CN100462485C - Composite brightener for alkaline electroless nickel plating and its application method - Google Patents
Composite brightener for alkaline electroless nickel plating and its application method Download PDFInfo
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- 238000007747 plating Methods 0.000 title claims abstract description 73
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 32
- 239000002131 composite material Substances 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000005554 pickling Methods 0.000 claims abstract description 3
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 18
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 14
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical group C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 10
- 238000005282 brightening Methods 0.000 claims description 9
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 7
- JHUFGBSGINLPOW-UHFFFAOYSA-N 3-chloro-4-(trifluoromethoxy)benzoyl cyanide Chemical compound FC(F)(F)OC1=CC=C(C(=O)C#N)C=C1Cl JHUFGBSGINLPOW-UHFFFAOYSA-N 0.000 claims description 6
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 2
- -1 and wherein Chemical compound 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 9
- 239000003513 alkali Substances 0.000 claims 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 3
- 229910052708 sodium Inorganic materials 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical compound CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 claims 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 2
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- RWDJJOUSDATHMI-UHFFFAOYSA-N benzenesulfinic acid;sodium Chemical compound [Na].OS(=O)C1=CC=CC=C1 RWDJJOUSDATHMI-UHFFFAOYSA-N 0.000 claims 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 claims 1
- SRJQTHAZUNRMPR-UYQKXTDMSA-N spinosyn A Chemical compound O([C@H]1CCC[C@@H](OC(=O)C[C@H]2[C@@H]3C=C[C@@H]4C[C@H](C[C@H]4[C@@H]3C=C2C(=O)[C@@H]1C)O[C@H]1[C@@H]([C@H](OC)[C@@H](OC)[C@H](C)O1)OC)CC)[C@H]1CC[C@H](N(C)C)[C@@H](C)O1 SRJQTHAZUNRMPR-UYQKXTDMSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 29
- 238000000576 coating method Methods 0.000 abstract description 29
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 4
- 238000000354 decomposition reaction Methods 0.000 abstract description 3
- 238000005238 degreasing Methods 0.000 abstract description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 7
- 229940081974 saccharin Drugs 0.000 description 7
- 235000019204 saccharin Nutrition 0.000 description 7
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- CHLCPTJLUJHDBO-UHFFFAOYSA-M sodium;benzenesulfinate Chemical compound [Na+].[O-]S(=O)C1=CC=CC=C1 CHLCPTJLUJHDBO-UHFFFAOYSA-M 0.000 description 5
- LDHXNOAOCJXPAH-UHFFFAOYSA-M sodium;prop-2-yne-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC#C LDHXNOAOCJXPAH-UHFFFAOYSA-M 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910001096 P alloy Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical group [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241001085205 Prenanthella exigua Species 0.000 description 1
- 102100038239 Protein Churchill Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
本发明公开了一种碱性化学镀镍复合光亮剂及其使用方法。它是以1升计,它是由初级光亮剂含量为10-20g、次级光亮剂含量为25-50g和辅助光亮剂含量为30-52g,其余为水所组成的复合光亮剂。使用方法是将复合光亮剂缓慢加入化学镀液中,并用体积百分比5%-10%的稀氨水溶液调节pH值至8.0-11.0;施镀温度为40-80℃;将经过除油、酸洗、活化处理的零件浸入镀液中10-150min,即可在零件表面获得光亮的镀镍层。本发明不仅能显著提高镀层的光亮性,而且有助于降低镀层孔隙率;出光快,分散能力好,能提高镀液稳定性,延长镀液寿命,光亮剂分解产物不影响镀液成分和镀件质量;镀层致密,表面应力低,韧性好。The invention discloses an alkaline electroless nickel plating composite brightener and a using method thereof. It is based on 1 liter, and it is a composite brightener composed of primary brightener content of 10-20g, secondary brightener content of 25-50g and auxiliary brightener content of 30-52g, and the rest is water. The method of use is to slowly add the composite brightener to the chemical plating solution, and adjust the pH value to 8.0-11.0 with a 5%-10% volume percentage of dilute ammonia solution; the plating temperature is 40-80°C; after degreasing and pickling 1. After immersing the activated parts in the plating solution for 10-150 minutes, a bright nickel plating layer can be obtained on the surface of the parts. The invention can not only significantly improve the brightness of the plating layer, but also help reduce the porosity of the plating layer; the light output is fast, the dispersion ability is good, the stability of the plating solution can be improved, and the service life of the plating solution can be improved. The decomposition products of the brightener do not affect the composition of the plating solution and the The quality of the parts; the coating is dense, the surface stress is low, and the toughness is good.
