CN108384212A - A kind of novel heat-conducting plastics and its application - Google Patents
A kind of novel heat-conducting plastics and its application Download PDFInfo
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- CN108384212A CN108384212A CN201810122174.3A CN201810122174A CN108384212A CN 108384212 A CN108384212 A CN 108384212A CN 201810122174 A CN201810122174 A CN 201810122174A CN 108384212 A CN108384212 A CN 108384212A
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- cement
- heat
- conducting
- resin
- plastics
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- Pending
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- 239000004033 plastic Substances 0.000 title claims abstract description 40
- 229920003023 plastic Polymers 0.000 title claims abstract description 40
- 239000004568 cement Substances 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000011398 Portland cement Substances 0.000 claims description 12
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 11
- -1 polybutylene terephthalate Polymers 0.000 claims description 10
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004425 Makrolon Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000011401 Portland-fly ash cement Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000000071 blow moulding Methods 0.000 claims description 2
- 238000000748 compression moulding Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000010137 moulding (plastic) Methods 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 238000005453 pelletization Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000010883 coal ash Substances 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of novel heat-conducting plastics and its application, the heat-conducting plastic is by resin and cement composition, and their mass percentage content is respectively:Resin 8~80%, cement 20~92%.High heat conduction plastics disclosed in this invention, production cost is low, and heat conduction and good insulation preformance can be used for the fields such as LED illumination, automobile, electronic apparatus.
Description
Technical field
The invention belongs to new material technology fields, and in particular to a kind of novel heat-conducting plastics and its application.
Background technology
LED has that energy conservation and environmental protection, small, light emission color temperature is friendly, long lifespan etc. as a kind of novel energy-conserving light source product
Advantage is widely applied in the every field for producing and living.The work temperature in the light extraction efficiency of LED and service life and chip
There is degree direct relationship, the electric light transformation efficiency of white LED light source to be generally 30% or so, and 70% energy is converted into thermal energy,
These thermal energy generate huge side effect to LED, if cannot effectively radiate, LED internal temperatures can be made to increase, lead to LED's
Luminous efficiency reduces, and directly affects the service life of LED chip, therefore heat dissipation is great power LED key application place.No matter LED cores
Piece encapsulation or Design of Luminaires application, generally require to discharge heat caused by LED by Heat Conduction Material, for heat dissipation
Cost alsies occupy the proportion of system cost about 20%~30%, seeks the heat dissipation solution of high performance-price ratio and also become always to chase after
The target asked.Due to plastics design freedom is high, easily molded processing, light weight and it is at low cost etc. the advantages of, people will
In plastic applications to the lamps and lanterns manufacture of LED industry, however the thermal coefficient very little of most of plastics, influence their application.It carries
The approach of high plastics thermal conductivity:First, the synthetic material inherently resin matrix with high thermal conductivity, such as has and well leads
Polyaniline, polypyrrole of hot property etc., but such material there is a problem of it is expensive;Second is that using having high heat conduction filler to fill out
Plastics are filled to realize, the filler of generally use has metal powder filler such as aluminium powder, copper powder and silver powder etc., and metal oxide filler is such as
Aluminium oxide, bismuth oxide, beryllium oxide, magnesia and zinc oxide etc., inorganic non-metallic filler for example graphite, silicon carbide, glass fibre and
Ceramics etc., such as with the carbon fiber of high length-diameter ratio and boron nitride cooperation using metal, metal oxide as filler, product obtained
Thermal coefficient is 20W/mK (ZL99815810.0);Or using insulating packings such as metal oxide, silicon carbide as filler, it is made
The thermal coefficient of product (ZL200510101700.0) between 2~4 W/mK.
Currently, most of heat-conducting plastic heat conductivility is not high enough, mechanical performance is unstable or heat conductivility is still but steady
It is qualitative bad, it is on the high side the problems such as still annoying LED illumination manufacturing enterprise.It is grown rapidly as LED illuminates application, and
Move towards consuming public, the requirements such as the automation size production of lamps and lanterns product, cost control, safety, lightweight also increasingly carry
The market demand of height, heat-conducting plastic also increases year by year.Therefore, seek what a kind of low production cost, heat conduction and insulation performance were done
Novel heat-conducting plastics have prodigious commercial value.
