CN102099425A - 可再分散的经表面改性的二氧化硅颗粒的制备方法 - Google Patents
可再分散的经表面改性的二氧化硅颗粒的制备方法 Download PDFInfo
- Publication number
- CN102099425A CN102099425A CN2009801280172A CN200980128017A CN102099425A CN 102099425 A CN102099425 A CN 102099425A CN 2009801280172 A CN2009801280172 A CN 2009801280172A CN 200980128017 A CN200980128017 A CN 200980128017A CN 102099425 A CN102099425 A CN 102099425A
- Authority
- CN
- China
- Prior art keywords
- silica dioxide
- dioxide granule
- surface modification
- predispersion
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000002245 particle Substances 0.000 title abstract description 28
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000006185 dispersion Substances 0.000 claims abstract description 24
- 239000002904 solvent Substances 0.000 claims abstract description 17
- 239000007791 liquid phase Substances 0.000 claims abstract description 15
- 125000000524 functional group Chemical group 0.000 claims abstract description 13
- 229910002808 Si–O–Si Inorganic materials 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 4
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 3
- 239000008187 granular material Substances 0.000 claims description 60
- 238000012986 modification Methods 0.000 claims description 52
- 230000004048 modification Effects 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 8
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910018540 Si C Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000000991 decompressive effect Effects 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- 238000000197 pyrolysis Methods 0.000 claims 1
- 238000000227 grinding Methods 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 150000003961 organosilicon compounds Chemical class 0.000 abstract 1
- 239000013464 silicone adhesive Substances 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
- -1 siloxanes Chemical class 0.000 description 45
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 33
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 19
