WO2022153916A1

WO2022153916A1 - Transformer

Info

Publication number: WO2022153916A1
Application number: PCT/JP2022/000206
Authority: WO
Inventors: 翔平今井
Original assignee: 株式会社村田製作所
Priority date: 2021-01-13
Filing date: 2022-01-06
Publication date: 2022-07-21

Abstract

The present invention comprises: a first wiring provided on a first surface of a first layer; a second wiring provided on a second surface of a second layer; and a third wiring provided on a third surface of a third layer provided between the first layer and the second layer. The first wiring and the second wiring are electrically connected with each other via a via conductor. The third wiring is wound by more than one turn on the third surface. The first wiring and the second wiring are provided so as to be electromagnetically coupled to the third wiring.

Description

Transformer

This disclosure relates to a transformer.

In recent years, electronic devices have been required to be further miniaturized and thinned. Electronic components are integrated in this electronic device. In the integration of electronic components, it is important to integrate magnetic elements such as transformers. That is, in electronic devices, it is important to reduce the size of the transformer.

Japanese Unexamined Patent Publication No. 2012-134354

In the transformer described in Patent Document 1, a primary winding is formed by connecting a lower coil of one turn and an upper coil of one turn with a via hole in a multilayer substrate. The transformer is provided with a one-turn coil, which is a secondary winding, between the lower coil and the upper coil. Further, in the transformer, since the lower coil and the upper coil are connected in parallel, the primary winding is equivalently set to 0.5 turn and the secondary winding is set to 1 turn. Therefore, if it is desired to obtain a high impedance in the transformer described in Patent Document 1, it is necessary to increase the winding size, so that the size cannot be reduced.

Therefore, the purpose is to provide a transformer that is compact and can obtain high inductance.

The transformer according to one aspect of the present invention includes a first wiring provided on the first surface of the first layer, a second wiring provided on the second surface of the second layer, the first layer and the first layer. A third wiring provided on the third surface of the third layer provided between the two layers is provided, and the first wiring and the second wiring are electrically connected by a via conductor, and the first wiring is provided. The three wirings are wound more than one turn on the third surface, and the first wiring and the second wiring are provided so as to be electromagnetically coupled to the third wiring.

According to the present disclosure, it is possible to provide a transformer that is compact and can obtain a high inductance.

It is a schematic perspective view which shows an example of the structure of a transformer. It is a figure for demonstrating an example of the definition of a turn. It is a graph which shows the relationship between the path length and the Euclidean distance. It is a figure which shows an example which viewed the upper layer wiring in a plan view. It is a figure which shows an example which viewed the lower layer wiring in a plan view. It is a figure which shows an example which viewed the middle layer wiring in a plan view. It is a figure which shows an example which looked at the upper layer wiring of the transformer which concerns on a comparative example in a plan view. It is a figure which shows an example which looked at the lower layer wiring of the transformer which concerns on a comparative example in a plan view. It is a figure which shows an example which looked at the middle layer wiring of the transformer which concerns on a comparative example in a plan view. It is a figure which shows an example which made the upper layer wiring of the 1st modification into a plan view. It is a figure which shows an example which made the lower layer wiring of the 1st modification into a plan view. It is a figure which shows an example which made the middle layer wiring of the 1st modification into a plan view. It is a perspective view which shows an example of the state in which each layer of the 2nd modification is overlapped. It is a figure which shows an example which made the upper layer wiring of the 2nd modification into a plan view. It is a figure which shows an example which made the lower layer wiring of the 2nd modification into a plan view. It is a figure which shows an example which made the middle layer wiring of the 2nd modification into a plan view. It is a figure which shows an example of the cross section of the transformer of a 6-layer multilayer substrate.

Hereinafter, each embodiment of the present disclosure will be described with reference to each figure.

=== Composition ===
The configuration of the transformer 100 will be described with reference to FIG. FIG. 1 is a schematic perspective view showing an example of the configuration of the transformer 100.

