CN101737723A - A kind of LED light conversion plate and its manufacturing method - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及一种LED转光板及其制造方法，属于半导体照明领域。The invention relates to an LED light conversion plate and a manufacturing method thereof, belonging to the field of semiconductor lighting.
背景技术Background technique
LED(发光二极管)作为一种新型固体光源，近几年发展十分迅速，现在已经被广泛应用于大屏幕显示、交通信号灯、景观照明、路灯照明等领域。与白炽灯和节能灯相比，其主要优点有：体积小、反应速度快，抗震性好、寿命长、尤其节能环保，被誉为第四代照明光源。As a new type of solid light source, LED (Light Emitting Diode) has developed rapidly in recent years and has been widely used in large-screen display, traffic signal lights, landscape lighting, street lighting and other fields. Compared with incandescent lamps and energy-saving lamps, its main advantages are: small size, fast response, good shock resistance, long life, especially energy saving and environmental protection, known as the fourth generation of lighting sources.
由于技术原因，目前主流的LED制造方法是蓝光芯片+黄色荧光粉，封装工艺也都大同小异：将荧光粉和硅胶或者环氧树脂混合均匀后，涂敷在芯片上面，固化即可。采用这种工艺制造的LED，其光衰或者说老化来自于两个方面：一是芯片长长时间使用后自身的老化，这是任何电子元器件都存在的问题，随着使用时间的增长，效率也越来越低；二是荧光粉由于受芯片散热影响造成的量子效率衰减，由于现行LED封装工艺都是直接将荧光粉和硅胶的混合物点胶到芯片上，而芯片在工作时，会散发出大量的热，使芯片周围的温度迅速升高，结果荧光粉的发光效率由于受热而不断下降，最终直接影响到LED的寿命。因此为了降低LED的光衰，必须从上述两个根本问题着手。此外采用目前主流封装工艺还存在其他一些问题，例如：批量生产时，点胶量难以达到高度的一致性，封装后，还需要根据参数分拣；单颗芯片上面的荧光粉胶层厚度不一，中间厚，四周薄。这些问题也都是必须解决的。Due to technical reasons, the current mainstream LED manufacturing method is blue light chip + yellow phosphor powder, and the packaging process is similar: mix the phosphor powder with silica gel or epoxy resin evenly, apply it on the chip, and then cure it. The light decay or aging of LEDs manufactured by this process comes from two aspects: one is the aging of the chip itself after long-term use, which is a problem with any electronic component. With the increase of use time, The efficiency is also getting lower and lower; the second is the attenuation of the quantum efficiency of the phosphor powder due to the heat dissipation of the chip. Because the current LED packaging process is to directly dispense the mixture of phosphor powder and silica gel onto the chip, and the chip will be in operation when it is working. A large amount of heat is emitted, causing the temperature around the chip to rise rapidly. As a result, the luminous efficiency of the phosphor is continuously reduced due to the heat, and finally directly affects the life of the LED. Therefore, in order to reduce the light decay of LEDs, we must start from the above two fundamental problems. In addition, there are still some other problems in the current mainstream packaging process, such as: in mass production, the dispensing amount is difficult to achieve a high degree of consistency, after packaging, it needs to be sorted according to parameters; the thickness of the phosphor layer on a single chip is different , thick in the middle and thin around. These problems must also be resolved.
此外，除了以上老化和一致性问题外，目前的LED灯具普遍存在着眩光问题，到夜晚时对人眼的视觉造成了严重影响，这是由于制造灯具时使用的LED光源是点光源的原因，因此欲解决这个问题，必须使灯具的点光源转变为面光源。In addition, in addition to the above aging and consistency problems, the current LED lamps generally have the problem of glare, which seriously affects the vision of the human eye at night. This is because the LED light source used in the manufacture of lamps is a point light source. Therefore, in order to solve this problem, it is necessary to convert the point light source of the lamp into a surface light source.