Description
技术领域 technical field
本发明涉及金属材料表面化学处理的技术领域,尤其涉及一种碱性化学镀镍复合光亮剂及其使用方法。The invention relates to the technical field of chemical surface treatment of metal materials, in particular to an alkaline electroless nickel plating composite brightener and a use method thereof.
背景技术 Background technique
化学镀镍-磷合金作为一种新型的优良工程材料,成为国内外科研单位、生产企业研究开发的重点。它是利用氧化—还原反应在催化比表面沉积一层合金镀层的一种新兴的表面处理技术,所得的化学镀镍磷合金镀层具有良好的耐蚀性和耐磨性、镀层厚度均匀、硬度高、且仿行性好,因而广泛应用于化工机械、宇宙航空等领域。Electroless nickel-phosphorus alloy, as a new type of excellent engineering material, has become the focus of research and development by domestic and foreign scientific research institutes and production enterprises. It is an emerging surface treatment technology that uses oxidation-reduction reaction to deposit a layer of alloy coating on the catalytic surface. The obtained electroless nickel-phosphorus alloy coating has good corrosion resistance and wear resistance, uniform coating thickness and high hardness. , and good imitation, and thus widely used in chemical machinery, aerospace and other fields.
长期以来,化学镀镍工艺,特别是国内生产工艺,主要采用高温无光亮的酸性Ni-P合金工艺,虽然它的沉积速度较快,耐腐蚀性较好,但需高温(90℃以上)才能施镀,能耗高,镀层光亮性差,同时镀液稳定性差,溶液自分解严重,溶液的重新补充及再生没得到完全解决,许多厂家只能采取一次性镀。从碱性化学镀镍液得到的镀层中磷含量比酸性镀液要低,光泽度仍然比较差,镀层孔隙率比较大,因而耐蚀性较差,但溶液比较稳定,操作方便,启镀温度较低,有的工艺在室温下即可进行。为了解决碱性化学镀镍镀层光亮性差的问题,扩大碱性化学镀镍工艺在工业上的应用范围,研究一种适用于碱性化学镀镍的光亮剂是十分必要的。由于化学镀镀液成分复杂,影响因素多,而在碱性化学镀液中pH值较高,所以开发碱性化学镀镍光亮剂必须充分考虑光亮剂中各组分与镀液中各种离子的相互作用以及高的pH值的影响,才能充分发挥碱性化学镀镍的优点和光亮剂的作用效果。For a long time, the electroless nickel plating process, especially the domestic production process, mainly adopts the acidic Ni-P alloy process with high temperature and dullness. Although its deposition speed is fast and its corrosion resistance is good, it needs high temperature (above 90°C) to Plating requires high energy consumption, poor coating brightness, poor stability of the plating solution, severe self-decomposition of the solution, and incomplete solution of replenishment and regeneration of the solution. Many manufacturers can only adopt one-time plating. The phosphorus content in the coating obtained from the alkaline electroless nickel plating solution is lower than that of the acid plating solution, the gloss is still relatively poor, and the coating porosity is relatively large, so the corrosion resistance is poor, but the solution is relatively stable and easy to operate. Low, some processes can be carried out at room temperature. In order to solve the problem of poor brightness of alkaline electroless nickel plating and expand the industrial application range of alkaline electroless nickel plating, it is very necessary to study a brightener suitable for alkaline electroless nickel plating. Due to the complex composition of the electroless plating bath, there are many influencing factors, and the pH value in the alkaline electroless plating bath is relatively high, so the development of the brightener for alkaline electroless nickel plating must fully consider the various components in the brightener and the various ions in the plating bath. In order to give full play to the advantages of alkaline electroless nickel plating and the effect of brightener, the interaction of the interaction and the influence of high pH value.
