CN101773367A - Semiconductor water dispenser - Google Patents
Semiconductor water dispenser Download PDFInfo
- Publication number
- CN101773367A CN101773367A CN201010300530A CN201010300530A CN101773367A CN 101773367 A CN101773367 A CN 101773367A CN 201010300530 A CN201010300530 A CN 201010300530A CN 201010300530 A CN201010300530 A CN 201010300530A CN 101773367 A CN101773367 A CN 101773367A
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- Prior art keywords
- cold water
- links
- bucket
- water
- radiator
- Prior art date
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 104
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000005057 refrigeration Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000013332 literature search Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
一种家电技术领域的半导体饮水机，包括：水桶、制冷装置、制热装置和常温装置，水桶分别和制冷装置、制热装置、常温装置相连，制冷装置包括冷水箱、冷水龙头、制冷片、散热器和热管，冷水箱和水桶相连，冷水龙头和冷水箱相连，制冷片分别与冷水箱和散热器相连，热管顶端和水桶相连，末端和散热器相连，顶端浸没在水中。能随时提供冷水、常温水和热水，在制冷装置中使用了功率高的半导体制冷片，使得制冷能力大大提高，同时使用了集成热管的散热器，使得其散热能力得到了极大的提高。整体结构简单、性能可靠、成本低、节能环保。
A semiconductor water dispenser in the technical field of home appliances, comprising: a bucket, a refrigeration device, a heating device and a normal temperature device, the water bucket is connected to the refrigeration device, the heating device, and the normal temperature device respectively, and the refrigeration device includes a cold water tank, a cold water faucet, a cooling sheet, The radiator is connected to the heat pipe, the cold water tank is connected to the water bucket, the cold water faucet is connected to the cold water tank, the refrigeration sheet is connected to the cold water tank and the radiator respectively, the top of the heat pipe is connected to the water bucket, the end is connected to the radiator, and the top is submerged in water. It can provide cold water, normal temperature water and hot water at any time. The high-power semiconductor cooling chip is used in the refrigeration device, which greatly improves the cooling capacity. At the same time, the radiator with integrated heat pipe is used to greatly improve the heat dissipation capacity. The overall structure is simple, the performance is reliable, the cost is low, energy saving and environmental protection.
Description
Technical field
What the present invention relates to is the device of a kind of family electro-technical field, in particular a kind of semiconductor water dispenser.
Background technology
Water dispenser is risen the nineties in last century, is the water source with pure water or through the running water after filtering, and sanitation and hygiene are easy to use.Modal on the market is the cold and hot type water dispenser.The heating method of water dispenser is basic identical, but that its refrigerating method just has is a variety of, such as using semiconductor refrigerating or cold-producing medium refrigeration etc.Use the water dispenser power consumption of semiconductor chilling plate little, but refrigeration will be lower than the water dispenser that uses cold-producing medium, key is because the power of the semiconductor chilling plate that water dispenser uses is low, if with the high semiconductor chilling plate of power, the high-power radiator that will change the outfit mates it, but high more its volume of radiator power is just big more, so just can't be installed on the less water dispenser, and increased cost, these are difficult problems to manufacturer, so it is limited that the semiconductor water dispenser refrigeration promotes always, can't better be people's service.
Find through literature search prior art, Chinese patent literature number: CN2588903Y, this technology discloses a kind of cold-instantly type semiconductor water dispenser, this technology comprises: semiconductor is device for cooling, EGR, feed pump, heat jar and power supply, semiconductor is that device for cooling comprises main switch, secondary interchanger and semiconductor subassembly, and the main switch upper and lower faces respectively is provided with a secondary interchanger.Put between major and minor interchanger semiconductor subassembly is arranged.EGR comprises condenser and circulating pump, and condenser one end is connected with circulating pump by tube connector, and the other end is communicated with secondary interchanger, and the secondary interchanger other end is connected with circulating pump.Feed pump is communicated with the main switch water inlet, and the main switch water outlet is connected with tap.This technology has been used the large-power semiconductor cooling piece, be equipped with powerful radiator, and devices such as EGR, feed pump and power supply have been designed in the whole water dispenser more, complex structure, power consumption is big, has consumed many materials, and it is more that cost increases, so just be unfavorable for promoting, can't come into huge numbers of families.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of semiconductor water dispenser is provided, in refrigerating plant, has used the high semiconductor chilling plate of power, make its refrigerating capacity improve greatly, use the radiator of integrated heat pipe simultaneously, made its heat-sinking capability be greatly improved.
