. 1, the electrode layout on the semiconductor unit of the first row 405 and the third row 407 is located in addition to the semiconductor unit 451, The electrode layouts of the other semiconductor units are substantially similar to each other except for the electrodes on 455, 471, and 475. The first extension 4411 includes a linear extension 44Ua and a second-order extension 4411c, wherein all of the second extensions 4421 are curved extensions. The first extending portion 4411 on the semiconductor unit of the first and second rows 4〇5, 4〇7 extends from the first side of the semiconductor unit to the third side and the fourth side adjacent to the first side, and The second extension portion 4421 extends from the second side to the third side and the fourth side. The first extension 4411 on the semiconductor unit of the second row = 06 extends from the second side of the semiconductor unit to the third side and the fourth side, and the second extension 4421 is from the first side to the third side. The fourth side extends. The curve extensions 4411 and 4421 are not parallel to either side of the semiconductor unit. First, the pad 4412 and the second electrode pad 4422 are respectively located on the semiconductor units 455 and 471, and the connecting portion 443 is formed in a single-series connection. Fig. 13 is an equivalent circuit diagram of the photovoltaic element 40 shown in Fig. 11. So eve? The Principality chart reveals that the photovoltaic element according to the fifth embodiment of the present invention is 上=upper view. Fig. 15 is a three-dimensional perspective view of the photovoltaic element 50. 36, the size is 4 〇 X4 〇 mU2, the driving voltage is 36V, the driving voltage of the + conductor unit is about ("?, in this embodiment, the photoelectric element 5 〇 contains the body early 兀, respectively, arranged in rows 505, 5 〇 6 and 5〇7 include four semiconductor units 551, 552, 553, and 554 in series, and the second row 506 includes three semiconductor units 15 201203533 561, 562, and 563 connected in a second direction; semiconductor unit 57 The first electrode 54 having the first extension portion 5411 is extended on the semiconductor unit other than the single mV54, and the first electrode 541 having "542 formed on all the semiconductor + conductor early 554" includes a first [The second _542 on the body unit 571 is formed between - in series. Figure 16 is an equivalent circuit diagram of Figure 5 in Figure 14. Figure 17 of the eDonkey reveals that it meets the sixth implementation of the case 160〇ί, 18f ® ^ ^ ^ .60^ 3D 4, « 24V, Semiconductor Army - 疋l2〇Xl2〇mi12, whose driving voltage is Λ) ' ^本In the embodiment, the electrical component 60 includes eight semiconductor diodes, which are disposed in rows 605, 6〇6, and 6〇7. 605 includes two semiconductor units 651 and 652 which are arranged in a first direction, and include six semiconductor units 66, 662, 663, ^f, which are connected in series in the second direction; the third line 6G7 includes two halves. The guide contains a first extension of the adjacent 64' / direction. The first electrode 641 is cut by the covering portion 6. In addition, the first electrode 641 on one of the plurality of semiconductors including the second extension unit 数 Μ = number + conductor early 包含 includes two first electrode pads and a second on the other semiconductor unit The electrode 642 includes two second electrodes 塾 6422. The connections are connected in series. Figure 19 is the 17th figure by: equal forging early: the equivalent circuit diagram of the shape. The photo-electric component 60 7 in the 17th figure is ίi. Figure 7 shows the photoelectric element of the seventh embodiment. The photoelectric element 70 is a small cow; 2〇:: a body image.疋120xl20mil, its driving voltage is 16 201203533; 4V 'the driving voltage of the semiconductor unit is about v == In the example, the photoelectric element 7〇 contains, the two elements = j are arranged in the line 7〇5, view, and 7〇 7 in. The first t3 two semiconductor units 751 and 752 include three semiconductor units 76, 762, and body units in a first direction 606. The third line 707 includes two semiconductors L connected in series in the first direction. The second electrode 742 of the first electrode 741 includes the second electrode 742 on the first fish port and the second electrode 742 includes two second series. The positive electrode 22 is in the semiconductor unit. The rib H of the photovoltaic element 70 shown in the first embodiment of the present invention is a three-dimensional view of the photovoltaic element 80 of the photoelectric element of the eighth embodiment of the present invention.