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 235000019439 ethyl acetate Nutrition 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229940093476 ethylene glycol Drugs 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 229940051250 hexylene glycol Drugs 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 239000012808 vapor phase Substances 0.000 description 3
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- GQKZRWSUJHVIPE-UHFFFAOYSA-N 2-Pentanol acetate Chemical compound CCCC(C)OC(C)=O GQKZRWSUJHVIPE-UHFFFAOYSA-N 0.000 description 2
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 2
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 2
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 2
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N heptadecan-1-ol Chemical group CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- XAOGXQMKWQFZEM-UHFFFAOYSA-N isoamyl propanoate Chemical compound CCC(=O)OCCC(C)C XAOGXQMKWQFZEM-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
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- WUFHQGLVNNOXMP-UHFFFAOYSA-N n-(triethoxysilylmethyl)cyclohexanamine Chemical compound CCO[Si](OCC)(OCC)CNC1CCCCC1 WUFHQGLVNNOXMP-UHFFFAOYSA-N 0.000 description 2
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- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
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- 238000012216 screening Methods 0.000 description 1
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- 125000000547 substituted alkyl group Chemical group 0.000 description 1
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- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3009—Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
- C09C1/3018—Grinding
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/309—Combinations of treatments provided for in groups C09C1/3009 - C09C1/3081
-
- C—CHEMISTRY; METALLURGY
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Abstract
