CN202127762U - Semiconductor water dispenser with copper inner container - Google Patents
Semiconductor water dispenser with copper inner container Download PDFInfo
- Publication number
- CN202127762U CN202127762U CN201120074712U CN201120074712U CN202127762U CN 202127762 U CN202127762 U CN 202127762U CN 201120074712 U CN201120074712 U CN 201120074712U CN 201120074712 U CN201120074712 U CN 201120074712U CN 202127762 U CN202127762 U CN 202127762U
- Authority
- CN
- China
- Prior art keywords
- inner bag
- semiconductor
- copper inner
- inner container
- refrigerating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 42
- 239000010949 copper Substances 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims description 23
- 239000000498 cooling water Substances 0.000 claims description 8
- 238000005057 refrigeration Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 241000196324 Embryophyta Species 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 244000188472 Ilex paraguariensis Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor water dispenser with a copper inner container, which comprises a shell; a refrigerating device, a heating device and a normal temperature device are respectively arranged in the shell; the refrigerating device comprises a copper inner container communicated with a water tank, a refrigerating sheet and a radiator, the refrigerating sheet is made of a semiconductor, the semiconductor refrigerating sheet and the radiator are arranged outside the copper inner container, and the semiconductor refrigerating sheet is connected with the copper inner container and the radiator respectively. Compared with the prior art, the semiconductor water dispenser has the following advantages: 1. the inner container is made of copper materials, the whole inner container can be used for the transfer of the refrigeration capacity, therefore, the refrigerating efficiency is high; 2. with the adoption of the copper inner container structure, a radiating sheet is unnecessary to extend into the inner container, the semiconductor sheet can be directly adhered to the surface of the inner container for refrigerating, thereby preventing the radiating sheet from being corroded in the water, and guaranteeing the water quality.
Description
Technical field
The utility model relates to a kind of water dispenser, particularly a kind of semiconductor water dispenser of copper inner bag.
Background technology
Water dispenser is risen the nineties in last century, is the water source with pure water or through the running water after filtering, sanitation and hygiene, and easy to use, modal in the market is the cold and hot type water dispenser.The heating method of existing water dispenser is basic identical, but that its refrigerating method just has is a variety of, such as using semiconductor refrigerating or cold-producing medium refrigeration etc.Can produce the material that causes environmental pollution in the process of using cold-producing medium to freeze; Use the water dispenser power consumption of semiconductor chilling plate smaller, and can not produce the material that causes environmental pollution, promptly energy-conservation environmental protection again.But the inner bag of conventional semiconductors refrigerating drinker all is to be made by plastics, then fin is extend in the inner bag cold is passed in the water, at the other end laminated semiconductor sheet of fin cold is provided, and inner bag is not participated in the transmittance process of cold.There are problems such as burn into water quality inferiority after the long-time use of fin in water; Water in the inner bag all be lean on that temperature difference produces flow positive energy exchange naturally; The energy transmission speed is slow, so just makes that the refrigerating speed of semiconductor chilling plate is slow, and refrigerating capacity is low.
Also there is the high semiconductor chilling plate of the power of employing to improve refrigerating speed, increases refrigerating capacity, but use the high semiconductor chilling plate of power; The high-power radiator that will change the outfit matees it, and high more its volume of radiator power is just big more, so just can't be installed on the less water dispenser; And increased the cost of water dispenser; These are difficult problems to manufacturer, so the refrigeration of semiconductor water dispenser can't promote effectively always, can't better be people's service.
Like the Chinese patent publication number is that the patent document of CN2588903 discloses a kind of cold-instantly type semiconductor water dispenser, and refrigerating plant has used the large-power semiconductor cooling piece in this technology, has been equipped with powerful radiator; And designed devices such as EGR, suction pump and power supply in the whole water dispenser more, though refrigeration has increased much complex structure; Power consumption is big, has consumed many materials, and it is more that cost increases; So just be unfavorable for promoting, can't come into huge numbers of families.
Because the above-mentioned defective that existing water dispenser exists needs a kind of semiconductor water dispenser to remedy the existing existing defective of water dispenser especially.
The utility model content
The purpose of the utility model is to provide a kind of copper inner bag semiconductor water dispenser; Overcome above-mentioned shortcoming of the prior art; Can not only make that water temperature is tending towards even fast in the inner bag; Also improved simultaneously the refrigerating efficiency of semiconductor chilling plate, overall structure is simple, dependable performance, low, the energy-conserving and environment-protective of cost.
