WO2013047838A1 - 床構造用接着剤及び床構造 - Google Patents
床構造用接着剤及び床構造 Download PDFInfo
- Publication number
- WO2013047838A1 WO2013047838A1 PCT/JP2012/075246 JP2012075246W WO2013047838A1 WO 2013047838 A1 WO2013047838 A1 WO 2013047838A1 JP 2012075246 W JP2012075246 W JP 2012075246W WO 2013047838 A1 WO2013047838 A1 WO 2013047838A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- floor
- adhesive
- floor structure
- base material
- adhesive layer
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 123
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 121
- 239000000463 material Substances 0.000 claims abstract description 152
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 49
- -1 trimethoxysilyl group Chemical group 0.000 claims abstract description 40
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 35
- 239000003054 catalyst Substances 0.000 claims abstract description 23
- 238000009833 condensation Methods 0.000 claims abstract description 20
- 230000005494 condensation Effects 0.000 claims abstract description 20
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims description 49
- 239000000945 filler Substances 0.000 claims description 22
- 239000011256 inorganic filler Substances 0.000 claims description 18
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 15
- 239000002245 particle Substances 0.000 description 17
- 229920001971 elastomer Polymers 0.000 description 13
- 239000004593 Epoxy Substances 0.000 description 11
- 239000011120 plywood Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 239000006087 Silane Coupling Agent Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 8
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 8
- 239000012024 dehydrating agents Substances 0.000 description 8
- 239000011164 primary particle Substances 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 6
- 239000011324 bead Substances 0.000 description 6
- 238000013016 damping Methods 0.000 description 6
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 6
- 229920001451 polypropylene glycol Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000004567 concrete Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 241000218631 Coniferophyta Species 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 238000009408 flooring Methods 0.000 description 4
- 239000010881 fly ash Substances 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 4
- 239000013464 silicone adhesive Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000011122 softwood Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 235000019738 Limestone Nutrition 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000006028 limestone Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000010454 slate Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UVDDHYAAWVNATK-VGKOASNMSA-L (z)-4-[dibutyl-[(z)-4-oxopent-2-en-2-yl]oxystannyl]oxypent-3-en-2-one Chemical compound CC(=O)\C=C(C)/O[Sn](CCCC)(CCCC)O\C(C)=C/C(C)=O UVDDHYAAWVNATK-VGKOASNMSA-L 0.000 description 1
- NDQXKKFRNOPRDW-UHFFFAOYSA-N 1,1,1-triethoxyethane Chemical compound CCOC(C)(OCC)OCC NDQXKKFRNOPRDW-UHFFFAOYSA-N 0.000 description 1
- HDPNBNXLBDFELL-UHFFFAOYSA-N 1,1,1-trimethoxyethane Chemical compound COC(C)(OC)OC HDPNBNXLBDFELL-UHFFFAOYSA-N 0.000 description 1
- SZMZIUKGERWEQD-UHFFFAOYSA-N 1-isocyanatopropyl(trimethoxy)silane Chemical compound O=C=NC(CC)[Si](OC)(OC)OC SZMZIUKGERWEQD-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- VYVFQBFOMKEKBG-UHFFFAOYSA-L 3,3-dibutyl-2,4,3-benzodioxastannepine-1,5-dione Chemical compound O=C1O[Sn](CCCC)(CCCC)OC(=O)C2=CC=CC=C21 VYVFQBFOMKEKBG-UHFFFAOYSA-L 0.000 description 1
- FVKFHMNJTHKMRX-UHFFFAOYSA-N 3,4,6,7,8,9-hexahydro-2H-pyrimido[1,2-a]pyrimidine Chemical compound C1CCN2CCCNC2=N1 FVKFHMNJTHKMRX-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- XBGSYTUNSOYWEF-UHFFFAOYSA-N dibutyltin;dodecanoic acid Chemical compound CCCC[Sn]CCCC.CCCCCCCCCCCC(O)=O XBGSYTUNSOYWEF-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- LQRUPWUPINJLMU-UHFFFAOYSA-N dioctyl(oxo)tin Chemical compound CCCCCCCC[Sn](=O)CCCCCCCC LQRUPWUPINJLMU-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- XRYSLOXQYFXUGK-UHFFFAOYSA-N ethyl-[3-(oxiran-2-ylmethoxy)propyl]-silylsilane Chemical compound C(C1CO1)OCCC[SiH]([SiH3])CC XRYSLOXQYFXUGK-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- QMIREOCYHAFOPK-UHFFFAOYSA-N n,n'-bis(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCNCCC[Si](OCC)(OCC)OCC QMIREOCYHAFOPK-UHFFFAOYSA-N 0.000 description 1
- KWCRBSAFZCVWGF-UHFFFAOYSA-N n,n'-bis(3-triethoxysilylpropyl)hexane-1,6-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCCCCCNCCC[Si](OCC)(OCC)OCC KWCRBSAFZCVWGF-UHFFFAOYSA-N 0.000 description 1