$,半導體單元的驅動電麗約為3V;=J /元配=實:中’光電元件8°包含仰 02、8〇3、8〇4、8〇5、806 及807 體單元朝一第一3方上〇二、及8〇7中分別包含七個半導 半導r輩-ϊ ί向串接;行8〇2及’中包含七個 疋!:方向串接;第四行804包含六個 個半導體 iUf,早4ΤΛ的第A電二842包含—第二電極 ,、你位於第一+導體層123上。此外,且 延伸部則的第一電極841係位於第一電‘ 所置的半導體單元之外的半導體單元上;具 17 201203533$, the driving power of the semiconductor unit is about 3V; = J / yuan match = real: the middle 'photovoltaic element 8° contains the elevation 02, 8〇3, 8〇4, 8〇5, 806 and 807 body unit toward the first 3 〇 〇 2, and 8 〇 7 respectively contain seven semi-conducting semi-conductors - ϊ ί ί contiguous; row 8 〇 2 and ' contain seven 疋!: direction concatenation; fourth line 804 contains Six semiconductor iUfs, the first A 2 842 of the early 4 包含 include a second electrode, and you are located on the first + conductor layer 123. In addition, the first electrode 841 of the extension portion is located on the semiconductor unit other than the first semiconductor unit; the device 17 201203533
2二延伸部8421的第二電極842係位於所有丰薄 體早元上。連接部843於半導體單元 :士 J 一電極墊8412所位於的半導體單元8Π上: j興牛導體早兀812的第一電極841連 電,墊8422所位於的半導體單元871上的第妾一|: 半導^於第二半t體層121上’藉由連接部843與 牛導體早兀872的第二電極842連接。 第25圖揭示一符合本案第九實施例之光電 置m圖。《η光電元件9〇包含48個半導體單元配 复 *、 2、8〇3、8〇4、805、806 及 807 中。 八2觀及電極配置與光電元件8〇相似, 體形成於半導體單元811的第= 巧123上’藉由連接部843與半導體單元812的 導ί,84^成t接;第二電極塾9422係形成於半 導體早兀871的第二半導體層123上,藉由 ^43與半導體單元872的第二電極842形成串接。各 外。P電源供應電流自第二電極墊9422注入,再 由第一電極墊9412輸出時,由於第二電極墊9422 ^半導體單元871電阻大於其與連接部843與半導 ::872的第二電極842的串接電阻,因此電流直接 自第一電極墊9422經由連接部843流向半導體單元The second electrode 842 of the second extension portion 8421 is located on all of the abundance bodies. The connecting portion 843 is connected to the semiconductor unit 8 of the semiconductor unit: the J-electrode pad 8412: the first electrode 841 of the j-near conductor early 812 is electrically connected, and the first unit of the semiconductor unit 871 where the pad 8422 is located | : The semiconductor is connected to the second electrode 842 of the bobbin 872 by the connecting portion 843 on the second half of the body layer 121. Fig. 25 shows a photoelectric m diagram in accordance with the ninth embodiment of the present invention. <<η Photoelectric element 9〇 contains 48 semiconductor units in the *, 2, 8〇3, 8〇4, 805, 806 and 807. The eighth electrode and the electrode arrangement are similar to those of the photo-electric element 8A, and the body is formed on the first photo 123 of the semiconductor unit 811. The connection portion 843 is connected to the semiconductor unit 812 by a connection 843. The second electrode 塾9422 It is formed on the second semiconductor layer 123 of the semiconductor early 871, and is formed in series with the second electrode 842 of the semiconductor unit 872 by ^43. Various. When the P power supply current is injected from the second electrode pad 9422 and outputted by the first electrode pad 9412, the resistance of the semiconductor unit 871 is greater than the second electrode 842 of the second electrode pad 9422 and the connection portion 843 and the semiconductor: 872 Series resistance, so current flows directly from the first electrode pad 9422 via the connection portion 843 to the semiconductor unit
