CN101448862B - 感光性树脂及感光性树脂组合物 - Google Patents
感光性树脂及感光性树脂组合物 Download PDFInfo
- Publication number
- CN101448862B CN101448862B CN2006800548081A CN200680054808A CN101448862B CN 101448862 B CN101448862 B CN 101448862B CN 2006800548081 A CN2006800548081 A CN 2006800548081A CN 200680054808 A CN200680054808 A CN 200680054808A CN 101448862 B CN101448862 B CN 101448862B
- Authority
- CN
- China
- Prior art keywords
- photosensitive resin
- acrylate
- meth
- mol
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/14—Esterification
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/12—Polymers provided for in subclasses C08C or C08F
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/144—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 比较例1 | 比较例2 | |
耐热性 | -1.0 | -0.5 | -1.2 | -0.7 | -4.2 | -5.1 |
粘合性 | ○ | ○ | ○ | ○ | × | × |
碱显影性 | ○ | ○ | ○ | ○ | ○ | ○ |
实施例5 | 实施例6 | 实施例7 | 实施例8 | 比较例3 | 比较例4 | |
耐热性 | -0.9 | -0.4 | -1.0 | -0.6 | -3.2 | -4.2 |
粘合性 | ○ | ○ | ○ | ○ | × | × |
碱显影性 | ○ | ○ | ○ | ○ | ○ | ○ |
Claims (5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/311076 WO2007141829A1 (ja) | 2006-06-02 | 2006-06-02 | 感光性樹脂および感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101448862A CN101448862A (zh) | 2009-06-03 |
CN101448862B true CN101448862B (zh) | 2011-12-14 |
Family
ID=38801102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800548081A Active CN101448862B (zh) | 2006-06-02 | 2006-06-02 | 感光性树脂及感光性树脂组合物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5060474B2 (zh) |
KR (1) | KR101269756B1 (zh) |
CN (1) | CN101448862B (zh) |
WO (1) | WO2007141829A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105669892A (zh) * | 2016-03-17 | 2016-06-15 | 上海昭和高分子有限公司 | 一种溶剂型共聚树脂及其组合物 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101495533B1 (ko) * | 2010-12-21 | 2015-02-25 | 동우 화인켐 주식회사 | 스페이서 형성용 감광성 수지 조성물, 이를 이용하여 제조된 표시 장치용 스페이서 및 이를 포함하는 표시 장치 |
CN105061671A (zh) * | 2015-07-30 | 2015-11-18 | 新东方油墨有限公司 | 一种led用液态感光阻焊树脂及其制备方法 |
JP6871909B2 (ja) * | 2016-03-09 | 2021-05-19 | 株式会社カネカ | 制震材および衝撃吸収材 |
CN106905151B (zh) * | 2017-03-24 | 2020-04-03 | 惠州市华泓新材料有限公司 | 一种改性松香树脂、制备方法及采用该改性松香树脂的油墨 |
CN107459608B (zh) * | 2017-09-14 | 2020-03-24 | 中国林业科学研究院林产化学工业研究所 | 一种丙烯酸松香基高分子表面活性剂及其制备方法和用途 |
JP7171404B2 (ja) * | 2017-12-22 | 2022-11-15 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
JP7338226B2 (ja) * | 2018-05-07 | 2023-09-05 | 荒川化学工業株式会社 | 樹脂、ワニス組成物、印刷インキ及び印刷物 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1040602A (zh) * | 1988-08-25 | 1990-03-21 | 无锡市化工研究设计院 | 一种光固化抗蚀印料的制备方法 |
CN1044666A (zh) * | 1989-02-01 | 1990-08-15 | 北京大学 | 光固化组合物及其制备方法和用途 |
JP2000212232A (ja) * | 1999-01-27 | 2000-08-02 | Arakawa Chem Ind Co Ltd | 活性エネルギ―線硬化性樹脂組成物および剥離帳票シ―ト用コ―ティング剤 |
JP2001089533A (ja) * | 1999-09-24 | 2001-04-03 | Showa Highpolymer Co Ltd | 感光性樹脂 |
CN1425729A (zh) * | 2002-12-30 | 2003-06-25 | 中国科学院广州化学研究所 | 丙烯海松酸二缩水甘油酯及其环氧树脂和它们的制法 |
CN1653610A (zh) * | 2002-04-02 | 2005-08-10 | 3M创新有限公司 | 具有导电和导热性能的热固性粘合片 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59170165A (ja) * | 1983-03-17 | 1984-09-26 | Nippon Shokubai Kagaku Kogyo Co Ltd | 紫外線硬化型組成物 |
JP3183726B2 (ja) * | 1992-09-17 | 2001-07-09 | 積水化学工業株式会社 | 光反応性組成物及び透明積層体の製造方法 |
JP3363211B2 (ja) * | 1993-08-06 | 2003-01-08 | 東京応化工業株式会社 | 感光性樹脂組成物およびその製造方法 |
JPH08160616A (ja) * | 1994-12-12 | 1996-06-21 | Toagosei Co Ltd | レジスト用樹脂組成物の製造方法 |