发明内容 Contents of the invention
本发明的目的是提供一种光亮性和整平性好、出光速度快且对镀液成分和镀件质量没有危害的碱性化学镀镍复合光亮剂及其使用方法。The object of the present invention is to provide an alkaline electroless nickel plating composite brightener with good brightness and leveling property, fast light output speed and no harm to plating solution components and plated parts quality and its application method.
碱性化学镀镍复合光亮剂以1升计,它是由初级光亮剂含量为10-20g,、次级光亮剂含量为25-50g和辅助光亮剂含量为30-52g,其余为水所组成的复合光亮剂;初级光亮剂为糖精,其含量为10-20g,初级光亮剂由糖精和苯亚磺酸钠组成,其中,糖精含量为5-15g,苯亚磺酸钠含量为5-15g;次级光亮剂由1,4-丁炔二醇、吡啶和硫脲组成,其中,1,4-丁炔二醇含量为5-10g,吡啶含量为20-40g,硫脲含量为0.5-1g;辅助光亮剂由烯丙基磺酸钠和丙炔磺酸钠组成,其中,烯丙基磺酸钠含量为30-50g,丙炔磺酸钠0.5-2g。Alkaline electroless nickel plating composite brightener is calculated in 1 liter. It is composed of primary brightener content of 10-20g, secondary brightener content of 25-50g and auxiliary brightener content of 30-52g, and the rest is composed of water Composite brightener; the primary brightener is saccharin, its content is 10-20g, the primary brightener is composed of saccharin and sodium benzenesulfinate, wherein, the content of saccharin is 5-15g, and the content of sodium benzenesulfinate is 5-15g ; The secondary brightener consists of 1,4-butynediol, pyridine and thiourea, wherein the content of 1,4-butynediol is 5-10g, the content of pyridine is 20-40g, and the content of thiourea is 0.5- 1g; the auxiliary brightener is composed of sodium allyl sulfonate and sodium propyne sulfonate, wherein the content of sodium allyl sulfonate is 30-50g, and sodium propyne sulfonate is 0.5-2g.
碱性化学镀镍复合光亮剂的使用方法:取2-4ml复合光亮剂缓慢加入1升化学镀镀液中,并用5%-10%的氨水溶液调节pH值至8.0-11.0;施镀温度为40-80℃;将经过除油、酸洗、活化处理的零件浸入镀液中10-150min,即可在零件表面获得光亮的镀镍层。The method of using the composite brightener for alkaline electroless nickel plating: Take 2-4ml composite brightener and slowly add it to 1 liter of electroless plating solution, and adjust the pH value to 8.0-11.0 with 5%-10% ammonia solution; the plating temperature is 40-80°C; Immerse the parts after degreasing, pickling and activation treatment in the plating solution for 10-150 minutes, and a bright nickel plating layer can be obtained on the surface of the parts.
与现有技术相比,本发明有如下优点:Compared with prior art, the present invention has following advantage:
1.不仅能显著提高镀层的光亮性和增加镀层的整平性,而且有助于降低镀层的孔隙率;1. It can not only significantly improve the brightness of the coating and increase the leveling of the coating, but also help reduce the porosity of the coating;
2.出光快,分散能力好,能提高镀液稳定性,延长镀液寿命,光亮剂分解产物不影响镀液成分和镀件质量;2. Fast light emission and good dispersion ability can improve the stability of the plating solution and prolong the service life of the plating solution. The decomposition products of the brightener will not affect the composition of the plating solution and the quality of the plated parts;
3.镀层致密平整,表面应力低、韧性好。3. The coating is dense and flat, with low surface stress and good toughness.