- HZGIOLNCNORPKR-UHFFFAOYSA-N n,n'-bis(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCC[Si](OC)(OC)OC HZGIOLNCNORPKR-UHFFFAOYSA-N 0.000 description 1
- IAUJBLTYWDIDKB-UHFFFAOYSA-N n,n'-bis(3-trimethoxysilylpropyl)hexane-1,6-diamine Chemical compound CO[Si](OC)(OC)CCCNCCCCCCNCCC[Si](OC)(OC)OC IAUJBLTYWDIDKB-UHFFFAOYSA-N 0.000 description 1
- RGZOACSRFUXKEQ-UHFFFAOYSA-N n,n'-bis[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCNCCC[Si](C)(OC)OC RGZOACSRFUXKEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- GKASDNZWUGIAMG-UHFFFAOYSA-N triethyl orthoformate Chemical compound CCOC(OCC)OCC GKASDNZWUGIAMG-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/08—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
Definitions
- the present invention relates to an adhesive for floor structure for bonding and integrating a floor finishing material on a floor base material laid on a floor base, and in particular, the occurrence of squealing and gaps is reduced, and the floor finishing material
- the present invention relates to a floor structure adhesive capable of easily peeling a floor finishing material from a floor base material at the time of repair, and a floor structure using the same.
- a floor base material is laid through a leg member on a floor base such as a concrete floor slab, and a floor structure in which a floor finishing material is bonded and integrated to the floor base material through an adhesive. It has been adopted.
- a floor structure a plurality of floor finishing materials are arranged without gaps. And the appearance and design nature of a floor are improved by using the floor finish material which has patterns, such as a grain pattern.
- an epoxy adhesive or a urethane adhesive is used as an adhesive used for the floor structure.
- the cured film of the adhesive is hard. Therefore, when a person walks on the floor finishing material, a noise is generated from the floor finishing material.
- a phenomenon in which an unpleasant sound such as a groaning sound is generated from the floor structure when a load movement or impact is applied to the floor finishing material in this way is generally called “flooring”.
- Patent Document 1 a floor structure using a modified silicone adhesive is known (Patent Document 1).
- the cured film of the modified silicone adhesive is flexible. For this reason, when the floor finishing material undergoes drying shrinkage due to a temperature change in the surrounding environment, a gap is generated between adjacent floor finishing materials. In this way, the phenomenon in which a gap is generated between floor finishing materials in a floor structure is generally called “mesh”.
- the floor finish material is damaged, peel off the damaged floor finish material from the floor base material, and bond the new floor finish material to the floor base material.
- the floor finish has been refurbished by re-upholstering.
- adhesives such as epoxy adhesives, urethane adhesives, and modified silicone adhesives
- the floor finish is firmly bonded to the floor base material via the adhesive, so the floor finish May not be easily peeled off from the floor base material.
- you try to forcibly peel the floor finish from the floor base material a part of the floor base material peels off together with the floor finish material and damages the floor base material. I can't.
- the present invention is a floor structure adhesive for bonding and integrating a floor finishing material on a floor base material laid on a floor base, and the floor structure in which generation of floor noise and gaps is reduced It is an object of the present invention to provide an adhesive for floor structure that can provide the floor finishing material and can easily peel the floor finishing material from the floor base material at the time of repairing the floor finishing material.
- an object of the present invention is to provide a floor structure in which generation of floor noise and gaps is reduced, and the floor finishing material can be easily peeled off from the floor base material when the floor finishing material is repaired.
- the floor structure adhesive of the present invention contains a polyoxyalkylene polymer having a trimethoxysilyl group, calcium carbonate, and a silanol condensation catalyst, and does not contain an aminosilane coupling agent.
- Polyoxyalkylene polymer In the polyoxyalkylene polymer having a trimethoxysilyl group (—Si (OCH 3 ) 3 ), the main chain has a general formula: — (R—O) n — (wherein R has 1 to 14 carbon atoms) And a polymer containing a repeating unit represented by the following formula: n is a positive integer.