The transformer 100 performs impedance matching by impedance conversion by, for example, two wires coupled in an electromagnetic field, and converts a differential signal and a single-ended signal to each other. The transformer 100 is formed of, for example, a multilayer substrate. Hereinafter, for convenience, the terms "primary" and "secondary" may be used in the description of the transformer 100, but the transformer 100 also includes a configuration in which "primary" and "secondary" are interchanged.

The transformer 100 includes, for example, at least the outermost layer (hereinafter referred to as the upper layer 110), a layer adjacent to the upper layer 110 (hereinafter referred to as the middle layer 130), and a layer adjacent to the upper layer 110 in the middle layer 130 (hereinafter referred to as the upper layer 110). Hereinafter, it is assumed that it is configured to include the lower layer 120). As shown in FIG. 1, the transformer 100 includes, for example, wiring formed on the surface of the upper layer 110 (hereinafter referred to as “upper layer wiring 111”) and wiring formed on the surface of the lower layer 120 (hereinafter referred to as “upper layer wiring 111”) in the multilayer substrate. , "Lower layer wiring 121"), wiring formed on the surface of the middle layer 130 (hereinafter referred to as "middle layer wiring 131"), via

conductors

140 and 150, and connection wiring 160. As shown in FIG. 1, it is desirable that the center C of the upper layer wiring 111, the lower layer wiring 121, and the middle layer wiring 131 is coaxial.

First, the electrical relationship in each component of the transformer 100 will be described. The via conductor 140 penetrates, for example, the upper layer 110. The via conductor 140 electrically connects, for example, the upper layer wiring 111 and the connection wiring 160. The via conductor 150 penetrates, for example, the middle layer 130. The via conductor 150 electrically connects, for example, the connection wiring 160 and the lower layer wiring 121. The connection wiring 160 electrically connects the end portion 141 of the via conductor 140 and the end portion 151 of the via conductor 150, for example, on the surface of the middle layer 130. That is, the upper layer wiring 111 and the lower layer wiring 121 are connected in series. Therefore, in the transformer 100, assuming that the primary winding is the middle layer wiring 131, the secondary winding is formed by the upper layer wiring 111, the

via conductors

140 and 150, the connection wiring 160, and the lower layer wiring 121. Hereinafter, for convenience, the middle layer wiring 131 will be referred to as a primary winding, and the upper layer wiring 111, via

conductors

140 and 150, the connection wiring 160, and the lower layer wiring 121 will be described as secondary windings. The middle layer wiring 131 is provided between the upper layer wiring 111 and the lower layer wiring 121 so that the upper layer wiring 111 and the lower layer wiring 121 are electromagnetically coupled. Further, the middle layer wiring 131 is wound around the surface of the middle layer 130 more than one turn (one turn), for example. As a result, the inductance can be increased, so that the characteristics of the transformer 100 can be improved. Further, it is desirable that the total number of turns of the upper layer wiring 111 and the lower layer wiring 121 is more than one turn. As a result, the coupling coefficient can be increased while increasing the inductance, so that the characteristics of the transformer 100 can be improved.

Here, the outline of the operation of the transformer 100 will be described with reference to FIG. First, the signal current flows through the middle layer wiring 131, which is the primary winding, in the direction of the solid arrow shown in FIG. At this time, due to the signal current flowing through the middle layer wiring 131, the induced current flows through the upper layer wiring 111 and the lower layer wiring 121 in the direction of the broken line arrow shown in FIG.

Next, an example of the definition of "turn" in the middle layer wiring 131 will be described with reference to FIGS. 2A and 2B. FIG. 2A is a diagram for explaining an example of the definition of a turn. FIG. 2B is a graph showing the relationship between the route length and the Euclidean distance. The definition of "turn" is similarly applied to the upper layer wiring 111 and the lower layer wiring 121.