Invention content
In view of the problems of the existing technology, low it is an object of the invention to design a kind of production cost of offer, while energy
Take into account heat conduction and the novel heat-conducting plastics of insulation performance and its technical solution of application.
A kind of novel heat-conducting plastics, it is characterised in that the heat-conducting plastic is by resin and cement composition, the tree
The mass percentage content of fat and cement is:Resin 8~80%, cement 20~92%.
The resin is polyamide(PA), makrolon(PC), polybutylene terephthalate (PBT)(PBT), it is poly- to benzene
Naphthalate(PET), polyformaldehyde(POM), polyphenylene oxide(PPO), acrylonitrile-butadiene-styrene (ABS)(ABS), polypropylene
(PP), polyphenylene sulfide(PPS), polysulfones(PSF), polyethylene(PE), polymethyl methacrylate(PMMA), polytetrafluoroethylene (PTFE)
(PTFE)In one kind or arbitrary several mixture.
A kind of novel heat-conducting plastics, it is characterised in that the cement is portland cement, slag silicate brine
One kind in mud, Portland pozzolana cement, Portland fly ash cement, composite Portland cement or arbitrary several mixing
Object.
A kind of novel heat-conducting plastics, it is characterised in that the heat-conducting plastic moulding process is injection moulding, squeezes
Go out molding, compression moulding, blow molding or cast molding.
A kind of novel heat-conducting plastics, it is characterised in that the thermal conductivity of the heat-conducting plastic is 1~3 W/mK.
A kind of application of the novel heat-conducting plastics as Heat Conduction Material.
It is compared with existing technology, the invention has the advantages that:High heat conduction plastics disclosed in this invention, production
It is at low cost, while preferable heat conduction and insulation performance can be taken into account, it can be used for the fields such as LED illumination, automobile, electronic apparatus.
Specific implementation mode
With reference to specific embodiment, the present invention will be further described.
Embodiment 1
Content calculation by mass percentage takes resin [makrolon(PC)20% and polyamide(PA66)18%] totally 38% and cement
(Portland cement 45% and portland slag cement 17%)It totally 62% is placed in mixing and blending machine after mixing, is squeezed by twin-screw
Go out machine extruding pelletization to get to the present invention a kind of high heat conduction plastic product.After gained heat-conducting plastic is melted and molded, heat conduction is used
The thermal coefficient of coefficient tester determination sample is 1.3 W/mK.
Embodiment 2
Content calculation by mass percentage takes resin [polyamide(PA6)16% and polybutylene terephthalate (PBT)(PBT)11%]
Totally 27% and cement(Portland pozzolana cement 52%, Portland fly ash cement 21%)Totally 73% be placed in high-speed mixer mix
Close uniformly after, by double screw extruder extruding pelletization to get to the present invention a kind of high heat conduction plastic product.Gained heat conduction is moulded
It is 1.1 W/mK with the thermal coefficient of heat conduction coefficient tester determination sample after material is melted and molded.
Embodiment 3
Content calculation by mass percentage takes acrylonitrile-butadiene-styrene (ABS)(ABS)19% and cement(Portland cement)81%
It is placed in high-speed mixer after mixing, is moulded to get to a kind of high heat conduction of the present invention by double screw extruder extruding pelletization
Expect product.It is 1.6 W/m with the thermal coefficient of heat conduction coefficient tester determination sample after gained heat-conducting plastic is melted and molded
K。
Embodiment 4
Content calculation by mass percentage takes resin [polypropylene(PP)20% and polyamide(PA6)10%] totally 30% and cement(Powder
Coal ash portland cement 55%, composite Portland cement 15%)It totally 70% is placed in high-speed mixer after mixing, by twin-screw
Extruder extruding pelletization to get to the present invention a kind of high heat conduction plastic product.After gained heat-conducting plastic is melted and molded, with leading
The thermal coefficient of hot coefficient tester determination sample is 1.3 W/mK.
Embodiment 5
Content calculation by mass percentage takes polyamide(PA6)35% and cement(Portland cement 43%, fly ash silicate water
Mud 22%)Totally 65% be placed in high-speed mixer after mixing, by double screw extruder extruding pelletization to get to the present invention one
Kind high heat conduction plastic product.After gained heat-conducting plastic is melted and molded, with the thermal coefficient of heat conduction coefficient tester determination sample
For 1.1 W/mK.