JPH09278842A (ja) * | 1996-04-17 | 1997-10-28 | Daicel Chem Ind Ltd | 硬化性樹脂組成物 |
JP3634141B2 (ja) * | 1998-03-02 | 2005-03-30 | 太陽インキ製造株式会社 | 感光性組成物及びそれを用いて得られる焼成物パターン |
-
2006
- 2006-06-02 CN CN2006800548081A patent/CN101448862B/zh active Active
- 2006-06-02 JP JP2008520070A patent/JP5060474B2/ja active Active
- 2006-06-02 WO PCT/JP2006/311076 patent/WO2007141829A1/ja active Application Filing
-
2008
- 2008-11-25 KR KR1020087028846A patent/KR101269756B1/ko active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1040602A (zh) * | 1988-08-25 | 1990-03-21 | 无锡市化工研究设计院 | 一种光固化抗蚀印料的制备方法 |
CN1044666A (zh) * | 1989-02-01 | 1990-08-15 | 北京大学 | 光固化组合物及其制备方法和用途 |
JP2000212232A (ja) * | 1999-01-27 | 2000-08-02 | Arakawa Chem Ind Co Ltd | 活性エネルギ―線硬化性樹脂組成物および剥離帳票シ―ト用コ―ティング剤 |
JP2001089533A (ja) * | 1999-09-24 | 2001-04-03 | Showa Highpolymer Co Ltd | 感光性樹脂 |
CN1653610A (zh) * | 2002-04-02 | 2005-08-10 | 3M创新有限公司 | 具有导电和导热性能的热固性粘合片 |
CN1425729A (zh) * | 2002-12-30 | 2003-06-25 | 中国科学院广州化学研究所 | 丙烯海松酸二缩水甘油酯及其环氧树脂和它们的制法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105669892A (zh) * | 2016-03-17 | 2016-06-15 | 上海昭和高分子有限公司 | 一种溶剂型共聚树脂及其组合物 |
CN105669892B (zh) * | 2016-03-17 | 2019-07-26 | 上海昭和高分子有限公司 | 一种溶剂型共聚树脂及其组合物 |
Also Published As
Publication number | Publication date |
---|---|
CN101448862A (zh) | 2009-06-03 |
JPWO2007141829A1 (ja) | 2009-10-15 |
WO2007141829A1 (ja) | 2007-12-13 |
KR20090013806A (ko) | 2009-02-05 |
JP5060474B2 (ja) | 2012-10-31 |
KR101269756B1 (ko) | 2013-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101448862B (zh) | 感光性树脂及感光性树脂组合物 | |
CN101663335B (zh) | 光和/或热固化性共聚物、固化性树脂组合物以及固化物 | |
CN101517486B (zh) | 感光性树脂组合物 | |
US20070112106A1 (en) | Photosensitive resin composition | |
JP4806611B2 (ja) | 感光性樹脂組成物 | |
JP2008088394A (ja) | アルカリ現像可能な感光性樹脂及びそれを含む感光性樹脂組成物 | |
JP4030025B2 (ja) | 光硬化性液状ソルダーレジスト用インキ組成物 | |
JP2008143941A (ja) | 感光性樹脂及びそれを含む感光性樹脂組成物 | |
JP4924241B2 (ja) | 感光性樹脂組成物及びこれを用いた感光性エレメント | |
JP2004067814A (ja) | ポリカルボン酸樹脂およびポリカルボン酸樹脂組成物、ならびにその硬化物 | |
JP3659639B2 (ja) | ビニルエステル樹脂およびビニルエステル樹脂組成物、ならびにその硬化物 | |
WO1996008525A1 (fr) | Procede de production de resine photosensible et composition liquide de resine photosensible | |
JP4469481B2 (ja) | 感光性樹脂組成物 | |
JP4682340B2 (ja) | 感光性樹脂の製造方法 | |
JP5385729B2 (ja) | 感光性樹脂 | |
JPH10142797A (ja) | 耐熱性光選択熱硬化塗料 | |
JP2011093970A (ja) | 感光性樹脂 | |
JP2000256428A (ja) | 硬化性樹脂及びその組成物 | |
JP2011099034A (ja) | ポリカルボン酸樹脂及びポリカルボン酸樹脂組成物 | |
JP3559615B2 (ja) | カーボンブラック、樹脂組成物およびブラックマトリックス | |
JPH09278843A (ja) | 硬化性樹脂組成物 | |
TW202428664A (zh) | 感光性樹脂組成物、樹脂硬化膜及畫像顯示裝置 | |
JPH07286032A (ja) | 導体ペースト組成物及びその硬化物 | |
CN113150244A (zh) | 一种磺酸盐型环氧丙烯酸酯树脂及其制备方法和应用 | |
CN115685679A (zh) | 固化性树脂组合物、图案和图像显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHOWA DENKO K.K. Free format text: FORMER OWNER: SHOWA HIGHPOLYMER CO., LTD. Effective date: 20110902 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20110902 Address after: Tokyo, Japan Applicant after: SHOWA DENKO Kabushiki Kaisha Address before: Tokyo, Japan Applicant before: SHOWA HIGHPOLYMER Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo Patentee before: Showa electrical materials Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20230620 Address after: Tokyo Patentee after: Showa electrical materials Co.,Ltd. Address before: Tokyo Patentee before: SHOWA DENKO Kabushiki Kaisha |
|
TR01 | Transfer of patent right |