In FIG. 2A, an XY Cartesian coordinate system is defined with the origin O at the outer peripheral end of the middle layer wiring 131. The middle layer wiring 131 passes from the origin O through an arbitrary path to reach the end point E on the inner peripheral side. In FIG. 2A, the path length from the origin O to an arbitrary point P of the middle layer wiring 131 is represented by L. Further, in FIG. 2A, the Euclidean distance between the origin O and the point P is represented by D. As shown in FIG. 2B, the Euclidean distance D shows the first maximum value at the point P2 of the middle layer wiring 131. Then, the Euclidean distance D shows the minimum value at the point P4, the Euclidean distance D shows the second maximum value at the point P6, and reaches the end point E. In the present embodiment, as an example, a set of a maximum value and a minimum value appearing after the maximum value may be defined as the number of turns. Further, when a set of a maximum value and a minimum value does not appear, the number of maximum values may be defined as 0.5 turn in terms of the number of turns. That is, in FIG. 2A, since the middle layer wiring 131 has one set of the first maximum value and the minimum value and further has the second maximum value, it has 1.5 turns (1 turn + 0.5 turns). ) More than that. Hereinafter, for convenience, the wiring of the middle layer wiring 131 on the first turn from the outside is referred to as "first turn wiring 131a", and the wiring on the second turn from the outside starting from the broken line shown in FIG. 2A is referred to as "second turn wiring 131b". .. As an example, the number obtained by dividing the total angle of the middle layer wiring 131 by 360 degrees may be defined as the number of turns. That is, in FIG. 2A, the direction of the middle layer wiring 131 is changed by 90 degrees at each of the points P1 to P6. Therefore, the middle-rise wiring 131 of the present embodiment has more turns than 1.5 turns because the direction is changed by 540 degrees.

Next, the shape and arrangement of each component of the transformer 100 will be described with reference to FIGS. 3A to 3C. FIG. 3A is a diagram showing an example of the upper layer wiring 111 viewed in a plan view. FIG. 3B is a diagram showing an example of the lower layer wiring 121 viewed in a plan view. FIG. 3C is a diagram showing an example of the middle layer wiring 131 viewed in a plan view. The "planar view" refers to a state when viewed from the direction (Z direction) in which the layers on the multilayer substrate are laminated.

As shown in FIG. 3A, for example, one end of the upper layer wiring 111 is connected to an external circuit (not shown), and the other end is connected to the via conductor 140. The upper layer wiring 111 is formed on the surface of the upper layer 110 so as not to intersect the middle layer wiring 131 in a plan view, for example. It is desirable that the upper layer wiring 111 is provided so as to overlap the first turn wiring 131a or the second turn wiring 131b in a plan view, for example. As a result, the coupling coefficient between the wirings of each layer can be increased. Further, the upper layer wiring 111 may be provided between the first turn wiring 131a and the second turn wiring 131b in a plan view, for example. As a result, the upper layer wiring 111 and the first turn wiring 131a and the second turn wiring 131b are evenly coupled to each other, so that the characteristics of the transformer 100 can be improved. The shape of the upper layer wiring 111 in a plan view is not particularly limited.

As shown in FIG. 3B, for example, one end of the lower layer wiring 121 is connected to an external circuit (not shown), and the other end is connected to the via conductor 150. The lower layer wiring 121 is formed on the surface of the lower layer 120 so as not to intersect the middle layer wiring 131 in a plan view, for example. It is desirable that the lower layer wiring 121 is provided so as to overlap the first turn wiring 131a or the second turn wiring 131b in a plan view, for example. As a result, the coupling coefficient between the wirings of each layer can be increased. Further, the lower layer wiring 121 may be provided between the first turn wiring 131a and the second turn wiring 131b in a plan view, for example. As a result, the lower layer wiring 121 and the first turn wiring 131a and the second turn wiring 131b are evenly coupled, so that the characteristics of the transformer 100 can be improved. The shape of the lower layer wiring 121 in a plan view is not particularly limited.

As shown in FIG. 3C, for example, one end of the middle layer wiring 131 is connected to an external circuit (not shown) and the other end is connected to a via conductor (not shown). The middle layer wiring 131 is wound more than one turn. The middle layer wiring 131 may be wound more than one turn, and the number of turns is not limited. The middle layer wiring 131 is provided at a position facing the first turn wiring 131a on the first turn from the outside and the first turn wiring 131a on the second turn from the outside, and a current flows in the same direction as the first turn wiring 131a. Includes a second turn wiring 131b formed to flow. In the middle layer wiring 131, for example, a connection wiring 160 is provided between at least a part of the first turn wiring 131a and at least a part of the second turn wiring 131b. Here, the connection wiring 160 electrically connects the end portion 141 of the via conductor 140 and the end portion 151 of the via conductor 150. That is, the connection wiring 160 is a part of the secondary winding and is electromagnetically coupled to the middle layer wiring 131. As a result, since the connection wiring 160 is close to the first turn wiring 131a and the second turn wiring 131b which are a part of the primary winding, the coupling coefficient between the primary winding and the secondary winding can be increased. The shape of the middle layer wiring 131 in a plan view is not particularly limited.

