Tps 25947

TPS25947
SLVSFC9B – OCTOBER 2020 – REVISED MARCH 2022
TPS25947xx, 2.7-V–23-V, 5.5-A, 28-mΩ True Reverse Current Blocking eFuse with
Input Reverse Polarity Protection
1 Features 3 Description
• Wide operating input voltage range: 2.7 V to 23 V The TPS25947xx family of eFuses is a highly
– 28-V absolute maximum integrated circuit protection and power management
– Withstands negative voltages up to –15 V solution in a small package. The devices provide
• Integrated back-to-back FETs with low on- multiple protection modes using very few external
resistance: RON = 28.3 mΩ (typ.) components and are a robust defense against
• Ideal diode operation with true reverse current overloads, short-circuits, voltage surges, reverse
blocking polarity and excessive inrush current. With integrated
• Fast overvoltage protection back-to-back FETs, reverse current flow from output
– Overvoltage clamp (OVC) with pin-selectable to input is blocked at all times, making the devices
threshold (3.8 V, 5.7 V, 13.8 V) and 5-μs (typ.) well suited for power MUX/ORing applications as
response time OR well as systems which need load side energy hold
– Adjustable overvoltage lockout (OVLO) with up storage in case input power supply fails. The
1.2-μs (typ.) response time devices use linear ORing based scheme to ensure
• Overcurrent protection with load current monitor almost zero DC reverse current and emulate ideal
output (ILM) diode behavior with minimum forward voltage drop
– Active current limit OR circuit-breaker options and power dissipation.
– Adjustable threshold (ILIM) 0.5 A–6 A Output slew rate and inrush current can be adjusted
• ±10% accuracy for ILIM > 1 A using a single external capacitor. Loads are protected
– Adjustable transient blanking timer (ITIMER) to from input overvoltage conditions either by clamping
allow peak currents up to 2 × ILIM the output to a safe fixed maximum voltage (pin
– Output load current monitor accuracy: ±6% selectable), or by cutting off the output if input
(IOUT ≥ 1 A) exceeds an adjustable overvoltage threshold. The
• Fast-trip response for short-circuit protection devices respond to output overload by actively limiting
– 500-ns (typ.) response time the current or breaking the circuit. The output current
– Adjustable (2 × ILIM) and fixed thresholds limit threshold as well as the transient overcurrent
• Active high enable input with adjustable blanking timer are user adjustable. The current limit
undervoltage lockout threshold (UVLO) control pin also functions as an analog load current
• Adjustable output slew rate control (dVdt) monitor.
• Overtemperature protection The devices are available in a 2-mm × 2-mm,
• Digital outputs 10-pin HotRod QFN package for improved thermal
– Priority power MUX control (AUXOFF) and fault performance and reduced system footprint.
indication (FLT) or
– Power Good indication (PG) with adjustable The devices are characterized for operation over a
threshold (PGTH) junction temperature range of –40°C to +125°C.
• UL 2367 recognition Device Information
– File No. E339631 PART NUMBER PACKAGE(1) BODY SIZE (NOM)
– RILM ≥ 750 Ω TPS25947xxRPW QFN (10) 2 mm × 2 mm
• IEC 62368-1 CB certified
• Small footprint: QFN 2 mm × 2 mm, 0.45-mm pitch (1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications VIN = 2.7 to 23 V VOUT
IN OUT
• Power MUX/ORing EN/UV LO

VLOGIC COUT
• Adapter input protection

TPS25 9470x
AUXOFF
OVL O
FLT
• USB PD protection – PC, notebook, monitors,

ITIMER dVd t GND ILM
CITIMER CDVD T R ILM
docks
• Server, PC motherboard, and add-on cards
Simplified Schematic
• Enterprise storage – RAID/HBA/SAN/eSSD
• Patient monitors
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS25947
SLVSFC9B – OCTOBER 2020 – REVISED MARCH 2022 www.ti.com
Table of Contents
1 Features............................................................................1 9.2 Single Device, Self-Controlled.................................. 40
2 Applications..................................................................... 1 9.3 Typical Application.................................................... 41
3 Description.......................................................................1 9.4 Active ORing............................................................. 44
4 Revision History.............................................................. 2 9.5 Priority Power MUXing..............................................46
5 Device Comparison Table...............................................3 9.6 USB PD Port Protection............................................53
6 Pin Configuration and Functions...................................4 9.7 Parallel Operation..................................................... 55
7 Specifications.................................................................. 6 10 Power Supply Recommendations..............................58
7.1 Absolute Maximum Ratings........................................ 6 10.1 Transient Protection................................................ 58
7.2 ESD Ratings............................................................... 6 10.2 Output Short-Circuit Measurements....................... 59
7.3 Recommended Operating Conditions.........................7 11 Layout........................................................................... 60
7.4 Thermal Information....................................................7 11.1 Layout Guidelines................................................... 60
7.5 Electrical Characteristics.............................................8 11.2 Layout Example...................................................... 61
7.6 Timing Requirements................................................ 10 12 Device and Documentation Support..........................63
7.7 Switching Characteristics.......................................... 11 12.1 Documentation Support.......................................... 63
7.8 Typical Characteristics.............................................. 12 12.2 Receiving Notification of Documentation Updates..63
8 Detailed Description......................................................21 12.3 Support Resources................................................. 63
8.1 Overview................................................................... 21 12.4 Trademarks............................................................. 63
8.2 Functional Block Diagram......................................... 22 12.5 Electrostatic Discharge Caution..............................63
8.3 Feature Description...................................................25 12.6 Glossary..................................................................63
8.4 Device Functional Modes..........................................39 13 Mechanical, Packaging, and Orderable
9 Application and Implementation.................................. 40 Information.................................................................... 64
9.1 Application Information............................................. 40
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2021) to Revision B (March 2022) Page
• Updated the UIL/IEC certification status.............................................................................................................1
• Corrected the ESD Ratings to show CDM testing was per JS-002.................................................................... 6
• Updated image formatting................................................................................................................................ 12
• Updated Table 8-5 ........................................................................................................................................... 37
Changes from Revision * (October 2020) to Revision A (March 2021) Page

• Changed status from "Advance Information" to "Production Data".....................................................................1
2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS25947

TPS25947
www.ti.com SLVSFC9B – OCTOBER 2020 – REVISED MARCH 2022
5 Device Comparison Table

Overvoltage Overcurrent
Part Number AUXOFF or PG FLT or PGTH Response to Fault
Response Response
TPS259470ARPW Auto-Retry
Adjustable OVLO AUXOFF FLT
TPS259470LRPW Latch-Off
Active Current Limit
TPS259472ARPW Pin Selectable OVC Auto-Retry
TPS259472LRPW (3.8 V/5.7 V/13.8 V) Latch-Off

PG PGTH
TPS259474ARPW Auto-Retry
Adjustable OVLO Circuit Breaker
TPS259474LRPW Latch-Off
Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

TPS25947
6 Pin Configuration and Functions

IN OUT
EN/UVLO 1 10 ITIMER
OVLO/
2 9 ILM
OVCSEL
5 6
PG/
3 8 GND
AUXOFF
PGTH/ DVDT
FLT 4 7
Figure 6-1. TPS25947xx RPW Package 10-Pin QFN Top View
Table 6-1. Pin Functions

PIN
TYPE DESCRIPTION
NAME NO.
Active High Enable for the device. A Resistor Divider on this pin from input supply to GND
Analog
EN/UVLO 1 can be used to adjust the Undervoltage Lockout threshold. Do not leave floating. Refer to
Input
Section 8.3.2 for details.
TPS259470x, TPS259474x: A Resistor Divider on this pin from supply to GND can be
Analog
OVLO used to adjust the Overvoltage Lockout threshold. This pin can also be used as an Active
Input
2 Low Enable for the device. Do not leave floating. Refer to Section 8.3.3 for details.
Analog
OVCSEL TPS259472x: Overvoltage Clamp Threshold Select Pin. Refer to Section 8.3.4 for details.
Input
TPS259472x, TPS259474x: Power Good indication. This pin is an Open Drain signal
Digital
PG which is asserted High when the internal powerpath is fully turned ON and PGTH input
Output
exceeds a certain threshold. Refer to Section 8.3.11 for more details.
3 TPS259470x: Auxiliary channel control signal. This pin is an Open Drain signal which
is asserted High when the input supply is valid and channel has completed inrush
Digital
AUXOFF sequence. This can be used to enable/disable the auxiliary supply eFuse to facilitate
Output
smooth switchover in a Priority power MUXing configuration. Refer to Section 8.3.10 for
more details.
Digital TPS259470x: Active low Fault event indicator. This pin is an Open Drain signal which will
FLT
Output be pulled low when a fault is detected. Refer to Section 8.3.9 for more details.
4
Analog TPS259472x, TPS259474x: Power Good Threshold. Refer to Section 8.3.11 for more
PGTH
Input details.
IN 5 Power Power input
OUT 6 Power Power output

Analog A capacitor from this pin to GND sets the output turn on slew rate. Leave this pin floating
DVDT 7
Output for the fastest turn on slew rate. Refer to Section 8.3.5.1 for details.
This pin is the ground reference for all internal circuits and must be connected to system
GND 8 Ground
GND.

TPS25947
Table 6-1. Pin Functions (continued)

PIN
TYPE DESCRIPTION
NAME NO.
This pin is a dual function pin used to limit and monitor the output current. An external
Analog resistor from this pin to GND sets the output current limit threshold during start-up as well
ILM 9
Output as steady state. The pin voltage can also be used as analog output load current monitor
signal. Do not leave floating. Refer to Section 8.3.5.2 or Section 8.3.5.3 for more details.
A capacitor from this pin to GND sets the overcurrent blanking interval during which the
output current can temporarily exceed set current limit (but lower than fast-trip threshold)
Analog
ITIMER 10 before the device overcurrent response takes action. Leave this pin open for fastest
Output
response to overcurrent events. Refer to Section 8.3.5.2 or Section 8.3.5.3 for more
details.

TPS25947
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Parameter Pin MIN MAX UNIT
max(–15, VOUT –
Maximum Input Voltage Range, –40℃ ≤ TJ ≤ 125℃ 28 V
21)
VIN IN
max(–15, VOUT –
Maximum Input Voltage Range, –10℃ ≤ TJ ≤ 125℃ 28 V
22)
Maximum Output Voltage Range, –40℃ ≤ TJ ≤ 125℃ –0.3 min (28, VIN + 21)
VOUT OUT
Maximum Output Voltage Range, –10℃ ≤ TJ ≤ 125℃ –0.3 min (28, VIN + 22)
VOUT,PLS Minimum Output Voltage Pulse (< 1 µs) OUT –0.8
VEN/UVLO Maximum Enable Pin Voltage Range (2) EN/UVLO –0.3 6.5 V
Maximum OVLO Pin Voltage Range (TPS259470x/4x)
VOVLO (2) OVLO –0.3 6.5 V
VOVCSEL Maximum OVCSEL Pin Voltage Range (TPS259472x) OVCSEL Internally Limited V
VdVdT Maximum dVdT Pin Voltage Range dVdt Internally Limited V
VITIMER Maximum ITIMER Pin Voltage Range ITIMER Internally Limited V
Maximum PGTH Pin Voltage Range (TPS259472x/4x)
VPGTH (2) PGTH –0.3 6.5 V
VAUXOFF Maximum AUXOFF Pin Voltage Range (TPS259470x) AUXOFF –0.3 6.5 V
VPG Maximum PG Pin Voltage Range (TPS259472x/4x) PG –0.3 6.5 V
VFLTB Maximum FLT Pin Voltage Range (TPS259470x) (2) FLT –0.3 6.5 V
VILM Maximum ILM Pin Voltage Range ILM Internally Limited V
IMAX Maximum Continuous Switch Current IN to OUT Internally Limited A
TJ Junction temperature Internally Limited °C
TLEAD Maximum Lead Temperature 300 °C
TSTG Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) If this pin has a pull-up up to VIN, it is recommended to use a resistance of 350 kΩ or higher to limit the current under conditions where
IN can be exposed to reverse polarity.
7.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC
±2000
V(ESD) Electrostatic discharge JS-001(1) V
Charged device model (CDM), ANSI/ESDA/JEDEC JS-002(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TPS25947
7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
Parameter Pin MIN MAX UNIT
VIN Input Voltage Range IN 2.7 23 (1) V
VOUT Output Voltage Range OUT min (23, VIN + 20) V
VEN/UVLO Enable Pin Voltage Range EN/UVLO 5 (2) V
VOVLO OVLO Pin Voltage Range (TPS259470x/4x) OVLO 0.5 1.5 V
VdVdT dVdt Capacitor Voltage Rating dVdt VIN + 5 V (3) V
VFLTB FLT Pin Voltage Range (TPS259470x) FLT 5 (4) V
VPGTH PGTH Pin Voltage Range (TPS259472x/4x) PGTH 5 (4) V
VAUXOFF AUXOFF Pin Voltage Range (TPS259470x) AUXOFF 5 (4) V
VPG PG Pin Voltage Range (TPS259472x/4x) PG 5 (4) V
VITIMER ITIMER Pin Capacitor Voltage Rating ITIMER 4 V
RILM ILM Pin Resistance ILM 549 6650 Ω
IMAX Continuous Switch Current, TJ ≤ 125℃ IN to OUT 5.5 A
TJ Junction temperature –40 125 °C
(1) For TPS259472x variants, the input operating voltage should be limited to the selected Output Voltage Clamp threshold as listed in the
Electrical Characteristics section
(2) For supply voltages below 5V, it is okay to pull up the EN pin to IN directly. For supply voltages greater than 5V or systems which can
be exposed to reverse polarity on input supply, it is recommended to use a pull-up resistor with a minimum value of 350 kΩ.
(3) In a PowerMUX/ORing scenario with unequal supplies, the dVdt capacitor rating for each device should be chosen based on the
highest of the 2 rails.
(4) For systems which can be exposed to reverse polarity on input supply, if this pin is referred to input supply, it is recommended to use a
pull-up resistor with a minimum value of 350 kΩ to limit the current through the pin.
7.4 Thermal Information