The present invention is achieved through the following technical solutions, and the present invention includes: bucket, refrigerating plant, heating combined equipment and normal temperature device, wherein: bucket links to each other with refrigerating plant, heating combined equipment and normal temperature device respectively.
Described refrigerating plant comprises: cold water storage cistern, cold water faucet, cooling piece, radiator and heat pipe, wherein: cold water storage cistern links to each other with bucket, and cold water faucet links to each other with cold water storage cistern, and cooling piece links to each other with radiator with cold water storage cistern respectively, the top of heat pipe links to each other with bucket, and end links to each other with radiator.
Described cooling piece is to be made by semi-conducting material.
Described cooling piece comprises: chill surface and radiating surface, and wherein: chill surface and radiating surface are relatively arranged on the cooling piece, and chill surface is connected with cold water storage cistern, and radiating surface links to each other with radiator.
Described heat pipe is sealing and the inner metal tube that is provided with refrigeration working medium.
In the water of the top-submerged of described heat pipe in bucket.
Described heating combined equipment comprises: boiler, heater circuit and hot water tap, and wherein: heater circuit is arranged in the boiler, and boiler links to each other with bucket, and the hot water tap links to each other with boiler.
Described normal temperature device is the normal-temperature water tap, and the normal-temperature water tap directly links to each other with bucket.
The present invention has following advantage compared to existing technology: the present invention can provide cold water, normal-temperature water and hot water at any time, in refrigerating plant, used the high semiconductor chilling plate of power, make refrigerating capacity improve greatly, use the radiator of integrated heat pipe simultaneously, made its heat-sinking capability be greatly improved.Overall structure is simple, dependable performance, low, the energy-conserving and environment-protective of cost.
Description of drawings
Fig. 1 is a side view of the present invention;
Fig. 2 is a front view of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated: present embodiment is to implement under the prerequisite in technical solution of the present invention.Provided detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figure 1, present embodiment comprises: bucket 1, tank 2, refrigerating plant 3, heating combined equipment 4 and normal temperature device 5, and wherein: the outlet of bucket 1 is provided with tank 2, and tank 2 links to each other with refrigerating plant 3, heating combined equipment 4 and normal temperature device 5 respectively.
Refrigerating plant 3 comprises: cold water storage cistern 6, cold water faucet 7, cooling piece 8, radiator 9 and heat pipe 10, wherein: cold water storage cistern 6 links to each other with tank 2, cold water faucet 7 links to each other with cold water storage cistern 6, cooling piece 8 links to each other with radiator 9 with cold water storage cistern 6 respectively, the top of heat pipe 10 links to each other with tank 2, end links to each other with radiator 9, and the top of heat pipe 10 is not had by the water logging in the tank 2 fully.
Cooling piece 8 is made by semi-conducting material, comprises chill surface and radiating surface, and chill surface and radiating surface are oppositely arranged on the cooling piece, and chill surface is connected with cold water storage cistern 6, and radiating surface links to each other with radiator 9.
Heat pipe 10 is sealing and the inner thin copper pipe that is provided with water, is vertically set on water dispenser inside.
Heating combined equipment 4 comprises: boiler 11, heater circuit 12 and hot water tap 13, and wherein: heater circuit 12 is arranged in the boiler 11, and boiler 11 links to each other with tank 2, and hot water tap 13 links to each other with boiler 11.
This water dispenser is opened the normal-temperature water tap and can be obtained normal-temperature water after connecting power supply.Open hot-water switch and start heating combined equipment 4, water in the heater circuit 12 heat hot water tanks 11 stops heating automatically after setting high-temperature, heating automatically again when the water in the boiler 11 drops to the setting low temperature, behind design temperature, stop automatically, water temperature remains on to be set between the high and low temperature, opens hot water tap 13 and just can obtain hot water.
Open cold water switch and start refrigerating plant 3, cooling piece 8 work, the chill surface refrigeration that connects cold water storage cistern 6, water for cooling in the cold water storage cistern 6, radiating surface is passed to radiator 9 with chill surface from the heat that cold water storage cistern 6 absorbs, radiator 9 is dispersed into the part heat in the air, part heat transferred heat pipe 10, the heat of vaporization that the water of heat pipe 10 inside absorbs radiator 9 transmission is that steam rises to heat pipe 10 tops, the top is not had by the water logging in the tank 2 fully, steam is passed to water in the tank 2 by tube wall with heat, dissipated heat is condensed into water and runs down into end again from radiator 9 heat absorption evaporations along heat pipe 10 inwalls, and the water in the tank 2 both can have been lowered the temperature naturally by air, also can enter the water hybrid cooling of tank 2 with bucket 1, the continuous cooling of the water in the cold water storage cistern 6 is opened cold water faucet 7 and just can be obtained cold water.