Next, with reference to FIGS. 4A to 4C, the effectiveness of arranging the connection wiring 160 between the first turn wiring 131a and the second turn wiring 131b will be described in more detail. FIG. 4A is a diagram showing an example in which the upper layer wiring 1110 of the transformer 1000 according to the comparative example is viewed in a plan view. FIG. 4B is a diagram showing an example in which the lower layer wiring 1210 of the transformer 1000 according to the comparative example is viewed in a plan view. FIG. 4C is a diagram showing an example in which the middle layer wiring 1310 of the transformer 1000 according to the comparative example is viewed in a plan view. The transformer 1000 according to the comparative example is for explaining the effectiveness of the connection wiring 160 of the transformer 100, and the transformer 1000 is not excluded from the present embodiment. That is, the transformer 100 may be configured like the transformer 1000. In the transformer 1000 included in the present embodiment, since the first turn wiring 1310a and the second turn wiring 1310b are close to each other, good characteristics can be obtained when each of them is regarded as a single inductor.

As shown in FIGS. 4A and 4B, in the transformer 1000, the upper layer wiring 1110 and the lower layer wiring 1210 are formed on the surface of each layer so as not to intersect with the middle layer wiring 1310 in a plan view. Then, as shown in FIG. 4C, the connection wiring 1600 is provided inside the second turn wiring 1310b. In this case, the upper layer wiring 1110 and the lower layer wiring 1210 need to bend the end portion 1111 and the end portion 1211 90 degrees on each layer in order to connect to the connection wiring 1600 through the

via conductors

1400 and 1500. Then, the end portion 1111 and the end portion 1211 intersect with a part of the middle layer wiring 1310. As a result, the coupling coefficient of the transformer 1000 is lowered. Even when the connection wiring 1600 is provided outside the second turn wiring 1310b, the end portion 1111 and the end portion 1211 intersect with a part of the middle layer wiring 1310, so that the coupling coefficient of the transformer 1000 is lowered.

On the other hand, as shown in FIG. 3C, in the transformer 100, since the connection wiring 160 is formed between the first turn wiring 131a and the second turn wiring 131b, the upper layer wiring 111 and the lower layer wiring 121 and the middle layer No intersection occurs with the wiring 131. Therefore, the transformer 100 can have a higher coupling coefficient than the transformer 1000 according to the comparative example, so that the characteristics can be improved.

Further, as shown in FIG. 4C, in the transformer 1000, the distance between the connection wiring 1600 and the first turn wiring 1310a is larger than the distance between the connection wiring 1600 and the second turn wiring 1310b. That is, in the transformer 1000, an imbalance occurs between the coupling coefficient between the connecting wiring 1600 and the first turn wiring 1310a and the coupling coefficient between the connecting wiring 1600 and the second turn wiring 1310b. In other words, in the transformer 1000, there is a possibility that the first turn wiring 1310a cannot be effectively used as wiring for mutual inductance. As a result, the characteristics of the transformer 1000 deteriorate.

On the other hand, as shown in FIG. 3C, in the transformer 100, the connection wiring 160 is formed between the first turn wiring 131a and the second turn wiring 131b. Therefore, the distance between the connection wiring 160 and the first turn wiring 131a is substantially equal to the distance between the connection wiring 160 and the second turn wiring 131b. That is, in the transformer 100, the coupling coefficient between the connection wiring 160 and the first turn wiring 131a and the coupling coefficient between the connection wiring 160 and the second turn wiring 131b are in equilibrium. This improves the characteristics of the transformer 1000.