12的第一電極841,而不會流向半導體單元SB 的第一半導體層121、活性區122、以及第二半導 層123。同樣的電流在流至半導體單元812的第一電 極841,經由連接部843流向第一電極墊9412後, 並不會流向半導體單元811下方的第一半 121、活性區122、以及第二半導體層123,而是直^ 輸出至外部電源。因此第一電極墊9412及第二電極 墊9422下方的半導體單元811及871不會產生光。 18 201203533 為了進一步電性隔絕電極墊 元之間形成:以層避免= 墊下方的半導體層形成短路。 的半導及第二電極墊9422下方The first electrode 841 of 12 does not flow to the first semiconductor layer 121, the active region 122, and the second semiconductor layer 123 of the semiconductor unit SB. The same current flows to the first electrode 841 of the semiconductor unit 812, and flows to the first electrode pad 9412 via the connection portion 843, and does not flow to the first half 121 below the semiconductor unit 811, the active region 122, and the second semiconductor layer. 123, but output directly to the external power supply. Therefore, the semiconductor elements 811 and 871 under the first electrode pad 9412 and the second electrode pad 9422 do not generate light. 18 201203533 In order to further electrically isolate the formation of the electrode pads: a layer avoidance = short circuit of the semiconductor layer under the pad. Semi-conductive and under the second electrode pad 9422
元811的面積大致相當,第二電極墊I t ΤΑ, 外先電70件90中第一電極墊9412 ^=1=8”的第二電極塾8422搭配,此時 的第二半導體声於半導體單元8U 半導辦第二電極塾8422係位於 第二電極墊8422所位;的ΐΐί單 ^第一電極841,藉由連接部843與半 的第二電極842連接,當電流注入時牛導體早=2 參 ^電7L件90中第二電極墊9422亦可盥光雷开杜8Λ 中的第一電極墊8412搭配,此時第一電極墊料丨牛 i於單元811的部份第一半導體121之上,而 辦留-〇1等體層I23之上,第一電極墊所位於的半導 上的第二電極842,藉由連接部⑷ ϊ 的第一電極841連接,當電流注入時, 第一電極墊8412所位於的半導體單元811合于, 而^7)第一電極墊9422的電流並不會流經半導體單 區122,而係直接藉由連接部J = 導體單Si 7不2發:此第二電極塾9422所位於的半 第-半導體層、活性層、及第二半導體層的材 19 201203533The area of the element 811 is substantially equal, and the second electrode pad I t ΤΑ is externally electrically matched with the second electrode 塾 8422 of the first electrode pad 9412 =1 = 8 ”, and the second semiconductor is audible to the semiconductor. The unit 8U is configured to be located at the second electrode pad 8422; the first electrode 841 is connected to the second electrode 842 by the connecting portion 843, and the bobconductor is early when the current is injected. =2 The second electrode pad 9422 of the 7L piece 90 can also be matched with the first electrode pad 8412 of the Twilight Leikai Du 8Λ. At this time, the first electrode is padded with the first semiconductor of the unit 811. Above the 121, the second electrode 842 on the semi-conductor on which the first electrode pad is located is connected by the first electrode 841 of the connection portion (4) , when current is injected. The semiconductor unit 811 where the first electrode pad 8412 is located is combined, and the current of the first electrode pad 9422 does not flow through the semiconductor single region 122, but directly through the connection portion J = the conductor single Si 7 is not 2 The semi-semiconductor layer, the active layer, and the material of the second semiconductor layer where the second electrode 塾9422 is located 2012 201233
料包含一或多個元素選自於〇a、A卜In、As、P、N 及Sl所構成的群組,例如GaN、AlGaN、InGaN、The material comprises one or more elements selected from the group consisting of 〇a, Ab, In, As, P, N, and S1, such as GaN, AlGaN, InGaN,
