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BR9908520A - Laminados reforçados com fibra de vidro, placas de circuitos eletrônicos e métodos para montar uma tela - Google Patents

Laminados reforçados com fibra de vidro, placas de circuitos eletrônicos e métodos para montar uma tela

Info

Publication number
BR9908520A
BR9908520A BR9908520-8A BR9908520A BR9908520A BR 9908520 A BR9908520 A BR 9908520A BR 9908520 A BR9908520 A BR 9908520A BR 9908520 A BR9908520 A BR 9908520A
Authority
BR
Brazil
Prior art keywords
screen
yarn
circuit boards
fiberglass
assembling
Prior art date
Application number
BR9908520-8A
Other languages
English (en)
Inventor
Bruce E Novich
Xiang Wu
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of BR9908520A publication Critical patent/BR9908520A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Woven Fabrics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laser Surgery Devices (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

"LAMINADOS REFORçADOS COM FIBRA DE VIDRO, PLACAS DE CIRCUITOS ELETRôNICOS E MéTODOS PARA MONTAR UMA TELA". A presente invenção provê laminados reforçados para placas de circuitos impressos tendo uma tela de reforço tecida de um fio incluindo fibras de vidro E tendo um revestimento que seja compatível com o material de matriz polimérico. O fio tem uma perda por ignição variando de cerca de 0,01 a cerca de 0,6 por cento em peso e uma Força de Arraste de Transporte por Jato de Ar superior a cerca de um grama força por grama massa de fio avaliada usando uma unidade de bico de jato de ar agulheado tendo uma câmara de jato de ar interna tendo um diâmetro de 2 milímetros e um tubo de saída de bico tendo um comprimento de 20 centímetros a uma taxa de alimentação de fio de de cerca de 274 metros por minuto e uma pressão de ar manométrica de cerca de 310 quiloPascals. O laminado tem uma resistência fletora na direção da tela maior que cerca de 3 x 10^ 7^ quilogramas por metro quadrado. O fio pode incluir poliéster e um polímero selecionado do grupo consistindo de polímeros de vinil pirrolidona, polímeros de álcool vinílico, amidos e misturas destes. Alternativamente, o laminado tem um coeficiente de expansão térmica na direção z de menos que cerca de 4,5 por cento a uma temperatura de 288° C.
BR9908520-8A 1998-03-03 1999-02-25 Laminados reforçados com fibra de vidro, placas de circuitos eletrônicos e métodos para montar uma tela BR9908520A (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13
PCT/US1999/004086 WO1999044959A1 (en) 1998-03-03 1999-02-25 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric

Publications (1)

Publication Number Publication Date
BR9908520A true BR9908520A (pt) 2000-10-24

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9908520-8A BR9908520A (pt) 1998-03-03 1999-02-25 Laminados reforçados com fibra de vidro, placas de circuitos eletrônicos e métodos para montar uma tela

Country Status (16)

Country Link
EP (1) EP1060144A1 (pt)
JP (1) JP2002505216A (pt)
KR (1) KR20010041518A (pt)
CN (1) CN1291963A (pt)
AU (1) AU2788999A (pt)
BR (1) BR9908520A (pt)
CA (1) CA2320746A1 (pt)
HU (1) HUP0101382A3 (pt)
ID (1) ID26528A (pt)
IL (1) IL137977A0 (pt)
MX (2) MXPA00008517A (pt)
NO (1) NO20004272L (pt)
PL (1) PL342654A1 (pt)
TR (1) TR200002520T2 (pt)
TW (1) TW436422B (pt)
WO (1) WO1999044959A1 (pt)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA02001090A (es) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Hebras de fbira de vidrio impregnadas y productos que las incluyen.
MXPA01003660A (es) * 1999-07-30 2001-07-01 Torones de fibra de vidrio impregnados y productos que los inclu
MXPA02001093A (es) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Hebras de fibra de vidrio impregnadas y productos que las incluyen.
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068753A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247564A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247491A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
JP5048307B2 (ja) * 2006-11-13 2012-10-17 信越石英株式会社 複合織物及びプリント配線基板
DE102009045892A1 (de) 2009-10-21 2011-04-28 Evonik Degussa Gmbh Folie aus Polyarylenetherketon
KR101890915B1 (ko) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 폴리아릴렌 설파이드계 수지 조성물 및 성형품
CN103788583B (zh) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 一种耐高温抗静电人造合成石及其制造工艺
FR3020361B1 (fr) * 2014-04-28 2016-05-06 Saint Gobain Procede de fabrication de verre mince
CN108349796A (zh) * 2015-11-02 2018-07-31 中央硝子株式会社 电磁屏蔽性金属被覆玻璃纤维填料、电磁屏蔽性金属被覆玻璃纤维填料的制造方法、以及电磁屏蔽性树脂物品
CN105517324B (zh) * 2015-11-30 2018-07-24 卢美珍 印刷电路板的覆金属层基板结构
CN105517322B (zh) * 2015-11-30 2018-08-14 卢美珍 印刷电路板的织物基层覆金属的叠板结构
CN105517323B (zh) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 印刷电路板的负载导体图案的叠层板
CN105517321B (zh) * 2015-11-30 2018-06-19 燕山大学里仁学院 电子元件封装体的覆金属层基板结构
CN105517325B (zh) * 2015-11-30 2018-07-24 卢美珍 印刷电路板的覆金属层叠板结构
CN105517332B (zh) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 一种用于多层压合的粘结片及其制备方法
CN111356723A (zh) * 2017-08-07 2020-06-30 卓尔泰克公司 用于补强塑料的经聚乙烯醇施胶的填料
CN110981223B (zh) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 一种耐高温玻璃纤维及其制备方法

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US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte
JPH0818853B2 (ja) * 1989-11-15 1996-02-28 日東紡績株式会社 ガラスクロスの製造方法
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers

Also Published As

Publication number Publication date
AU2788999A (en) 1999-09-20
ID26528A (id) 2001-01-11
PL342654A1 (en) 2001-07-02
NO20004272D0 (no) 2000-08-25
WO1999044959A1 (en) 1999-09-10
EP1060144A1 (en) 2000-12-20
TW436422B (en) 2001-05-28
HUP0101382A2 (hu) 2001-08-28
IL137977A0 (en) 2001-10-31
MXPA00008517A (es) 2001-03-01
JP2002505216A (ja) 2002-02-19
TR200002520T2 (tr) 2001-01-22
NO20004272L (no) 2000-11-01
CA2320746A1 (en) 1999-09-10
MXPA00008554A (es) 2001-03-01
HUP0101382A3 (en) 2002-10-28
KR20010041518A (ko) 2001-05-25
CN1291963A (zh) 2001-04-18

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1876 DE 19/12/2006.

B15K Others concerning applications: alteration of classification

Free format text: PROCEDIMENTO AUTOMATICO DE RECLASSIFICACAO. AS CLASSIFICACOES IPC ANTERIORES ERAM: C03C 25/02; C08J 5/08; H05K 1/03.

Ipc: C08J 5/08 (2006.01), C03C 25/28 (2018.01), C03C 25

Ipc: C08J 5/08 (2006.01), C03C 25/28 (2018.01), C03C 25