TPS25947xx
THERMAL METRIC (1) RPW (QFN) UNIT
10 PINS
41.7 (2) °C/W
RθJA Junction-to-ambient thermal resistance
74.5 (3) °C/W
ΨJT Junction-to-top characterization parameter 1 °C/W
20 (2) °C/W
ΨJB Junction-to-board characterization parameter
27.6 (3) °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Based on simulations conducted with the device mounted on a custom 4-layer PCB (2s2p) with 8 thermal vias under device
(3) Based on simulations conducted with the device mounted on a JEDEC 4-layer PCB (2s2p) with no thermal vias under device

TPS25947
7.5 Electrical Characteristics

(Test conditions unless otherwise noted) –40°C ≤ TJ ≤ 125°C, VIN = 12 V, OUT = Open, VEN/UVLO = 2 V, VOVLO = 0 V for
TPS259470x/4x, OVCSEL = 390 kΩ to GND for TPS259472x, RILM = 549 Ω , dVdT = Open, ITIMER = Open, AUXOFF =
Open for TPS259470x, FLT = Open for TPS259470x, PGTH = Open for TPS259472x/4x, PG = Open for TPS259472x/4x. All
voltages referenced to GND.
Test
Description MIN TYP MAX UNITS
Parameter
INPUT SUPPLY (IN)
VUVP(R) IN Supply UVP Rising threshold 2.44 2.53 2.64 V
VUVP(F) IN Supply UVP Falling threshold 2.35 2.42 2.55 V
IN Supply Quiescent Current (TPS259470x) 428 610 µA
IN Supply Quiescent Current (TPS259472x) 426 610 µA
IQ(ON) IN Supply Quiescent Current (TPS259474x) 428 610 µA
IN Supply Quiescent Current during RCB, VOUT = VIN + 1 V 193 µA
IN Supply Current during OVC (TPS259472x) 445 625 µA
IQ(OFF) IN Supply disabled State Current (VSD(F) < VEN < VUVLO(F)) 73 130 µA
ISD IN Supply Shutdown Current (VEN < VSD(F)) 4.4 28.7 µA
IQ(OVLO) IN Supply OFF Current (OVLO condition), VOUT = VIN + 1 V 190 267 µA
IINLKG(IRPP) IN Supply Leakage Current (VIN = –14 V, VOUT = 0 V) –3.7 µA
IOUTLKG(OVLO) OUT Leakage Current (OVLO condition), VOUT > VIN 319 443 µA
ON RESISTANCE (IN - OUT)
VIN = 12 V, IOUT = 3 A, TJ = 25℃ 28.2 mΩ
RON
2.7 ≤ VIN ≤ 23 V, IOUT = 3 A, –40℃ ≤ TJ ≤ 125℃ 45 mΩ
ENABLE/UNDERVOLTAGE LOCKOUT (EN/UVLO)
VUVLO(R) UVLO Rising threshold 1.183 1.20 1.223 V
VUVLO(F) UVLO Falling threshold 1.076 1.09 1.116 V
VSD(F) EN/UVLO Falling Threshold for lowest shutdown current 0.45 0.74 V
IENLKG EN/UVLO leakage current –0.1 0.1 µA
OVERVOLTAGE LOCKOUT (OVLO) - TPS259470x/4x
VOV(R) OVLO Rising threshold 1.183 1.20 1.223 V
VOV(F) OVLO Falling threshold 1.076 1.09 1.116 V
IOVLKG OVLO pin leakage current, 0.5 V < VOVLO < 1.5 V –0.1 0.1 µA
OUTPUT VOLTAGE CLAMP (OUT) - TPS259472x
Overvoltage Clamp Threshold, OVCSEL = Shorted to GND 3.65 3.88 4.1 V
VOVC Overvoltage Clamp Threshold, OVCSEL = Open 5.25 5.74 6.2 V
Overvoltage Clamp Threshold, OVCSEL = 390 kΩ to GND 13.2 13.85 14.5 V
Output Voltage During Clamping, OVCSEL = Shorted to
3.2 3.82 4.2 V
GND, IOUT = 10 mA
Output Voltage During Clamping, OVCSEL = Open, IOUT =
VCLAMP 5.0 5.68 6.12 V
10 mA
Output Voltage During Clamping, OVCSEL = 390 kΩ to
13.0 13.79 14.6 V
GND, IOUT = 10 mA
OVERCURRENT PROTECTION (OUT)
Overcurrent Threshold, RILM = 6.65 kΩ 0.425 0.500 0.575 A
Overcurrent Threshold, RILM = 3.32 kΩ 0.850 1.007 1.150 A
ILIM Overcurrent Threshold, RILM = 1.65 kΩ 1.800 2.028 2.200 A
Overcurrent Threshold, RILM = 750 Ω 3.960 4.452 4.840 A
Overcurrent Threshold, RILM = 549 Ω 5.400 6.068 6.600 A

TPS25947
7.5 Electrical Characteristics (continued)

Test
Parameter
Circuit Breaker Threshold, ILM Pin Open (Single point
0.1 A
failure)
IFLT
Circuit Breaker Threshold, ILM Pin Shorted to GND (Single
1.1 2.1 A
point failure)
ISCGain Scalable Fast Trip Threshold (ISC) : ILIM Ratio 201 %
IFT Fixed Fast-trip current threshold 22.2 A
VFB VOUT threshold to exit Current Limit Foldback 1.9 V
OVERCURRENT FAULT TIMER (ITIMER)
VINT ITIMER pin internal pull-up voltage 2.3 2.57 2.72 V
RITIMER ITIMER pin internal pull-up resistance 15 kΩ
IITIMER ITIMER pin internal discharge current, IOUT > ILIM 1.2 1.8 2.5 µA
ΔVITIMER ITIMER discharge differential voltage threshold 1.286 1.51 1.741 V
OUTPUT LOAD CURRENT MONITOR (ILM)
Analog Load Current Monitor Gain (IMON : IOUT), IOUT = 0.5 A
165 182 200 µA/A
to 1 A, IOUT < ILIM
GIMON
Analog Load Current Monitor Gain (IMON : IOUT), IOUT = 1 A to
165 182 200 µA/A
5.5 A, IOUT < ILIM
REVERSE CURRENT BLOCKING (IN - OUT)
VFWD VIN – VOUT Forward regulation voltage, IOUT = 10 mA 4.7 16.9 mV
VIN – VOUT threshold for fast BFET turn off (enter reverse
VREVTH –36.45 –29.3 –22.3 mV
current blocking)
VIN – VOUT threshold for fast BFET turn on (exit reverse
VFWDTH 83 104.1 125 mV
current blocking)
OUT Leakage Current during unpowered condition (VOUT =
IREVLKG(OFF) 4.86 µA
12 V, VIN = 0 V)
IREVLKG Reverse leakage current, (VOUT – VIN) = 21.5 V 10.1 µA
OUT Leakage Current during ON state with RCB, VOUT =
IOUTLKG(RCB) 234 µA
VIN + 1 V
POWER GOOD INDICATION (PG) - TPS259472x/4x or AUXILIARY CHANNEL CONTROL (AUXOFF) - TPS259470x
PG/AUXOFF pin voltage while de-asserted. VIN < VUVP(F),
0.67 1 V
VEN < VSD(F), Weak pull-up (IPG = 26 μA)
VPGD PG/AUXOFF pin voltage while de-asserted, VIN < VUVP(F),
0.79 1 V
VEN < VSD(F), Strong pull-up (IPG = 242 μA)
PG/AUXOFF pin voltage while de-asserted, VIN > VUVP(R) 0 V
IPGLKG PG/AUXOFF Pin leakage current, PG/AUXOFF asserted 0.9 3 µA
POWERGOOD THRESHOLD (PGTH) - TPS259472x/4x
VPGTH(R) PGTH Rising threshold 1.183 1.20 1.223 V
VPGTH(F) PGTH Falling threshold 1.076 1.09 1.116 V
IPGTHLKG PGTH leakage current –0.1 0.3 µA
FAULT INDICATION (FLT) - TPS259470x
IFLTLKG FLT leakage current –1 1 µA
RFLT FLT Internal Pull down resistance 12.3 Ω
OVERTEMPERATURE PROTECTION (OTP)
TSD Thermal Shutdown Rising Threshold, TJ↑ 154 °C

TPS25947
7.5 Electrical Characteristics (continued)

Test
Parameter
TSDHYS Thermal Shutdown Hysteresis, TJ↓ 10 °C
DVDT
IdVdt dVdt Pin Charging Current 0.81 2.21 3.82 µA
7.6 Timing Requirements

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Overvoltage lock-out response time
tOVLO VOVLO > VOV(R) to VOUT↓ 1.2 µs
(TPS259470x/4x)
Overvoltage clamp response time
tOVC VIN > VOVC to VOUT↓ 5 µs
(TPS259472x)
tCB Circuit-Breaker response time (TPS259474x) IOUT > 1.2 × ILIM & ITIMER expired to IOUT↓ 2 µs
I > 1.2 × ILIM & ITIMER expired to IOUT
tLIM Current limit response time (TPS259470x/2x) OUT 400 µs
settling to within 5 % of ILIM
tSC Scalable fast-trip response time IOUT > 3 × ILIM to IOUT↓ 500 ns
tFT Fixed fast-trip response time IOUT > IFT to IOUT↓ 500 ns
tRST Auto-Retry Interval after fault (TPS25947xA) 110 ms
OVLO fast recovery response
tSWOV VOVLO < VOV(F) to VOUT↑ 90 µs
time (TPS259470x)
tSWRCB Reverse Current Blocking recovery time (VIN – VOUT) > VFWDTH to VOUT ↑ 50 µs
Reverse Current Blocking comparator
tRCB (VOUT – VIN) > 1.3 × VREVTH to BFET OFF 1 µs
response time
tPGA PG Assertion de-glitch (TPS259472x/4x) 12 µs
tPGD PG De-assertion de-glitch (TPS259472x/4x) 12 µs

TPS25947
7.7 Switching Characteristics

The output rising slew rate is internally controlled and constant across the entire operating voltage range to ensure the
turn on timing is not affected by the load conditions. The rising slew rate can be adjusted by adding capacitance from
the dVdt pin to ground. As CdVdt is increased it will slow the rising slew rate (SR). See Slew Rate and Inrush Current
Control (dVdt) section for more details. The Turn-Off Delay and Fall Time, however, are dependent on the RC time constant
of the load capacitance (COUT) and Load Resistance (RL). The Switching Characteristics are only valid for the power-up
sequence where the supply is available in steady state condition and the load voltage is completely discharged before the
device is enabled.Typical Values are taken at TJ = 25°C unless specifically noted otherwise. RL = 100 Ω, COUT = 1 µF
CdVdt =
PARAMETER VIN CdVdt = Open CdVdt = 1800 pF UNIT
3300 pF
2.7 V 12.14 0.87 0.5
SRON Output Rising slew rate 12 V 28.1 1.09 0.61 V/ms
23 V 44.78 1.25 0.71
2.7 V 0.09 0.6 0.97
tD,ON Turn on delay 12 V 0.1 1.32 2.35 ms
23 V 0.11 1.99 3.69
2.7 V 0.17 2.51 4.33
tR Rise time 12 V 0.35 8.1 15.37 ms
23 V 0.40 14.4 25.89
2.7 V 0.27 3.11 5.31
tON Turn on time 12 V 0.45 10.08 17.72 ms
23 V 0.50 16.41 29.57
2.7 V 64.44 64.44 64.44
tD,OFF Turn off delay 12 V 25.32 25.32 25.32 µs
23 V 23.02 23.02 23.02
VEN/UVLO
EN/UVLO VUVLO(R) VUVLO(F)