本发明公开了制备经表面改性的二氧化硅颗粒的方法,所述二氧化硅颗粒的平均粒径最大为100nm,所述方法包括以下步骤:a)提供预分散体,b)高压研磨所述预分散体以形成分散体,c)去除所述分散体的液相,所述预分散体包含a1)经表面改性的二氧化硅颗粒,其是至少部分聚集的,其通过Si-O-Si键与表面改性组分结合,并且在其表面上仍具有反应性基团,a2)一种或多种有机硅化合物,其具有至少一个Si-C键,和至少一个可与所述反应性基团反应而形成共价Si-O-Si键的官能团,和a3)一种或多种溶剂。本发明还公开了可通过该方法得到的可再分散的经表面改性的二氧化硅颗粒。本发明公开了这些颗粒在调色剂粉末、硅橡胶、粘合剂和耐刮擦表面涂层中的用途。
Description
本发明涉及制备经表面改性的可再分散的二氧化硅颗粒的方法、所述颗粒及其用途。
经表面改性的二氧化硅颗粒可用于多种应用中,特别是在调色剂组合物中用作填料,以及用作涂层材料的组分。通过在颗粒表面上带有反应性基团(如硅烷醇基)的二氧化硅颗粒与表面改性剂进行反应而得到经表面改性的二氧化硅颗粒。根据改性剂的类型,产物可以主要是疏水或亲水的颗粒。
可用的二氧化硅颗粒既包括通过湿化学方法制备的颗粒,又包括通过气相法制备的颗粒。特别地,通过气相法制备的二氧化硅颗粒易于形成聚集体和团聚体。表面改性不会影响这些结构。
为了得到较小的经表面改性颗粒,人们尝试在包含亲水性二氧化硅颗粒的分散体中进行改性。通过合适的分散技术,可制备平均直径小于100nm的分散体。
WO 2006/045012中将二氧化硅颗粒的水性分散体与甲硅烷基胺反应。去除液相并随后进行干燥,以分离经表面改性的二氧化硅颗粒。
EP-B-1657283公开了非常复杂的制备经表面改性的二氧化硅颗粒的方法,其包括疏水化处理步骤、二硅氮烷与水性二氧化硅溶胶的反应,及随后的相分离步骤,其中在高温下加入二硅氮烷或硅氧烷实现相分离。
这些方法存在多项缺点。
-例如,表面改性剂限于甲硅烷基胺。
-在疏水性产物的情况中,在水相中进行反应导致疏水化程度的效果受限。
-可得到的颗粒大小取决于所使用的二氧化硅颗粒的大小。例如,二氧化硅颗粒的聚集程度较高时产生较大的经表面改性的二氧化硅颗粒。
-在液相去除后所得的经表面改性的二氧化硅颗粒本身不是可再分散的,而是需要在后续步骤中将其进一步粉碎。
-所述的粉碎带来部分颗粒没有被表面改性的效果。
本发明的目的是提供减少或完全避免这些缺点的方法。
本发明提供制备经表面改性的二氧化硅颗粒的方法,所述二氧化硅颗粒的平均粒径最大为100nm,所述方法包括以下步骤:
a)提供预分散体,
b)高压研磨所述预分散体以形成分散体,
c)去除所述分散体的液相,
所述预分散体包含
a1)经表面改性的二氧化硅颗粒,
-其是至少部分聚集的,
-其通过Si-O-Si键与表面改性组分结合,并且
-其表面上仍具有反应性基团。
a2)一种或多种有机硅化合物,
-其具有至少一个Si-C键,并且
-其具有至少一个可与所述反应性基团反应而形成Si-O-Si共价键的官能团,和
a3)一种或多种溶剂。
所述颗粒表面上的反应性基团是所使用的颗粒上已存在和分散操作中形成的那些反应性基团。所述反应性基团主要是OH基或仅是OH基。所使用的经表面改性的二氧化硅颗粒表面上的反应性基团可全部或仅部分地与所述有机硅化合物反应。它们可以部分地进行反应,这是由于如单个的反应性基团因表面改性化合物的筛选作用而在空间上是不触及的。
根据本发明的方法,所使用的经表面改性的二氧化硅颗粒中的至少一部分以聚集体的形式存在。应理解“一部分”是表示聚集颗粒的比例为至少5重量%,基于聚集体和非聚集颗粒的总量;根据本发明,这些颗粒是初级颗粒。但是,优选使用主要以聚集形式存在的颗粒,即至少80重量%,通常至少90重量%的程度,其基于聚集体和非聚集颗粒的总量。该比例可通过例如计数TEM成像(TEM=透射电镜)来确定。
应理解“聚集体”表示通过例如烧结颈连接的固体初级颗粒。所述聚集体进而可组合形成团聚体,其中所述聚集体仅松散地相互结合。只有通过引入低剪切能量,团聚体才可再度裂开。
高压研磨后所述分散体中存在的颗粒,包括聚集体和初级颗粒的平均粒径最大为100nm。其优选50-100nm,更优选60-90nm。
所述预分散体中所存在颗粒的平均粒径大于100nm。所述平均粒径可以是200nm-几百微米,其包括初级颗粒、聚集体和团聚体。通常,所述粒径为10-500μm。通过例如动态光散射可测定粒径。在比所述分散体显著更低的剪切速率下可制备所述预分散体。例如,可使用简易搅拌器、溶解器或转子/定子器。理论上,所述预分散体是用于分散任何经表面改性的二氧化硅颗粒的团聚体,所述团聚体是通过聚集体经内聚力组合形成的。
所述预分散体中存在的经表面改性的二氧化硅颗粒可具有亲水性或疏水性。
对于所述表面性质(亲水性-疏水性)程度的度量是甲醇润湿度。在甲醇润湿度的测定中,在各种情况中将0.2g(±0.005g)疏水性二氧化硅颗粒称入透明离心管中。向各个经称重的样品中分别加入8.0ml甲醇/水混合物,所述混合物分别含有10体积%、20体积%、30体积%、40体积%、50体积%、60体积%、70体积%和80体积%的甲醇。将闭合后的离心管振荡30秒,然后以2500min-1离心5分钟。读取沉淀物的体积,将其转换为百分比并对甲醇含量(体积%)作图。曲线的拐点对应所述甲醇润湿度。甲醇润湿度越高,二氧化硅颗粒的疏水性越大。所使用的经表面改性的二氧化硅颗粒的甲醇润湿度优选为20-90,更优选40-80。