AlGalnN、GaP、GaAs、GaAsP、GaNAs、或 Si ;基 板的材料包含藍寶石、GaAs、GaP、SiC、ZnO、GaN、 AIN、Cu、或 Si。 、 本發明所列舉之各實施例僅用以說明本發明, 並非用以限制本發明之範圍。任何人對本發明所作之 任何顯而易知之修飾或變更皆不脫離本發明之精神 與範圍。 【圖式簡單說明】 =1圖係依本案一實施例所繪示之光電元件上視圖; 第2圖係第1圖所示之光電元件剖面圖; 第3圖係第1圖所示之光電元件3d立體圖; 第4圖係第1圖所示之光電元件等效電路圖; ^ 5圖,依本案一實施例所繪示之光電元件上視圖; 6圖係第5圖所示之光電元件3d立體圖; 第7圖係第5圖所示之光電元件等效電路圖; =8圖,依本案一實施例所繪示之光電元件上視圖; 第9圖係第8圖所示之光電元件3d立體圖; 第1〇圖係第8圖所示之光電元件等效電路圖 ” ®係依本案一實施例所繪ί之乂件上視 第12圖係第11圖所示之光電元件立體圖; 第13圖係第π圖所示之光電元件等效電路圖; =.14圖係依本案一實施例所繪示之光電元件上視 第15圖係第14圖所示之光電元件3D立體圖; 第16圖係第14圖所示之光電元件等效電路圖’; 第.17圖係依本案一實施例所繪示之光電元件上視 201203533 第18圖係第17圖所示之光電元件3D立體圖; 第19圖係第17圖所示之光電元件等效電路圖; 第20圖係依本案一實施例所繪示之光電元件上視 圖; 第21圖係第20圖所示之光電元件3D立體圖; 第22圖係第20圖所示之光電元件等效電路圖; 第23圖係依本案一實施例所繪示之光電元件上視 圖; 第24圖係第23圖所示之光電元件3D立體圖; 第25圖係依本案一實施例所繪示之光電元件上視 圖。 【主要元件符號說明】 10、20、30、40、50、60、70、80、90 光電元 件;11、21、31、41、51、61、71、81 基板;141、 24卜 341、441、541、64卜 74卜 841 第一電極;142、 242、 342、442、542、642、742、842 第二電極;143、 243、 343443、543、643、743、843 連接部;121 第 一半導體層;123第二半導體層;122活性區;170 溝槽;111、311 分割道;1411、2411、3411、4411、 541卜 6411、74η、8411 第一延伸部;1421、2421、 342卜442卜542卜642卜7421、8421第二延伸部; 1412、2412、3412、4412、5412、6412、7412、8412、 9412 第一電極墊;1422、2422、3422、4422、5422、 6422、7422、8422、9422 第二電極墊;105、106、 107 、 108 、 109 、 205 、 206 、 207 、 208 、 209 、 305 、 306、307、308、309 ' 405 ' 406、407 ' 505、506、 507 、 605 、 606 、 607 、 705 、 706 、 707 、 801 、 802 、 803、804、805、806、807 行;15:1、152、153、154、 155 、 161 、 162 、 163 、 164 、 165 、 171 、 172 、 173 、 21 201203533 174 194 263 283 353 373 393 462 475 572 671 811 191 255 275 295 364 384 454 472 562 662 769 872半導體單元;1411a、2411a第 一曲線延伸部;1421a、2421a第二曲線延伸部; 1421b、2421b、3411b、4411a 直線延伸部;1411c、 1421c、2411c、3411c、4411c 二階延伸部;3411a 曲 線延伸部。 181 195、 264、 284、 354、 374、 394、 463、 551、 573、 672、 812、 、182 251、 271、 291、 355、 375、 395、 464、 552、 574、 751、 871、 •183 252、 272, 292, 361、 381、 451、 465、 553、 651、 752、 .184 253, 273, 293 ' 362, 382, 452 ’ 466、 554 ' 652, 761、 185 254 274 294 363 383 453 471 561 661 762 192 261 281 351 371 391 455 473 563 663 771 193、 262、 282、 352、 372 ' 392、 461 > 474、 571、 664、 772、AlGalnN, GaP, GaAs, GaAsP, GaNAs, or Si; the material of the substrate comprises sapphire, GaAs, GaP, SiC, ZnO, GaN, AIN, Cu, or Si. The examples of the invention are intended to be illustrative only and not to limit the scope of the invention. Any changes or modifications of the present invention to those skilled in the art will be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view of a photovoltaic element according to an embodiment of the present invention; FIG. 2 is a cross-sectional view of a photovoltaic element shown in FIG. 1; FIG. 3 is a photoelectric diagram shown in FIG. Figure 3 is a perspective view of the photoelectric element shown in Fig. 1; Fig. 5 is a top view of the photovoltaic element according to an embodiment of the present invention; 6 is a photovoltaic element 3d shown in Fig. 5. Fig. 7 is an equivalent circuit diagram of a photovoltaic element shown in Fig. 5; Fig. 8 is a top view of a photovoltaic element according to an embodiment of the present invention; and Fig. 9 is a perspective view of a photovoltaic