具体实施方式 Detailed ways
本发明采用碱性化学镀镍液为基础配方,添加由几种电镀镍中间体和其它添加剂复配而成的复合光亮剂,所形成的镀层镜面光亮,表面胞状物细小,镀层结合力好,表面孔隙率低。镀液稳定性好。The present invention adopts alkaline electroless nickel plating solution as the basic formula, and adds a composite brightener compounded by several electroplating nickel intermediates and other additives. The formed coating has a bright mirror surface, fine cells on the surface, and good bonding force of the coating. Surface porosity is low. The plating solution has good stability.
本发明的碱性化学镀镍复合光亮剂以1升计,它是由初级光亮剂含量为10-20g,、次级光亮剂含量为25-50g和辅助光亮剂含量为30-52g,其余为水所组成的复合光亮剂。初级光亮剂为糖精(C7H5NO3S),其含量为10-20g,初级光亮剂由糖精和苯亚磺酸钠(C6H5NaO2S)组成,其中,糖精含量为5-10g,苯亚磺酸钠含量为5-10g;次级光亮剂由1,4-丁炔二醇(HOCH2CCCH2OH)、吡啶(C5H5N)和硫脲((NH2)2CS)组成,其中,1,4-丁炔二醇含量为5-10g,吡啶含量为20-40g,硫脲含量为0.5-1g;辅助光亮剂由烯丙基磺酸钠(CH2CHCH2SO3Na)和丙炔磺酸钠(HC=C-CH2-SO3Na)组成,其中,烯丙基磺酸钠含量为30-50g,丙炔磺酸钠含量为0.5-2g。每1升碱性化学镀镍液中缓慢加入2-4ml复合光亮剂,即可得到光亮的化学镀镍层。Alkaline electroless nickel plating composite brightener of the present invention is in 1 liter, and it is 10-20g by primary brightener content, and secondary brightener content is 25-50g and auxiliary brightener content is 30-52g, and all the other are Composite brightener composed of water. The primary brightener is saccharin (C 7 H 5 NO 3 S) with a content of 10-20g. The primary brightener is composed of saccharin and sodium benzenesulfinate (C 6 H 5 NaO 2 S), and the content of saccharin is 5 -10g, the content of sodium benzenesulfinate is 5-10g; the secondary brightener consists of 1,4-butynediol (HOCH 2 CCCH 2 OH), pyridine (C 5 H 5 N) and thiourea ((NH 2 ) 2 CS), wherein the content of 1,4-butynediol is 5-10g, the content of pyridine is 20-40g, and the content of thiourea is 0.5-1g; the auxiliary brightener is sodium allyl sulfonate (CH 2 CHCH 2 SO 3 Na) and sodium propyne sulfonate (HC=C-CH 2 -SO 3 Na), wherein the content of sodium allyl sulfonate is 30-50g, and the content of sodium propyne sulfonate is 0.5-2g . Slowly add 2-4ml composite brightener to every 1 liter of alkaline electroless nickel plating solution to get a bright electroless nickel plating layer.
上述成分中,初级光亮剂的主要作用是使晶粒细化,减少镀层脆性,随添加量的增加,镀层拉应力降低并逐渐转移为压应力;初级光亮剂还能降低镀液对金属杂质敏感性的作用。由化学镀镍的电化学机理可知,镀件上存在阴极区,当初级光亮剂中的糖精和苯亚磺酸钠在镀件阴极区发生吸附,并发生反应,生成少量硫,硫与镍发生共沉积且相互作用,形成化合物,使得沉积层体积膨胀,而基底限制这种膨胀,则在沉积层产生一个压应力分布,抵消了沉积层中部分张应力,使镀层内应力降低。同时,初级光亮剂影响镍离子的沉积,提高镀液的分散能力,因而改变了镀镍层的物理性能,细化了金属结晶和改变了结晶面的取向。Among the above components, the main function of the primary brightener is to refine the grains and reduce the brittleness of the coating. With the increase of the addition amount, the tensile stress of the coating decreases and gradually shifts to compressive stress; the primary brightener can also reduce the sensitivity of the plating solution to metal impurities. Sexuality. According to the electrochemical mechanism of electroless nickel plating, there is a cathode area on the plated parts. When saccharin and sodium benzenesulfinate in the primary brightener are adsorbed in the cathode area of the plated parts, and react to generate a small amount of sulfur, sulfur and nickel will form Co-deposit and interact to form compounds, so that the volume of the deposited layer expands, and the substrate restricts this expansion, generating a compressive stress distribution in the deposited layer, offsetting part of the tensile stress in the deposited layer, and reducing the internal stress of the coating. At the same time, the primary brightener affects the deposition of nickel ions and improves the dispersion ability of the plating solution, thus changing the physical properties of the nickel plating layer, refining the metal crystals and changing the orientation of the crystal plane.