Claims (5)
1. semiconductor water dispenser comprises: bucket, refrigerating plant, heating combined equipment and normal temperature device, and wherein: bucket links to each other with refrigerating plant, heating combined equipment and normal temperature device respectively, it is characterized in that, also comprises: heat pipe;
Described refrigerating plant comprises: cold water storage cistern, cold water faucet, radiator and cooling piece, and wherein: cold water storage cistern links to each other with bucket, and cold water faucet links to each other with cold water storage cistern, and cooling piece links to each other with radiator with cold water storage cistern respectively;
Described heating combined equipment comprises: boiler, heater circuit and hot water tap, and wherein: heater circuit is arranged in the boiler, and boiler links to each other with bucket, and the hot water tap links to each other with boiler;
Described normal temperature device is the normal-temperature water tap, and the normal-temperature water tap directly links to each other with bucket;
The top of described heat pipe links to each other with bucket, and end links to each other with radiator.
2. semiconductor water dispenser according to claim 1 is characterized in that, described cooling piece comprises: chill surface and radiating surface, and wherein: chill surface and radiating surface are relatively arranged on the cooling piece, and chill surface is connected with cold water storage cistern, and radiating surface links to each other with radiator.
3. semiconductor water dispenser according to claim 1 is characterized in that, described heat pipe is sealing and the inner metal tube that is provided with refrigeration working medium.
4. semiconductor water dispenser according to claim 1 is characterized in that described cooling piece is made by semi-conducting material.
5. semiconductor water dispenser according to claim 1 is characterized in that, in the water of the top-submerged of described heat pipe in bucket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010300530XA CN101773367B (en) | 2010-01-21 | 2010-01-21 | semiconductor water dispenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010300530XA CN101773367B (en) | 2010-01-21 | 2010-01-21 | semiconductor water dispenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101773367A true CN101773367A (en) | 2010-07-14 |
| CN101773367B CN101773367B (en) | 2011-06-01 |
Family
ID=42510053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010300530XA Expired - Fee Related CN101773367B (en) | 2010-01-21 | 2010-01-21 | semiconductor water dispenser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101773367B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818394A (en) * | 2012-08-14 | 2012-12-12 | 苏州华爱电子有限公司 | Indirect cooling semiconductor refrigerating device |
| CN109163443A (en) * | 2018-08-23 | 2019-01-08 | 民勤县威瑞环保有限责任公司 | It is a kind of can self-purging water source energy-saving heating type travelling scuttlebutt |
| CN109578683A (en) * | 2018-12-25 | 2019-04-05 | 华中科技大学 | Tap associated mode fast-refrigerating device and combinations thereof part |
| CN112034900A (en) * | 2020-09-10 | 2020-12-04 | 焦作大学 | An automatic temperature control device for a computer host and a control method thereof |
| CN113100632A (en) * | 2021-05-07 | 2021-07-13 | 江苏全给净化科技有限公司 | Circulation heat preservation water dispenser |
-
2010
- 2010-01-21 CN CN201010300530XA patent/CN101773367B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818394A (en) * | 2012-08-14 | 2012-12-12 | 苏州华爱电子有限公司 | Indirect cooling semiconductor refrigerating device |
| CN102818394B (en) * | 2012-08-14 | 2015-12-09 | 苏州华爱电子有限公司 | Indirect-cooling semiconductor cooling device |
| CN109163443A (en) * | 2018-08-23 | 2019-01-08 | 民勤县威瑞环保有限责任公司 | It is a kind of can self-purging water source energy-saving heating type travelling scuttlebutt |
| CN109578683A (en) * | 2018-12-25 | 2019-04-05 | 华中科技大学 | Tap associated mode fast-refrigerating device and combinations thereof part |
| CN112034900A (en) * | 2020-09-10 | 2020-12-04 | 焦作大学 | An automatic temperature control device for a computer host and a control method thereof |
| CN113100632A (en) * | 2021-05-07 | 2021-07-13 | 江苏全给净化科技有限公司 | Circulation heat preservation water dispenser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101773367B (en) | 2011-06-01 |
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Granted publication date: 20110601 Termination date: 20140121 |