Assembly

Several simulators ,currently ,available ,that teach computer organization are described in [1, 2, 3]. There are also professional tools, such as debuggers, available for the development ,of assembly ,language ,programs. However, these tools are generally too sophisticated and complex,to meet ,the special needs of introductory-level students. This paper ,describes ,an interactive ,visual learning environment ,EasyCPU especially designed for teaching,Computer

A wide array of lead-free alloys is available in the market and distinguishing one over the other is not an easy task. Several factors have to be considered before making a choice. Reliability under both thermal and mechanical conditions is one such factor. This experimental research aims at making a comparison of the different lead-free solder ball alloys for area

Real Time Operating System (RTOS) is a small operating system designed to manage peripherals and has a low level layer to enhance the parallel execution of multiple programs. In addition, a RTOS main concern is to achieve processing in real time. This paper discusses the development of Real-Time Operating System (RTOS) to be used with the PIC18F microcontroller. The kernel of this RTOS is written in assembly language however the users may use both assembly and C to develop their applications.

Abstract-Fine pitch surface mount devices (SMD's) are becoming more frequently used in circuit board manufacturing. These components have many closely spaced leads that are soldered to pads on a printed circuit board (PCB). Better accuracy in aligning the device to the PCB ...

In the excitement of the World Wide Web of hyperlinked multimedia spanning the globe, it's easy to lose sight of ordinary e-mail, which, like the Web, is built on the enabling infrastructure of the Internet. Yet the average person undoubtedly conducts more business by e-mail than by any other Internet service. Considering the importance and ubiquity of e-mail, it's surprising that it is not more widely used for group decision making-that is, structured business meetings, or more formally, deliberative assemblies. In the hope of providing basic guidelines and motivating further work, we offer some considerations regarding rules of order for conducting e-mail meetings

1. Introduction, 2. Brothers and sisters â€" adelphoi, 3. The believers, 4. The saints â€" hoi hagioi, 5. The assembly â€" hÄ" ekklÄ" sia, 6. Disciples â€" mathÄ" tai, 7. The way â€" hÄ" hodos, 8.'Christian'â€" Christianos, 9. Conclusions.

Fine-pitch ball grid array (BGA) and underfills have been used in benign office environments and wireless applications for a number of years, however their reliability in automotive underhood environment is not well understood. In this work, the reliability of fine-pitch plastic ball grid array (PBGA) packages has been evaluated in the automotive underhood environment. Experimental studies indicate that the coefficient of thermal expansion (CTE) as measured by thermomechanical analyzer (TMA) typically starts to change at 10-15°C lower temperature than the Tg specified by differential scanning calorimetry (DSC) potentially extending the change in CTE well into the accelerated test envelope in the neighborhood of 125°C. High Tg substrates with glass-transition temperatures much higher than the 125°C high temperature limit, are therefore not subject to the effect of high coefficient of thermal expansion close to the high temperature of the accelerated test. Darveaux's damage relationships were derived on ceramic ball grid array (CBGA) assemblies, with predominantly solder mask defined (SMD) pads and 62Sn36Pb2Ag solder. In addition to significant differences in the crack propagation paths for the two pad constructions, SMD pads fail significantly faster than the non solder mask defined (NSMD) pads in thermal fatigue. The thermal mismatch on CBGAs is much larger than PBGA assemblies. Crack propagation in CBGAs is often observed predominantly on the package side as opposed to both package and board side for PBGAs. In the present study, crack propagation data has been acquired on assemblies with 15, 17, and 23mm size plastic BGAs with NSMD pads and 63Sn37Pb on high-Tg printed circuit boards. The data has been benchmarked against Darveaux's data on CBGA assemblies. Experimental matrix also encompasses the effect of bis-maleimide triazine (BT) substrate thickness on reliability. Damage constants have been developed and compared against existing Darveaux Constants. Prediction error has been quantified for both sets of constants.

Several simulators ,currently ,available ,that teach computer organization are described in [1, 2, 3]. There are also professional tools, such as debuggers, available for the development ,of assembly ,language ,programs. However, these tools are generally too sophisticated and complex,to meet ,the special needs of introductory-level students. This paper ,describes ,an interactive ,visual learning environment ,EasyCPU especially designed for teaching,Computer

This paper discusses how cryptography is misused in the security design of a large part of the Web. Our focus is on ASP.NET, the web application framework developed by Microsoft that powers 25% of all Internet web sites. We show that attackers can abuse multiple cryptographic design flaws to compromise ASP.NET web applications. We describe practical and highly efficient attacks

The increasing component packing density and consequent reduction in feature size in printed circuit assemblies (PCA's) continues to place manufacturers under extreme pressures. The most significant demand is for improved first-off process yields because of the high cost and technical difficulty of rework processes and concerns over the reliability of reworked products. The dominant process for the production of PCA's is reflow soldering of a stencil/screen printed solder paste to form the interconnection between the component termination and the substrate. It is crucial for the manufacturer to ensure that each termination experiences a suitable thermal history throughout the reflow cycle. Despite the advances in processes to cope with complex product features, such as increasing the uniformity and amount of heat transfer in the process, ensuring right-the-first-time is still a problem leading to increased lead-times, reduced yields and the scrapping of assemblies used to establish the ideal process parameters for each particular product. This paper describes the utilization of a predictive model as a tool for the off-line determination of the most appropriate process and its specific set-up for a PCA. Results are also presented where PCA design is altered to improve thermal mass distribution

Organic composting forms the backbone & basic necessity of a poor farmer. The traditional methods are not sufficient & satisfactory for chopping the crop residues. Whereas buying the chemical fertilizer is not possible for every farmer due to its high cost. Organic waste chopping or shredding machine accelerates the process of composting by increasing the surface area of crop residues for aerobic degradation thereby reducing the time to obtain the compost from 4 Months to 3 Months. When the crop residues come through the hopper in the cutting chamber then due to the cutting blades & hammer blades it gets chopped into different sizes depending on the diameter of the sieve used thereby increasing the surface area of residue to decompose early. A portable machine serves for various problems like moving from one place to another, requires less space & is less bulky as compared to the existing bulky machines. It also helps the farmers to start small business thereby making them self-dependent. Machine can be used for various purposes like chopping, to obtain animal fodder, bed for poultry birds, etc which makes it a multipurpose machine. Design & development of the machine done taking into consideration various literature reviews & needs of farmers. Fabrication with proper dimensions & consideration of required parameters provides for an efficient “Portable Organic Waste Chopping Machine”.