In the above, the connection wiring 160 may not be provided in the middle layer 130. In this case, the via conductor 140 is provided so as to pass between the first turn wiring 131a and the second turn wiring 131b on the middle layer 130, for example. As a result, the upper layer wiring 111 and the lower layer wiring 121 and the middle layer wiring 131 do not intersect with each other, and the coupling coefficient can be increased, so that the characteristics of the transformer 100 can be improved.

<< First variant >>
The transformer 200 according to the first modification will be described with reference to FIGS. 5A to 5C. FIG. 5A is a diagram showing an example in which the upper layer wiring 211 of the first modification is viewed in a plan view. FIG. 5B is a diagram showing an example in which the lower layer wiring 221 of the first modification is viewed in a plan view. FIG. 5C is a diagram showing an example in which the middle layer wiring 231 of the first modification is viewed in a plan view.

In the transformer 200 according to the first modification, for example, the via

conductors

240 and 250 are connected to the connection wiring 260 in a region other than between the first turn wiring 221a and the second turn wiring 221b. Then, the connection wiring 260 is formed between the first turn wiring 221a and the second turn wiring 221b.

Specifically, as shown in FIG. 5A, the upper layer wiring 211 is wound, for example, 0.75 turns. As shown in FIG. 5B, the lower layer wiring 221 is wound around, for example, 0.5 turns. As shown in FIG. 5C, the connection wiring 260 is provided between, for example, the first turn wiring 221a and the second turn wiring 221b, and is wound around 0.75 turns. That is, in the transformer 200, for example, the secondary winding formed by the upper layer wiring 211, the lower layer wiring 221 and the connection wiring 260 is formed in two turns. As a result, even if the transformer 200 according to the first modification cannot secure the extension of the upper layer wiring 211 and the lower layer wiring 221 on the surface of each layer, the shape of the transformer 200 can be enlarged by the connection wiring 260 of the middle layer 230. It is possible to increase the coupling coefficient while obtaining a high inductance. Furthermore, the transformer 200 can freely provide the connection wiring 260 between the first turn wiring 221a and the second turn wiring 221b according to, for example, the arrangement state of the electronic components on the surface of each layer. Therefore, the degree of freedom in design can be increased.

<< Second variant >>
The transformer 300 according to the second modification will be described with reference to FIGS. 6 and 7A to 7C. FIG. 6 is a perspective view showing an example of a state in which the layers of the second modification are stacked. FIG. 7A is a diagram showing an example in which the upper layer wiring 311 of the second modification is viewed in a plan view. FIG. 7B is a diagram showing an example in which the lower layer wiring 321 of the second modification is viewed in a plan view. FIG. 7C is a diagram showing an example in which the middle layer wiring 331 of the second modification is viewed in a plan view. In the second modification, as shown in FIG. 7C, a mode in which the connecting wiring 160 of the transformer 100 is not provided will be described.

As shown in FIG. 6, in the transformer 300 according to the second modification, for example, in a plan view, at least one of a part of the first turn wiring 321a and a part of the second turn wiring 321b facing the first turn wiring 321a. The upper layer wiring 311 and the lower layer wiring 321 are provided so as to cover the portion.

As shown in FIG. 7A, for example, one end of the upper layer wiring 311 is connected to an external circuit (not shown), and the other end is connected to the via conductor 340. The upper layer wiring 311 has, for example, at least a part having a line width W. As shown in FIG. 7B, for example, one end of the lower layer wiring 321 is connected to an external circuit (not shown), and the other end is connected to the via conductor 340. Therefore, the lower layer wiring 321 is electrically connected in series with the upper layer 310 through the via conductor 340. The lower layer wiring 321 has, for example, at least a part having a line width W. This makes it possible to prevent the inductance from becoming too large. As shown in FIG. 7C, the middle layer wiring 331 is orthogonal to the extending direction of the first turn wiring 313a and the second turn wiring 313b in the portion where the first turn wiring 313a and the second turn wiring 313b face each other, for example. The line width in the direction is formed to be smaller than the line width W. As a result, the coupling coefficient between the primary winding and the secondary winding can be increased.