- the main chain skeleton of the polyoxyalkylene polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units.
- the main chain skeleton of the polyoxyalkylene polymer includes polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, and polyoxypropylene-polyoxybutylene copolymer.
- a polymer etc. are mentioned. Of these, polyoxypropylene is preferable.
- the polyoxyalkylene polymer preferably further has a urethane bond in addition to the trimethoxysilyl group.
- the urethane bond can impart polarity to the polyoxyalkylene polymer, thereby imparting an appropriate adhesive force to the adhesive layer formed by curing the floor structure adhesive.
- the polyoxyalkylene polymer preferably has a trimethoxysilyl group at both ends of the polyoxyalkylene chain via a urethane bond. According to the polyoxyalkylene polymer having a urethane bond in the vicinity of the trimethoxysilyl group, good rubber elasticity can be imparted to the adhesive layer formed by curing the floor structure adhesive.
- the polyoxyalkylene polymer having a trimethoxysilyl group via a urethane bond at both ends of the polyoxyalkylene chain includes, for example, a prepolymer having hydroxyl groups at both ends of the polyoxyalkylene chain, a trimethoxysilyl group, and It is obtained by reacting with a compound having an isocyanate group.
- Prepolymers having hydroxyl groups at both ends of the polyoxyalkylene chain include polyoxyethylene glycol, polyoxypropylene glycol, polyoxybutylene glycol, polyoxytetramethylene glycol, polyoxyethylene-polyoxypropylene glycol, and polyoxyethylene And propylene-polyoxybutylene glycol.
- Examples of the compound having a trimethoxysilyl group and an isocyanate group include 1-isocyanate methyltrimethoxysilane, 2-isocyanateethyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatebutyltrimethoxysilane, 3-isocyanatepentyltril. Examples include methoxysilane and 1-isocyanatopropyltrimethoxysilane.
- a prepolymer having hydroxy groups at both ends of the polyoxyalkylene chain, and trimethoxysilyl Mixing a compound having a group and an isocyanate group to obtain a mixture, and stirring the mixture to react the hydroxy group of the prepolymer with the isocyanate group of the compound to form a urethane bond. it can. Moreover, reaction can be accelerated
- the number average molecular weight of the polyoxyalkylene polymer is preferably 3,000 to 50,000, and more preferably 10,000 to 20,000. If the number average molecular weight of the polyoxyalkylene polymer is too large, the viscosity of the resulting floor structure adhesive will increase, and the coatability of the floor structure adhesive may be reduced. In addition, if the number average molecular weight of the polyoxyalkylene polymer is too small, the adhesive layer formed by curing the floor structure adhesive becomes brittle, and the mechanical strength, adhesive strength and rubber elasticity of the adhesive layer decrease. There is a fear.
- the number average molecular weight of the polyoxyalkylene polymer is a value in terms of polystyrene measured by a GPC (gel permeation chromatography) method. Specifically, 6 to 7 mg of a polyoxyalkylene polymer was sampled, the collected polyoxyalkylene polymer was supplied to a test tube, and 0.05 wt% BHT (dibutylhydroxytoluene) was added to the test tube. An o-DCB (orthodichlorobenzene) solution containing is added to dilute the polyoxyalkylene polymer to a concentration of 1 mg / mL to prepare a diluted solution.
- GPC gel permeation chromatography
- the diluted solution is shaken for 1 hour at 145 ° C. and a rotation speed of 25 rpm, and the polyoxyalkylene polymer is dissolved in an o-DCB solution containing BHT to obtain a measurement sample. Using this measurement sample, the number average molecular weight of the polyoxyalkylene polymer can be measured by the GPC method.
- the number average molecular weight in the polyoxyalkylene polymer can be measured, for example, with the following measuring apparatus and measurement conditions.
- Product name “HLC-8121GPC / HT” manufactured by TOSOH Measurement conditions Column: TSKgelGMHHR-H (20) HT x 3 TSK guard column-HHR (30) HT x 1
- Detector Bryce refractometer Standard material: Polystyrene (Molecular weight: 500 to 8420000, manufactured by TOSOH) Elution conditions: 145 ° C
- the viscosity of the polyoxyalkylene polymer at 25 ° C. is preferably 1000 to 30000 mPa ⁇ s, more preferably 4000 to 25000 mPa ⁇ s, and particularly preferably 5000 to 15000 mPa ⁇ s. If the viscosity of the polyoxyalkylene polymer is too high, the viscosity of the resulting floor structure adhesive will be high, and the coatability of the floor structure adhesive may be reduced. If the viscosity of the polyoxyalkylene polymer is too low, the adhesive layer formed by curing the floor structure adhesive becomes brittle, and the mechanical strength, adhesive strength and rubber elasticity of the adhesive layer may be reduced. There is.