发明内容Contents of the invention
本发明的目的是在于提供一种LED转光板，采用该转光板后，荧光粉和芯片不再相互接触，二是保持一定的距离，荧光粉不会再受到芯片发热的影响，量子效率能够在较长的时间内保持在较高水平，同时也不需要点胶等工序，只需要对芯片进行封装即可，能够大幅提高生产效率，此外采用本发明制造的LED灯具将是一个面光源，不会再存在眩光问题。本发明的另一目的是提供了上述LED转光板的制造方法。The purpose of the present invention is to provide an LED light conversion plate. After using the light conversion plate, the phosphor powder and the chip are no longer in contact with each other, and the second is to keep a certain distance. It can be maintained at a relatively high level for a long time, and at the same time, there is no need for processes such as dispensing, and only the chip needs to be packaged, which can greatly improve production efficiency. In addition, the LED lamp manufactured by the present invention will be a surface light source without There will be no more glare problems. Another object of the present invention is to provide a method for manufacturing the above-mentioned LED light conversion plate.
本发明的技术方案为：一种LED转光板，其特征在于原料组成为荧光粉和高分子聚合物，其中荧光粉和高分子聚合物的质量比为1∶(5-20)；转光板的厚度为0.5-5mm。The technical scheme of the present invention is: a kind of LED light conversion plate, it is characterized in that the raw material is composed of fluorescent powder and high molecular polymer, wherein the mass ratio of fluorescent powder and high molecular polymer is 1: (5-20); The thickness is 0.5-5mm.
其中所述的荧光粉为：YAG:Ce3+和/或YAG:Tb3+，或者是YAG:Ce3+和/或YAG:Tb3+与至少为Ba3MgSi2O8:Eu，Mn、Ca(Mo，W)O4:Eu，Sm、(Sr，Ca)S:Eu、Sr2Si5N8:Eu、(Ca，Sr)AlSiN3:Eu、(Na，Li)Eu(W，Mo)2O8中一种的混合物；其中混合物中YAG:Ce3+和/或YAG:Tb3+的质量占混合物总质量的20％-100％。Wherein said phosphor is: YAG:Ce 3+ and/or YAG:Tb 3+ , or YAG:Ce 3+ and/or YAG:Tb 3+ and at least Ba 3 MgSi 2 O 8 :Eu, Mn , Ca(Mo,W)O 4 :Eu,Sm, (Sr,Ca)S:Eu, Sr 2 Si 5 N 8 :Eu, (Ca,Sr)AlSiN 3 :Eu, (Na,Li)Eu(W , a mixture of Mo) 2 O 8 ; wherein the mass of YAG:Ce 3+ and/or YAG:Tb 3+ in the mixture accounts for 20%-100% of the total mass of the mixture.
优选上述的高分子聚合物为聚碳酸酯、亚克力、聚丙烯或涤纶树脂，更优选聚碳酸酯或亚克力。Preferably, the above-mentioned high molecular polymer is polycarbonate, acrylic, polypropylene or polyester resin, more preferably polycarbonate or acrylic.
本发明还提供了上述LED转光板的制造方法，具体步骤为：The present invention also provides a method for manufacturing the above-mentioned LED light conversion plate, the specific steps are:
(1)按比例分别称量一定质量的荧光粉和高分子聚合物原料；(1) Weigh a certain amount of fluorescent powder and high molecular polymer raw materials in proportion;
(2)将荧光粉和高分子聚合物原料混合均匀后，加入挤出机中；(2) After mixing the fluorescent powder and high molecular polymer raw materials evenly, add them to the extruder;
(3)设定好挤出机的温度，使荧光粉和高分子聚合物原料的混合物均匀挤出；(3) Set the temperature of the extruder so that the mixture of fluorescent powder and polymer raw materials is evenly extruded;
(4)将挤出的荧光粉和高分子聚合物的混合物通过成型处理制成转光板。(4) The mixture of extruded fluorescent powder and high molecular polymer is processed into a light conversion plate through molding.