在根据本发明的方法中,理论上可使用所有经表面改性的二氧化硅颗粒,只要它们是至少部分聚集的,通过Si-O-Si键与表面改性组分结合,并在其表面上仍具有反应性基团。这些颗粒的BET表面积通常为30-400m2/g,优选80-350m2/g,并且更优选150-270m2/g。
特别地,可使用通过对气相法二氧化硅颗粒(即通过火焰水解或火焰氧化得到的那些二氧化硅颗粒)进行表面改性而得到的经表面改性的二氧化硅颗粒。还可使用经后续表面改性的颗粒类型。通过机械作用和可能的后续研磨可对所述经表面改性的二氧化硅颗粒的结构进行改性。例如,使用球磨机或连续球磨机可对该结构进行改性。例如,通过空气喷射磨机、齿盘式磨机或针磨机可进行后续研磨。在EP-A-808880和DE-A-102006048509中也描述了结构改性。
用以制备所述预分散体中存在的经表面改性的二氧化硅颗粒的试剂具有至少一个可与待改性的二氧化硅颗粒的颗粒表面上的反应性基团形成Si-O-Si键的官能团。
除了可进入所述颗粒的表面基团的化学键中的官能团之外,所述改性剂通常具有在表面改性剂结合后可向所述颗粒赋予一些疏水性或亲水性的分子基团。
所使用的经表面改性的二氧化硅颗粒的制备中优选使用的表面改性剂是硅烷。这些化合物的碳链可插入O、S或NH基团。可使用一种或多种改性剂。所使用的硅烷具有至少一个不可水解的基团。
优选硅烷的通式为RxSiY4-x(I),其中x的值为1、2或3,并且R基团是相同或不同的、各自不可水解的基团,Y基团是相同或不同的、各自可水解的基团或羟基。
在通式(I)中,相同或不同的可水解的Y基团是例如:
-氢、
-卤素,如F、Cl、Br或I、
-烷氧基,优选C1-C6-烷氧基,如甲氧基、乙氧基、正丙氧基、异丙氧基和丁氧基、
-芳氧基,优选C6-C10-芳氧基,如苯氧基、
-酰氧基,优选C1-C6-酰氧基,如乙酰氧基或丙酰氧基、
-烷羰基,优选C2-C7-烷羰基,如乙酰基。
优选的可水解基团是卤素、烷氧基和酰氧基。特别优选的可水解基团是C1-C4-烷氧基,特别是甲氧基和乙氧基。
可相同或不同的不可水解的R基团是具有或不具有官能团的R基团。
所述不具有官能团的不可水解的R基团是例如:
-烷基,优选C1-C8-烷基,如甲基、乙基、正丙基、异丙基、正丁基、仲丁基和叔丁基、戊基、己基、辛基或环己基;取代烷基、
-烯基,优选C2-C6-烯基,如乙烯基、1-丙烯基、2-丙烯基和丁烯基、
-炔基,优选C2-C6-炔基,如乙炔基和炔丙基、
-芳基,优选C6-C10-芳基,如苯基和萘基,和相应的烷芳基和芳烷基,如甲苯基、苯甲基和苯乙基。
优选的表面改性剂可以特别是CH3SiCl3、CH3Si(OC2H5)3、CH3Si(OCH3)3、C2H5SiCl3、C2H5Si(OC2H5)3、C2H5Si(OCH3)3、C3H7Si(OC2H5)3、(C2H5O)3SiC3H6Cl、(CH3)2SiCl2、(CH3)2Si(OC2H5)2、(CH3)2Si(OH)2、C6H5Si(OCH3)3、C6H(Si(OC2H5)3、C6H5CH2CH2Si(OCH3)3、(C6H5)2SiCl2、(C6H5)2Si(OC2H5)2、(i-C3H7)3SiOH、CH2=CHSi(OOCCH3)3、CH2=CHSiCl3、CH2=CH-Si(OC2H5)3、CH2=CHSi(OC2H5)3、CH2=CH-Si(OC2H4OCH3)3,CH2=CH-CH2-Si(OC2H5)3、CH2=CH-CH2-Si(OC2H5)3、CH2=CH-CH2-Si(OOCCH3)3、n-C6H13-CH2-CH2-Si(OC2H5)3和n-C8H17-CH2-CH2-Si(OC2H5)3。
具有官能团的不可水解的R基团可包含例如以下基团作为其官能团:环氧基(缩水甘油基、缩水甘油氧基)、羟基、醚基、氨基、单烷基氨基、二烷基氨基、任选取代的苯胺基、酰胺基、羧基、丙烯酰基、丙烯酰氧基、甲基丙烯酰基、甲基丙烯酰氧基、巯基、氰基、烷氧基、异氰酸酯基、醛基、烷基羰基、酸酐或磷酸基团。
具有官能团的不可水解的R基团的优选实例是:
-缩水甘油基-(C1-C20)-亚烷基或缩水甘油氧基-(C1-C20)-亚烷基,如β-缩水甘油氧基乙基、γ-缩水甘油氧基丙基、δ-缩水甘油氧基丁基、ε-缩水甘油氧基戊基、ω-缩水甘油氧基己基和2-(3,4-环氧基环己基)乙基、
-(甲基)丙烯酰氧基-(C1-C6)-亚烷基,如(甲基)丙烯酰氧基甲基、(甲基)丙烯酰氧基乙基、(甲基)丙烯酰氧基丙基或(甲基)丙烯酰氧基丁基和