- the viscosity of the polyoxyalkylene polymer at 25 ° C. can be measured by a method based on JIS K1557.
- a commercially available polyoxyalkylene polymer having a trimethoxysilyl group can be used.
- a polyoxyalkylene polymer having a main chain skeleton of polyoxypropylene having a trimethoxysilyl group at the end of the main chain skeleton and not having a urethane bond
- Exastar A2551 manufactured by Asahi Glass Co., Ltd. Can be mentioned.
- Desmosal (registered trademark) XP2749 manufactured by Bayer Corporation can be used as a polyoxyalkylene polymer having a main chain skeleton of polyoxypropylene and having a trimethoxysilyl group at the end of the main chain skeleton via a urethane bond.
- Desmosal (registered trademark) XP2749 manufactured by Bayer Corporation can be used. Is mentioned.
- an adhesive layer having an appropriate adhesive force can be formed by using a combination of the above-described polyoxyalkylene polymer and calcium carbonate.
- the floor base material and the floor finish material can be bonded and integrated, while the floor base material is damaged when the floor finish material is repaired in the floor structure using the adhesive layer.
- the floor finishing material can be easily peeled off from the floor base material without any problems.
- the above-mentioned polyoxyalkylene polymer and calcium carbonate are used in combination, so that the adhesive layer does not become too flexible, and the adhesive layer has an appropriate amount. It is also possible to impart a sufficient mechanical strength and moderate rubber elasticity. Therefore, it is possible to highly reduce the occurrence of floor noise and gaps in a floor structure using such an adhesive layer.
- Preferred examples of calcium carbonate include heavy calcium carbonate and precipitated calcium carbonate.
- Heavy calcium carbonate can be obtained, for example, by pulverizing natural calcium carbonate such as natural chalk (chalk), marble, and limestone into fine powder.
- Precipitated calcium carbonate can be produced through a chemical reaction using, for example, limestone as a raw material.
- examples of precipitated calcium carbonate include light calcium carbonate and colloidal calcium carbonate.
- the primary particle size of light calcium carbonate is preferably 1 to 3 ⁇ m.
- the light calcium carbonate preferably has a spindle shape or a columnar shape.
- the primary particle diameter of colloidal calcium carbonate is preferably 0.02 to 0.1 ⁇ m.
- the colloidal calcium carbonate preferably has a cubic shape.
- calcium carbonate either heavy calcium carbonate or precipitated calcium carbonate may be used, or both may be used. Among them, it is preferable to use heavy calcium carbonate and colloidal calcium carbonate. By using a combination of heavy calcium carbonate and colloidal calcium carbonate, it is possible to impart thixotropy to the floor structure adhesive.
- the content of heavy calcium carbonate in the floor structure adhesive is 30 to 500 with respect to 100 parts by weight of the polyoxyalkylene polymer having a trimethoxysilyl group. Parts by weight are preferred, 50 to 350 parts by weight are more preferred, and 50 to 150 parts by weight are particularly preferred.
- the content of colloidal calcium carbonate in the floor structure adhesive is 10 to 10 parts by weight based on 100 parts by weight of the polyoxyalkylene polymer having a trimethoxysilyl group. 300 parts by weight are preferable, and 10 to 100 parts by weight are more preferable.
- the calcium carbonate is preferably surface-treated with a fatty acid or a fatty acid ester.
- a surface treatment with a fatty acid or a fatty acid ester By subjecting calcium carbonate to a surface treatment with a fatty acid or a fatty acid ester, aggregation of calcium carbonate can be suppressed.
- the floor structure adhesive of the present invention contains a silanol condensation catalyst.
- the silanol condensation catalyst is a catalyst for promoting a dehydration condensation reaction between silanol groups formed by hydrolysis of a trimethoxysilyl group contained in a polyoxyalkylene polymer.
- the silanol group means a hydroxy group ( ⁇ Si—OH) directly bonded to a silicon atom.