Embodiment 6
Content calculation by mass percentage takes resin [polypropylene(PP)20% and polybutylene terephthalate (PBT)(PBT)7%] altogether
27% and cement(Portland cement 42%, composite Portland cement 21%)Totally 73% be placed in high-speed mixer after mixing, by
Double screw extruder extruding pelletization to get to the present invention a kind of high heat conduction plastic product.Gained heat-conducting plastic is melted and molded
Afterwards, it is 1.6 W/mK with the thermal coefficient of heat conduction coefficient tester determination sample.
Claims (5)
1. a kind of novel heat-conducting plastics, it is characterised in that the heat-conducting plastic is by resin and cement composition, the resin and cement
Mass percentage content be:Resin 8~80%, cement 20~92%;
The resin is polyamide, makrolon, polybutylene terephthalate (PBT), polyethylene terephthalate, gathers
Formaldehyde, polyphenylene oxide, acrylonitrile-butadiene-styrene (ABS), polypropylene, polyphenylene sulfide, polysulfones, polyethylene, poly-methyl methacrylate
One kind in ester, polytetrafluoroethylene (PTFE) or arbitrary several mixture.
2. a kind of novel heat-conducting plastics as described in claim 1, it is characterised in that the cement is portland cement, slag
One kind or arbitrary several in portland cement, Portland pozzolana cement, Portland fly ash cement, composite Portland cement
The mixture of kind.
3. a kind of novel heat-conducting plastics as described in claim 1, it is characterised in that the heat-conducting plastic moulding process is note
Penetrate molding, extrusion molding, compression moulding, blow molding or cast molding.
4. a kind of novel heat-conducting plastics as described in claim 1, it is characterised in that the thermal conductivity of the heat-conducting plastic is 1~
3 W/m·K。
5. a kind of application of the novel heat-conducting plastics as described in claim 1 as Heat Conduction Material.
Priority Applications (1)
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CN201810122174.3A CN108384212A (en) | 2018-02-07 | 2018-02-07 | A kind of novel heat-conducting plastics and its application |
Applications Claiming Priority (1)
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CN201810122174.3A CN108384212A (en) | 2018-02-07 | 2018-02-07 | A kind of novel heat-conducting plastics and its application |
Publications (1)
Publication Number | Publication Date |
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CN108384212A true CN108384212A (en) | 2018-08-10 |
Family
ID=63075430
Family Applications (1)
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CN201810122174.3A Pending CN108384212A (en) | 2018-02-07 | 2018-02-07 | A kind of novel heat-conducting plastics and its application |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111286184A (en) * | 2020-03-24 | 2020-06-16 | 上海锦湖日丽塑料有限公司 | PC/ABS alloy resistant to damp-heat aging and preparation method thereof |
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CN101405236A (en) * | 2006-03-22 | 2009-04-08 | 诺瓦化学公司 | Lightweight concrete compositions |
CN104403311A (en) * | 2014-12-24 | 2015-03-11 | 江阴济化新材料有限公司 | Heat conducting nylon material and preparation method thereof |
CN107011646A (en) * | 2017-04-25 | 2017-08-04 | 柳州市够旺贸易有限公司 | Polycarbonate engineering plastic |
-
2018
- 2018-02-07 CN CN201810122174.3A patent/CN108384212A/en active Pending
Patent Citations (4)
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---|---|---|---|---|
CN101405236A (en) * | 2006-03-22 | 2009-04-08 | 诺瓦化学公司 | Lightweight concrete compositions |
CN101186748A (en) * | 2006-11-15 | 2008-05-28 | 东丽纤维研究所(中国)有限公司 | Nano composite material of polyester and inorganic silicate, and preparation method thereof |
CN104403311A (en) * | 2014-12-24 | 2015-03-11 | 江阴济化新材料有限公司 | Heat conducting nylon material and preparation method thereof |
CN107011646A (en) * | 2017-04-25 | 2017-08-04 | 柳州市够旺贸易有限公司 | Polycarbonate engineering plastic |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111286184A (en) * | 2020-03-24 | 2020-06-16 | 上海锦湖日丽塑料有限公司 | PC/ABS alloy resistant to damp-heat aging and preparation method thereof |
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