以上所述的制造LED转光板的方法中：优选上述的荧光粉的粒径范围为1-100μm；高分子聚合物原料为颗粒料，粒径的范围为1-5000μm。所述的挤出机的温度为100-300℃。所述的制板的方法为模压、注射成型或冷却滚。所述的制成的转光板的形状为平面、球面或其他灯具设计需要曲面板。In the above-mentioned method for manufacturing an LED light conversion plate: preferably, the particle size of the above-mentioned fluorescent powder is in the range of 1-100 μm; the raw material of the polymer is granular material, and the particle size range is in the range of 1-5000 μm. The temperature of the extruder is 100-300°C. The method for making the plate is molding, injection molding or cooling roll. The shape of the manufactured light transfer plate is a plane, a spherical surface or other lamp designs that require a curved plate.
有益效果：Beneficial effect:
首先制造出LED转光板，然后采用本发明该LED转光板制造LED灯具，与现有技术相比，优势在于：First of all, the LED light conversion plate is manufactured, and then the LED light conversion plate of the present invention is used to manufacture LED lamps. Compared with the prior art, the advantages are:
(1)该转光板制造方法简单，技术门槛低，可以大规模制造；(1) The manufacturing method of the light conversion plate is simple, the technical threshold is low, and it can be manufactured on a large scale;
(2)采用该LED转光板制造LED整灯，荧光粉和芯片不在相互接触，而是保持一定的距离，这样荧光粉就不会再收到芯片散热的影响，量子效率能够在较长时间内保持在较高的水平上，直接延长了灯具的使用寿命。(2) Using the LED light conversion plate to manufacture the whole LED lamp, the phosphor powder and the chip are not in contact with each other, but keep a certain distance, so that the phosphor powder will no longer be affected by the heat dissipation of the chip, and the quantum efficiency can be improved for a long time Keeping it at a high level directly prolongs the service life of the lamps.
(3)由于该转光板制造方便，并且一致性高，用于整灯制造后，可以使不同批次的灯具之间都保持高度的一致性。同时省去了对单颗LED光源进行分拣的工序，大大提高了生产效率。(3) Since the light conversion plate is easy to manufacture and has high consistency, it can maintain a high degree of consistency among lamps of different batches after being used in the manufacture of the whole lamp. At the same time, the process of sorting a single LED light source is omitted, which greatly improves the production efficiency.
(4)采用本转光板制造的LED灯具为面光源，有效解决了眩光问题。(4) The LED lamp manufactured by the light conversion plate is used as a surface light source, which effectively solves the problem of glare.
具体实施方式Detailed ways
实施例1：分别称取1kg YAG:Ce3+荧光粉(粒径为1-30μm)和5kg聚碳酸酯原料(粒径为1-200μm)，将二者混合均匀后加入挤出机内，设定挤出机温度为180℃，使荧光粉和聚碳酸酯原料混合物均匀挤出，然后将挤出的混合物经过冷却滚处理，即可制成平面型转光板。Example 1: Weigh 1 kg of YAG:Ce 3+ fluorescent powder (with a particle size of 1-30 μm) and 5 kg of polycarbonate raw material (with a particle size of 1-200 μm), mix the two evenly and add them to the extruder. Set the temperature of the extruder to 180°C to uniformly extrude the mixture of phosphor powder and polycarbonate raw materials, and then pass the extruded mixture through cooling and rolling to make a flat light conversion plate.
实施例2：分别称取1kg YAG:Ce3+荧光粉(粒径为50-100μm)和10kg聚碳酸酯原料(粒径为300-1500μm)，将二者混合均匀后加入挤出机内，设定挤出机温度为150℃，使荧光粉和聚碳酸酯原料混合物均匀挤出，然后将挤出的混合物经过注射成型处理，即可制成球面型转光板。Embodiment 2: Weigh 1kg YAG:Ce 3+ fluorescent powder (with a particle diameter of 50-100 μm) and 10kg of polycarbonate raw material (with a particle diameter of 300-1500 μm) respectively, mix them uniformly and add them into the extruder, Set the temperature of the extruder to 150°C to uniformly extrude the mixture of phosphor powder and polycarbonate raw materials, and then inject the extruded mixture to make a spherical light conversion plate.