0
tON tD,OFF
VIN SRON 90%

OUT
0V 10%
tR tF
tD,ON
Time
Figure 7-1. TPS25947xx Switching Times

TPS25947
7.8 Typical Characteristics

30.9
IOUT (A)
30.6 1
30.3 3
4
30 5.5
29.7
RON (m:)
29.4
29.1
28.8
28.5
28.2
27.9
2.5 5 7.5 10 12.5 15 17.5 20 22.5 25
VIN (V) D007
Figure 7-2. ON-Resistance vs Supply Voltage Figure 7-3. Forward Voltage Drop vs Load Current
480 445
440 VIN (V)
460 3.3
435 5
430 12
440
425
VIN (V)
IQ(ON) (PA)
IQ(ON) (PA)
420 420
2.7
5 415
400 12 410
23
405
380
400
360 395
390
340 385
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (qC) D011
TA (qC) D012
Figure 7-4. IN Quiescent Current vs Temperature (TPS259470x, Figure 7-5. IN Quiescent Current vs Temperature (TPS259472x
TPS2594704x Variants) Variant)
95 14
VIN (V) VIN (V)
90 2.7 12 2.7
5 5
85 12 12
23 10 23
80
IQ(OFF) (PA)
8
ISD (PA)
75
6
70
4
65
60 2
55 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (qC) D014
TA (qC) D013
Figure 7-6. IN OFF State (UVLO) Current vs Temperature Figure 7-7. IN Shutdown Current vs Temperature

TPS25947
7.8 Typical Characteristics (continued)

1.204
VIN (V)
2.7
5
1.203 12
23
VUVLO(R) (V)
1.202
1.201
1.2
-40 -20 0 20 40 60 80 100 120 140
TA (C)
Figure 7-8. IN Undervoltage Threshold vs Temperature Figure 7-9. EN/UVLO Rising Threshold vs Temperature
1.097 0.825
VIN (V) VIN (V)
0.8
2.7 2.7
5 0.775 5
1.096 12 12
23 0.75 23
0.725
VUVLO(F) (V)
VSD(F) (V)
0.7
1.095
0.675
0.65
1.094 0.625
0.6
0.575
1.093 0.55
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (C) TA (C)
Figure 7-10. EN/UVLO Falling Threshold vs Temperature Figure 7-11. EN/UVLO Shutdown Falling Threshold vs
Temperature
1.204 1.097
VIN (V) VIN (V)
2.7 2.7
12 12
1.203 23 1.096 23
VOV(R) (V)
VOV(F) (V)
1.202 1.095
1.201 1.094
1.2 1.093
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (C) TA (C)
Figure 7-12. OVLO Rising Threshold vs Temperature Figure 7-13. OVLO Falling Threshold vs Temperature

TPS25947

7000 18
Min
6000 Max
12
5000
6
ILIM error (%)

4000
ILIM (A)
0
3000
-6
2000
1000 -12
0 -18
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 0 1000 2000 3000 4000 5000 6000
RILM (k:) D005 ILIM (mA)
Figure 7-14. Overcurrent Threshold vs ILM Resistor Figure 7-15. Overcurrent Threshold Accuracy (Across Process,
Voltage and Temperature)
10 203
Min VIN (V)
8 Max 2.7
202.5 5
6 12
23
4 ISFT/ILIM Ratio (%) 202
GIMON error (%)
2 201.5
0
201
-2
-4 200.5
-6
200
-40 -20 0 20 40 60 80 100 120 140
-8
TA (C)
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
IOUT (A) Figure 7-17. Scalable Fast-Trip Threshold: Current Limit
Figure 7-16. Analog Current Monitor Gain Accuracy Threshold (ILIM) Ratio vs Temperature
26 20
VIN (V) VIN (V)
25 2.7 19.5 2.7
5 5
24 12 12
19 23
23
23
VFWD (mV)
18.5
22
IFT (A)
21 18
20 17.5
19
17
18
16.5
17 -40 -20 0 20 40 60 80 100 120 140
-40 -20 0 20 40 60 80 100 120 140 TA (C)
TA (qC) D030 Figure 7-19. RCB - Forward Regulation Voltage vs Temperature
Figure 7-18. Steady State Fixed Fast-Trip Current Threshold vs
Temperature

TPS25947

-28.5 120
VIN (V)
-29 2.7
115 5
-29.5 12
23
-30
VREVTH (mV)
VFWDTH (mV)
110
-30.5
-31 105
VIN (V)
-31.5 2.7
5 100
-32 12
23
-32.5 95
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (C) TA (C)
Figure 7-20. RCB - Reverse Comparator Threshold vs Figure 7-21. RCB - Forward Comparator Threshold vs
Temperature Temperature
Figure 7-22. OUT Leakage Current During ON-State Reverse Figure 7-23. Reverse Leakage Current During OFF-State
Current Blocking
14 14
TA (C)
13 13.95 -40
12 OVCSEL 13.9 25
GND 85
11 OPEN 13.85 105
392 k: to GND 125
10 13.8
VCLAMP (V)
VOVC (V)
9 13.75
8 13.7
7 13.65
6 13.6
5 13.55
4 13.5
0 100 200 300 400 500 600 700 800 900 1000
3
IOUT (mA)
-40 -20 0 20 40 60 80 100 120 140
TA (qC) D038
Figure 7-25. OVC Clamping Voltage (OVCSEL = 392 kΩ to GND)
Figure 7-24. OVC Threshold vs Temperature vs Load Current

TPS25947

4 5.85
TA (C) TA (C)
3.95 -40 5.8 -40
25 25
3.9 85 5.75 85
105 105
3.85 125 5.7 125
VCLAMP (V)
VCLAMP (V)
3.8 5.65
3.75 5.6
3.7 5.55
3.65 5.5
3.6 5.45
0 100 200 300 400 500 600 700 800 900 1000 0 100 200 300 400 500 600 700 800 900 1000
IOUT (mA) IOUT (mA)
Figure 7-26. OVC Clamping Voltage (OVCSEL = GND) vs Load Figure 7-27. OVC Clamping Voltage (OVCSEL = Open) vs Load
Current Current
1.518 1.83
VIN (V) VIN (V)
1.516 2.7 1.825 2.7
5 5
12 1.82 12
1.514
23 23
1.815
1.512
'VITIMER (V)
IITIMER (PA) 1.81

1.51
1.805
1.508
1.8
1.506
1.795
1.504 1.79
1.502 1.785
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TA (qC) D041
TA (qC) D043
Figure 7-28. ITIMER Discharge Differential Voltage Threshold vs Figure 7-29. ITIMER Discharge Current vs Temperature
Temperature
18.5 3
VIN (V) VIN (V)
18
2.7 2.9 2.7
17.5 5 2.8 5
12 12
17 23 2.7 23
16.5 2.6
RITIMER (k:)
VINT (V)
16 2.5
15.5
2.4
15
2.3
14.5
2.2
14
2.1
13.5
2
13 -40 -20 0 20 40 60 80 100 120 140
-40 -20 0 20 40 60 80 100 120 140 TA (C)
TA (qC) D044
Figure 7-31. ITIMER Internal Pullup Voltage vs Temperature
Figure 7-30. ITIMER Internal Pullup Resistance vs Temperature

TPS25947
2.7 VIN (V)

2.7
2.6 5
12
2.5 23
IDVDT (PA)
2.4
2.3
2.2
2.1
1.9
-40 -20 0 20 40 60 80 100 120 140
TA (qC) D029
Figure 7-32. DVDT Charging Current vs Temperature Figure 7-33. PGTH Threshold vs Temperature
0.9 19
IPG (A) VIN (V)
0.85 26 18 2.7
242 12
17
0.8 23
16
0.75
VPGD (V)
15
0.7 RFLTB (:) 14
0.65 13
0.6 12
11
0.55
10
0.5
-40 -20 0 20 40 60 80 100 120 140 9
TA (C) -40 -20 0 20 40 60 80 100 120 140
TA (qC)
Figure 7-34. PG Low Voltage Without Input Supply vs D028
Temperature Figure 7-35. FLTb Pin Pulldown Resistance vs Temperature
Figure 7-36. Time to Thermal Shut-Down During Inrush State Figure 7-37. Time to Thermal Shut-Down During Steady State

TPS25947
VIN
VOUT
EN
IIN
VIN = 12 V, COUT = 30 μF, CdVdt = Open, VEN/UVLO stepped up

VEN/UVLO = 3.3 V, COUT = 30 μF, CdVdt = Open, VIN ramped up
to 1.4 V
to 12 V
Figure 7-38. Start-Up with Enable
Figure 7-39. Start-Up with Supply
EN
VOUT
PG
IIN
COUT = 220 μF, CdVdt = 10 nF, EN/UVLO connected to IN

VIN = 12 V, COUT = 470 μF, CdVdt = 3300 pF, VEN/UVLO stepped
through resistor ladder, 12 V hot-plugged to IN
up to 1.4 V
Figure 7-40. Input Hot-Plug
Figure 7-41. Inrush Current with Capacitive Load
VIN
VIN
VOUT
VOUT
PG
PG
IIN
COUT = 220 μF, PG pulled up to 3 V, -15 V hot-plugged to IN

VIN = 12 V, COUT = 470 μF, ROUT = 5 Ω, CdVdt = 3300 pF,
VEN/UVLO stepped up to 1.4 V Figure 7-43. Input Reverse Polarity Protection - Fast Ramp
Figure 7-42. Inrush Current with Resistive and Capacitive Load

TPS25947

VIN
VIN
VOUT
VOUT OVLO
PG
IIN
COUT = 220 μF, PG pulled up to 3 V, VIN ramped down from 0 COUT = 220 μF, ROUT = 20 Ω, VIN Overvoltage threshold set to
V to -15 V and then ramped up to 0 V 13.2 V, VIN ramped up from 12 V to 16 V
Figure 7-44. Input Reverse Polarity Protection - Slow Ramp Figure 7-45. Overvoltage Lockout Response - TPS259470x/4x
VIN
VOUT
VIN
VOUT
PG PG
ROVCSEL = GND, COUT = 220 μF, IOUT = 120 mA, VIN ramped ROVCSEL = Open, COUT = 220 μF, IOUT = 150 mA, VIN ramped
up from 3.3 V to 6 V up from 5 V to 8 V
Figure 7-46. Overvoltage Clamp Response - TPS259472x Figure 7-47. Overvoltage Clamp Response - TPS259472x
VIN
VOUT
VIN
VOUT
IIN
PG
FLTb
ROVCSEL = 390 kΩ, COUT = 220 μF, IOUT = 300 mA, VIN VIN = 12 V, CITIMER = 2.2 nF, COUT = 220 μF, RILM = 549 Ω,
ramped up from 12 V to 16.5 V IOUT stepped from 3 A → 9 A → 3 A within 5 ms
Figure 7-48. Overvoltage Clamp Response - TPS259472x Figure 7-49. Active Current Limit Response - TPS259470x

TPS25947
VIN
VOUT
VIN
VOUT
ITIMER
IIN
FLTb
IIN
VIN = 12 V, CITIMER = 2.2 nF, COUT = 220 μF, RILM = 549 Ω, VIN = 12 V, CITIMER = 2.2 nF, COUT = 470 μF, RILM = 549 Ω,
IOUT stepped from 3 A → 9 A IOUT ramped from 4 A → 8 A→ 4 A within 1 ms
Figure 7-50. Active Current Limit Response Followed by TSD - Figure 7-51. Transient Overcurrent Blanking Timer Response -
TPS259470x TPS259474x
VIN
VIN
VOUT
VOUT
PG
IIN
IOUT
VIN = 12 V, CITIMER = 2.2 nF, COUT = 470 μF, RILM = 549 Ω, VIN = 12 V, RILM = 549 Ω, VEN/UVLO = 3.3 V, OUT stepped from
IOUT ramped from 4 A → 8 A Open → Short-circuit to GND
Figure 7-52. Circuit Breaker Response - TPS259474x Figure 7-53. Output Short-Circuit During Steady State
VIN
VIN
VOUT
VOUT
FLTb
IOUT IIN
VIN = 12 V, RILM = 549 Ω, VEN/UVLO = 3.3 V, OUT stepped from VIN = 12 V, COUT = Open, OUT short-circuit to GND, RILM =
Open → Short-circuit to GND 1650 Ω, VEN/UVLO stepped from 0 V to 3.3 V
Figure 7-54. Output Short-Circuit During Steady State (Zoomed Figure 7-55. Power Up into Short-Circuit
In)

TPS25947
8 Detailed Description
8.1 Overview
The TPS25947xx is an eFuse with integrated power path that is used to ensure safe power delivery in a system.
The device starts its operation by monitoring the IN bus. When the input supply voltage (VIN) exceeds the
Undervoltage Protection threshold (VUVP), the device samples the EN/UVLO pin. A high level (> VUVLO) on
this pin enables the internal power path (BFET+HFET) to start conducting and allow current to flow from IN to
OUT. When EN/UVLO is held low (< VUVLO), the internal power path is turned off. In case of reverse voltages
appearing at the input, the power path remains OFF thereby protecting the output load.
After a successful start-up sequence, the device now actively monitors its load current and input voltage, and
controls the internal HFET to ensure that the user adjustable overcurrent limit threshold (ILIM) is not exceeded
and overvoltage spikes are either safely clamped to the selected threshold voltage (VOVC) or cut-off after they
cross the user adjustable overvoltage lockout threshold (VOVLO). The device also provides fast protection against
severe overcurrent during short-circuit events. This keeps the system safe from harmful levels of voltage and
current. At the same time, a user adjustable overcurrent blanking timer allows the system to pass moderate
transient peaks in the load current profile without tripping the eFuse. This ensures a robust protection solution
against real faults which is also immune to transients, thereby ensuring maximum system uptime.
The device has integrated reverse current blocking FET (BFET) which operates like an ideal diode. The BFET
is linearly regulated to maintain a small constant forward drop (VFWD) in forward conduction mode and turned off
completely to block reverse current if output voltage exceeds the input voltage.
The device also has a built-in thermal sensor based shutdown mechanism to protect itself in case the device
temperature (TJ) exceeds the recommended operating conditions.

