CN101465403B - Technique for producing encapsulating material for high-power LED support frame - Google Patents
Technique for producing encapsulating material for high-power LED support frame Download PDFInfo
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- CN101465403B CN101465403B CN2008101481408A CN200810148140A CN101465403B CN 101465403 B CN101465403 B CN 101465403B CN 2008101481408 A CN2008101481408 A CN 2008101481408A CN 200810148140 A CN200810148140 A CN 200810148140A CN 101465403 B CN101465403 B CN 101465403B
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- 239000000463 material Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 18
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 24
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 24
- 238000002347 injection Methods 0.000 claims abstract description 22
- 239000007924 injection Substances 0.000 claims abstract description 22
- 239000000835 fiber Substances 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- 238000001746 injection moulding Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 11
- -1 polyphenylene Polymers 0.000 claims abstract description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 239000000654 additive Substances 0.000 claims abstract description 5
- 239000000805 composite resin Substances 0.000 claims abstract 4
- 229920000265 Polyparaphenylene Polymers 0.000 claims abstract 3
- 150000002148 esters Chemical class 0.000 claims abstract 3
- 238000001125 extrusion Methods 0.000 claims abstract 2
- 239000011347 resin Substances 0.000 claims abstract 2
- 229920005989 resin Polymers 0.000 claims abstract 2
- 239000012756 surface treatment agent Substances 0.000 claims abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 20
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- ASLNLSYDVOWAFS-UHFFFAOYSA-N diethylazanium;dihydrogen phosphate Chemical compound CCNCC.OP(O)(O)=O ASLNLSYDVOWAFS-UHFFFAOYSA-N 0.000 claims description 5
- UNXNGGMLCSMSLH-UHFFFAOYSA-N dihydrogen phosphate;triethylazanium Chemical compound OP(O)(O)=O.CCN(CC)CC UNXNGGMLCSMSLH-UHFFFAOYSA-N 0.000 claims description 5
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 5
- 239000001095 magnesium carbonate Substances 0.000 claims description 5
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 5
- UUVZTKMMRCCGHN-OUKQBFOZSA-N triethoxy-[(e)-2-phenylethenyl]silane Chemical group CCO[Si](OCC)(OCC)\C=C\C1=CC=CC=C1 UUVZTKMMRCCGHN-OUKQBFOZSA-N 0.000 claims description 5
- JRSJRHKJPOJTMS-MDZDMXLPSA-N trimethoxy-[(e)-2-phenylethenyl]silane Chemical group CO[Si](OC)(OC)\C=C\C1=CC=CC=C1 JRSJRHKJPOJTMS-MDZDMXLPSA-N 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 10
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- 230000003712 anti-aging effect Effects 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 11
- 239000003595 mist Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- 238000005453 pelletization Methods 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 229920006389 polyphenyl polymer Polymers 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- 150000003568 thioethers Chemical class 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000003750 conditioning effect Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-M 4-hydroxybenzoate Chemical compound OC1=CC=C(C([O-])=O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-M 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
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- Processes Of Treating Macromolecular Substances (AREA)
Abstract
本发明涉及一种大功率LED支架框架包封材料的生产工艺，将100质量单位分子量为3-8万的聚苯硫醚树脂在200℃氧化热交联8小时后，加入添加剂与5-15质量单位聚苯酯微粉和10-30质量单位纳米级无机填料在高速搅拌机里搅拌均匀，得到聚苯硫醚树脂复合预混料；所得聚苯硫醚树脂复合预混料经同向双螺杆挤出机加入氧化铝陶瓷纤维晶须或经过KH550表面处理剂处理过后单纤维直径为15um的玻璃纤维20-30质量单位完成混炼挤出；最后采用注塑温度为290-320℃，模温为90-120℃的注塑机注塑成LED成形支架。由本发明生产制造的支架具有良好的耐高温绝缘和抗老化性能，尤其适合高大功率LED支架框架包封材料使用。
The invention relates to a production process of a high-power LED bracket frame encapsulation material. After 100 mass units of polyphenylene sulfide resin with a molecular weight of 30,000-80,000 are oxidized and thermally cross-linked at 200°C for 8 hours, additives and 5-15 The mass unit of polyphenylene ester micropowder and 10-30 mass units of nano-scale inorganic filler are stirred evenly in a high-speed mixer to obtain a polyphenylene sulfide resin composite premix; the obtained polyphenylene sulfide resin composite premix is extruded by co-rotating twin-screw Add alumina ceramic fiber whiskers or 20-30 mass units of glass fiber with a single fiber diameter of 15um after being treated with KH550 surface treatment agent to complete the mixing and extrusion; the final injection molding temperature is 290-320 ° C, and the mold temperature is 90 The injection molding machine at -120°C is injection molded into LED forming brackets. The bracket produced by the invention has good high-temperature-resistant insulation and anti-aging properties, and is especially suitable for high-power LED bracket frame encapsulation materials.
