ATE528139T1 - VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF - Google Patents
VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPFInfo
- Publication number
- ATE528139T1 ATE528139T1 AT10154893T AT10154893T ATE528139T1 AT E528139 T1 ATE528139 T1 AT E528139T1 AT 10154893 T AT10154893 T AT 10154893T AT 10154893 T AT10154893 T AT 10154893T AT E528139 T1 ATE528139 T1 AT E528139T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- layer
- silicon
- silicon substrate
- discharge head
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 239000007788 liquid Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 8
- 229910052710 silicon Inorganic materials 0.000 abstract 8
- 239000010703 silicon Substances 0.000 abstract 8
- 238000001039 wet etching Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009044111 | 2009-02-26 | ||
JP2009285779 | 2009-12-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE528139T1 true ATE528139T1 (de) | 2011-10-15 |
Family
ID=42236572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT10154893T ATE528139T1 (de) | 2009-02-26 | 2010-02-26 | VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF |
Country Status (6)
Country | Link |
---|---|
US (1) | US8377828B2 (de) |
EP (1) | EP2223807B1 (de) |
JP (1) | JP5566130B2 (de) |
CN (1) | CN101817257B (de) |
AT (1) | ATE528139T1 (de) |
RU (1) | RU2417152C1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7824560B2 (en) * | 2006-03-07 | 2010-11-02 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head |
WO2010021326A1 (ja) | 2008-08-19 | 2010-02-25 | リンテック株式会社 | 成形体、その製造方法、電子デバイス部材および電子デバイス |
CN102439077B (zh) | 2009-05-22 | 2014-12-10 | 琳得科株式会社 | 成型体、其制造方法、电子设备用构件和电子设备 |
JP4659898B2 (ja) | 2009-09-02 | 2011-03-30 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
EP2556954B1 (de) * | 2010-03-31 | 2019-09-25 | Lintec Corporation | Transparenter leitender film und elektronische vorrichtung mit dem transparenten leitenden film |
JP5697230B2 (ja) | 2010-03-31 | 2015-04-08 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材及び電子デバイス |
WO2012023389A1 (ja) * | 2010-08-20 | 2012-02-23 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材及び電子デバイス |
US8435805B2 (en) | 2010-09-06 | 2013-05-07 | Canon Kabushiki Kaisha | Method of manufacturing a substrate for liquid ejection head |
US20130209800A1 (en) * | 2010-09-07 | 2013-08-15 | Lintec Corporation | Adhesive sheet and electronic device |
JP2013230589A (ja) * | 2012-04-27 | 2013-11-14 | Canon Inc | 液体吐出ヘッドの製造方法 |
JP2013244654A (ja) * | 2012-05-25 | 2013-12-09 | Canon Inc | インクジェットヘッド基板の加工方法 |
JP6456158B2 (ja) * | 2015-01-20 | 2019-01-23 | キヤノン株式会社 | 記録素子基板、およびその製造方法 |
JP6504939B2 (ja) * | 2015-06-26 | 2019-04-24 | キヤノン株式会社 | シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法 |
JP6873836B2 (ja) * | 2017-06-19 | 2021-05-19 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3143307B2 (ja) * | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JPH06320730A (ja) * | 1993-05-17 | 1994-11-22 | Ricoh Co Ltd | サーマルインクジェットヘッド |
US6720522B2 (en) * | 2000-10-26 | 2004-04-13 | Kabushiki Kaisha Toshiba | Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining |
JP2002240293A (ja) * | 2001-02-14 | 2002-08-28 | Fuji Xerox Co Ltd | 液滴噴射記録装置およびシリコン構造体の製造方法 |
JP4217434B2 (ja) | 2002-07-04 | 2009-02-04 | キヤノン株式会社 | スルーホールの形成方法及びこれを用いたインクジェットヘッド |
JP2004140196A (ja) * | 2002-10-17 | 2004-05-13 | Nec Electronics Corp | 半導体装置の製造方法および基板洗浄装置 |
JP3998254B2 (ja) * | 2003-02-07 | 2007-10-24 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
US7323115B2 (en) | 2003-02-13 | 2008-01-29 | Canon Kabushiki Kaisha | Substrate processing method and ink jet recording head substrate manufacturing method |
JP3962713B2 (ja) * | 2003-09-30 | 2007-08-22 | キヤノン株式会社 | アライメントマークの形成方法、およびデバイスが構成される基板 |
JP4522086B2 (ja) * | 2003-12-15 | 2010-08-11 | キヤノン株式会社 | 梁、梁の製造方法、梁を備えたインクジェット記録ヘッド、および該インクジェット記録ヘッドの製造方法 |
JP4480132B2 (ja) * | 2004-02-18 | 2010-06-16 | キヤノン株式会社 | 液体吐出用ヘッドの製造方法 |
JP2007137015A (ja) * | 2005-11-22 | 2007-06-07 | Seiko Epson Corp | 液滴吐出ヘッド、液滴吐出装置、液滴吐出ヘッドの製造方法、及び液滴吐出装置の製造方法 |
US7824560B2 (en) * | 2006-03-07 | 2010-11-02 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head |
JP4854336B2 (ja) * | 2006-03-07 | 2012-01-18 | キヤノン株式会社 | インクジェットヘッド用基板の製造方法 |
JP5028112B2 (ja) * | 2006-03-07 | 2012-09-19 | キヤノン株式会社 | インクジェットヘッド用基板の製造方法およびインクジェットヘッド |
JP4182360B2 (ja) | 2006-06-05 | 2008-11-19 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
-
2010
- 2010-02-19 JP JP2010034693A patent/JP5566130B2/ja active Active
- 2010-02-22 US US12/709,544 patent/US8377828B2/en active Active
- 2010-02-25 CN CN2010101229999A patent/CN101817257B/zh active Active
- 2010-02-25 RU RU2010107094/12A patent/RU2417152C1/ru not_active IP Right Cessation
- 2010-02-26 EP EP10154893A patent/EP2223807B1/de active Active
- 2010-02-26 AT AT10154893T patent/ATE528139T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101817257B (zh) | 2013-07-10 |
US20100216264A1 (en) | 2010-08-26 |
JP5566130B2 (ja) | 2014-08-06 |
CN101817257A (zh) | 2010-09-01 |
EP2223807A1 (de) | 2010-09-01 |
JP2011143701A (ja) | 2011-07-28 |
US8377828B2 (en) | 2013-02-19 |
EP2223807B1 (de) | 2011-10-12 |
RU2417152C1 (ru) | 2011-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |