CN101706703B - 一种电容式触摸屏四边边缘金属膜的制作方法 - Google Patents
一种电容式触摸屏四边边缘金属膜的制作方法 Download PDFInfo
- Publication number
- CN101706703B CN101706703B CN2009103103193A CN200910310319A CN101706703B CN 101706703 B CN101706703 B CN 101706703B CN 2009103103193 A CN2009103103193 A CN 2009103103193A CN 200910310319 A CN200910310319 A CN 200910310319A CN 101706703 B CN101706703 B CN 101706703B
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- ito
- metal film
- minutes
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000011521 glass Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000007747 plating Methods 0.000 claims abstract description 28
- 238000005238 degreasing Methods 0.000 claims abstract description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 50
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 46
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 30
- 239000008367 deionised water Substances 0.000 claims description 25
- 229910021641 deionized water Inorganic materials 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 17
- 229910052737 gold Inorganic materials 0.000 claims description 17
- 229910001096 P alloy Inorganic materials 0.000 claims description 15
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 10
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 6
- 206010070834 Sensitisation Diseases 0.000 claims description 5
- 230000007935 neutral effect Effects 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 230000008313 sensitization Effects 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims 5
- 239000011259 mixed solution Substances 0.000 claims 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Natural products CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 238000012216 screening Methods 0.000 claims 1
- 150000003464 sulfur compounds Chemical class 0.000 claims 1
- 230000003213 activating effect Effects 0.000 abstract 1
- 230000001235 sensitizing effect Effects 0.000 abstract 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 20
- 239000007788 liquid Substances 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 11
- 238000004506 ultrasonic cleaning Methods 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 239000008151 electrolyte solution Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000013527 degreasing agent Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000006424 Flood reaction Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000001455 metallic ions Chemical class 0.000 description 3
- 229910001453 nickel ion Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 indium tin metal oxide Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103103193A CN101706703B (zh) | 2009-11-24 | 2009-11-24 | 一种电容式触摸屏四边边缘金属膜的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103103193A CN101706703B (zh) | 2009-11-24 | 2009-11-24 | 一种电容式触摸屏四边边缘金属膜的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101706703A CN101706703A (zh) | 2010-05-12 |
CN101706703B true CN101706703B (zh) | 2011-06-22 |
Family
ID=42376932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009103103193A Expired - Fee Related CN101706703B (zh) | 2009-11-24 | 2009-11-24 | 一种电容式触摸屏四边边缘金属膜的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101706703B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101845625B (zh) * | 2010-06-01 | 2012-03-21 | 无锡阿尔法电子科技有限公司 | 一种在电容式触摸屏表面进行化学镀金的方法 |
CN201886454U (zh) * | 2010-06-02 | 2011-06-29 | 无锡阿尔法电子科技有限公司 | 一种电容式触控面板 |
WO2012008346A1 (ja) * | 2010-07-14 | 2012-01-19 | アルプス電気株式会社 | 入力装置及びその製造方法 |
CN102221949A (zh) * | 2011-05-12 | 2011-10-19 | 信利半导体有限公司 | 电容式触摸屏及其制作方法 |
CN103132057A (zh) * | 2011-11-24 | 2013-06-05 | 睿明科技股份有限公司 | 触控面板的低阻抗电控线路及其制造方法 |