-3-异氰酸酯基丙基。
具体可使用的表面改性剂是γ-缩水甘油氧基丙基三甲氧基硅烷、缩水甘油氧基丙基三乙氧基硅烷、3-异氰酸酯基丙基三乙氧基硅烷、3-异氰酸酯基丙基二甲基氯硅烷、氨基丙基三乙氧基硅烷、氨基丙基三甲氧基硅烷、氨基甲基三乙氧基硅烷、氨基甲基三甲氧基硅烷、氨基丙基三氯硅烷、(N-环己基氨基甲基)三乙氧基硅烷、2-氨基乙基-3-氨基丙基三甲氧基硅烷、N-(正丁基)-3-氨基丙基三甲氧基硅烷、2-氨基乙基-3-氨基丙基甲基二甲氧基硅烷、(3-氨基丙基)二乙氧基甲基硅烷、(3-氨基丙基)乙基二乙氧基硅烷、(3-甲基氨基丙基)三甲氧基硅烷、(氨基乙基氨基甲基)苯乙基三甲氧基硅烷、(N,N-二乙基-3-氨基丙基)三甲氧基硅烷、(N,N-二甲基氨基)二甲基氯硅烷、(N,N-二甲基氨基丙基)三甲氧基硅烷、(N-乙酰基甘氨酰基)-3-氨基丙基三甲氧基硅烷、(N-环己基氨基甲基)甲基二乙氧基硅烷、(N-环己基氨基甲基)三乙氧基硅烷、(N-苯基氨基甲基)甲基二甲氧基硅烷、(N-苯基氨基甲基)三甲氧基硅烷、11-氨基十一基三乙氧基硅烷、3-(1,3-二甲基亚丁基)氨基丙基三乙氧基硅烷、3-(1-氨基丙氧基)-3,3-二甲基-1-丙烯基三甲氧基硅烷、3-(2,4-二硝基苯基氨基)丙基三乙氧基硅烷、3-(2-氨基乙基氨基)丙基甲基二甲氧基硅烷、3-(2-氨基乙基氨基)丙基三甲氧基硅烷、3-(环己基氨基)丙基三甲氧基硅烷、3-(氨基苯氧基)丙基三甲氧基硅烷、3-(N-烯丙基氨基)丙基三甲氧基硅烷、3-(N-苯乙烯基甲基-2-氨基乙基氨基)丙基三甲氧基硅烷、3-(苯基氨基)丙基三甲氧基硅烷、3-氨基丙基二异丙基乙氧基硅烷、3-氨基丙基二甲基乙氧基硅烷、3-氨基丙基甲基双(三甲基甲硅烷氧基)硅烷、3-氨基丙基甲基二乙氧基硅烷、3-氨基丙基三(甲氧基乙氧基乙氧基)硅烷、3-氨基丙基三(三甲基甲硅烷氧基)硅烷、4-氨基丁基三乙氧基硅烷、氨基苯基三甲氧基硅烷、双(2-羟基乙基)-3-氨基丙基三乙氧基硅烷、二乙基氨基甲基三乙氧基硅烷、N,N-二甲基氨基甲基乙氧基硅烷、N-(2-氨基乙基)-3-氨基异丁基二甲基甲氧基硅烷、N-(2-氨基乙基)-3-氨基丙基甲基二甲氧基硅烷、N-(2-氨基乙基)-3-氨基丙基三乙氧基硅烷、N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷、N-(2-氨基甲基)-11-氨基十一基三甲氧基硅烷、N-(3-丙烯酰氧基-2-羟基丙基)-3-氨基丙基三乙氧基硅烷、N-(3-甲基丙烯酰氧基-2-羟基丙基)-3-氨基丙基三乙氧基硅烷、N-(6-氨基己基)氨基丙基三甲氧基硅烷、N-(羟基乙基)-N-甲基氨基丙基三甲氧基硅烷、N-3-[(氨基(聚亚丙基氧基)]氨基丙基三甲氧基硅烷、正丁基氨基丙基三甲氧基硅烷、N-环己基氨基丙基三甲氧基硅烷、N-乙基氨基异丁基甲基二乙氧基硅烷、N-乙基氨基异丁基三甲氧基硅烷、N-甲基氨基丙基甲基二甲氧基硅烷、N-甲基氨基丙基三甲氧基硅烷、N-苯基氨基甲基三乙氧基硅烷、苯基双(二甲基氨基)氯硅烷、叔-丁基氨基丙基三甲氧基硅烷、氨基丙基硅烷三醇、N-(2-氨基乙基)-3-氨基丙基硅烷三醇、N-环己基氨基甲基三乙氧基硅烷、N-环己基氨基甲基甲基二乙氧基硅烷、N-苯基氨基甲基三甲氧基硅烷、3-(甲基)丙烯酰氧基丙基三乙氧基硅烷、3-(甲基)丙烯酰氧基丙基三甲氧基硅烷。
此外,也可以通过甲硅烷基胺对所述预分散体中存在的二氧化硅颗粒进行表面改性。应理解“甲硅烷基胺”表示具有至少一个Si-N键,并且可与所述二氧化硅颗粒表面上存在的Si-OH基反应的化合物。其实例是乙烯基二甲基甲硅烷基胺、辛基二甲基甲硅烷基胺、苯基二甲基甲硅烷基胺、双(二甲基氨基二甲基甲硅烷基)乙烷、六甲基二硅氮烷、(N,N-二甲基氨基)三甲基硅烷和双(三氟丙基)四甲基二硅氮烷。还可使用环状硅氮烷。
合适的表面改性剂还可以是环状聚硅氧烷D3、D4、D5及其同系物,应理解“D3、D4和D5”表示具有3个、4个或5个-O-Si(CH3)2型单元的环状聚硅氧烷,例如八甲基环四硅氧烷=D4。
合适的表面改性剂还可以是Y-O-[(RR’SiO)m-(R”R”’SiO)n]u-Y型的聚硅氧烷或硅油,其中
m=0、1、2、3、...∞,优选0、1、2、3、...100000,
n=0、1、2、3、...∞,优选0、1、2、3、...100000,
u=0、1、2、3、....∞,优选0、1、2、3、...100000,
Y=CH3、H、CnH2n+1、n=2-20;Si(CH3)3、Si(CH3)2H、Si(CH3)2OH、Si(CH3)2(OCH3)、Si(CH3)2(CnH2n+1),n=2-20,
R、R’、R”、R”’彼此独立地是烷基,如CnH2n+1,n=1-20;芳基,如苯基和取代苯基;(CH2)n-NH2和H。为了表面改性,通常对聚硅氧烷或硅油进行热活化。