- Silanol condensation catalysts include dibutyltin dilaurate, dibutyltin oxide, dibutyltin diacetate, dibutyltin phthalate, bis (dibutyltin lauric acid) oxide, dibutyltin bis (acetylacetonate), dibutyltin bis (monoester maleate)
- Organotin compounds such as tin octylate, dibutyltin octoate, dioctyltin oxide, dibutyltin bis (triethoxysilicate), dioctyltin dilaurate, bis (dibutyltin bistriethoxysilicate) oxide, and dibutyltin oxybisethoxysilicate;
- Organotitanium compounds such as tetra-n-butoxy titanate and tetraisopropoxy titanate; 1,5,7-triazabicyclo [4.4.0] deca5-en
- silanol condensation catalyst examples include organotin compounds and cycloamidine compounds, such as dibutyltin bis (triethoxysilicate) and 1,8-diazabicyclo [5.4.0] undec-7-ene. Is more preferable.
- the content of the silanol condensation catalyst in the floor structure adhesive is preferably 0.1 to 5 parts by weight and more preferably 0.5 to 3 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer.
- the content of the silanol condensation catalyst in the floor structure adhesive is too low, the curing rate of the floor structure adhesive is low, and the time required for curing the floor structure adhesive may be increased.
- the content of the silanol condensation catalyst in the floor structure adhesive is too high, the floor structure adhesive curing rate becomes too fast, and the floor structure adhesive storage stability and handling may be reduced. .
- the floor structure adhesive of the present invention does not contain an aminosilane coupling agent. If the aminosilane coupling agent is contained in the floor structure adhesive, the adhesiveness of the floor structure adhesive becomes too high, and it becomes difficult to peel the floor finish from the floor structure.
- the aminosilane coupling agent means a compound containing a silicon atom having an alkoxy group bonded in one molecule and a functional group containing a nitrogen atom.
- Specific examples of aminosilane coupling agents include 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, and N- (2-aminoethyl) -3-aminopropyltrimethoxy.
- the floor structure adhesive of the present invention does not contain an aminosilane coupling agent.
- the content of the aminosilane coupling agent in the floor structure adhesive is less than 0.001 part by weight, particularly 0 part by weight, per 100 parts by weight of the polyoxyalkylene polymer.
- the floor structure adhesive of the present invention preferably contains an epoxy silane coupling agent. According to the adhesive layer formed by curing the floor structure adhesive containing the epoxy silane coupling agent, it is possible to highly reduce the occurrence of floor noise and gaps in the floor structure using the adhesive layer.
- the epoxy silane coupling agent means a compound containing a silicon atom having an alkoxy group bonded in one molecule and a functional group having an epoxy group.
- Specific examples of the epoxy silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropylethyldisilane. Examples thereof include ethoxysilane, and 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane. These epoxy silane coupling agents may be used alone or in combination of two or more. Of these, 3-glycidoxypropyltrimethoxysilane is preferable.
- the content of the epoxy silane coupling agent in the floor structure adhesive is preferably 0.1 to 10 parts by weight, and more preferably 1 to 5 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer. If the content of the epoxy silane coupling agent in the floor structure adhesive is too low, there is a possibility that a sufficient effect cannot be obtained by adding the epoxy silane coupling agent. In addition, if the content of the epoxy silane coupling agent in the floor structure adhesive is too high, the adhesiveness of the floor structure adhesive becomes too high and it is difficult to peel the floor base material from the floor finish. There is a risk of becoming.
- the floor structure adhesive of the present invention preferably contains a hollow filler. According to the hollow filler, it is possible to impart an appropriate mechanical strength and an appropriate rubber elasticity by an adhesive layer formed by curing an adhesive for floor structure containing the same, and using the adhesive layer, The generation of squealing and gaps in the floor structure can be reduced.
- hollow inorganic fillers such as philite, glass balloon, silica balloon, ceramic balloon, shirasu balloon, and fly ash balloon, polyvinylidene fluoride, or polyvinylidene fluoride copolymer are used.
- examples include organic fillers.
- glass balloons, shirasu balloons, and fly ash balloons are preferable, and shirasu balloons and fly ash balloons are more preferable.
- These hollow fillers may be used alone or in combination of two or more.
- the glass balloon is a filler having a hollow spherical shape made of glass, and is also called “glass hollow filler”.
- Such glass balloons are commercially available from, for example, Glass Bubbles S and K series manufactured by Sumitomo 3M.
- the average primary particle diameter of the hollow filler is preferably 15 to 200 ⁇ m, more preferably 30 to 200 ⁇ m, particularly preferably 30 to 150 ⁇ m, and most preferably 50 to 150 ⁇ m.