次级光亮剂能使镀层产生明显的光泽,但同时带来镀层的张应力和脆性及对杂质的敏感性,通过与初级光亮剂的合理配合,能产生全光亮的镀层。次级光亮剂中1,4-丁炔二醇能使镀层产生明显的白亮光泽,但整平性较差,通过与辅助光亮剂中的丙炔磺酸钠和烯丙基磺酸钠配合使用,能使整平性大大改善;吡啶本身有较好的光亮和整平性能,但为防止或减少漏镀,加入少量硫脲与之配合;硫脲能防止或减少漏镀,提高对重金属杂质的容忍能力,硫脲兼有稳定剂的作用,在一定范围内使镀液稳定,但超过一定用量,使镀速降低,故在化学镀镍液中用量较少。次级光亮剂通过吸附在催化表面的微阴极区,改变表面状态,使氢气易于析出,有利于结晶细致。The secondary brightener can make the coating produce obvious luster, but at the same time it brings the tensile stress, brittleness and sensitivity to impurities of the coating. Through reasonable cooperation with the primary brightener, a fully bright coating can be produced. The 1,4-butynediol in the secondary brightener can make the coating produce obvious white luster, but the leveling property is poor, and it can be used in conjunction with sodium propyne sulfonate and sodium allyl sulfonate in the auxiliary brightener , can greatly improve the leveling performance; pyridine itself has good brightness and leveling performance, but in order to prevent or reduce missing plating, a small amount of thiourea is added to cooperate with it; thiourea can prevent or reduce missing plating and improve the resistance to heavy metal impurities Tolerance, thiourea also acts as a stabilizer to stabilize the plating solution within a certain range, but if the amount exceeds a certain amount, the plating speed will be reduced, so the amount used in the electroless nickel plating solution is less. The secondary brightener changes the surface state by adsorbing on the micro-cathode area of the catalytic surface, making hydrogen easy to precipitate, which is conducive to fine crystallization.
辅助光亮剂对镀层光亮仅起辅助作用,具有良好的分散作用,对改善镀层的覆盖能力,降低镀液对金属杂质的敏感性有利。The auxiliary brightener only plays an auxiliary role in the brightening of the coating, and has a good dispersion effect, which is beneficial to improving the covering ability of the coating and reducing the sensitivity of the plating solution to metal impurities.
上述光亮剂的使用方法:将按要求配好的光亮剂按规定缓慢加入化学镀液中,并用5%-10%的稀氨水溶液调节pH值至8.0-11.0;加温至40-80℃;将经除油、酸洗、活化的零件浸入镀液中10-150min,即可在零件表面获得镜面光亮的镀镍层。The method of using the above-mentioned brightener: slowly add the prepared brightener into the electroless plating solution according to the regulations, and adjust the pH value to 8.0-11.0 with 5%-10% dilute ammonia solution; heat to 40-80°C; Immerse the degreased, pickled and activated parts in the plating solution for 10-150 minutes, and a mirror-bright nickel layer can be obtained on the surface of the parts.