TPS25947
8.2 Functional Block Diagram
TPS25 9470x FFT
+
-
+
-
16.9 mV 353 .9 mV
Temp S ense &
Overtemperature TSD
protection
IN 5 6 OUT
INRUSH_DONE
BFET HFE T
IRP P
CP 7 DVDT
2.8 V
A
+
-
+
UVPb
2.53 V9 A/A
- GHI
2.42 V; FFT
RCB
GHI
- 2x
OVL O 2
- SC
OVL Ob
1.20 V9 HFE T Control
+ +
BFET Con trol
1.09 V; Curren t Limit Amplifier
- 1x
+ OC
EN/UV LO 1 UVLOb
+ 9 ILM
1.20 V9 -
1.09 V;
ITIMER_EXPIRED
SWEN INRUSH_DONE Sho rt

Detect
-
SD
ILM Pin Sh ort
+
0.74 V;
RETRY #
INRUSH_DONE
SD 1.06 V; 2.57 V
OVL Ob
UVLOb
UVPb R /Q
RETRY # 110 ms
15 kŸ
TIMER # +
ITIMER_EXPIRED
TSD FLT
S Q - 10 ITIMER
ILM Pin Sh ort
RCB OC
ITIMER_EXPIRED
8 GND
4 3
FLT AUXOFF
# Not appl icab le to Latch-off variants (TPS 259470 L)
Figure 8-1. TPS259470x Block Diagram

TPS25947
TPS25 9472x FFT
+
-
+
-
16.9 mV 353 .9 mV
Temp S ense &
Overtemperature TSD
protection
IN 5 6 OUT
INRUSH_DONE
BFET HFE T
IRP P
CP 7 DVDT
+ 2.8 V
UVPb A
2.53 V9
+
-
-
2.42 V;
A/A
+ GHI
FFT
- OVC GHI
OVC Threshold - 2x
OVCSE L 2 SC
Sele ct RCB
HFE T Control +
BFET Con trol
Curren t Limit Amplifier
- 1x
+ OC
EN/UV LO 1
UVLOb + 9 ILM
1.20 V9 -
1.09 V;
ITIMER_EXPIRED
INRUSH_DONE
SWEN Sho rt
Detect
-
SD
ILM Pin Sh ort
+
0.74 V;
PG_ int 1.06 V; 2.57 V
OVC
INRUSH_DONE
15 kŸ
+
SD
UVPb R /Q ITIMER_EXPIRED
RETRY # ITIMER
RCB - 10
PG_ int
TSD FLT OC
S Q PG_ int
ILM Pin Sh ort
A
8 GND
110 ms R S
RETRY #
TIMER #
+
-
Q /Q
1.2 V9
1.09 V;
3 4
PG PGTH

TPS25947
TPS25 9474x FFT
+
-
+
-
16.9 mV 353 .9 mV
Temp S ense &
Overtemperature TSD
protection
IN 5 6 OUT
INRUSH_DONE
BFET HFE T
IRP P
CP 7 DVDT
2.8 V
A
+
-
+
UVPb
2.53 V9 A/A
- GHI
FFT
2.42 V; RCB
GHI
- 2x
OVL O 2
- SC
OVL Ob
1.20 V9 HFE T Control
+
BFET Con trol +
1.09 V; Curren t Limit Amplifier
- 1x
+ OC
EN/UV LO 1 UVLOb
1.20 V9 + 9 ILM
-
1.09 V; SWEN
Sho rt
INRUSH_DONE Detect
-
SD
ILM Pin Sh ort
+
0.74 V;
PG_ int 1.06 V; 2.57 V
INRUSH_DONE
15 kŸ
SD +
UVPb R /Q ITIMER_EXPIRED
RETRY #
RCB - 10 ITIMER
PG_ int
TSD FLT
ILM Pin Sh ort S Q PG_ int OC
ITIMER_EXPIRED A
R S 8 GND
110 ms
RETRY #
+
TIMER #
-
Q /Q
1.2 V9
1.09 V;
3 4
PG PGTH

TPS25947
8.3 Feature Description

The TPS25947xx eFuse is a compact, feature rich power management device that provides detection, protection
and indication in the event of system faults.
8.3.1 Input Reverse Polarity Protection

The TPS25947xx device is internally protected against steady state negative voltages applied at the input supply
pin. The device blocks the negative voltage from appearing at the output, thereby protecting the load circuits.
There’s no reverse current flowing from output to the input in this condition. The lowest negative voltage the
device can handle at the input is limited to -15 V or VOUT – 21 V, whichever is higher. It’s also recommended
that all signal pins (e.g. EN/UVLO, OVLO, PGTH) which are connected to input supply must have a sufficiently
large pull-up resistor to limit the current flowing out of these pins during reverse polarity conditions. Please refer
to Absolute Maximum Ratings table for more details.
8.3.2 Undervoltage Lockout (UVLO and UVP)
The TPS25947xx implements Undervoltage Protection on IN in case the applied voltage becomes too low for the
system or device to properly operate. The Undervoltage Protection has a default lockout threshold of VUVP which
is fixed internally. Also, the UVLO comparator on the EN/UVLO pin allows the Undervoltage Protection threshold
to be externally adjusted to a user defined value. The Figure 8-4 and Equation 1 show how a resistor divider can
be used to set the UVLO set point for a given voltage supply.
Power
IN
Supply
R1
EN/UVLO
R2
GND
Figure 8-4. Adjustable Undervoltage Protection
VUVLO × (R1 + R2)

VIN(UV) =
R2 (1)
8.3.3 Overvoltage Lockout (OVLO)

The TPS259470x/4x variants allow the user to implement Overvoltage Lockout to protect the load from input
overvoltage conditions. The OVLO comparator on the OVLO pin allows the Overvoltage Protection threshold to
be adjusted to a user defined value. After the voltage at the OVLO pin crosses the OVLO rising threshold VOV(R),
the device turns off the power to the output. Thereafter, the devices wait for the voltage at the OVLO pin to
fall below the OVLO falling threshold VOV(F) before the output power is turned ON again. The rising and falling
thresholds are slightly different to provide hysterisis. The Figure 8-5 and Equation 2 show how a resistor divider
can be used to set the OVLO set point for a given voltage supply.

TPS25947
Power
IN
Supply
R1
OVLO
R2
GND
Figure 8-5. Adjustable Overvoltage Protection
VOV × (R1 + R2)

VIN(OV) =
R2 (2)
While recovering from a OVLO event, the TPS259470x variants bypass the inrush control (dVdt) and start up in
a current limited manner to provide faster turn ON and minimize power supply droop.
Input Overvoltage Event Input Overvoltage Removed
IN
VOV(R)
OVLO VOV(F)
tOVLO
0 tSWOV
OUT Current Limited

0 Start-up
VFLT
FLT
0
VAUXOFF
AUXOFF
0
Time
Figure 8-6. TPS259470x Overvoltage Lockout and Recovery
While recovering from a OVLO event, the TPS259474x variants start up with inrush control (dVdt).

TPS25947
IN
VOV(R)
OVLO VOV(F)
tOVLO
0
OUT dVdt Limited

Start-up
0
tPGD tPGA
VPG
PG
0
Time
Figure 8-7. TPS259474x Overvoltage Lockout and Recovery
8.3.4 Overvoltage Clamp (OVC)

The TPS259472x variants implement a voltage clamp on the output to protect the system in the event of input
overvoltage. When the device detects the input has exceeded the Overvoltage Clamp Threshold (VOVC), it
quickly responds within tOVC and stops the output from rising further and then regulates the HFET linearly to
clamp the output voltage below VCLAMP as long as an overvoltage condition is present on the input.
If the part stays in clamping state for an extended period of time, there is a higher power dissipation inside the
part which can eventually lead to thermal shut-down (TSD). After the part shuts down due to TSD fault, it can
either stay latched off (TPS259472L variant) or restart automatically after a fixed delay (TPS259472A variant).
See Overtemperature Protection (OTP) for more details on device response to overtemperature.

TPS25947
IN VOVC
Thermal
Shutdown Retry Timer Expired (1)
0
tOVC
VCLAMP tRST
OUT dVdt Limited

Start-up
0
tPGD tPGA
VPG
PG
0
TSD
TSDHY S
TJ
Time
(1)
Applicable only for TPS259472A (Auto-retry variant)
Figure 8-8. TPS259472x Overvoltage Response (Auto-Retry)
There are 3 available overvoltage clamp threshold options which can be configured using the OVCSEL pin.
Table 8-1. TPS259472x Overvoltage Clamp Threshold Selection
OVCSEL Pin Connection Overvoltage Clamp Threshold
Shorted to GND 3.8 V
Open 5.7 V
Connected to GND through a 390-kΩ resistor 13.8 V
8.3.5 Inrush Current, Overcurrent, and Short Circuit Protection

TPS25947xx incorporates four levels of protection against overcurrent:
1. Adjustable slew rate (dVdt) for inrush current control
2. Adjustable threshold (ILIM) for overcurrent protection during start-up or steady-state
3. Adjustable threshold (ISC) for fast-trip response to severe overcurrent during start-up or steady-state
4. Fixed threshold (IFT) for fast-trip response to quickly protect against hard output short-circuits during steady-
state
8.3.5.1 Slew Rate (dVdt) and Inrush Current Control
During hot-plug events or while trying to charge a large output capacitance at start-up, there can be a large
inrush current. If the inrush current is not managed properly, it can damage the input connectors and/or cause
the system power supply to droop leading to unexpected restarts elsewhere in the system. The inrush current
during turn-on is directly proportional to the load capacitance and rising slew rate. Equation 3 can be used to find
the slew rate (SR) required to limit the inrush current (IINRUSH) for a given load capacitance (COUT):
IINRUSH (mA)
SR (V/ms) =
COUT (µF) (3)
A capacitor can be connected to the dVdt pin to control the rising slew rate and lower the inrush current during
turn-on. The required CdVdt capacitance to produce a given slew rate can be calculated using Equation 4.

TPS25947
2000
CdVdt (pF) =
SR (V/ms) (4)
The fastest output slew rate is achieved by leaving the dVdt pin open.
Note
For CdVdt > 10 nF, TI recommends to add a 100-Ω resistor in series with the capacitor on the dVdt pin.
8.3.5.2 Circuit-Breaker
The TPS259474x (Circuit-Breaker) variants respond to output overcurrent conditions by turning off the output
after a user adjustable transient fault blanking interval. When the load current exceeds the set overcurrent
threshold (ILIM) set by the ILM pin resistor (RILM), but stays lower than the fast-trip threshold (2 x ILIM), the device
starts discharging the ITIMER pin capacitor using an internal 1.8-μA pull-down current. If the load current drops
below ILIM before the ITIMER pin capacitor (CITIMER) discharges by ΔVITIMER, the ITIMER is reset by pulling it
up to VINT internally and the circuit breaker action is not engaged. This allows short load transient pulses to
pass through the device without tripping the circuit. If the overcurrent condition persists, the CITIMER continues to
discharge and after it discharges by ΔVITIMER, the circuit breaker action turns off the HFET immediately. At the
same time, the CITIMER is charged up to VINT again so that it is at its default state before the next overcurrent
event. This ensures the full blanking timer interval is provided for every overcurrent event. Equation 5 can be
used to calculate the RILM value for a overcurrent threshold.
3334
RILM :À; =
ILIM :A; (5)
Note
1. Leaving the ILM pin open sets the current limit to nearly zero and results in the part breaking the
circuit with the slightest amount of loading at the output.
2. Shorting the ILM pin to ground at any point during normal operation is detected as a fault and the
part shuts down. There is a minimum current (IFLT) which the part allows in this condition before
the pin short condition is detected.
The duration for which transients are allowed can be adjusted using an appropriate capacitor value from ITIMER
pin to ground. The CITIMER value needed to set the desired transient overcurrent blanking interval can be
calculated using Equation 6.
¿VITIMER (V) × CITIMER (nF)

tITIMER (ms) =
IITIMER (µA) (6)

