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TR200002520T2 - Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler. - Google Patents

Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler.

Info

Publication number
TR200002520T2
TR200002520T2 TR2000/02520T TR200002520T TR200002520T2 TR 200002520 T2 TR200002520 T2 TR 200002520T2 TR 2000/02520 T TR2000/02520 T TR 2000/02520T TR 200002520 T TR200002520 T TR 200002520T TR 200002520 T2 TR200002520 T2 TR 200002520T2
Authority
TR
Turkey
Prior art keywords
fabric
electronic circuit
circuit boards
inch2
approx
Prior art date
Application number
TR2000/02520T
Other languages
English (en)
Inventor
E. Novich Bruce
Wu Xiang
Original Assignee
Ppg Industries Ohio, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Industries Ohio, Inc. filed Critical Ppg Industries Ohio, Inc.
Publication of TR200002520T2 publication Critical patent/TR200002520T2/tr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Woven Fabrics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laser Surgery Devices (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

Mevcut bulus, polimerik matris malzemesi ile uyumlu olan bir kaplamaya sahip E-cam elyaflar içeren bir ipligin bir güçlendirici dokuma kumasina sahip baskili elektronik devre kartlari için güçlendirilmis laminatlar saglar. Iplik 2 milimetre çapinda bir dahili hava püskürtme bölmesine ve yaklasik 274 metre/dakika (yaklasik 300) yard/dakika) iplik besleme hizinda ve yaklasik 310 kiloPaskal (yaklasik 45 Pound/inç2) ölçüsünde bir hava basincinda 20 santimetre uzunlugguna sahip olan bir supap çikis borusuna sahip bir igne hava püskürtme supap birimi kullanarak ölçülen agirlikça yüzde yaklasik 0.01 ila yaklasik 0.6 araliginda bir yanma kaybina ve yaklasik bir gram kuvvet/gram kütle'den daha büyük bir Hava Püskürtme Tasima Çekme Kuvvetine sahiptir. Laminat kumasin dolum dogrultusunda yaklasik 3x10 üzeri7 kilogram/metre kare'den (yaklasik 42.7 kpsi) daha büyük bir bükülme mukavemetine sahiptir. Alternatif olarak, laminat 288 C sicaklikta z-dogrultusunda yaklasik %4.5 ten daha DEVAMI VAR.
TR2000/02520T 1998-03-03 1999-02-25 Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler. TR200002520T2 (tr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13

Publications (1)

Publication Number Publication Date
TR200002520T2 true TR200002520T2 (tr) 2001-01-22

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2000/02520T TR200002520T2 (tr) 1998-03-03 1999-02-25 Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler.

Country Status (16)

Country Link
EP (1) EP1060144A1 (tr)
JP (1) JP2002505216A (tr)
KR (1) KR20010041518A (tr)
CN (1) CN1291963A (tr)
AU (1) AU2788999A (tr)
BR (1) BR9908520A (tr)
CA (1) CA2320746A1 (tr)
HU (1) HUP0101382A3 (tr)
ID (1) ID26528A (tr)
IL (1) IL137977A0 (tr)
MX (2) MXPA00008517A (tr)
NO (1) NO20004272L (tr)
PL (1) PL342654A1 (tr)
TR (1) TR200002520T2 (tr)
TW (1) TW436422B (tr)
WO (1) WO1999044959A1 (tr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA02001090A (es) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Hebras de fbira de vidrio impregnadas y productos que las incluyen.
MXPA01003660A (es) * 1999-07-30 2001-07-01 Torones de fibra de vidrio impregnados y productos que los inclu
MXPA02001093A (es) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Hebras de fibra de vidrio impregnadas y productos que las incluyen.
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068753A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247564A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247491A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
JP5048307B2 (ja) * 2006-11-13 2012-10-17 信越石英株式会社 複合織物及びプリント配線基板
DE102009045892A1 (de) 2009-10-21 2011-04-28 Evonik Degussa Gmbh Folie aus Polyarylenetherketon
KR101890915B1 (ko) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 폴리아릴렌 설파이드계 수지 조성물 및 성형품
CN103788583B (zh) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 一种耐高温抗静电人造合成石及其制造工艺
FR3020361B1 (fr) * 2014-04-28 2016-05-06 Saint Gobain Procede de fabrication de verre mince
CN108349796A (zh) * 2015-11-02 2018-07-31 中央硝子株式会社 电磁屏蔽性金属被覆玻璃纤维填料、电磁屏蔽性金属被覆玻璃纤维填料的制造方法、以及电磁屏蔽性树脂物品
CN105517324B (zh) * 2015-11-30 2018-07-24 卢美珍 印刷电路板的覆金属层基板结构
CN105517322B (zh) * 2015-11-30 2018-08-14 卢美珍 印刷电路板的织物基层覆金属的叠板结构
CN105517323B (zh) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 印刷电路板的负载导体图案的叠层板
CN105517321B (zh) * 2015-11-30 2018-06-19 燕山大学里仁学院 电子元件封装体的覆金属层基板结构
CN105517325B (zh) * 2015-11-30 2018-07-24 卢美珍 印刷电路板的覆金属层叠板结构
CN105517332B (zh) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 一种用于多层压合的粘结片及其制备方法
CN111356723A (zh) * 2017-08-07 2020-06-30 卓尔泰克公司 用于补强塑料的经聚乙烯醇施胶的填料
CN110981223B (zh) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 一种耐高温玻璃纤维及其制备方法

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Also Published As

Publication number Publication date
AU2788999A (en) 1999-09-20
ID26528A (id) 2001-01-11
PL342654A1 (en) 2001-07-02
NO20004272D0 (no) 2000-08-25
WO1999044959A1 (en) 1999-09-10
EP1060144A1 (en) 2000-12-20
TW436422B (en) 2001-05-28
HUP0101382A2 (hu) 2001-08-28
IL137977A0 (en) 2001-10-31
MXPA00008517A (es) 2001-03-01
JP2002505216A (ja) 2002-02-19
NO20004272L (no) 2000-11-01
CA2320746A1 (en) 1999-09-10
MXPA00008554A (es) 2001-03-01
HUP0101382A3 (en) 2002-10-28
KR20010041518A (ko) 2001-05-25
CN1291963A (zh) 2001-04-18
BR9908520A (pt) 2000-10-24

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