所述预分散体中可使用的合适的经表面改性的二氧化硅颗粒是可商购的材料R104、R106、R202、R805、R812、R812S、R972、R974、R8200、LE-1和LE-2、R 9200、R 8200和R 7200,它们都来自Evonik Degussa。
基于所述预分散体,所使用的经表面改性的二氧化硅颗粒的比例取决于包括所述颗粒的改性类型、溶剂类型和有机硅化合物类型在内的因素。通常,所述比例在1-50重量%的范围。优选10-40重量%的范围,特别优选15-30重量%的范围。
所述预分散体还包含一种或多种具有至少一个Si-C键和至少一个官能团的有机硅化合物,所述官能团可与所述二氧化硅颗粒的反应性基团反应而形成Si-O-Si共价键。
所述有机硅化合物与已详述地用于制备根据本发明的方法中所使用的经表面改性的二氧化硅颗粒的表面改性剂是相同的化合物。
使用通式RxSiY4-x(I)的硅烷得到最佳结果,其中所述不可水解的基团不带有任何官能团,如三甲基氯硅烷和三甲基乙氧基硅烷。甲硅烷基胺也是特别合适的。在此应特别指出六甲基二硅氮烷和(N,N-二甲基氨基)三甲基硅烷。
原则上,用于制备所述预分散体中存在的二氧化硅颗粒和有机硅化合物的表面改性剂可以是相同或不同的。例如,根据本发明,所述预分散体可包含通过二氧化硅颗粒与六甲基二硅氮烷反应得到的经表面改性的二氧化硅颗粒,并且对于有机硅化合物也使用六甲基二硅氮烷。同样可能地是,根据本发明,所述预分散体包含通过二氧化硅颗粒与二甲基二氯硅烷反应得到的经表面改性的二氧化硅颗粒,而对于有机硅化合物使用六甲基二硅氮烷。
基于所使用的经表面改性的二氧化硅颗粒,有机硅化合物的比例优选0.01-10重量%,并且更优选0.1-3重量%。当认为有机硅化合物的完全转化重要时,可通过初步测试确定需要的比例,所述初步测试是例如通过使用超离心机分离液相和固相,并且测定溶液中的有机硅化合物浓度。
此外,根据本发明的方法中所使用的预分散体具有包含一种或更多种溶剂和一种或更多种硅化合物的液相。
所述溶剂通常是有机溶剂。可优选烷烃、芳族化合物、醇、多元醇的单烷基醚、酯、醚和酮。
合适的烷烃和芳族化合物可以是:戊烷、己烷、庚烷、辛烷、异辛烷、石油醚、苯、甲苯、二甲苯、芳族化合物的混合物。
合适的醇可以是:甲醇、乙醇、正丙醇、异丙醇、正丁醇、异丁醇、仲丁醇、叔丁醇、正戊醇、异戊醇、2-甲基丁醇、仲戊醇、叔戊醇、3-甲氧基丁醇、正己醇、2-甲基戊醇、仲己醇、2-乙基丁醇、仲庚醇、3-庚醇、正辛醇、2-乙基己醇、仲辛醇、正壬醇、2,6-二甲基庚-4-醇、正癸醇、仲十一烷醇、三甲基壬醇、仲十四烷醇、仲十七烷醇、苯酚、环己醇、甲基环己醇、3,3,5-三甲基环己醇、苯甲醇、二丙酮醇、乙二醇、1,2-丙二醇、1,3-丁二醇、2,4-戊二醇、2-甲基-2,4-戊二醇、2,5-己二醇、2,4-庚二醇、2-乙基-1,3-己二醇、二乙二醇、二丙二醇、己二醇、辛二醇、三乙二醇、三丙二醇和丙三醇。
合适的多元醇的单烷基醚可以是:乙二醇单甲醚、乙二醇单乙醚、乙二醇单丙醚、乙二醇单丁醚、乙二醇单己醚、乙二醇单苯醚、乙二醇单-2-乙基丁醚、二乙二醇单甲醚、二乙二醇单乙醚、二乙二醇单丙醚、二乙二醇单丁醚、二乙二醇单己醚、丙二醇单甲醚、丙二醇单乙醚、丙二醇单丙醚、丙二醇单丁醚、二丙二醇单甲醚、二丙二醇单乙醚和二丙二醇单丙醚。
合适的酯可以是:碳酸二乙酯、碳酸亚乙酯、碳酸亚丙酯、乙酸甲酯、乙酸乙酯、γ-丁内酯、γ-戊内酯、乙酸正丙酯、乙酸异丙酯、乙酸正丁酯、乙酸异丁酯、乙酸仲丁酯、乙酸正戊酯、乙酸仲戊酯、乙酸3-甲氧基丁酯、乙酸甲基戊酯、乙酸2-乙基丁酯、乙酸2-乙基己酯、乙酸苯甲酯、乙酸环己酯、乙酸甲基环己酯、乙酸正壬酯、乙酰乙酸甲酯、乙酰乙酸乙酯、乙二醇单甲醚乙酸酯、乙二醇单乙醚乙酸酯、二乙二醇单甲醚乙酸酯、二乙二醇单乙醚乙酸酯、二乙二醇单正丁醚乙酸酯、丙二醇单甲醚乙酸酯、丙二醇单乙醚乙酸酯、丙二醇单丙醚乙酸酯、丙二醇单丁醚乙酸酯、二丙二醇单甲醚乙酸酯、二丙二醇单乙醚乙酸酯、二乙酸乙二酯、乙酸甲氧基三甘油酯、丙酸乙酯、丙酸正丁酯、丙酸异戊酯、乙二酸二乙酯、乙二酸二正丁酯、乳酸甲酯、乳酸乙酯、乳酸正丁酯、乳酸正戊酯、丙二酸二乙酯、邻苯二甲酸二甲酯和邻苯二甲酸二乙酯。
合适的醚可以是:二丙醚、二异丙醚、二氧杂环乙烷、四氢呋喃、四氢吡喃、乙二醇二甲醚、乙二醇二乙醚、乙二醇二丙醚、丙二醇二甲醚、丙二醇二乙醚、丙二醇二丙醚、二乙二醇二甲醚、二乙二醇二乙醚和二乙二醇二丙醚。
合适的酮可以是:丙酮、甲基乙基酮、甲基正丙基酮、甲基正丁基酮、二乙基酮、甲基异丁基酮、甲基正戊基酮、乙基正丁基酮、甲基正己基酮、二-正-丁基酮(di-n-butyl ketone)、三甲基壬酮、环己酮、2-己酮、甲基环己酮、2,4-戊二酮、2,5-己二酮、苯乙酮、乙酰基丙酮、2,4-己二酮、2,4-庚二酮、3,5-庚二酮、2,4-辛二酮、3,5-辛二酮、2,4-壬二酮、3,5-壬二酮、5-甲基-2,4-己二酮和2,2,6,6-四甲基-3,5-庚二酮。