CN107365958B (zh) * | 2017-07-13 | 2020-01-07 | 上海天马有机发光显示技术有限公司 | 金属掩膜板的制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996012393A1 (de) * | 1994-10-18 | 1996-04-25 | Atotech Deutschland Gmbh | Verfahren zum beschichten elektrisch nichtleitender oberflächen mit verbundenen metallstrukturen |
CN1900361A (zh) * | 2006-07-14 | 2007-01-24 | 西南大学 | 钕铁硼永磁材料表面梯度功能涂层制备方法 |
CN201169571Y (zh) * | 2008-01-31 | 2008-12-24 | 谷崧精密工业股份有限公司 | 玻璃面板结构 |
CN101403110A (zh) * | 2008-11-17 | 2009-04-08 | 浙江大学 | 一种简化预处理的化学镀金属包覆碳化物粉体的制备方法 |
-
2009
- 2009-11-24 CN CN2009103103193A patent/CN101706703B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996012393A1 (de) * | 1994-10-18 | 1996-04-25 | Atotech Deutschland Gmbh | Verfahren zum beschichten elektrisch nichtleitender oberflächen mit verbundenen metallstrukturen |
CN1900361A (zh) * | 2006-07-14 | 2007-01-24 | 西南大学 | 钕铁硼永磁材料表面梯度功能涂层制备方法 |
CN201169571Y (zh) * | 2008-01-31 | 2008-12-24 | 谷崧精密工业股份有限公司 | 玻璃面板结构 |
CN101403110A (zh) * | 2008-11-17 | 2009-04-08 | 浙江大学 | 一种简化预处理的化学镀金属包覆碳化物粉体的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101706703A (zh) | 2010-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101706703B (zh) | 一种电容式触摸屏四边边缘金属膜的制作方法 | |
CN103526192B (zh) | 一种用于ito/fto/azo导电玻璃上具有强选择性的新型化学镀镍法 | |
KR100807948B1 (ko) | 저저항 금속 배선 형성방법, 금속 배선 구조 및 이를이용하는 표시장치 | |
CN104294244B (zh) | 激光辅助化学混合镀实现二维表面金属结构的方法 | |
CN1876891B (zh) | 使不导电基底直接金属化的方法 | |
WO2019018604A1 (en) | PROCESS FOR METALLIZING INTERCONNECTION IN A SUBSTRATE | |
CN113789513A (zh) | 一种基于正负脉冲的陶瓷基板表面镀铜方法 | |
CN102953053B (zh) | 一种ipmc 驱动器的选择性镀工艺 | |
TW201213111A (en) | Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in EMI shielding applications | |
JP3944027B2 (ja) | フレキシブルプリント配線板の製造方法及びその製造方法で得られたフレキシブルプリント配線板 | |
CN102776495A (zh) | 一种用于在电容式触摸屏ito走线上的化学镀镍方法 | |
TWI686361B (zh) | 附膜玻璃板之製造方法 | |
CN102732862A (zh) | 铜箔上置换镀Ni-S合金阻挡层的方法及该阻挡层的化学钝化方法 | |
CN102508583B (zh) | 电容式触摸屏金属引线的制备方法 | |
CN101922001B (zh) | 一种电引发化学镀的加成法制造印刷电路板的方法 | |
KR100798870B1 (ko) | 커플링 에이전트를 포함하는 전도성 금속 도금 폴리이미드기판 및 그 제조 방법 | |
KR20110024492A (ko) | 금속적층구조가 개선된 ito 금속 적층판 및 그 전극 형성방법 | |
CN104005027A (zh) | 一种含硅环氧树脂表面金属化的方法 | |
JP2003183881A5 (zh) | ||
CN1865500A (zh) | 一种在硅片上化学镀铜的方法 | |
WO2014145743A1 (en) | Surface treated aluminum foil for electronic circuits | |
TW201529885A (zh) | 聚亞醯胺基板金屬化的方法 | |
CN105839104A (zh) | 挠性金属积层材料的制造方法 | |
CN105957930A (zh) | 一种rgb金属基板的制作方法 | |
JP2005146330A (ja) | 非導体材料への表面処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing method of metal film on periphery of capacitive touch screen Effective date of registration: 20141016 Granted publication date: 20110622 Pledgee: SHANGHAI CENSI AUTOMOBILE PARTS Co.,Ltd. Pledgor: WUXI ALPHA ELECTRONICS Co.,Ltd. Registration number: 2014330000039 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI CENSI AUTOMOBILE PARTS CO., LTD. Free format text: FORMER OWNER: WUXI ARF ELECTRONICS CO., LTD. Effective date: 20150807 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150807 Address after: 201112, No. 201, South Lu, West Village, Pujiang Town, Minhang District, Shanghai Patentee after: SHANGHAI CENSI AUTOMOBILE PARTS Co.,Ltd. Address before: A road Binhu District 214125 Jiangsu city of Wuxi province Taihu city science and Technology Industrial Park No. 27 room 1301 Patentee before: WUXI ALPHA ELECTRONICS Co.,Ltd. |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150724 Granted publication date: 20110622 Pledgee: SHANGHAI CENSI AUTOMOBILE PARTS Co.,Ltd. Pledgor: WUXI ALPHA ELECTRONICS Co.,Ltd. Registration number: 2014330000039 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 |
|
CF01 | Termination of patent right due to non-payment of annual fee |