TPS25947
Transient Overcurrent Persistent Output Overload ITIMER expired
2 x ILIM
Circuit-Breaker
operation
IOUT ILIM
0
tITIMER
VINT
¨VITIMER
ITIMER
0
VIN
OUT
VPGTH
PGTH
0
tPGD
VPG
PG
0
TSD
TSDHY S
TJ
TJ
Time
Figure 8-9. TPS259474x Overcurrent Response
Note
1. Leave the ITIMER pin open to allow the part to break the circuit with the minimum possible delay.
2. Shorting the ITIMER pin to ground results in minimum overcurrent response delay (similar
to ITIMER pin open condition), but increases the device current consumption. This is not a
recommended mode of operation.
3. Increasing the ITIMER cap value extends the overcurrent blanking interval, but it also extends
the time needed for the ITIMER cap to recharge up to VINT. If the next overcurrent event occurs
before the ITIMER cap is recharged fully, it takes lesser time to discharge to the ITIMER expiry
threshold, thereby providing a shorter blanking interval than intended.
After the part shuts down due to a Circuit Breaker fault, it can either stay latched off (TPS259474L variant) or
restart automatically after a fixed delay (TPS259474A variant).
8.3.5.3 Active Current Limiting
The TPS259470x/2x (Active Current Limit) variants respond to output overcurrent conditions by actively limiting
the current after a user adjustable transient fault blanking interval. When the load current exceeds the set
overcurrent threshold (ILIM) set by the ILM pin resistor (RILM), but stays lower than the short-circuit threshold (2 ×
ILIM), the device starts discharging the ITIMER pin capacitor using an internal 1.8-μA pulldown current. If the load
current drops below the overcurrent threshold before the ITIMER capacitor (CITIMER) discharges by ΔVITIMER,
the ITIMER is reset by pulling it up to VINT internally and the current limit action is not engaged. This allows

TPS25947
short load transient pulses to pass through the device without getting current limited. If the overcurrent condition
persists, the C ITIMER continues to discharge and after it discharges by ΔVITIMER, the current limit starts regulating
the HFET to actively limit the current to the set overcurrent threshold (ILIM). At the same time, the CITIMER is
charged up to VINT again so that it is at its default state before the next overcurrent event. This ensures the
full blanking timer interval is provided for every overcurrent event. Equation 7 can be used to calculate the RILM
value for a desired overcurrent threshold.
3334
RILM :À; =
ILIM :A; (7)
Note
1. Leaving the ILM pin open sets the current limit to nearly zero and results in the part entering
current limit with the slightest amount of loading at the output.
2. The current limit circuit employs a foldback mechanism. The current limit threshold in the foldback
region (0 V < VOUT < VFB) is lower than the steady state current limit threshold (ILIM).
3. Shorting the ILM pin to ground at any point during normal operation is detected as a fault and the
part shuts down. There’s a minimum current (IFLT) which the part allows in this condition before
the pin short condition is detected.
The duration for which transients are allowed can be adjusted using an appropriate capacitor value from ITIMER
pin to ground. The CITIMER value needed to set the desired transient overcurrent blanking interval can be
calculated using Equation 8 below.
¿VITIMER (V) × CITIMER (nF)

tITIMER (ms) =
IITIMER (µA) (8)

TPS25947
Transient Overcurrent Persistent Output Overload ITIMER expired Overload Removed

Persistent Output Overload ITIMER expired Thermal shutdown
2 x ILIM
tLIM tLIM
IOUT ILIM
Current limiting Current limiting
operation operation
0
tITIMER tITIMER
VINT
¨VITIMER
ITIMER
0
VIN
OUT
1.2 V
(1)
PGTH tPGD tPGD
tPGA
0
VPG
(1)
PG
0
VFLT
(2)
FLT
0
TSD
TSDHY S
TJ
TJ
Time
(1)
Applicable only to TPS259472x/4x variants
(2)
Applicable only to TPS259470x variants
Figure 8-10. TPS259470x/2x Active Current Limit Response
Note
1. Leave the ITIMER pin open to allow the part to limit the current with the minimum possible delay.
2. Shorting the ITIMER pin to ground results in minimum overcurrent response delay (similar
to ITIMER pin open condition), but increases the device current consumption. This is not a
recommended mode of operation.
3. Active current limiting based on RILM is active during start-up for both TPS259470x/2x (Current
Limit) and TPS259474x (Circuit-Breaker) variants. In case the start-up current exceeds ILIM, the
device regulates the current to the set limit. However, during start-up the current limit is engaged
without waiting for the ITIMER delay.
4. For the TPS259472x variants, during overvoltage clamp condition, if an overcurrent event occurs,
the current limit is engaged without waiting for the ITIMER delay.
5. Increasing the CITIMER value extends the overcurrent blanking interval, but it also extends the time
needed for the CITIMER to recharge up to VINT. If the next overcurrent event occurs before the
CITIMER is recharged fully, it takes less time to discharge to the ITIMER expiry threshold, thereby
providing a shorter blanking interval than intended.
During active current limit, the output voltage drops resulting in increased device power dissipation across the
HFET. If the device internal temperature (TJ) exceeds the thermal shutdown threshold (TSD), the HFET is turned
off. After the part shuts down due to TSD fault, it can either stay latched off (TPS25947xL variants) or restart
automatically after a fixed delay (TPS25947xA variants). See Overtemperature Protection (OTP) for more details
on device response to overtemperature.

TPS25947
8.3.5.4 Short-Circuit Protection

During an output short-circuit event, the current through the device increases very rapidly. When a severe
overcurrent condition is detected, the device triggers a fast-trip response to limit the current to a safe level.
The internal fast-trip comparator employs a scalable threshold (ISC) which is equal to 2 × ILIM. This enables the
user to adjust the fast-trip threshold rather than using a fixed threshold which can be too high for some low
current systems. The device also employs a fixed fast-trip threshold (IFT) to protect fast protection against hard
short-circuits during steady state. The fixed fast-trip threshold is higher than the maximum recommended user
adjustable scalable fast-trip threshold. After the current exceeds ISC or IFT, the HFET is turned off completely
within tFT. Thereafter, the devices tries to turn the HFET back on after a short de-glitch interval (30 μs) in a
current limited manner instead of a dVdt limited manner. This ensures that the HFET has a faster recovery after
a transient overcurrent event and minimizes the output voltage droop. However, if the fault is persistent, the
device stays in current limit causing the junction temperature to rise and eventually enter thermal shutdown. See
Overtemperature Protection (OTP) section for details on the device response to overtemperature.
Transient Severe Overcurrent Persistent Severe Overcurrent Output Hard Short-circuit to ground
Thermal Shutdown Thermal Shutdown
Overcurrent Removed Short-circuit Removed
Retry Timer Elapsed (3) Retry Timer Elapsed (3)
VIN
IN
0
tSC tSC tFT
IFT
2 x ILIM
IOUT
ILIM
VIN
OUT
Current Limited dVdt Limited dVdt Limited
0 Start-up Start-up Start-up
tPGD tPGD tPGD
VPG
PG (1)
0
VFLT
FLT (2)
0
tRST tRST
TSD
TSDHYS
TJ
Time
(1)
Applicable only to TPS259472x/4x variants
(2)
Applicable only to TPS259470x variants
(3)
Applicable only to TPS25947xA variants
Figure 8-11. TPS25947xx Short-Circuit Response
8.3.6 Analog Load Current Monitor

The device allows the system to accurately monitor the output load current by providing an analog current sense
output on the ILM pin which is proportional to the current through the FET. The user can sense the voltage (VILM)
across the RILM to get a measure of the output load current.
VILM (µV)
IOUT (A) =
RILM :À; × GIMON (µA/A) (9)
The waveform below shows the ILM signal response to a load step at the output.

TPS25947
VIN
VOUT
VILM
IIN
VIN = 12 V, COUT = 22 μF, RILM = 1150 Ω, IOUT varied dynamically between 0A and 3.5 A
Figure 8-12. Analog Load Current Monitor Response
Note
The ILM pin is sensitive to capacitive loading. Careful design and layout is needed to ensure the
parasitic capacitive loading on the ILM pin is < 50 pF for stable operation.
8.3.7 Reverse Current Protection

The device functions like an ideal diode and blocks reverse current flow from OUT to IN under all conditions.
The device has integrated back-to-back MOSFETs connected in a common drain configuration. The voltage
drop between the IN and OUT pins is constantly monitored and the gate drive of the blocking FET (BFET) is
adjusted as needed to regulate the forward voltage drop at VFWD. This closed loop regulation scheme (linear
ORing control) enables graceful turn off of the MOSFET during a reverse current event and ensures there is no
DC reverse current flow.
The device also uses a conventional comparator (VREVTH) based reverse blocking mechanism to provide fast
response (tRCB) to transient reverse currents. After the device enters reverse current blocking condition, it waits
for the (VIN – VOUT) forward drop to exceed the VFWDTH before it performs a fast recovery to reach full forward
conduction state. This provides sufficient hysterisis to prevent supply noise or ripple from affecting the reverse
current blocking response. The recovery from reverse current blocking is very fast (tSWRCB). This ensures
minimum supply droop which is helpful in applications such as supply MUXing/ORing and USB Fast Role Swap
(FRS).
VFWD
IN OUT
IN OUT
BFET operating state
Linear ORing loop response BFET turned OFF BFET regulation BFET full conduction
RCB fast comparator response BFET fast disable BFET fast enable
(RCB entry) (RCB exit)
VIN - VOUT VREVTH 0V VFWD VFWTH
IIN Reverse 0A Forward
Figure 8-13. Reverse Current Blocking Response
The waveforms below illustrate the reverse current blocking performance in various scenarios.

TPS25947
During fast voltage step at output (for example. hot-plug), the fast comparator based reverse blocking
mechanism ensures minimum jump/glitch on the input rail.
VIN
VOUT
FLTb
IIN
Figure 8-14. Reverse Current Blocking Performance During Fast Voltage Step at Output
During slow voltage ramp at output, the linear ORing based reverse blocking mechanism ensures there is no DC
current flow from OUT to IN, thereby avoiding input rail from getting slowly charged up to output voltage.
VIN
VOUT
FLTb
IIN
Figure 8-15. Reverse Current Blocking Performance During Slow Voltage Ramp at Output
When the input supply droops or gets disconnected while the output storage element (bulk capacitor or super
capacitor) is charged to the full voltage, the linear ORing scheme minimizes the self-discharge from OUT to IN.
This ensures maximum hold-up time for the output storage element in critical power back-up applications.
It also prevents incorrect supply presence indication in applications which sense the input voltage to detect if the
supply is connected.
VIN
VOUT
AUXOFF
Figure 8-16. Reverse Current Blocking Performance During Input Supply Failure
8.3.8 Overtemperature Protection (OTP)

The device monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the
temperature exceeds a safe operating level (TSD) thereby protecting the device from damage. The device does
not turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD – TSDHYS).
When the TPS25947xL (latch-off variant) detects thermal overload, it is shut down and remain latched-off until
the device is power cycled or re-enabled. When the TPS25947xA (auto-retry variant) detects thermal overload, it
remains off until it has cooled down by TSDHYS. Thereafter, the device remains off for an additional delay of tRST
after which it automatically retries to turn on if it is still enabled.

TPS25947
Table 8-2. Thermal Shutdown

Device Enter TSD Exit TSD
TJ < TSD – TSDHYS
TPS25947xL (Latch-Off) TJ ≥ TSD VIN cycled to 0 V and then above VUVP(R) OR
EN/UVLO toggled below VSD(F)
TJ < TSD – TSDHYS
VIN cycled to 0 V and then above VUVP(R) OR
TPS25947xA (Auto-Retry) TJ ≥ TSD
EN/UVLO toggled below VSD(F) OR tRST timer
expired
8.3.9 Fault Response and Indication (FLT)

The following table summarizes the device response to various fault conditions. Additionally, an active low
external fault indication (FLT) pin is available on the TPS259470x variants.
Table 8-3. Fault Summary
Event Protection Response Fault Latched Internally FLT Pin Status (1) FLT Assertion Delay(1)
Overtemperature Shutdown Y L
Undervoltage (UVP or
Shutdown N H
UVLO)
Input Reverse Polarity Shutdown N H
Shutdown(1) (2) N H
Input Overvoltage
Voltage Clamp(2) N N/A
Transient Overcurrent (ILIM

None N N
< IOUT < 2 × ILIM)
Persistent Overcurrent Circuit Breaker(3) Y N/A
Persistent Overcurrent Current Limit(4) N L tITIMER
Output Short-Circuit to Circuit Breaker followed by

N H
GND Current Limit
ILM Pin Open

Shutdown N L tITIMER
(During Steady State)
ILM Pin Shorted to GND Shutdown Y L tITIMER
Reverse Current ((VOUT –

Reverse Current Blocking N L
VIN) > VREVTH)
(1) Applicable to TPS259470x variants only.