The technical problem that the utility model solved can adopt following technical scheme to realize:
A kind of copper inner bag semiconductor water dispenser; Comprise housing, it is characterized in that, in said housing, be respectively arranged with refrigerating plant, heating combined equipment and normal temperature device; Said housing upper end is provided with the tank that links to each other with bucket; Said tank is communicated with said refrigerating plant, heating combined equipment and normal temperature device respectively, is respectively arranged with cooling water outlet and hot water outlet on the said housing, and said cooling water outlet is connected with heating combined equipment with said refrigerating plant through pipeline respectively with hot water outlet; Said refrigerating plant comprises copper inner bag and cooling piece and the radiator that is connected with said tank; Said cooling piece is a semiconductor chilling plate, and said semiconductor chilling plate and radiator are arranged on outside the copper inner bag, and said semiconductor chilling plate links to each other with radiator with said copper inner bag respectively.
In an embodiment of the utility model, said cooling piece comprises chill surface and radiating surface, and said chill surface and radiating surface are oppositely arranged on the said cooling piece, and said chill surface links to each other with the copper inner bag, and said radiating surface links to each other with radiator.
In an embodiment of the utility model; Said heating combined equipment comprises boiler and heater circuit; Said heater circuit is arranged in the said boiler, links to each other through pipeline between said boiler and the tank, links to each other through pipeline between said boiler and the said hot water outlet.
In an embodiment of the utility model, said normal temperature device is normal-temperature water outlet, and said normal-temperature water outlet directly links to each other with said tank through pipeline.
The semiconductor water dispenser of the utility model is compared prior art and is had following advantage:
1, inner bag adopts copper product to make, and whole inner bag can both participate in the transmittance process of cold, and refrigerating efficiency is high;
2, the copper inner-tube structure need not extend into fin in the inner bag, and semiconductor chip can directly be attached to inner bag surface refrigeration, can prevent corrosion and the assurance water quality of fin in water.
3, simple, the dependable performance of overall structure, low, the energy-conserving and environment-protective of cost.
The copper inner bag semiconductor water dispenser of the utility model; Adopt this new model of copper inner bag; Semiconductor chilling plate directly is attached on the inner bladder outer wall freezes, make whole copper inner bag all participate in the transmittance process of cold, whole cylindrical shell can pass to cold in the inner water; Meanwhile, use the copper inner bag just need not again fin be extend in the water, guaranteed the quality and the etching problem that has solved fin of water, improved the refrigerating efficiency of semiconductor chilling plate, improved the performance of water dispenser.Overall structure is simple, dependable performance, low, the energy-conserving and environment-protective of cost, realizes the purpose of the utility model.
Description of drawings
Specify the utility model below in conjunction with the accompanying drawing and the specific embodiment:
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the front view of the utility model.
The specific embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand understanding with effect, below in conjunction with concrete diagram, further set forth the utility model.
Like Fig. 1, shown in Figure 2; The copper inner bag semiconductor water dispenser of the utility model; Comprise housing 100, in housing 100, be respectively arranged with refrigerating plant 200, heating combined equipment 300 and normal temperature device 400, housing 100 upper ends are provided with the tank 110 that links to each other with bucket 500; Tank 110 is connected with refrigerating plant 200, heating combined equipment 300 and normal temperature device 400 respectively; Be respectively arranged with cooling water outlet 210 and hot water outlet 310 on the housing 100, cooling water outlet 210 is connected with heating combined equipment 300 with refrigerating plant 200 through pipeline respectively with hot water outlet 310, and the cooling piece 220 of refrigerating plant 200 is a semiconductor chilling plate.
Refrigerating plant 200 comprises copper inner bag 230, cooling piece 220 and radiator 240; Link to each other through pipeline between copper inner bag 230 and the tank 110; Link to each other through pipeline between copper inner bag 230 and the cooling water outlet 210, cooling piece 220 is arranged on outside the copper inner bag 230 with radiator 240.Cooling piece 220 links to each other with radiator 240 with copper inner bag 230 respectively.Whole refrigerating plant 200 integrated being bundled together.
Cooling piece 220 comprises chill surface and radiating surface, and the chill surface 221 and the radiating surface 222 of cooling piece 220 are oppositely arranged on the cooling piece 220, and the chill surface 221 of cooling piece 220 links to each other with copper inner bag 230, and the radiating surface 222 of cooling piece 220 links to each other with radiator 240.
Heating combined equipment 300 comprises boiler 320 and heater circuit 330, and heater circuit 330 is arranged in the boiler 320, links to each other through pipeline between boiler 320 and the tank 110, links to each other through pipeline between boiler 320 and the hot water outlet 310.
Normal temperature device 400 is normal-temperature water outlet, and said normal-temperature water outlet directly links to each other with tank 110 through pipeline.
After water dispenser connects power supply, open the normal-temperature water outlet and can obtain normal-temperature water; Open hot-water switch and start heating combined equipment 300; Water in the heater circuit 330 heat hot water tanks 320 stops heating automatically after setting high-temperature; Heating automatically again when the water in the boiler 320 drops to the setting low temperature; Behind design temperature, stop automatically, water temperature remains on to be set between the high and low temperature, opens hot water outlet 310 and just can obtain hot water.
Open cold water switch and start refrigerating plant 200; Cooling piece 220 work, the chill surface 221 that connects copper inner bag 230 freezes the water for cooling in the copper inner bag 230; Radiating surface 222 is passed to radiator 240 with chill surface 221 from the heat that copper inner bag 230 absorbs, and radiator 240 is dispersed into the part heat in the air.Water in the bucket 500 flows into copper inner bag 230 through tank 110; The heat conductivility of copper inner bag 230 is good, can pass in the water by fine cold with cooling piece 220, and whole inner bag all participates in transmitting the process of cold; Improved refrigerating efficiency; Also improved simultaneously the refrigerating speed of cooling piece 220, the continuous cooling of the water in the copper inner bag 230 is like this opened cooling water outlet 210 and just can be obtained cold water.
More than show and described the advantage of basic principle, principal character and the utility model of the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The just principle of describing in the foregoing description and the specification of the utility model; The utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these variations and improvement all fall in the scope of the utility model that requires protection.The protection domain that the utility model requires is defined by appending claims and equivalent thereof.
Claims (4)
1. copper inner bag semiconductor water dispenser; Comprise housing, it is characterized in that, in said housing, be respectively arranged with refrigerating plant, heating combined equipment and normal temperature device; Said housing upper end is provided with the tank that links to each other with bucket; Said tank is communicated with said refrigerating plant, heating combined equipment and normal temperature device respectively, is respectively arranged with cooling water outlet and hot water outlet on the said housing, and said cooling water outlet is connected with heating combined equipment with said refrigerating plant through pipeline respectively with hot water outlet; Said refrigerating plant comprises copper inner bag and cooling piece and the radiator that is connected with said tank; Said cooling piece is a semiconductor chilling plate, and said semiconductor chilling plate and radiator are arranged on outside the copper inner bag, and said semiconductor chilling plate links to each other with radiator with said copper inner bag respectively.
2. copper inner bag semiconductor water dispenser according to claim 1; It is characterized in that said cooling piece comprises chill surface and radiating surface, said chill surface and radiating surface are oppositely arranged on the said cooling piece; Said chill surface links to each other with the copper inner bag, and said radiating surface links to each other with radiator.
3. copper inner bag semiconductor water dispenser according to claim 1; It is characterized in that; Said heating combined equipment comprises boiler and heater circuit; Said heater circuit is arranged in the said boiler, links to each other through pipeline between said boiler and the tank, links to each other through pipeline between said boiler and the said hot water outlet.
4. copper inner bag semiconductor water dispenser according to claim 1 is characterized in that, said normal temperature device is normal-temperature water outlet, and said normal-temperature water outlet directly links to each other with said tank through pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120074712U CN202127762U (en) | 2011-03-21 | 2011-03-21 | Semiconductor water dispenser with copper inner container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120074712U CN202127762U (en) | 2011-03-21 | 2011-03-21 | Semiconductor water dispenser with copper inner container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202127762U true CN202127762U (en) | 2012-02-01 |
Family
ID=45516551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120074712U Expired - Lifetime CN202127762U (en) | 2011-03-21 | 2011-03-21 | Semiconductor water dispenser with copper inner container |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202127762U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102687987A (en) * | 2011-03-21 | 2012-09-26 | 铜联商务咨询（上海）有限公司 | Semiconductor water dispenser with copper inner container |
| CN109744881A (en) * | 2017-11-06 | 2019-05-14 | 深圳天赋健医疗器械科技有限公司 | A kind of drinker cold liner radiator buckled mounting structure |
-
2011
- 2011-03-21 CN CN201120074712U patent/CN202127762U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102687987A (en) * | 2011-03-21 | 2012-09-26 | 铜联商务咨询（上海）有限公司 | Semiconductor water dispenser with copper inner container |
| CN109744881A (en) * | 2017-11-06 | 2019-05-14 | 深圳天赋健医疗器械科技有限公司 | A kind of drinker cold liner radiator buckled mounting structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120201 |
|
| CX01 | Expiry of patent term |