特别优选以下溶剂:甲醇、乙醇、1-丙醇、异丙醇、正丁醇、己烷、庚烷、辛烷、异辛烷和石油醚。
如果去除所述分散体的液相的后续步骤通过喷雾干燥进行,可以合适地使用挥发性溶剂或挥发性溶剂的组合物。应理解“挥发性溶剂”表示挥发值为50或更低,优选5-35。优选使用挥发值为1的二乙醚。
所述预分散体中的溶剂比例可以是50-98重量%。所述比例典型地是60-95重量%。
本发明必需将所述预分散体进行高压研磨。例如,所述高压研磨可通过以下方法进行:对所述预分散体加压至50-500MPa,并通过喷嘴如孔型喷嘴或槽形喷嘴减压减压,孔径或喷嘴的槽宽为0.05-1mm,优选0.1-0.5mm,并且喷嘴孔的长度/直径比或喷嘴槽的槽深/槽宽比为1-10。在一些情况中,在该类型分散体中可能必需通过过滤或沉淀去除粗颗粒。
根据本发明所述方法的优选实施方案是将所述预分散体分为至少两个子流体,将所述子流体加压并通过各喷嘴向同一碰撞点减压喷射。
所述子流体射流的速度优选为至少300m·s-1,更优选400-1000m·s-1,并且最优选600-900m·s-1。应理解所述“速度”表示所述子流体在喷嘴通道中的速度。将该速度定义为每个喷嘴的体积流量(m3·s-1)与喷嘴的孔面积(m2)的商。所述孔的直径通常为0.1-1mm,优选0.2-0.4mm。
根据本发明的方法还设计将所述分散体的液相去除。这可通过如蒸馏、过滤或离心实施。液相去除不需要完全去除。由此,通过根据本发明的方法得到的经表面改性的二氧化硅颗粒仍然可含有粘附的溶剂。如需要,之后还可进行干燥步骤。同样地,使用合适的溶剂可洗涤液相去除后得到的颗粒,然后通过如过滤或离心去除溶剂。
已发现用于去除所述液相的合适方法是喷雾干燥和冷冻干燥。特别是在喷雾干燥的情况中达到良好的结果。在该情况中,利用惰性气体,通过喷嘴将所述分散体喷入加热的干燥室中,并将挥发性组分去除。在该实施方案中,所使用的分散体不应包含任何不挥发的组分。如上所述,所述分散体的液相由挥发值为50或更低,优选5-35的挥发性溶剂组成。这些溶剂可以是己烷、庚烷、辛烷、异辛烷、石油醚混合物、苯、甲苯、二甲苯、芳族化合物混合物、甲醇、乙醇、1-丙醇、异丙醇、1-丁醇及它们的混合物。
去除液相后所得到的颗粒具有低拍实密度,其通常不大于所使用的二氧化硅颗粒的拍实密度的150%。例如,将高压研磨后得到的分散体进行喷雾干燥后的拍实密度仅为55g/l,所述分散体包含已使用六甲基二硅氮烷进行表面改性且BET表面积为200-240m2/g的气相法二氧化硅、六甲基二硅氮烷和乙醇。
本发明还提供聚集体和/或经分离的单独颗粒形式的经表面改性的二氧化硅颗粒,在各种情况下,通过本发明的方法可得的平均粒径最大为100nm。在本文的上下文中,应理解“可再分散的”是指即使在低剪切速率,如通过搅拌(齿盘式)下,所述经表面改性的二氧化硅颗粒也可被掺入分散体中。
本发明还提供本发明所述经表面改性的二氧化硅颗粒在调色剂粉末、硅橡胶、粘合剂和耐刮擦表面涂层中的用途。
实施例:
通过溶解器制备乙醇中的含有15重量%(基于预分散体)的R812S(Evonik Degussa)和1重量%(基于R812S)的六甲基二硅氮烷的预分散体。然后将预分散体分为三份子流体并加压,通过金刚石喷嘴将所述子流体减压喷射至同一碰撞点,所述子流体互呈120°的角度,速度为700m·s-1。
所得分散体的中值粒径为86nm。
在剪切范围内的粘度为0.1-1000s-1:
剪切速率 | 粘度(23℃) |
s-1 | mPa·s |
0.1 | 147.6 |
0.1374 | 68.13 |
0.1887 | 42.24 |
0.2593 | 27.73 |
0.3562 | 22.4 |
0.6723 | 19.25 |
0.9237 | 15.36 |
1.269 | 15.59 |
11.72 | 13.45 |
108.3 | 11.37 |
1000 | 9.052 |
随后将所述分散体喷雾干燥。所得颗粒的拍实密度为55g/l。
通过溶解器将所述颗粒加入乙醇中。其中值粒径为88nm,几乎与所述分散体的所得值相同。因此这是纳米级的可再分散粉末。
Claims (11)
1.制备经表面改性的二氧化硅颗粒的方法,所述二氧化硅颗粒的平均粒径最大为100nm,所述方法包括以下步骤:
a)提供预分散体,
b)高压研磨所述预分散体以形成分散体,
c)去除所述分散体的液相,
所述预分散体包含:
a1)经表面改性的二氧化硅颗粒,
-其是至少部分聚集的,
-其通过Si-O-Si键与表面改性组分结合,并且
-在其表面上仍具有反应性基团。
a2)一种或多种有机硅化合物,
-其具有至少一个Si-C键,并且
-其具有至少一个可与所述反应性基团反应而形成共价Si-O-Si键的官能团,和