Description
Technical field
The invention belongs to the high-power LED encapsulation support and make the field with synthetic material.
Background technology
The great power LED solid-state illumination is to have continued since the incandescent lamp invention most important illumination revolution.The semiconductor LED material can be converted into luminous energy with electric energy, has different with traditional lighting light source maximum, the luminous efficiency height, and energy consumption only is an ordinary incandescent lamp 1/8th; Life-span is long; No stroboscopic, no infrared and ultra-violet radiation and do not contain mercury element etc. are typically energy-conservation, environmental protection illuminations.
Along with the continuous expansion of technological progress and market scale, the power density of single great power LED and luminous efficiency are improving constantly, and high-power LED encapsulation material and technology are also had higher requirement.
Support, chip and transparent enclosure glue are the big main raw material(s)s of three in the high-power LED encapsulation technology.The quality of high-power LED bracket performance has very important influence to the stable use of LED light fixture.Shown in accompanying drawing 2,3, high-power LED bracket comprises that mainly support lead-in wire 3, heat sink 4 and Support frame seal plastics 5 and form.
Seal plastics mainly act on be the insulation heat insulation, particularly at high temperature must have certain mechanical mechanics property.There is the factor of two aspects to cause sealing the plastics damage easily, the one, because existing technical limitations, the electric energy of led chip 80% converts heat energy to, it is very severe to cause great power LED in use to generate heat, the light source serviceability temperature is very high, and insulation property are not affected the requirement of plastic encapsulation material using for a long time more than 100 ℃; The 2nd, instantaneous temperature is up to more than 260 ℃ when welding for high-power LED light source, and short-term high temperature can not produce the plastic encapsulation material and destroy, and insulation property and mechanical strength can not have too big decay.
Traditional plastics of sealing are that the nylon enhancing is material modified, the modified composite material that with nylon is matrix is all undesirable relatively in high temperature resistant, ageing-resistant, shock resistance, insulation property, in the light fixture manufacture process or in the light source welding process, often be not easy to bear and reach 260 ℃ of short time high temperatures, and cause aging insulation property to lower, even light fixture lost efficacy.
Summary of the invention
In view of the above shortcoming of prior art, the objective of the invention is research and make a kind of high temperature resistant, ageing-resistant, shock resistance, high insulation, high-power LED bracket material and manufacturing process thereof, make it to overcome the above shortcoming of prior art.Its main means are:
Employing has the material of high-insulativity and heat resistance and produces the LED special stand through injection mo(u)lding, adopts following technology:
1) be that the polyphenylene sulfide of 3-8 ten thousand is after the 200-230 ℃ of crosslinked 4-8 of the heat of oxidation hour with 100 mass unit molecular weight, add additive and 5-15 mass unit polybenzoate micro mist and 10-30 mass unit nanometer grade silica and in homogenizer, stir, obtain the polyphenylene sulfide compound premix;
2) add ceramic alumina fiber whisker 20-30 mass unit at 1 gained polyphenylene sulfide compound premix through parallel dual-screw extruding machine and finish mixing extruding, again through cooling, pelletizing; Adopting injection temperature at last is 290-300 ℃, and the mould temperature is injection molded into the LED shaped bracket for 80-90 ℃ injection molding machine.