(4) Applicable to TPS259470x/2x variants only.
Faults which are latched internally can be cleared either by power cycling the part (pulling VIN to 0 V) or by
pulling the EN/UVLO pin voltage below VSD. This also releases the FLT pin for the TPS259470x variants and
resets the tRST timer for the TPS25947xA (auto-retry) variants.
During a latched fault, pulling the EN/UVLO just below the UVLO threshold has no impact on the device. This is
true for both TPS25947xL (latch-off) and TPS25947xA (auto-retry) variants.
For TPS25947xA (auto-retry) variants, on expiry of the tRST timer after a fault, the device restarts automatically
and the FLT pin is de-asserted (TPS259470A variant).
8.3.10 Auxiliary Channel Control (AUXOFF)
The TPS259470x variants provide an active high digital output (AUXOFF) which is asserted to indicate when
the priority input supply is in a valid range (above UVP/UVLO and below OVLO thresholds) and the device has

TPS25947
successfully completed its inrush sequence. The AUXOFF pin is an open-drain signal which must be pulled up to
an external supply.
After power up, AUXOFF pin is pulled low initially. The device initiates a inrush sequence in which the HFET is
turned on in a controlled manner. When the FET gate voltage has reached the full overdrive indicating that the
inrush sequence is complete and device is capable of delivering full power, the AUXOFF pin is asserted high.
Thereafter, the AUXOFF pin is de-asserted only if the input supply becomes invalid (below UVP/UVLO or above
OVLO thresholds). No load side events/faults have any control over the AUXOFF de-assertion.
This pin is used to control the auxiliary channel when 2 TPS259470x devices are connected in a priority power
MUX configuration. It can also be used as a supply valid status indication to the downstream load or system
supervisor.
Table 8-4. TPS259470x AUXOFF Indication Summary
Event AUXOFF Pin
Undervoltage (UVP or UVLO) L
Input Reverse Polarity L
Overvoltage (OVLO) L
Inrush L
Steady State H
Overcurrent H
Short-Circuit H
ILM Pin Open H
ILM Pin Shorted to GND H
Reverse current ((VOUT – VIN) > VREVTH) H
Overtemperature H
When there is no supply to the device, the AUXOFF pin is expected to stay low. However, there is no active
pull-down in this condition to drive this pin all the way down to 0 V. If the AUXOFF pin is pulled up to an
independent supply which is present even if the device is unpowered, there can be a small voltage seen on this
pin depending on the pin sink current, which is a function of the pull-up supply voltage and resistor. Minimize
the sink current to keep this pin voltage low enough not to be detected as a logic HIGH by associated external
circuits in this condition. This also ensures that the auxiliary channel is not turned off inadvertently in a priority
power MUX configuration.
8.3.11 Power Good Indication (PG)
The TPS259472x, TPS259474x variants provide an active high digital output (PG) which serves as a power
good indication signal and is asserted high depending on the voltage at the PGTH pin along with the device
state information. The PG is an open-drain pin and must be pulled up to an external supply.
After power up, PG is pulled low initially. The device initiates a inrush sequence in which the HFET is turned
on in a controlled manner. When the HFET gate voltage reaches the full overdrive indicating that the inrush
sequence is complete and the voltage at PGTH is above VPGTH(R), the PG is asserted after a de-glitch time
(tPGA).
PG is de-asserted if at any time during normal operation, the voltage at PGTH falls below VPGTH(F), or the device
detects a fault (except overcurrent). The PG de-assertion de-glitch time is tPGD.

TPS25947
Device Enabled Overload Event Overload Removed

Overcurrent blanking
timer expired
VUVLO(R)
EN/UVLO
0
IN
Slew rate (dVdt) controlled
0 startup/Inrush current limiting
VIN Active Current

limiting (1)
OUT
0
VPGTH(R)
VPGTH(F)
PGTH
0
VPG
PG tPGA tPGD tPGA
0
VIN
dVdt
VOUT + 2.8V
VHGate
tITIMER
0
ILIM
IINRUSH
IOUT
0
(1) Time
Applicable to TPS259472x only
Figure 8-17. TPS259472x, TPS259474x PG Timing Diagram
Table 8-5. TPS259472x, TPS259474x PG Indication Summary

Event Protection Response PG Pin PG Delay
Undervoltage (UVP or UVLO) Shutdown L
Input Reverse Polarity Shutdown L
H (If PGTH pin voltage >

Overvoltage (OVC) VPGTH(R)) tPGA
Clamp
(TPS259472x only) L (If PGTH pin voltage < tPGD
VPGTH(F))
Overvoltage (OVLO) L (If PGTH pin voltage <

Shutdown tPGD
(TPS259474x only) VPGTH(F))

TPS25947
Table 8-5. TPS259472x, TPS259474x PG Indication Summary (continued)

Event Protection Response PG Pin PG Delay

VPGTH(R)) tPGA
Steady State NA
L (If PGTH pin voltage < tPGD
VPGTH(F))

VPGTH(R)) tPGA
Transient overcurrent NA
VPGTH(F))

Persistent overload (TPS259472x VPGTH(R)) tPGA
Current Limiting
only) L (If PGTH pin voltage < tPGD
VPGTH(F))
Persistent overload (TPS259474x

Shutdown L
only)

VPGTH(R)) tPGA
Output Short-Circuit to GND Fast trip followed by Current Limit
VPGTH(F))
L (If PGTH pin voltage <

ILM Pin Open Shutdown tPGD
VPGTH(F))
L (If PGTH pin voltage <

ILM Pin Shorted to GND Shutdown tPGD
VPGTH(F))
Reverse current ((VOUT – VIN) >

Reverse current blocking L tPGD
VREVTH)
Overtemperature Shutdown L
When there is no supply to the device, the PG pin is expected to stay low. However, there is no active pull-down
in this condition to drive this pin all the way down to 0 V. If the PG pin is pulled up to an independent supply
which is present even if the device is unpowered, there can be a small voltage seen on this pin depending on the
pin sink current, which is a function of the pull-up supply voltage and resistor. Minimize the sink current to keep
this pin voltage low enough not to be detected as a logic HIGH by associated external circuits in this condition.
8.4 Device Functional Modes
Table 8-6. TPS259472x Overvoltage Clamp Threshold Selection
OVCSEL Pin Connection Overvoltage Clamp Threshold
Shorted to GND 3.8 V
Open 5.7 V
Connected to GND through a 390-kΩ resistor 13.8 V

TPS25947
9 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information

The TPS25947xx is a 2.7-V to 23-V, 5.5-A eFuse that is typically used for power rail protection applications.
The device operates from 2.7 V to 23 V with adjustable overvoltage and undervoltage protection. The device
provides ability to control inrush current and protection against input reverse polarity as well as reverse current
conditions. The device can be used in a variety of systems such as adapter input protection, USB PD port
protection, server/PC motherboard/add-on cards, enterprise storage – RAID/HBA/SAN/eSSD, monitors, docks.
The design procedure explained in the subsequent sections can be used to select the supporting component
values based on the application requirement. Additionally, a spreadsheet design tool, TPS25947xx Design
Calculator, is available in the web product folder.
9.2 Single Device, Self-Controlled
VIN = 2.7 to 23 V IN OUT VOUT VIN = 2.7 to 23 V IN OUT VOUT
VLOGIC COUT COUT
EN/UVLO EN/UVLO PGTH VLOGIC

TPS259470x TPS259472x
AUXOFF
OVLO FLT OVCSEL PG

ITIMER dVdt GND ILM ITIMER dVdt GND ILM
VIN = 2.7 to 23 V IN OUT VOUT
COUT
EN/UVLO PGTH VLOGIC

TPS259474x
OVLO PG
ITIMER dVdt GND ILM
Figure 9-1. Single Device, Self-Controlled
Other variations:
In a Host MCU controlled system, EN/UVLO or OVLO can also be driven from the host GPIO to control the
device.
ILM pin can be connected to the MCU ADC input for current monitoring purpose.

TPS25947
Note
TI recommends to keep parasitic capacitance on ILM pin below 50 pF to ensure stable operation.
For the TPS259472x/4x variants, either VIN or VOUT can be used to drive the PGTH resistor divider depending
on which supply must be monitored for power good indication.
9.3 Typical Application
TPS259474x can be used for PCIe card input power protection. A full-sized ×16 graphics card can draw up to
5.5 A at +12 V (66 W). A typical PCIe slot has the capacity of providing current up to 6 A. During overcurrent
or short-circuit event at load side, TPS259474x can quickly respond to this fault event by turning off the device
and thus protect the load from damage as well as prevent input supply from drooping. The ITIMER feature
allows short duration peak currents to pass through without tripping the eFuse, thereby meeting the transient
load current profile of graphics cards.
VIN = 12 V VOUT
IN OUT
R1 R4
COUT
470 k 47 k
F
D2*
EN/UV LO PGTH
3.3 V
TPS25 9474L
R2 R5
11 k 5.6 k
D1* CIN 47 k
F
OVL O
PG
R3 RILM
CITIMER CdVd t
47 k
2.2 nF 330 0 p F
* Optional circuit components needed for transient protection depending on input and output inductance. Please
refer to Transient Protection section for details.
Figure 9-2. PCIe Card Input Power Protection
9.3.1 Design Requirements

Table 9-1. Design Parameters
PARAMETER VALUE
Input supply voltage (VIN) 12 V
Undervoltage threshold (VIN(UV)) 10.8 V
Overvoltage threshold (VIN(OV)) 13.2 V
Output power good threshold (VPG) 11.4 V
Max continuous current 5.5 A
Load transient blanking interval (tITIMER) 2 ms
Output capacitance (COUT) 470 μF
Output rise time (tR) 20 ms

TPS25947
Table 9-1. Design Parameters (continued)

PARAMETER VALUE
Overcurrent threshold (ILIM) 6A
Overcurrent response Circuit breaker
Fault response Latch-off
9.3.2 Detailed Design Procedure

9.3.2.1 Device Selection
Because the application requires circuit-breaker response to overcurrent with latch-off response after a fault, the
TPS259474L variant is selected after refering to the Device Comparison Table.
9.3.2.2 Setting Undervoltage and Overvoltage Thresholds
The supply undervoltage and overvoltage thresholds are set using the resistors R1, R2 and R3 whose values
can be calculated using Equation 10 and Equation 11:
VUVLO(R) × (R1 + R2 + R3)

VIN(UV) =
R2 + R3 (10)
VOV(R) × (R1 + R2 + R3)

VIN(OV) =
R3 (11)
Where VUVLO(R) is the UVLO rising threshold and VOV(R) is the OVLO rising threshold. Because R1, R2 and R3
leak the current from input supply VIN, these resistors must be selected based on the acceptable leakage current
from input power supply VIN. The current drawn by R1, R2 and R3 from the power supply is IR123 = VIN / (R1 +
R2 + R3). However, leakage currents due to external active components connected to the resistor string can add
error to these calculations. So, the resistor string current, IR123 must be chosen to be 20 times greater than the
leakage current expected on the EN/UVLO and OVLO pins.
From the device electrical specifications, both the EN/UVLO and OVLO leakage currents are 0.1 μA (maximum),
VOV(R) = 1.2 V and VUVLO(R) = 1.2 V. From design requirements, VIN(OV) = 13.2 V and VIN(UV) = 10.8 V. To solve
the equation, first choose the value of R1 = 470 kΩ and use the above equations to solve for R2 = 10.7 kΩ and
R3 = 48 kΩ.
Using the closest standard 1% resistor values, we get R1 = 470 kΩ, R2 = 11 kΩ, and R3 = 47 kΩ.
9.3.2.3 Setting Output Voltage Rise Time (tR)
For a successful design, the junction temperature of device must be kept below the absolute maximum rating
during both dynamic (start-up) and steady-state conditions. Dynamic power stresses often are an order of
magnitude greater than the static stresses, so it is important to determine the right start-up time and inrush
current limit required with system capacitance to avoid thermal shutdown during start-up.
The slew rate (SR) needed to achieve the desired output rise time can be calculated as:
VIN (V) 12 V
SR (V/ms) = = = 0.6 V/ms
tR (ms) 20 ms (12)
The CdVdt needed to achieve this slew rate can be calculated as:
2000 2000
CdVdt :pF; = = = 3333 pF
SR :V/ms; 0.6 (13)
Choose the nearest standard capacitor value as 3300 pF.

For this slew rate, the inrush current can be calculated as:

TPS25947
IINRUSH :mA; = SR (V/ms) × COUT :µF; = 0.6 × 470 = 282 mA (14)
The average power dissipation inside the part during inrush can be calculated as:
IINRUSH :A; × VIN :V; 0.282 × 12

PDINRUSH :W; = = = 1.69 W
2 2 (15)
For the given power dissipation, the thermal shutdown time of the device must be greater than the ramp-up time
tR to avoid start-up failure. Figure 9-3 shows the thermal shutdown limit, for 1.69 W of power, the shutdown time
is more than 10 s which is very large as compared to tR = 20 ms. Therefore, it is safe to use 20 ms as the startup
time for this application.
Figure 9-3. Thermal Shut-Down Plot During Inrush
9.3.2.4 Setting Power Good Assertion Threshold

The Power Good assertion threshold can be set using the resistors R4 and R5 connected to the PGTH pin
whose values can be calculated as:
VPGTH(R) × (R4 + R5)

VPG =
R5 (16)
Because R4 and R5 leak the current from the output rail VOUT, these resistors must be selected to minimize
the leakage current. The current drawn by R4 and R5 from the power supply is IR45 = VOUT / (R4 + R5).
However, leakage currents due to external active components connected to the resistor string can add error to
these calculations. So, the resistor string current, IR123 must be chosen to be 20 times greater than the PGTH
leakage current expected.
From the device electrical specifications, PGTH leakage current is 1 μA (maximum), VPGTH(R) = 1.2 V and from
design requirements, VPG = 11.4 V. To solve the equation, first choose the value of R4 = 47 kΩ and calculate R5
= 5.52 kΩ. Choose nearest 1% standard resistor value as R5 = 5.6 kΩ.
9.3.2.5 Setting Overcurrent Threshold (ILIM)
The overcurrent protection (Circuit Breaker) threshold can be set using the RILM resistor whose value can be
calculated as:
3334 3334
RILM :À; = = = 555.6 À
ILIM :A; 6A (17)
Choose nearest 1% standard resistor value as 549 Ω.