实施例3：分别称取1kg YAG:Ce3+荧光粉(粒径为80-100μm)和20kg聚碳酸酯原料(粒径为2000-5000μm)，将二者混合均匀后加入挤出机内，设定挤出机温度为170℃，使荧光粉和聚碳酸酯原料混合物均匀挤出，然后将挤出的混合物经过模压处理，即可制成球面型转光板。Embodiment 3: Weigh 1kg YAG:Ce 3+ fluorescent powder (particle diameter is 80-100 μm) and 20kg polycarbonate raw material (particle diameter is 2000-5000 μm) respectively, mix the two and add in the extruder, Set the temperature of the extruder to 170°C to uniformly extrude the mixture of phosphor powder and polycarbonate raw materials, and then mold the extruded mixture to make a spherical light conversion plate.
实施例4：分别称取1kg YAG:Ce3+荧光粉(粒径为20-50μm)和5kg亚克力原料(粒径为100-1000μm)，将二者混合均匀后加入挤出机内，设定挤出机温度为180℃，使荧光粉和亚克力原料混合物均匀挤出，然后将挤出的混合物经过冷却滚处理，即可制成平面型转光板。Example 4: Weigh 1 kg of YAG:Ce 3+ fluorescent powder (with a particle size of 20-50 μm) and 5 kg of acrylic raw material (with a particle size of 100-1000 μm), mix the two evenly and add them to the extruder, set The temperature of the extruder is 180°C, so that the mixture of phosphor powder and acrylic raw materials is uniformly extruded, and then the extruded mixture is cooled and rolled to make a flat light conversion plate.
实施例5：分别称取1kg YAG:Ce3+荧光粉(粒径为1-20μm)和10kg聚丙烯原料(粒径为20-100μm)，将二者混合均匀后加入挤出机内，设定挤出机温度为180℃，使荧光粉和聚丙烯原料混合物均匀挤出，然后将挤出的混合物经过冷却滚处理，即可制成平面型转光板。Embodiment 5: take by weighing 1kg YAG:Ce 3+ fluorescent powder (particle diameter is 1-20 μm) and 10kg polypropylene raw material (particle diameter is 20-100 μm) respectively, after the two are mixed uniformly, add in the extruder, set The temperature of the extruder is set at 180°C to uniformly extrude the mixture of phosphor powder and polypropylene raw materials, and then the extruded mixture is cooled and rolled to make a flat light-transfer plate.
实施例6：分别称取1kg YAG:Ce3+、0.5kg YAG:Tb3+荧光粉(粒径为5-80μm)和10kg亚克力原料(粒径为50-300μm)，将荧光粉和亚克力原料混合均匀后加入挤出机内，设定挤出机温度为200℃，使荧光粉和亚克力原料混合物均匀挤出，然后将挤出的混合物经过注射成型处理，即可制成球面型转光板。Example 6: Weigh 1kg YAG:Ce 3+ , 0.5kg YAG:Tb 3+ fluorescent powder (5-80 μm in particle size) and 10 kg of acrylic raw material (50-300 μm in particle size) respectively, and mix the fluorescent powder and acrylic raw material After mixing evenly, put it into the extruder, set the temperature of the extruder to 200°C, so that the mixture of phosphor powder and acrylic raw materials can be uniformly extruded, and then the extruded mixture can be processed by injection molding to make a spherical light conversion plate.