The polyphenyl fat micro mist that adds among the present invention is main to be to utilize polybenzoate all to have very high mechanical rigid in very wide temperature range, and very high compression creep is arranged, and machine cut processing easily has very high weight capacity and good self lubricity.Has very high thermal stability simultaneously, the conductive coefficient of maximum in the plastics, excellent electric insulating and excellent chemical-resistance.In high-power LED bracket framework encapsulating material, add the polybenzoate micro mist, its objective is and utilize very high thermal stability of polybenzoate and maximum character such as conductive coefficient, thereby improve the heat dispersion of high-power LED bracket framework encapsulating material, can prolong the useful life of high-power LED bracket framework encapsulating material so greatly; Improve the characteristics such as high temperature resistant and impact strength of high-power LED bracket framework encapsulating material simultaneously.Its addition is 5-15%, as is higher than 15% and can increases its cost, as is lower than 5% and does not but reach and increase the service life and characteristics such as high temperature resistant and impact strength.Therefore adding 5-15% is best selection.
Can add the nano grade inorganic filler among the present invention is: nanoscale white porcelain powder, diatomite, quartz sand, white carbon, silicon dioxide, talcum powder, ceramic clay, titanium dioxide, materials such as calcium carbonate, wherein with nanometer grade silica, titanium dioxide, calcium carbonate is best, its main purpose is to improve electrical insulating property and the impact strength of composite material after injection mo(u)lding, also can improve the high temperature resistant degree of composite material simultaneously, thereby make led support, framework, encapsulating material can bear continuous serviceability temperature and bring up to 200-230 ℃, the short time bearing temperature reaches 260-300 ℃, its addition 20-30% between, as be higher than 30% and can increase its cost, as be lower than 20% and but do not reach high temperature resistant and characteristic such as impact strength.Therefore adding 20-30% is best selection.
In the solution of the present invention, because the chip of led light source but has 80% electric energy to be converted into heat energy, the led support material require of use bears higher temperature, otherwise can reduce the useful life of led support.In the light fixture manufacture process, in the chips welding process, often need to bear and reach 260 ℃ of short time high temperatures, the domestic and international at present high-power LED bracket material that uses, mainly be five large-engineering plastic or other material, the characteristics of these material maximums are low prices, it is high temperature resistant, ageing-resistant, shock resistance, insulation property are all desirable not to the utmost, after engineering plastics process enhancement process, the temperature that can bear for a long time is exactly between 120-130 ℃, the short time bearing temperature is about 180 ℃, their these characteristics can satisfy the manufacturing needs of LED light fixture far from, simultaneously, in the lead-tin soldering termination process of chip, can make present engineering plastics fusing because welding temperature is high, even burn and shorten its useful life, also may cause harm such as be short-circuited between the electrode, the resulting support of polyphenyl thioether composite material of the present invention for this reason has the thermal stability under the excellent high temperature, and has a high flame retardant, high electric insulation, radiation hardness and favorable mechanical performance, thereby make the long-time bearing temperature of led support material up to 200-230 ℃, the temperature that the short time bears is between 260-300 ℃.Especially the material that is fit to high great power LED support unit uses.
Description of drawings
Fig. 1 is a process chart of the present invention.
Fig. 2 is high-power LED encapsulation structure figure: 1-support lead-in wire 2-chip 3-packaging plastic and the heat sink 5-support of lens 4-are sealed plastics
The properties of product table that Fig. 3 obtains for embodiment of the invention experiment
Specific embodiments
The present invention implements to obtain with following technological process:
Embodiment 1:
Adopting above-mentionedly as Fig. 1 technological process, is 3 with molecular weight
+-Ten thousand polyphenylene sulfide 200kg adds in the heat cross-linking machine, temperature is controlled at 230 ℃, with the heat of oxidation after crosslinked 4 hours, add 0.2kg polyoxy styrene ether phosphate diethylamine, the styryl triethoxysilane of 10kg, the magnesium oxide of 0.2kg again, and the 10kg particle diameter is that polybenzoate (p-hydroxybenzoate) micro mist, 40kg nanometer grade silica, the 0.2kg antioxidant GK-1010 of 1um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Gained premix and 40kg handle later through the KH550 surface conditioning agent, and single fiber diameter is the glass fibre of 15um, extrude through parallel dual-screw extruding machine is mixing, cooling, pelletizing, employing injection temperature are that 290 ℃ of mould temperature are that 80 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 2:
With molecular weight is 4
+-Ten thousand polyphenylene sulfide 100kg adds in the heat cross-linking machine, temperature is controlled at 200 ℃, with the heat of oxidation after crosslinked 8 hours, add 0.5kg polyoxy styrene ether phosphate triethylamine, the styryl trimethoxy silane of 3.3kg, the magnesium carbonate of 0.2kg again, and the 10kg particle diameter is that polybenzoate micro mist, 20kg nanometer grade silica, 0.2kg antioxidant GK-1010 about 2.4um stirs in homogenizer.Gained premix and 30kg handle later through the KH550 surface conditioning agent, and single fiber diameter is the glass fibre of 15um, extrude through parallel dual-screw extruding machine is mixing, cooling, pelletizing, employing injection temperature are that 300 ℃ of mould temperature are that 90 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 3:
Adopting above-mentionedly as Fig. 1 technological process, is 5 with molecular weight
+-Ten thousand polyphenylene sulfide 100kg adds in the heat cross-linking machine, temperature is controlled at 210 ℃, with the heat of oxidation after crosslinked 6 hours, add 0.9kg polyoxy styrene ether phosphate triethylamine, the styryl trimethoxy silane of 3.9kg, the magnesium carbonate of 0.4kg again, and the 15kg particle diameter is that polybenzoate micro mist, 23kg nanometer grade silica, 0.6kg antioxidant GK-1010 about 4.4um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Gained premix and 23kg handle later through the KH550 surface conditioning agent, and single fiber diameter is the glass fibre of 15um, extrude through parallel dual-screw extruding machine is mixing, cooling, pelletizing, employing injection temperature are that 310 ℃ of mould temperature are that 120 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 4:
Adopting above-mentionedly as Fig. 1 technological process, is 5 with molecular weight
+-Ten thousand polyphenylene sulfide 100kg adds in the heat cross-linking machine, temperature is controlled at 210 ℃, with the heat of oxidation after crosslinked 5 hours, add 1.9kg polyoxy styrene ether phosphate diethylamine, the styryl triethoxysilane of 5kg, the magnesium oxide of 0.8kg again, and the 12kg particle diameter is that polybenzoate micro mist, 28kg nanometer grade silica, 1.0kg antioxidant GK-1010 about 3.7um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Gained premix and 27kg handle later through the KH550 surface conditioning agent, and single fiber diameter is the glass fibre of 15um, extrude through parallel dual-screw extruding machine is mixing, cooling, pelletizing, employing injection temperature are that 320 ℃ of mould temperature are that 120 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 5:
Adopting above-mentionedly as Fig. 1 technological process, is 6 with molecular weight
+-Ten thousand polyphenylene sulfide 100kg adds in the heat cross-linking machine, temperature is controlled at 220 ℃, with the heat of oxidation after crosslinked 6 hours, add 5.0kg polyoxy styrene ether phosphate triethylamine, the styryl triethoxysilane of 4kg, the magnesium carbonate of 0.8kg again, and the 7.5kg particle diameter is that polybenzoate micro mist, 20kg nanometer grade silica, 0.2kg antioxidant GK-1010 about 7.2um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Gained premix and 20kg ceramic alumina fiber whisker are extruded through parallel dual-screw extruding machine is mixing, and cooling, pelletizing, employing injection temperature are that 320 ℃ of mould temperature are that 110 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 6:
Adopting above-mentionedly as Fig. 1 technological process, is 7 with molecular weight
+-Ten thousand polyphenylene sulfide 100kg adds in the heat cross-linking machine, temperature is controlled at 200 ℃, with the heat of oxidation after crosslinked 8 hours, add 5.0kg polyoxy styrene ether phosphate diethylamine, the styryl trimethoxy silane of 5.0kg, the magnesium oxide of 1.0kg again, and the 10kg particle diameter is that polybenzoate micro mist, 30kg nanometer grade silica, 0.9kg antioxidant GK-1010 about 9.4um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Then, gained premix and 30kg ceramic alumina fiber whisker are extruded through parallel dual-screw extruding machine is mixing, and cooling, pelletizing, employing injection temperature are that 300 ℃ of mould temperature are that 100 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 7:
Adopting above-mentionedly as Fig. 1 technological process, is 8 with molecular weight
+-Ten thousand polyphenylene sulfide 200kg adds in the heat cross-linking machine, temperature is controlled at 215 ℃, with the heat of oxidation after crosslinked 5.5 hours, add 2.6kg polyoxy styrene ether phosphate diethylamine, the styryl triethoxysilane of 3kg, the magnesium oxide of 0.5kg again, and the 12kg particle diameter is that polybenzoate micro mist, 17kg nanometer grade silica, 0.7kg antioxidant GK-1010 about 10.0um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Then, gained premix and 23kg ceramic alumina fiber whisker are extruded through parallel dual-screw extruding machine is mixing, and cooling, pelletizing, employing injection temperature are that 320 ℃ of mould temperature are that 115 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics of the LED shaped bracket of the polyphenyl thioether composite material that makes, in accompanying drawing 3 properties of product tables, show.