TPS25947
9.3.2.6 Setting Overcurrent Blanking Interval (tITIMER)

The overcurrent blanking timer interval can be set using the CITIMER capacitor whose value can be calculated as:
tITIMER (ms) × IITIMER (µA) 2 × 1.8

CITIMER (nF) = = = 2.38 nF
¿VITIMER (V) 1.51 (18)
Choose nearest standard capacitor value as 2.2 nF.

9.3.3 Application Curves
Figure 9-5. Transient Overload

Figure 9-4. Power Up
Figure 9-6. Circuit Breaker Response
9.4 Active ORing

A typical redundant power supply configuration is shown in Figure 9-7 below. Schottky ORing diodes have been
popular for connecting parallel power supplies, such as parallel operation of wall adapter with a battery or a
hold-up storage capacitor. The disadvantage of using ORing diodes is high voltage drop and associated power
loss. The TPS259470x/4x with integrated, low-ohmic, back-to-back FETs provide a simple and efficient solution.
Figure 9-7 below shows the Active ORing implementation using TPS249474x devices.

TPS25947
IN OUT
VIN1 VOUT
VLOGIC COUT
EN/UVLO PGTH
TPS259474x
OVLO
PG PG_SYS
ITIMER dVdt GND ILM
VIN1 VIN2
Hotswap
protection
IN OUT
VIN2
VLOGIC
EN/UVLO PGTH
TPS259474x
OVLO
PG
ITIMER dVdt GND ILM
Figure 9-7. Two Devices, Active ORing Configuration
The linear ORing mechanism in TPS25947xx ensures that there's no reverse current flowing from one power
source to the other during fast or slow ramp of either supply.
The following waveform illustrates the active ORing behavior when the supply rails are being ramped up
sequentially.
VIN1
VIN2
VOUT
IOUT
Figure 9-8. Active ORing Response
VIN1
VIN2
VOUT
PG1
Figure 9-9. Active ORing Response
When the bus voltages (IN1 and IN2) are matched, device in each path sees a forward voltage drop and is
ON delivering the load current. During this period, current is shared between the rails in the ratio of differential
voltage drop across each device.

TPS25947
In addition to supply ORing, the devices protect the system from overvoltage, excessive inrush current, overload
and short-circuit faults at all times.
Note
1. The TPS259472x (OVC variants) are not recommended for use in ORing applications. While the
device is in clamping state, if the output is forced to a higher voltage by the other channel, the
device can get damaged.
2. ORing can be done either between two similar rails or between dissimilar rails. For ORing
cases with skewed voltage combinations, care must be taken to design circuit components on
PGTH/EN/OVLO pins for the lower voltage channel devices such that the Absolute maximum
ratings on those pins are not exceeded when higher voltage is present on the other channel. Also,
the dVdt pin capacitor rating must be chosen based on the highest of the 2 supplies. Refer to
Recommended Operating Conditions table for more details.
9.5 Priority Power MUXing

Applications having two energy sources such as PCIe cards, Tablets and Portable battery powered equipment
require preference of one source to another. For example, mains power (wall-adapter) has the priority over the
internal battery back-up power. These applications demand for switchover from mains power to backup power
only when main input voltage falls below a user defined threshold. The TPS25947xx devices provide a simple
solution for priority power multiplexing needs.
Figure 9-10 below shows a typical priority power multiplexing implementation using TPS259470x devices. When
primary (priority) power source (IN1) is present and within the valid range (not in UV/OV condition), the primary
path device path powers the OUT bus irrespective of whether auxiliary supply voltage (VIN2) is greater than,
equal to or less than primary supply voltage (VIN1). The device in auxiliary path is held in off condition by forcing
its OVLO pin to high using the AUXOFF signal from the primary path device.
After the primary supply voltage falls outside the user-defined valid operating range (UV/OV condition), the
primary path device de-asserts the AUXOFF which signals the auxiliary path device to turn on and the system
starts operating from the auxiliary supply. During this transition, the auxiliary path device bypasses its dVdt
limited startup and performs a fast recovery to start delivering power within tSWOV.
When the primary supply is restored, the primary path device turns on fully at a defined slew rate and then
asserts its AUXOFF pin high to turn the auxiliary path device off, allowing a seamless transition from auxiliary to
the primary supply with minimal output voltage droop and with no shoot-through current.
A key consideration in power MUXing applications is the minimum voltage the output bus droops to during the
switchover from one supply to another. This in turn depends on multiple factors including the output load current
(ILOAD), output bus hold-up capacitance (COUT) and switchover time (tSW).
While switching from primary supply (VIN1) to auxiliary supply (VIN2), the minimum bus voltage can be calculated
using Equation 19. Here, the switchover time (tSW) is equal to the fast OVLO recovery time (tSWOV) taken by the
TPS259470x variants to turn on fully and start delivering current to the load.
t SW V u , LOAD $
V OUT min V min V IN1,V IN2
COUT ) (19)
While switching from auxiliary supply (VIN2) to primary supply (VIN1), the minimum bus voltage can be calculated
using Equation 20. Here the maximum switchover time is equal to the RCB recovery time (tSWRCB), depending
on whether VIN1 is equal to or lower than VIN2 to start with.
t SWRCB V u , LOAD $
V OUT min V min VIN1,V IN2 V FWDTH V
COUT ) (20)

TPS25947
The AUXOFF pins of the devices can be used as a digital indication to identify which of the 2 supplies is active
and delivering power to the load.
IN OUT
VIN1 VOUT
COUT
VLOGIC
EN/UVLO
TPS259470x
FLT
OVLO
ITIMER dVdt GND ILM AUXOFF IN1 supply active
IN OUT
VIN2
VLOGIC
EN/UVLO
TPS259470x
FLT
AUXOFF IN2 supply active
OVLO ITIMER dVdt GND ILM
Figure 9-10. Priority Power MUXing with 2 × TPS259470x - Option 1
This configuration provides the most compact priority power MUXing solution with multiple benefits, including
active current limit protection on both channels as well as overvoltage protection on primary channel. It also
provides the fastest switchover time from primary to auxiliary, but at the cost of a slightly increased quiescent
current on the auxiliary path while primary path is active. Also, it uses the fewest external components, but at the
cost of bypassing overvoltage protection on auxiliary channel.
The following waveforms illustrate the TPS259470x performance in a priority power MUXing configuration.

TPS25947
VIN1
VOUT
VIN2
IOUT
Figure 9-11. TPS259470x Power MUX - Switchover from Primary to Auxiliary Supply
VIN1
VIN2
VOUT
IOUT
Figure 9-12. TPS259470x Power MUX - Switchover from Auxiliary to Primary Supply
There's a possible variation to the above configuration in case overvoltage protection is needed on both
channels. This needs an additional signal N-FET to drive the OVLO pin of the auxiliary path device as shown in
Figure 9-13 below. The switchover times are similar to the previous configuration.

TPS25947
IN OUT
VIN1 VOUT
COUT
VLOGIC
EN/UVLO
TPS259470x
FLT
OVLO
IN OUT
VIN2
VLOGIC
EN/UVLO
TPS259470x
FLT
OVLO
Another variation of the previous configuration ensures minimum quiescent current on the auxiliary chanel while
primary channel is active, but at the cost of additional N-FET to drive the EN/UVLO pin of auxiliary path device
as shown in Figure 9-14 below. At the same time, it has a higher switchover delay from primary to auxiliary
supply as compared to the previous configuration.

TPS25947
IN OUT
VIN1 VOUT
COUT
VLOGIC
EN/UVLO
TPS259470x
FLT
OVLO
IN OUT
VIN2
VLOGIC
EN/UVLO
TPS259470x
FLT
OVLO
While switching from a higher supply rail to lower supply rail, the minimum bus voltage can be calculated using
Equation 21. Here, the switchover time is equal to the time taken by the device to come out of reverse current
blocking state (tSWRCB).
t SWRCB V u , LOAD $
V OUT min V min VIN1,V IN2 V FWDTH V
COUT ) (21)
While switching from a lower supply rail to higher supply rail, the minimum bus voltage can be calculated using
Equation 22. Here, the switchover time (tSW) is the time taken by the device to turn on fully and start delivering

TPS25947
current to the load, which is equal to the device turn-on time (tON), which in turn includes the turn-on delay (tD,ON)
and rise time (tR) determined by the dVdt capacitor (CdVdt) and bus voltage.
t SW V u , LOAD $
COUT ) (22)
All the preceding configurations provide a priority power MUXing solution with active current limit protection
response. In case circuit breaker response is prefered, it is possible to implement a solution using TPS259474x
devices as shown in Figure 9-15 below. Here, the EN/UVLO signal of the primary path device is used to control
the OVLO of the auxiliary path device. This ensures that auxiliary path device is turned on only when the primary
supply falls below a user-defined undervoltage (UVLO) threshold. In this configuration, supply overvoltage
protection is not available on both channels. The PG pins of the devices can be used as a digital indication to
identify which of the 2 supplies is active and delivering power to the load.

TPS25947
IN OUT
VIN1 VOUT
COUT
VLOGIC
EN/UVLO
PGTH TPS259474x
OVLO
ITIMER dVdt GND ILM PG IN1 supply active
IN OUT
VIN2
VLOGIC
EN/UVLO
TPS259474x
PGTH
OVLO ITIMER dVdt GND ILM PG IN2 supply active
Figure 9-15. Priority power MUXing with 2 × TPS259474x
While switching from one supply rail to the other, the minimum bus voltage can be calculated using Equation 23.
Here, the maximum switchover time (tSW) is the time taken by the device to turn on and start delivering power to
the load, which is equal to the device turn-on time (tON), which in turn includes the turn-on delay (tD,ON) and rise
time (tR) determined by the dVdt capacitor (CdVdt) and bus voltage.
t SW V u , LOAD $
COUT ) (23)

TPS25947
Note
1. The TPS259472x (OVC variants) are not recommended for use in power MUXing or ORing
applications. While the device is in clamping state, if the output is forced to a higher voltage by the
other channel, the device can get damaged.
2. Power MUXing can be done either between two similar rails (such as 12-V Primary and 12-V Aux,
3.3-V Primary and 3.3-V Aux) or between dissimilar rails (such as 12-V Primary and 5-V Aux or
vice versa).
3. For power MUXing cases with skewed voltage combinations, care must be taken to design
circuit components on PGTH/EN/OVLO pins for the lower voltage channel devices such that the
Absolute maximum ratings on those pins are not exceeded when higher voltage is present on the
other channel. Also, the dVdt pin capacitor rating must be chosen based on the highest of the 2
supplies. Refer to Recommended Operating Conditions table for more details.
9.6 USB PD Port Protection

End equipments like PC, Notebooks, Docking Stations, Monitors etc.. have USB PD ports which can be
configured as DFP (Source), UFP (Sink) or DRP (Source+Sink). TPS259470x can be used independently or
in conjunction with LM73100 to handle the power path protection requirements of USB PD ports as shown in
Figure 9-16 below.
TPS259470x provides Overcurrent and Short-Circuit protection in the source path, while blocking any reverse
current from the port to the internal source power rail. The fast recovery (tSWRCB) from reverse current blocking
ensures minimum supply droop during Fast Role Swap (FRS) events. The PD controller can also use the OVLO
pin as an active low enable signal to control the power path. Holding the OVLO pin high keeps the device in
OFF state in sink mode and blocks current in both directions. After the PD controller determines the need to
start sourcing power, it can pull the OVLO pin low to trigger a fast recovery from OFF to ON state within tSWOV,
meeting the FRS timing requirements.
The LM73100 provides overvoltage protection on the sink path, while blocking reverse current from internal sink
rail to the port.
The linear ORing mechanism in TPS259470x and LM73100 ensures that there's no reverse current flowing from
one power source to the other during fast or slow ramp of either supply.

TPS25947
VOUT = 5 V to 20 V OUT IN
IMON OVLO
LM73100
PGTH
dVdt GND PG EN/UVLO

VBUS = 5 V to 20V
CDVDT
PD Controller
EN/UVLO OVLO FLT
VIN = 5 V to 20 V IN OUT
TPS259470L
AUXOFF
ITIMER dVdt GND ILM
CITIMER CDVDT RILM
Figure 9-16. USB PD Port Protection
The waveform below shows the TPS259470x behavior when a 20-V source connected at the USB bus is
suddenly disconnected. The TPS259470x is initially in reverse current blocking condition. As the bus voltage
starts drooping, the TPS259470x exits the condition and performs a fast charge to restore the bus voltage above
vSafe5V(min) within tSWRCB, thereby meeting the USB FRS (Fast Role Swap) requirements.