实施例7：分别称取0.5kg YAG:Ce3+、0.5kg YAG:Tb3+、0.1Sr2Si5N8:Eu荧光粉(粒径为70-100μm)和20kg聚碳酸酯原料(粒径为300-2000μm)，将荧光粉和聚碳酸酯混合均匀后加入挤出机内，设定挤出机温度为250℃，使荧光粉和聚碳酸酯原料混合物均匀挤出，然后将挤出的混合物经过模压处理，即可制成球面型转光板。Example 7: Weigh 0.5kg YAG:Ce 3+ , 0.5kg YAG:Tb 3+ , 0.1Sr 2 Si 5 N 8 :Eu phosphor (particle size 70-100μm) and 20kg polycarbonate raw material (particle The diameter is 300-2000μm), mix the phosphor powder and polycarbonate evenly, and then put it into the extruder, set the temperature of the extruder to 250°C, so that the phosphor powder and polycarbonate raw material mixture can be uniformly extruded, and then extruded The mixture can be made into a spherical light conversion plate after molding.
实施例8：分别称取1kg YAG:Tb3+、0.05Sr2Si5N8:Eu、0.03Ca(Mo，W)O4:Eu，Sm荧光粉(粒径为60-80μm)和15kg亚克力原料(粒径为1000-4000μm)，将荧光粉和亚克力混合均匀后加入挤出机内，设定挤出机温度为180℃，使荧光粉和亚克力原料混合物均匀挤出，然后将挤出的混合物经过注射成型处理，即可制成球面型转光板。Example 8: Weigh 1kg of YAG:Tb 3+ , 0.05Sr 2 Si 5 N 8 :Eu, 0.03Ca(Mo,W)O 4 :Eu, Sm phosphor (60-80μm in particle size) and 15kg of acrylic Raw material (particle size is 1000-4000μm), mix the fluorescent powder and acrylic evenly and add it into the extruder, set the temperature of the extruder to 180°C to make the mixture of fluorescent powder and acrylic raw material uniformly extruded, and then extruded The mixture can be processed into a spherical light conversion plate through injection molding.
实施例9：分别称取0.1kg YAG:Ce3+、1kg YAG:Tb3+、0.03Ca(Mo，W)O4:Eu，Sm、0.05Sr2Si5N8:Eu、0.01(Ca，Sr)AlSiN3:Eu荧光粉(粒径为90-100μm)和20kg涤纶树脂原料(粒径为4000-5000μm)，将荧光粉和涤纶树脂混合均匀后加入挤出机内，设定挤出机温度为300℃，使荧光粉和涤纶树脂原料混合物均匀挤出，然后将挤出的混合物经过冷却滚处理，即可制成平面型转光板。Example 9: Weigh 0.1kg YAG:Ce 3+ , 1kg YAG:Tb 3+ , 0.03Ca(Mo, W)O 4 :Eu, Sm, 0.05Sr 2 Si 5 N 8 :Eu, 0.01(Ca, Sr)AlSiN 3 :Eu phosphor (90-100μm in particle size) and 20kg polyester resin raw material (4000-5000μm in particle size), mix the phosphor and polyester resin evenly and put them into the extruder, set the extruder The temperature is 300°C, so that the raw material mixture of phosphor powder and polyester resin is uniformly extruded, and then the extruded mixture is cooled and rolled to make a flat light conversion plate.
实施例10：分别称取1kg YAG:Tb3+、荧光粉(粒径为10-20μm)和10kg聚丙烯原料(粒径为100-500μm)，将二者混合均匀后加入挤出机内，设定挤出机温度为200℃，使荧光粉和聚丙烯原料混合物均匀挤出，然后将挤出的混合物经过模压处理，即可制成球面型转光板。Example 10: Weigh 1 kg of YAG:Tb 3+ , fluorescent powder (with a particle size of 10-20 μm) and 10 kg of polypropylene raw material (with a particle size of 100-500 μm), mix them uniformly and add them to the extruder, Set the temperature of the extruder to 200°C to uniformly extrude the mixture of phosphor powder and polypropylene raw materials, and then mold the extruded mixture to make a spherical light conversion plate.
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| CN200910264566A CN101737723B (en) | 2009-12-28 | 2009-12-28 | LED light conversion plate and manufacturing method thereof |
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