Embodiment 8:
Adopting above-mentionedly as Fig. 1 technological process, is 4 with molecular weight
+-Ten thousand polyphenylene sulfide 200kg adds in the heat cross-linking machine, temperature is controlled at 205 ℃, with the heat of oxidation after crosslinked 7 hours, add 4.2kg polyoxy styrene ether phosphate triethylamine, the styryl trimethoxy silane of 8.0kg, the magnesium carbonate of 1.2kg again, and the 15kg particle diameter is that polybenzoate micro mist, 20kg nanometer grade silica, 0.2kg antioxidant GK-1010 about 6.6um stirs in homogenizer, so just is mixed into that to contain polyphenylene sulfide be premix.Then, gained premix and 27kg ceramic alumina fiber whisker are extruded through parallel dual-screw extruding machine is mixing, and cooling, pelletizing, employing injection temperature are that 310 ℃ of mould temperature are that 120 ℃ injection molding machine is injection molded into the LED shaped bracket.
The various performance characteristics that make shaped bracket are seen Fig. 3.
Claims (5)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102888113B (en) * | 2011-07-18 | 2024-07-26 | 四川得阳特种新材料有限公司 | Manufacturing method of polyphenylene sulfide composite granules containing conductive material |
| CN102391647B (en) * | 2011-09-06 | 2013-01-16 | 四川瑞安特电子技术有限公司 | Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED) |
| CN102408717A (en) * | 2011-09-06 | 2012-04-11 | 四川瑞安特电子技术有限公司 | Manufacturing method for polyphenylene sulfide composite heat conduction material for LED |
| CN103224706A (en) * | 2013-04-09 | 2013-07-31 | 浙江俊尔新材料股份有限公司 | Polyphenylene sulfide composite material, preparation method and molding method thereof |
| CN103756318A (en) * | 2013-11-28 | 2014-04-30 | 芜湖跃飞新型吸音材料股份有限公司 | Ageing-resistant modified polyphenylene sulfide material for automobile plastic parts |
| CN107658375B (en) * | 2017-08-21 | 2022-04-22 | 山东鼎拓电子科技有限公司 | Production process and structure of a basalt LED bracket |
| CN107603128B (en) * | 2017-08-25 | 2019-03-26 | 四川依菲兰科技有限公司 | A kind of nonmetallic composite Nano heat sink material and preparation method thereof |
| CN107573688A (en) * | 2017-09-22 | 2018-01-12 | 南京肯特复合材料股份有限公司 | High temperature resistant end plane sealing strip PPS resin composite and preparation method thereof |
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| JP2006237114A (en) * | 2005-02-23 | 2006-09-07 | Asahi Kasei Chemicals Corp | LED diffusion unit |
| CN101123288A (en) * | 2007-07-31 | 2008-02-13 | 鹤山丽得电子实业有限公司 | A LED encapsulation method |
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| US6900285B2 (en) * | 1995-07-28 | 2005-05-31 | Dow Global Technologies Inc. | Fluorene-containing polymers and compounds useful in the preparation thereof |
| JP2006237114A (en) * | 2005-02-23 | 2006-09-07 | Asahi Kasei Chemicals Corp | LED diffusion unit |
| CN101123288A (en) * | 2007-07-31 | 2008-02-13 | 鹤山丽得电子实业有限公司 | A LED encapsulation method |
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| CN101465403A (en) | 2009-06-24 |
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