a3)一种或多种溶剂。
2.根据权利要求1所述的方法,其特征在于所使用的经表面改性的二氧化硅颗粒得自热解法。
3.根据权利要求1或2所述的方法,其特征在于基于所述预分散体,所使用的经表面改性的二氧化硅颗粒的比例为1-50重量%。
4.根据权利要求1-3中任一项所述的方法,其特征在于所使用的有机硅化合物是甲硅烷基胺。
5.根据权利要求1-4中任一项所述的方法,其特征在于基于所使用的经表面改性的二氧化硅颗粒,所述有机硅化合物的比例为0.01-10重量%。
6.根据权利要求1-5中任一项所述的方法,其特征在于所使用的溶剂是一种或多种挥发性有机溶剂。
7.根据权利要求1-6中任一项所述的方法,其特征在于通过以下的方法进行高压研磨:将所述预分散体分为至少两份子流体,将所述子流体加压并各自通过喷嘴减压喷射至同一碰撞点。
8.根据权利要求7所述的方法,其特征在于所述子流体的射流速度至少为300m·s-1。
9.根据权利要求1至8中任一项所述的方法,其特征在于通过喷雾干燥去除所述液相。
10.经表面改性的二氧化硅颗粒,其可根据权利要求1-9中任一项所述的方法得到。
11.根据权利要求10所述的经表面改性的二氧化硅颗粒在调色剂粉末、硅橡胶、粘合剂和耐刮擦表面涂层中的用途。
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EP08160715.2A EP2145929B1 (de) | 2008-07-18 | 2008-07-18 | Verfahren zur Herstellung redispergierbarer, oberflächenmodifizierter Siliciumdioxidpartikel |
EP08160715.2 | 2008-07-18 | ||
PCT/EP2009/056733 WO2010006837A2 (en) | 2008-07-18 | 2009-06-02 | Process for preparing redispersible surface-modified silicon dioxide particles |
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EP (1) | EP2145929B1 (zh) |
JP (1) | JP5562331B2 (zh) |
KR (1) | KR20110030603A (zh) |
CN (1) | CN102099425B (zh) |
RU (1) | RU2011105735A (zh) |
TW (1) | TW201022145A (zh) |
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- 2009-06-02 CN CN2009801280172A patent/CN102099425B/zh not_active Expired - Fee Related
- 2009-06-02 RU RU2011105735/05A patent/RU2011105735A/ru not_active Application Discontinuation
- 2009-06-02 US US12/996,936 patent/US8399093B2/en not_active Expired - Fee Related
- 2009-06-02 JP JP2011517830A patent/JP5562331B2/ja not_active Expired - Fee Related
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WO2010006837A2 (en) | 2010-01-21 |
US8399093B2 (en) | 2013-03-19 |
JP5562331B2 (ja) | 2014-07-30 |
EP2145929B1 (de) | 2020-06-24 |
CN102099425B (zh) | 2013-11-13 |
KR20110030603A (ko) | 2011-03-23 |
JP2011528310A (ja) | 2011-11-17 |
RU2011105735A (ru) | 2012-08-27 |
US20110086958A1 (en) | 2011-04-14 |
EP2145929A1 (de) | 2010-01-20 |
TW201022145A (en) | 2010-06-16 |
WO2010006837A3 (en) | 2010-03-18 |
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