EE141
EE141-Fall 2003
Digital Integrated
Circuits
Instructor: Borivoje Nikolić
TuTh 9:30-11
203 McLaughlin
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What is this class all about?
Introduction to digital integrated circuits.
CMOS devices and manufacturing technology.
CMOS inverters and gates. Propagation delay,
noise margins, and power dissipation. Sequential
circuits. Arithmetic, interconnect, and memories.
Design methodologies.
What will you learn?
Understanding, designing, and optimizing digital
circuits with respect to different quality metrics:
cost, speed, power dissipation, and reliability
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Practical Information
Instructor
Prof. Borivoje Nikolic
570 Cory Hall, 643-9297, bora@eecs.berkeley.edu
Office hours: Mo 1pm-2:30pm, Th 1:30-2:30pm
TAs:
Vladimir Petkov, vlpetkov@eecs.berkeley.edu
Nuntachai Poobuapheun, nuntachp@eecs.berkeley.edu
Gang Liu, liugang@eecs.berkeley.edu
Office hours: 353 Cory
Web page:
http://bwrc.eecs.berkeley.edu/Classes/ICDesign/EE141_f03/
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Discussions and Labs
Discussion sessions
M 3-4pm, 285 Cory
F 4-5pm, 203 McLaughlin
Labs (353 Cory)
M 9am-12pm
Tu 9:30am-12:30pm
W 12-3pm
W 3-6pm
F 11am-2pm
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Class Organization
10 Assignments
One design project with three phases
Labs: 6 software, 1 hardware
2 midterms, 1 final
Midterm 1: Thursday, October 2, evening
Midterm 2: Thursday, November 6, evening
Final: December 12, 8-11am
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Grading Policy
Homeworks: 10%
Labs: 10%
Projects: 20%
Midterms: 30%
Final: 30%
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Class Material
Textbook: “Digital Integrated Circuits – A
Design Perspective”, 2nd ed, by J. Rabaey, A.
Chandrakasan, B. Nikolic
Class notes: Web page
Lab Reader:
Available on the web page!
Selected material will be made available from Copy
Central
Check web page for the availability of tools
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The Web Site
Class and lecture notes
Assignments and solutions
Lab and project information
Exams
Many other goodies …
The sole source of information
http://www-inst.eecs.berkeley.edu/~ee141
Print only what you need: Save a tree!
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Software
MicroMagic
Schematic editor: Sue
Layout editor: Max
Online documentation and tutorials
HSPICE and IRSIM for simulation
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Getting Started
Assignment 1: Getting SPICE to work –see
web-page on Thursday
Due next Wednesday, September 3, 5pm
Drop box outside 275 Cory
NO discussion sessions or labs this week.
First discussion sessions in Week 2
First Software Lab in Week 3
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Digital Integrated Circuits
Introduction: Issues in digital design
The CMOS inverter
Combinational logic structures
Sequential logic gates
Design methodologies
Interconnect: R, L and C
Timing
Arithmetic building blocks
Memories and array structures
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Introduction
Why is designing
digital ICs different
today than it was
before?
Will it change in
future?
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The First Computer
The Babbage
Difference Engine
(1832)
25,000 parts
cost: £17,470
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ENIAC - The first electronic computer (1946)
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The Transistor Revolution
First transistor
Bell Labs, 1948
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The First Integrated Circuits
Bipolar logic
1960’s
ECL 3-input Gate
Motorola 1966
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Intel 4004 Micro-Processor
1971
1000 transistors
1 MHz operation
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Intel Pentium (IV) microprocessor
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Moore’s Law
zIn 1965, Gordon Moore noted that the
number of transistors on a chip doubled
every 18 to 24 months.
zHe made a prediction that
semiconductor technology will double its
effectiveness every 18 months
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Moore’s Law
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COMPONENTS PER INTEGRATED FUNCTION
15
14
13
12
LOG2 OF THE NUMBER OF
11
10
9
8
7
6
5
4
3
2
1
0
1959
1960
1961
1962
1963
1964
1965
1966
1967
1968
1969
1970
1971
1972
1973
1974
1975
Electronics, April 19, 1965.
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Evolution in Complexity
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Transistor Counts
1 Billion
K
Transistors
1,000,000
100,000
Pentium® III
10,000 Pentium® II
Pentium® Pro
1,000 Pentium®
i486
100 i386
80286
10 8086
Source: Intel
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1975 1980 1985 1990 1995 2000 2005 2010
Projected
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Moore’s law in Microprocessors
1000
Transistors (MT)
100 2X growth in 1.96 years!
10
P6
Pentium® proc
1 486
386
0.1 286
8085 8086
0.01 8080
8008
4004
0.001
1970 1980 1990 2000 2010
Year
Transistors on Lead Microprocessors double every 2 years
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Die Size Growth
100
Die size (mm)
P6
10 486 Pentium ® proc
386
286
8080 8086
8085 ~7% growth per year
8008
4004 ~2X growth in 10 years
1
1970 1980 1990 2000 2010
Year
Die size grows by 14% to satisfy Moore’s Law
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Frequency
10000
Doubles every
Frequency (Mhz) 1000 2 years
P6
100
Pentium ® proc
486
10 8085 386
8086 286
1 8080
8008
4004
0.1
1970 1980 1990 2000 2010
Year
Lead Microprocessors frequency doubles every 2 years
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Power Dissipation
100
P6
Pentium ® proc
Power (Watts)
10
486
8086 286
386
8085
1 8080
8008
4004
0.1
1971 1974 1978 1985 1992 2000
Year
Lead Microprocessors power continues to increase
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Power will be a major problem
100000
18KW
10000 5KW
Power (Watts) 1.5KW
1000 500W
Pentium® proc
100
286 486
10 8086 386
8085
8080
8008
1 4004
0.1
1971 1974 1978 1985 1992 2000 2004 2008
Year
Power delivery and dissipation will be prohibitive
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Power density
10000
Rocket
Power Density (W/cm2)
Nozzle
1000
Nuclear
Reactor
100
8086
10 4004 Hot Plate P6
8008 8085 386 Pentium® proc
286 486
8080
1
1970 1980 1990 2000 2010
Year
Power density too high to keep junctions at low temp
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Not Only Microprocessors
Cell
Phone
Small Power
Signal RF RF
Digital Cellular Market
(Phones Shipped) Power
Management
1996 1997 1998 1999 2000
Analog
Units 48M 86M 162M 260M 435M Baseband
Digital Baseband
(DSP + MCU)
(data from Texas Instruments)
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Productivity Trends
Logic Transistor per Chip (M)
10,000
10,000,000 100,000
100,000,000
1,000 Logic Tr./Chip 10,000
1,000,000 10,000,000
(K) Trans./Staff - Mo.
Tr./Staff Month.
100
100,000 1,000
1,000,000
Complexity
Productivity
10 58%/Yr. compounded 100
10,000 Complexity growth rate 100,000
1,0001 10
10,000
x x
0.1
100 1
1,000
xx
x 21%/Yr. compound
xx Productivity growth rate
x
0.01
10 0.1
100
0.001
1 0.01
10
1981
1983
1985
1987
1989
1991
1993
1995
1999
2001
2005
2007
1997
2003
2009
Source: Sematech
Complexity outpaces design productivity
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Why Scaling?
Technology shrinks by 0.7/generation
With every generation can integrate 2x more
functions per chip; chip cost does not increase
significantly
Cost of a function decreases by 2x
But …
How to design chips with more and more functions?
Design engineering population does not double every
two years…
Hence, a need for more efficient design methods
Exploit different levels of abstraction
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Design Abstraction Levels
SYSTEM
MODULE
GATE
CIRCUIT
DEVICE
G
S D
n+ n+
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This Class
Introduces basic metrics for design of
integrated circuits – how to measure delay,
power, etc.
Groups layout rectangles into transistors and
wires
Transistors and wires into gates
Gates into functions
Need to verify that the assumptions are valid
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Next Tuesday
Introduces basic metrics for design of
integrated circuits – how to measure
delay, power, cost, etc.
Brief intro to IC manufacturing and
design
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