为配合本发明的实施,采用已经在工业上应用的碱性化学镀镍液为基础镀液,具体配方和施镀条件如下:For coordinating the implementation of the present invention, adopting the alkaline electroless nickel plating solution that has been applied industrially is the basic plating solution, and concrete formula and plating condition are as follows:
六水合硫酸镍(NiSO4·6H2O) 25g/lNickel sulfate hexahydrate (NiSO 4 ·6H 2 O) 25g/l
次亚磷酸钠(NaH2PO2·H2O) 20g/lSodium hypophosphite (NaH 2 PO 2 ·H 2 O) 20g/l
柠檬酸钠(Na3C6H5O7·2H2O) 11g/lSodium citrate (Na 3 C 6 H 5 O 7 2H 2 O) 11g/l
氯化铵(NH4OH) 50g/lAmmonium chloride (NH 4 OH) 50g/l
用5%-10%的稀氨水溶液调节镀液的pH值。Use 5%-10% dilute ammonia solution to adjust the pH value of the plating solution.
按上述配方配制250ml镀液,用30mm×30mm×3mm的45#钢作基体进行试验,样品经除锈、粗磨、细磨、除油、酸洗活化等步骤后,放入镀液中施镀。Prepare 250ml of plating solution according to the above formula, and use 30mm×30mm×3mm 45# steel as the substrate to carry out the test. plating.
根据本发明所述的光亮剂种类和成分范围,分别配制不同成分的本发明化学镀镍复合光亮剂,如下表1所示,加入上述基础镀液中并混合均匀,然后按权利要求书的条件施镀,具体实施例的工艺如表2所示。According to the brightener type and the composition range of the present invention, prepare the electroless nickel plating composite brightener of the present invention of different components respectively, as shown in the following table 1, add in the above-mentioned basic plating solution and mix homogeneously, then according to the conditions of the claims Plating, the technology of specific embodiment is as shown in table 2.
化学镀的镀速用称重法测量,镀层的孔隙率用贴滤纸法测定,腐蚀液成分为铁氰化钾10g/l、氯化钠20g/l,粘贴时间为5min。The plating speed of electroless plating is measured by weighing method, and the porosity of the coating is measured by sticking filter paper. The components of the corrosion solution are potassium ferricyanide 10g/l, sodium chloride 20g/l, and the sticking time is 5min.
表1.不同成分光亮剂配方表Table 1. Formula table of brighteners with different components
表2.各实施例施镀工艺表Table 2. Plating process table of each embodiment
镀后评价镀层光亮度并测试镀速和镀层孔隙率如下表3所示。After plating, evaluate the brightness of the coating and test the plating speed and porosity of the coating as shown in Table 3 below.
表3.各实施例所得镀层性能Table 3. The coating performance of each embodiment gained
由表3可见,加入本发明光亮剂后,试样表面比未加光亮剂时光亮平整,色泽均匀,且能明显减小镀层表面的孔隙率,这对改善镀层的耐腐蚀性能有很大的帮助。As can be seen from Table 3, after adding the brightener of the present invention, the sample surface is brighter and smoother than when no brightener is added, and the color is uniform, and can obviously reduce the porosity of the coating surface, which has a great effect on improving the corrosion resistance of the coating. help.
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JPH0967684A (en) * | 1995-08-25 | 1997-03-11 | Sumitomo Metal Ind Ltd | Pretreatment method for ferrous metal materials for etching |
CN1229148A (en) * | 1998-03-13 | 1999-09-22 | 李兰民 | Titanium-plating technology for aluminium section material |
CN1477236A (en) * | 2003-07-10 | 2004-02-25 | 上海交通大学 | Alkaline solution electroplating zinc-nickel alloy, brass additive components and its preparation method |
CN1718859A (en) * | 2005-07-07 | 2006-01-11 | 浙江大学 | Composite brightener for acidic electroless nickel plating and its application method |
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JPH0967684A (en) * | 1995-08-25 | 1997-03-11 | Sumitomo Metal Ind Ltd | Pretreatment method for ferrous metal materials for etching |
CN1229148A (en) * | 1998-03-13 | 1999-09-22 | 李兰民 | Titanium-plating technology for aluminium section material |
CN1477236A (en) * | 2003-07-10 | 2004-02-25 | 上海交通大学 | Alkaline solution electroplating zinc-nickel alloy, brass additive components and its preparation method |
CN1718859A (en) * | 2005-07-07 | 2006-01-11 | 浙江大学 | Composite brightener for acidic electroless nickel plating and its application method |
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