TPS25947
VIN
VOUT
IIN
VIN = 5 V, COUT = 10 μF, ROUT = 8 Ω, VOUT = 20 V initially and then disconnected
Figure 9-17. TPS259470x 5-V Source Path - USB Fast Role Swap Response
9.7 Parallel Operation

Applications which need higher steady current can use 2 TPS25947xx devices connected in parallel as shown in
Figure 9-18 below. In this configuration, the first device turns on initially to provide the inrush current limiting. The
second device is held in an OFF state by driving its EN/UVLO pin low using the AUXOFF/PG signal of the first
device. After the inrush sequence is complete, the first device asserts its AUXOFF/PG pin high and turns on the
second device. The second device asserts its AUXOFF/PG signal to indicate when it has turned on fully, thereby
indicating to the system that the parallel combination is ready to deliver the full steady state current.
After in steady state, both devices share current nearly equally. There can be a slight skew in the currents
depending on the part-to-part variation in the RON as well as the PCB trace resistance mismatch.

TPS25947
IN OUT
VLOGIC
EN/UVLO
TPS259470x
AUXOFF
OVLO
FLT
ITIMER dVdt GND ILM VOUT
VIN = 2.7 to 23 V
COUT
IN OUT
EN/UVLO
TPS259470x
To
AUXOFF downstream
enable
OVLO FLT
ITIMER dVdt GND ILM
Figure 9-18. Two Devices Connected in Parallel for Higher Steady State Current Capability
The waveforms below illustrate the behavior of the parallel configuration during start-up as well as during steady
state.

TPS25947
VIN
VOUT
AUXOFF1
AUXOFF2
Figure 9-19. Parallel Devices Sequencing During Start-Up
VIN
VOUT
IIN1
IIN2
Figure 9-20. Parallel Devices Load Current During Steady State

TPS25947
10 Power Supply Recommendations

The TPS25947xx devices are designed for a supply voltage range of 2.7 V ≤ VIN ≤ 23 V. TI recommends an
input ceramic bypass capacitor higher than 0.1 μF if the input supply is located more than a few inches from
the device. The power supply must be rated higher than the set current limit to avoid voltage droops during
overcurrent and short-circuit conditions.
The lowest negative voltage the device can handle at the input is limited to –15 V or VOUT –21 V, whichever
is higher. Any low voltage signals (for example. EN/UVLO, OVLO, PGTH) derived from the input supply must
have a sufficiently large pull-up resistor to limit the current through those pins to < 10 μA during reverse polarity
conditions. Please refer to Absolute Maximum Ratings table for more details.
10.1 Transient Protection

In the case of a short-circuit and overload current limit when the device interrupts current flow, the input
inductance generates a positive voltage spike on the input, and the output inductance generates a negative
voltage spike on the output. The peak amplitude of voltage spikes (transients) is dependent on the value of
inductance in series to the input or output of the device. Such transients can exceed the absolute maximum
ratings of the device if steps are not taken to address the issue. Typical methods for addressing transients
include:
• Minimize lead length and inductance into and out of the device.
• Use a large PCB GND plane.
• Connect a Schottky diode from the OUT pin ground to absorb negative spikes.
• Connect a low ESR capacitor larger than 1 μF at the OUT pin very close to the device.
• Use a low-value ceramic capacitor CIN = 1 μF to absorb the energy and dampen the transients. The capacitor
voltage rating must be atleast twice the input supply voltage to be able to withstand the positive voltage
excursion during inductive ringing.
The approximate value of input capacitance can be estimated with Equation 24:
VSPIKE(Absolute) = VIN + ILOAD × ¨

LIN
CIN
(24)
where
– VIN is the nominal supply voltage.
– • ILOAD is the load current.
– LIN equals the effective inductance seen looking into the source.
– CIN is the capacitance present at the input.
• Some applications can require the addition of a Transient Voltage Suppressor (TVS) to prevent transients
from exceeding the absolute maximum ratings of the device. In some cases, even if the maximum amplitude
of the transients is below the absolute maximum rating of the device, a TVS can help to absorb the excessive
energy dump and prevent it from creating very fast transient voltages on the input supply pin of the IC, which
can couple to the internal control circuits and cause unexpected behavior.
Note
If there is a likelihood of input reverse polarity in the system, TI recommends to use a bi-directional
TVS, or a reverse blocking diode in series with the TVS.
• For applications such as USB-C ports where a powered cable can be plugged to the output of the device,
there can be excess voltage stress from OUT to IN which exceeds the absolute maximum rating of the
device. TI recommends to add a TVS diode from OUT to IN to clamp the voltage to a safe level.
The circuit implementation with optional protection components is shown in Figure 10-1.

TPS25947
D3 D4
VIN = 2.7 to 23 V VOUT

IN OUT
R1 COUT
D2
EN/UV LO
TPS25 9470x
R2
D1 CIN AUXOFF
OVL O
FLT
R3 RILM
CITIMER CDVD T
Figure 10-1. Circuit Implementation with Optional Protection Components
10.2 Output Short-Circuit Measurements

It is difficult to obtain repeatable and similar short-circuit testing results. The following contribute to variation in
results:
• Source bypassing
• Input leads
• Circuit layout
• Component selection
• Output shorting method
• Relative location of the short
• Instrumentation
The actual short exhibits a certain degree of randomness because it microscopically bounces and arcs. Ensure
that configuration and methods are used to obtain realistic results. Do not expect to see waveforms exactly like
those in this data sheet because every setup is different.

TPS25947
11 Layout
11.1 Layout Guidelines
• For all applications, TI recommends a ceramic decoupling capacitor of 0.1 μF or greater between the IN
terminal and GND terminal.
• The optimal placement of the decoupling capacitor is closest to the IN and GND terminals of the device. Care
must be taken to minimize the loop area formed by the bypass-capacitor connection, the IN terminal, and the
GND terminal of the IC.
• High current-carrying power-path connections must be as short as possible and must be sized to carry at
least twice the full-load current.
• The GND terminal must be tied to the PCB ground plane at the terminal of the IC with the shortest possible
trace. The PCB ground must be a copper plane or island on the board. TI recommends to have a separate
ground plane island for the eFuse. This plane doesn't carry any high currents and serves as a quiet ground
reference for all the critical analog signals of the eFuse. The device ground plane must be connected to the
system power ground plane using a star connection.
• The IN and OUT pins are used for heat dissipation. Connect to as much copper area on top and bottom
PCB layers using as possible with thermal vias. The vias under the device also help to minimize the voltage
gradient accross the IN and OUT pads and distribute current unformly through the device, which is essential
to achieve the best on-resistance and current sense accuracy.
• Locate the following support components close to their connection pins:
– RILM
– CdVdT
– CITIMER
– Resistors for the EN/UVLO, OVLO/OVCSEL and PGTH pins
• Connect the other end of the component to the GND pin of the device with shortest trace length. The trace
routing for the RILM, CITIMER and CdVdt components to the device must be as short as possible to reduce
parasitic effects on the current limit , overcurrent blanking interval and soft start timing. TI recommends to
keep parasitic capacitance on ILM pin below 50 pF to ensure stable operation. These traces must not have
any coupling to switching signals on the board.
• Because the bias current on ILM pin directly controls the overcurrent protection behavior of the device, the
PCB routing of this node must be kept away from any noisy (switching) signals.
• Protection devices such as TVS, snubbers, capacitors, or diodes must be placed physically close to the
device they are intended to protect. These protection devices must be routed with short traces to reduce
inductance. For example, TI recommends a protection Schottky diode to address negative transients due
to switching of inductive loads. TI recommends to add a ceramic decoupling capacitor of 1 μF or greater
between OUT and GND. These components must be physically close to the OUT pins. Care must be taken to
minimize the loop area formed by the Schottky diode/bypass-capacitor connection, the OUT pin and the GND
terminal of the IC.

TPS25947
11.2 Layout Example
Inner GND layer IN OUT
Power layer
Top layer
10
7
6
4
Figure 11-1. Layout Example - Single TPS259474x with PGTH Referred to OUT

TPS25947
Inner GND layer IN1 OUT
Power layer
Top layer
10
7
6
4
IN2
1
Figure 11-2. Layout Example - 2 × TPS259470x in PowerMUX Configuration

TPS25947
12 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, TPS25947EVM eFuse Evaluation Board user's guide
• Texas Instruments, TPS25947xx Design Calculator
• Texas Instruments, Fast Role Swap, Linear ORing with TPS25947 and LM73100 in USB Type-C Systems
application brief
• Texas Instruments, eFuses in Smart Electricity Meters application brief
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

TPS25947
13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 13-Sep-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS259470ARPWR ACTIVE VQFN-HR RPW 10 3000 RoHS & Green Call TI | NIPDAU Level-2-260C-1 YEAR -40 to 125 2A9H
TPS259470LRPWR ACTIVE VQFN-HR RPW 10 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 2A8H
TPS259472ARPWR ACTIVE VQFN-HR RPW 10 3000 RoHS & Green Call TI | NIPDAU Level-2-260C-1 YEAR -40 to 125 2ABH
TPS259472LRPWR ACTIVE VQFN-HR RPW 10 3000 RoHS & Green Call TI | NIPDAU Level-2-260C-1 YEAR -40 to 125 2AAH
TPS259474ARPWR ACTIVE VQFN-HR RPW 10 3000 RoHS & Green Call TI | NIPDAU Level-2-260C-1 YEAR -40 to 125 2ADH
TPS259474LRPWR ACTIVE VQFN-HR RPW 10 3000 RoHS & Green Call TI | NIPDAU Level-2-260C-1 YEAR -40 to 125 2ACH
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 13-Sep-2021
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jun-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS259470ARPWR VQFN- RPW 10 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2
HR
TPS259470LRPWR VQFN- RPW 10 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2
HR
HR
HR
HR
HR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jun-2021
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS259470ARPWR VQFN-HR RPW 10 3000 210.0 185.0 35.0
TPS259470LRPWR VQFN-HR RPW 10 3000 210.0 185.0 35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RPW0010A VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
B 2.1 A
1.9
PIN 1 IDENTIFICATION 2.1

1.9
(0.1) TYP
1 MAX
SEATING PLANE
0.05
0.00 0.08 C
2X 1.45
PKG
4X
SQ (0.15) TYP
4X 0.475 2X 0.25
5 6
4
7
4X 0.475 4X 0.35
0.25
0.1 C A B
0.05 C
2.1
2X 1.9 2X 0.45 PKG
4X 0.3
0.2
1 10 0.1 C A B
0.05 C
PIN 1 ID 4X 0.3
(OPTIONAL) 8X 0.5
0.3 2X 0.35 0.2
0.25
0.1 C A B
0.1 C A B
0.05 C
0.05 C 4225183/A 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
(1.8)
(1.45)
4X (0.475)
2X (0.25)
1 10
4X (0.25)
4X
2X (0.225) PKG 2X
(1.75) (2.4)
4X (0.475) 4X (0.3)
7
4
4X
(0.65)
(R0.05) TYP
5 6
2X (0.3) 4X (0.25)
PKG 8X (0.6)
LAND PATTERN EXAMPLE

SCALE: 30X
SOLDER MASK
0.05 MAX 0.05 MIN OPENING
ALL AROUND ALL AROUND
METAL METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
NON- SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS

NOT TO SCALE
4225183/A 08/2019
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
(1.8)
(1.425)
4X (0.4625)
2X (0.25)
METAL TYP
1 10
4X (0.25)
4X
(0.63)
2X PKG
(1.75)
4X (0.225)
4X (0.4625) 4X (0.275)
4X
7 (1.06)
4
4X
(0.65)
(R0.05)
TYP
5 6
4X (0.28) 4X (0.225)
PKG 8X (0.6)
SOLDER PASTE EXAMPLE

BASED ON 0.100 mm THICK STENCIL
PADS 1, 4,7 & 10: 93%; PADS 5 & 6: 82%

SCALE: 30X
4225183/A 08/2019
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
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TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
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Copyright © 2022, Texas Instruments Incorporated

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SLVSFC9B – OCTOBER 2020 – REVISED MARCH 2022

• Power MUX/ORing EN/UV LO

• Adapter input protection

• USB PD protection – PC, notebook, monitors,

CITIMER CDVD T R ILM

Changes from Revision * (October 2020) to Revision A (March 2021) Page

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Product Folder Links: TPS25947

5 Device Comparison Table

TPS259472LRPW (3.8 V/5.7 V/13.8 V) Latch-Off

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

6 Pin Configuration and Functions

Figure 6-1. TPS25947xx RPW Package 10-Pin QFN Top View

Table 6-1. Pin Functions

OUT 6 Power Power output

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Table 6-1. Pin Functions (continued)

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5

7.2 ESD Ratings

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7.3 Recommended Operating Conditions

7.4 Thermal Information

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7.5 Electrical Characteristics

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Product Folder Links: TPS25947

7.5 Electrical Characteristics (continued)

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7.5 Electrical Characteristics (continued)

7.6 Timing Requirements

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7.7 Switching Characteristics

EN/UVLO VUVLO(R) VUVLO(F)

VIN SRON 90%

Figure 7-1. TPS25947xx Switching Times

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7.8 Typical Characteristics

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7.8 Typical Characteristics (continued)

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7.8 Typical Characteristics (continued)

ILIM error (%)

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7.8 Typical Characteristics (continued)

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7.8 Typical Characteristics (continued)

IITIMER (PA) 1.81

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7.8 Typical Characteristics (continued)

2.7 VIN (V)

Temperature Figure 7-35. FLTb Pin Pulldown Resistance vs Temperature

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