In the above description, the upper layer wiring 311 and the lower layer wiring 321 are described so as to cover at least a part of the first turn wiring 331a and the second turn wiring 331b, but the present invention is not limited to this. For example, at least a part of the upper layer wiring 311 and the lower layer wiring 321 may be provided so as to cover at least a part of the first turn wiring 321a and the second turn wiring 321b.

=== Manufacturing method ===
An example of a method for manufacturing the transformer 100 will be described with reference to FIG. FIG. 8 is a diagram showing an example of a cross section of the transformer 100 of a 6-layer multilayer substrate. Note that FIG. 8 shows a mode in which the connecting wiring 160 is omitted and the via conductor 150 penetrates between the first turn wiring 121a and the second turn wiring 121b. Further, in FIG. 8, only the elements related to the transformer 100 are displayed, and for example, via conductors, wirings, electronic elements, and the like other than the elements are omitted.

First, the insulating film Is1 is formed on a semiconductor substrate by a chemical vapor deposition method, a sputtering method, a spin coating method, or the like. The insulating film Is1 is, for example, SiO2, SiN, SiON, etc., and is for protecting various electronic elements and the like. For example, the insulating films Is2, Is3, the lower layer 120, the middle layer 130, and the upper layer 110, which will be described later, are the same as the insulating film Is1. Next, the ground 170 is formed on the insulating film Is1 by, for example, a metal vapor deposition method, a sputtering method, a plating method, or the like. Next, the insulating films Is2, Is3 and the lower layer 120 are formed in the same manner as the insulating film Is1. Next, the lower layer wiring 121 is formed on the lower layer 120 by, for example, a metal vapor deposition method, a sputtering method, a plating method, or the like. Next, the middle layer 130 is formed, and the middle layer wiring 131 (here, the first turn wiring 131a and the second turn wiring 131b) is formed on the middle layer 130. At this time, the connection wiring 160 may be formed on the middle layer 130. Next, the upper layer 110 is formed. Next, via holes are formed in the upper layer 110 by, for example, a ly etching technique using a fluorine-based gas, a bromine-based gas, an iodine-based gas, or the like. Then, a conductor is embedded in the via hole to form the via conductor 140. Next, the upper layer wiring 111 is formed. As a result, the transformer 100 can be manufactured. As described above, when the ground 170 is provided in the lowest layer, that is, when an insulating film is provided between the ground 170 and the lower layer 120, the ground 170 and the lower layer wiring 121 (and the upper layer wiring 111) are provided. Since the distance between the ground 170 and the lower layer wiring 121 (and the upper layer wiring 111) can be secured, the parasitic capacitance between the ground 170 and the lower layer wiring 121 (and the upper layer wiring 111) can be suppressed. For example, the insulating film Is1 may not be provided. In this case, the transformer 100 is generated symmetrically with the lower layer 120 as the center.

In the above, the transformer 100 has been described so that the upper layer wiring 111 is formed in the uppermost layer, but the present invention is not limited to this. For example, the upper layer wiring 111 does not have to be, for example, the uppermost layer. Further, in the above, the transformer 100 has been described so that the ground 170 is formed in the lowest layer, but the present invention is not limited to this. For example, the ground 170 may be formed in a layer below the lower layer 120, for example.

=== Summary ===
The transformers 100, 200, and 300 according to the exemplary embodiment of the present disclosure include an upper layer wiring 111 (first wiring) provided on the surface (first surface) of the upper layer 110 (first layer) and a lower layer 120 (first layer). The lower layer wiring 121 (second wiring) provided on the surface (second surface) of the second layer) and the middle layer 130 (second layer) provided between the upper layer 110 (first layer) and the lower layer 120 (second layer). The middle layer wiring 131 (third wiring) provided on the surface (third surface) of the third layer) is provided, and the upper layer wiring 111 (first wiring) and the second wiring are electrically connected by via

conductors

140 and 150. The middle layer wiring 131 (third wiring) is wound more than one turn on the surface (third surface) of the middle layer wiring 131 (third wiring), and the upper layer wiring 111 (first wiring) and The lower layer wiring 121 (second wiring) is provided so as to be electromagnetically coupled to the middle layer wiring 131 (third wiring). As a result, the transformer 100 can have a large inductance, so that the characteristics are improved.