element 3d shown in Fig. 8. Fig. 1 is a diagram showing the equivalent circuit diagram of the photovoltaic element shown in Fig. 8; Fig. 13 is a perspective view of the photovoltaic element shown in Fig. 11 of Fig. 11 in accordance with an embodiment of the present invention; The equivalent circuit diagram of the photovoltaic element shown in the figure π; =.14 is a 3D perspective view of the photovoltaic element shown in Fig. 14 of the photoelectric element shown in the first embodiment of the present invention; The equivalent circuit diagram of the photovoltaic element shown in Fig. 14; Fig. 17 is a photoelectric diagram according to an embodiment of the present invention. Figure 2003533 Figure 18 is a 3D perspective view of the photovoltaic element shown in Figure 17; Figure 19 is an equivalent circuit diagram of the photovoltaic element shown in Figure 17; Figure 20 is a photovoltaic element according to an embodiment of the present invention Fig. 21 is a perspective view of a photovoltaic element shown in Fig. 20; Fig. 22 is an equivalent circuit diagram of a photovoltaic element shown in Fig. 20; Fig. 23 is a photoelectric element according to an embodiment of the present invention. Fig. 24 is a perspective view of a photovoltaic element shown in Fig. 23; Fig. 25 is a top view of a photovoltaic element according to an embodiment of the present invention. [Description of main component symbols] 10, 20, 30, 40, 50 , 60, 70, 80, 90 photoelectric elements; 11, 21, 31, 41, 51, 61, 71, 81 substrates; 141, 24, 341, 441, 541, 64, 74, 841 first electrodes; 142, 242 , 342, 442, 542, 642, 742, 842 second electrode; 143, 243, 343443, 543, 643, 743, 843 connection portion; 121 first semiconductor layer; 123 second semiconductor layer; 122 active region; Slot; 111, 311 dividing track; 1411, 2411, 3411, 4411, 541 b 6411, 74n, 8411 first extension Department; 1421, 2421, 342, 442, 542, 642, 7421, 8421 second extension; 1412, 2412, 3412, 4412, 5412, 6412, 7412, 8412, 9412 first electrode pad; 1422, 2422, 3422 4422, 5422, 6422, 7422, 8422, 9422 second electrode pads; 105, 106, 107, 108, 109, 205, 206, 207, 208, 209, 305, 306, 307, 308, 309 '405 '406, 407 '505, 506, 507, 605, 606, 607, 705, 706, 707, 801, 802, 803, 804, 805, 806, 807 rows; 15: 1, 152, 153, 154, 155, 161, 162 163, 164, 165, 171, 172, 173, 21 201203533 174 194 263 353 373 393 462 475 572 671 811 191 255 275 295 364 384 454 472 562 662 769 872 semiconductor unit; 1411a, 2411a first curve extension ; 1421a, 2421a second curve extension; 1421b, 2421b, 3411b, 4411a linear extension; 1411c, 1421c, 2411c, 3411c, 4411c second-order extension; 3411a curve extension. 181 195, 264, 284, 354, 374, 394, 463, 551, 573, 672, 812, 182 251, 271, 291, 355, 375, 395, 464, 552, 574, 751, 871, • 183 252 , 272, 292, 361, 381, 451, 465, 553, 651, 752, .184 253, 273, 293 ' 362, 382, 452 ' 466, 554 ' 652, 761, 185 254 274 294 363 383 453 471 561 661 762 192 261 281 351 371 391 455 473 563 663 771 193, 262, 282, 352, 372 '392, 461 > 474, 571, 664, 772,
22twenty two
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