Further, in the transformer 100 according to the exemplary embodiment of the present disclosure, the middle layer wiring 131 (third wiring) is the first turn wiring 131a (first part) on the first turn from the outside and the second turn from the outside. The second turn wiring 131b (second part) is provided at a position facing the first turn wiring 131a (first part) and is formed so that a current flows in the same direction as the first turn wiring 131a (first part). ), And the via

conductors

140 and 150 are placed between the first turn wiring 131a (first part) and the second turn wiring 131b (second part) on the surface (third surface) of the middle layer 130. It is provided to pass through. As a result, the transformer 100 can increase the coupling coefficient by suppressing the intersection of the upper layer wiring 111 and the lower layer wiring 121 with the middle layer wiring 131, so that the characteristics can be improved.

Further, in the transformer 100 according to the exemplary embodiment of the present disclosure, the middle layer wiring 131 (third wiring) is the first turn wiring 131a (first part) on the first turn from the outside and the second turn from the outside. The second turn wiring 131b (second part) is provided at a position facing the first turn wiring 131a (first part) and is provided so that a current flows in the same direction as the first turn wiring 131a (first part). The via

conductors

140 and 150 include the via conductor 140 (first via conductor) formed between the surface (first surface) of the upper layer 110 and the surface (third surface) of the middle layer 130, and the lower layer. On the surface (third surface) of the middle layer 130, including the via conductor 150 (second via conductor) formed between the surface of the 120 (second surface) and the surface (third surface) of the middle layer 130. , With at least a part of the first turn wiring 131a (first part) so as to be electromagnetically coupled to at least a part of the first turn wiring 131a (first part) and the second turn wiring 131b (second part). A connection wiring 160 that electrically connects the via conductor 140 (first via conductor) and the via conductor 150 (second via conductor) provided between at least a part of the second turn wiring 131b (second portion). Further prepare. As a result, the connection wiring 160, which is a part of the secondary winding, is close to the first turn wiring 131a and the second turn wiring 131b, which are a part of the primary winding. The coupling coefficient of can be increased.

Further, in the transformer 200 according to the exemplary embodiment of the present disclosure, the end portion 241 of the via conductor 240 (first via conductor) is the first turn wiring 231a (third surface) on the surface (third surface) of the middle layer 230. The end portion 251 of the via conductor 250 (second via conductor) is provided in a region not between the first part) and the second turn wiring 231b (second part), and the end portion 251 of the via conductor 250 (second via conductor) is the second turn wiring 131b (second part). Above, the connection wiring 160 is provided in a region not between the first turn wiring 131a (first portion) and the second turn wiring 131b (second portion), and the connection wiring 160 is provided on the surface (third surface) of the middle layer 130. , Is provided between the first turn wiring 131a (first portion) and the second turn wiring 131b (second portion). As a result, even if the transformer 200 cannot secure the extension of the upper layer wiring 211 and the lower layer wiring 221 by the connection wiring 260 of the middle layer 230, the coupling coefficient can be obtained while obtaining a high inductance without increasing the shape of the transformer 200. Can be enhanced.

Further, in the transformer 300 according to the exemplary embodiment of the present disclosure, at least a part of the upper layer wiring 311 (first wiring) and the lower layer wiring 321 (second wiring) is viewed from the outside in a plan view. It is provided at a position facing the middle layer wiring 331 (third wiring) portion of the first turn and the middle layer wiring 331 (third wiring) portion of the first turn on the second turn from the outside, and the first turn wiring 331a ( It is provided so as to cover at least a part of a predetermined portion of the middle layer wiring 331 (third wiring) formed so that a current flows in the same direction as the first portion). As a result, the coupling coefficient between the primary winding and the secondary winding can be increased.

Further, in the transformer 100 according to the exemplary embodiment of the present disclosure, the upper layer wiring 111 (first wiring) is wound on the surface (first surface) of the upper layer 110 in the number of first turns, and the lower layer wiring 121. (Second wiring) is wound on the surface (second surface) of the lower layer 120 in the second turn number, and the upper layer wiring 111 (first wiring) and the lower layer wiring 121 (second wiring) have the first turn number. And, the number of the second turns and the total are wound so as to be more than one turn. As a result, the coupling coefficient can be increased, so that the characteristics of the transformer 100 can be improved.

Further, the transformer 100 according to the exemplary embodiment of the present disclosure is at least between the ground 170 (ground layer), the ground 170, and the upper layer 110 (first layer) and the lower layer 120 (second layer). Insulation films Is2 and Is3 (fourth layer) including one insulator layer are further provided. As a result, the parasitic capacitance between the ground 170 and the lower layer wiring 121 (and the upper layer wiring 111) can be suppressed.

Further, in the transformer 100 according to the exemplary embodiment of the present disclosure, the upper layer wiring 111 (first wiring) and the lower layer wiring 121 (second wiring) are electrically connected in series by via

conductors

140 and 150. To. Thereby, the inductance can be increased.

The embodiments described above are for facilitating the understanding of the present disclosure, and are not for limiting and interpreting the present disclosure. The present disclosure may be modified or improved without departing from its intent, and the present disclosure also includes its equivalents. That is, those skilled in the art with appropriate design changes to the embodiments are also included in the scope of the present disclosure as long as they have the features of the present disclosure. The elements included in the embodiment and their arrangements are not limited to those illustrated, and can be appropriately changed.

100,200,300 ... Transformer, 110,210,310 ... Upper layer, 120,220,320 ... Lower layer, 130,230,330 ... Middle layer, 111,211,311 ... Upper layer wiring, 121,221,321 ... Lower layer wiring , 131,231,331 ... Middle layer wiring, 140, 150240, 250, 340 ... Via conductor, 160, 260 ... Connection wiring.

Claims

The first wiring provided on the first surface of the first layer and
The second wiring provided on the second surface of the second layer and
A third wiring provided on the third surface of the third layer provided between the first layer and the second layer, and
With
The first wiring and the second wiring are electrically connected by a via conductor.
The third wire is wound on the third surface more than one turn.
The first wiring and the second wiring are provided so as to be electromagnetically coupled to the third wiring.
Transformer.
The third wiring is provided at a position facing the first portion on the first turn from the outside and the first portion on the second turn from the outside, and is formed so that a current flows in the same direction as the first portion. Including the second part
The via conductor is provided on the third surface so as to pass between the first portion and the second portion.
The transformer according to claim 1.
The third wiring is provided at a position facing the first portion on the first turn from the outside and the first portion on the second turn from the outside, and is provided so that a current flows in the same direction as the first portion. Including the second part,
The via conductor includes a first via conductor formed between the first surface and the third surface, and a second via conductor formed between the second surface and the third surface. Including
On the third surface, between at least a part of the first part and at least a part of the second part so as to be electromagnetically coupled to at least a part of the first part and the second part. Further provided, a connection wiring for electrically connecting the first via conductor and the second via conductor is provided.
The transformer according to claim 1.
The end portion of the first via conductor is provided on the third surface in a region not between the first portion and the second portion.
The end portion of the second via conductor is provided on the third surface in a region not between the first portion and the second portion.
The connection wiring is provided between the first portion and the second portion on the third surface.
The transformer according to claim 3.
At least a part of the first wiring and the second wiring is a portion of the third wiring on the first turn from the outside and a third on the first turn on the second turn from the outside in a plan view. It covers at least a part of a predetermined part of the third wiring which is provided at a position facing the wiring part and is formed so that a current flows in the same direction as the third wiring part of the first turn. Provided in
The transformer according to any one of claims 1 to 4.
The first wiring is wound on the first surface in the first number of turns.
The second wiring is wound on the second surface in the second number of turns.
The first wiring and the second wiring are wound so that the total of the number of the first turns and the number of the second turns is more than one turn.
The transformer according to any one of claims 1 to 5.
With the ground layer
A fourth layer including at least one insulator layer between the ground layer and the first layer and the second layer.
The transformer according to any one of claims 1 to 6, further comprising.
The first wiring and the second wiring are electrically connected in series by the via conductor.
The transformer according to any one of claims 1 to 7.