- an appropriate mechanical strength and an appropriate rubber elasticity can be imparted by an adhesive layer obtained by curing an adhesive for floor structure containing the filler. It becomes possible, and generation
- the average primary particle diameter of the hollow filler is a value measured using a laser diffraction / scattering particle size analyzer. For example, after putting a hollow filler into methanol so that its concentration becomes 10% by weight, a suspension is obtained by irradiating ultrasonic waves at an output of 1 kW for 10 minutes using an ultrasonic homogenizer. For the liquid, the volume particle size distribution of the hollow filler is measured with a laser diffraction / scattering particle size analyzer (for example, SACD-2100, manufactured by Shimadzu Corporation), and the cumulative 50% value of the volume particle size distribution is determined as the hollow filler. The average primary particle diameter can be calculated.
- a laser diffraction / scattering particle size analyzer for example, SACD-2100, manufactured by Shimadzu Corporation
- True density of the hollow filler is preferably 0.1 ⁇ 0.9g / cm 3, more preferably 0.5 ⁇ 0.9g / cm 3, particularly preferably 0.6 ⁇ 0.8g / cm 3. According to the hollow filler whose true density is within the above range, more appropriate mechanical strength and rubber elasticity can be imparted to the adhesive layer obtained by curing the floor structure adhesive containing the true density.
- the true density of the hollow filler can be measured by a gas substitution method using, for example, a density measuring device (for example, Akipic II 1340 manufactured by Shimadzu Corporation).
- a density measuring device for example, Akipic II 1340 manufactured by Shimadzu Corporation.
- the content of the hollow filler in the floor structure adhesive is preferably 1 to 30 parts by weight and more preferably 5 to 20 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer. If the content of the hollow filler in the floor structure adhesive is too low, there is a possibility that appropriate mechanical strength and rubber elasticity cannot be imparted to the adhesive layer formed by curing the floor structure adhesive. In addition, if the content of the hollow filler in the floor structure adhesive is too high, the viscosity of the resulting floor structure adhesive increases, and the coatability of the floor structure adhesive may decrease. There is.
- the floor structure adhesive of the present invention preferably contains a flaky inorganic filler.
- a flaky inorganic filler By using a flaky inorganic filler, it becomes possible to impart more appropriate mechanical strength and rubber elasticity to an adhesive layer formed by curing an adhesive for floor structure, and a floor using an adhesive layer. The generation of floor noise and gaps in the structure can be greatly reduced.
- Examples of the material constituting the flaky inorganic filler include mica, talc, silica, vermiculite, alumina, mica and the like. Of these, talc is preferable.
- the average particle size of the flaky inorganic filler is preferably 1 to 50 ⁇ m, more preferably 10 to 30 ⁇ m. If the average particle size of the flaky inorganic filler is too small, there is a possibility that sufficient mechanical strength and rubber elasticity cannot be imparted to the adhesive layer. On the other hand, if the average particle diameter of the flaky inorganic filler is too large, the rubber elasticity of the adhesive layer may be lowered.
- the average particle diameter of the flaky inorganic filler is a value measured using a laser diffraction / scattering particle size analyzer.
- a suspension is obtained by irradiating ultrasonic waves at an output of 1 kW for 10 minutes using an ultrasonic homogenizer.
- the volume particle size distribution of the flaky inorganic filler is measured with a laser diffraction / scattering particle size analyzer (for example, SACD-2100 manufactured by Shimadzu Corporation), and the cumulative 50% value of the volume particle size distribution is flaky. It can be calculated as the average particle size of the inorganic filler.
- the content of the flaky inorganic filler in the floor structure adhesive is preferably 30 to 200 parts by weight, more preferably 50 to 150 parts by weight, more preferably 100 to 150 parts by weight based on 100 parts by weight of the polyoxyalkylene polymer. Part by weight is particularly preferred. If the content of the flaky inorganic filler in the floor structure adhesive is too low, there is a possibility that appropriate mechanical strength and rubber elasticity cannot be imparted to the adhesive layer formed by curing the floor structure adhesive. In addition, if the content of the flaky inorganic filler in the floor structure adhesive is too high, the viscosity of the resulting floor structure adhesive increases, and the applicability of the floor structure adhesive may decrease. There is.
- the floor structure adhesive of the present invention preferably further contains a dehydrating agent. According to the dehydrating agent, when the floor structure adhesive is stored, the floor structure adhesive can be prevented from being hardened by moisture contained in the air.
- dehydrating agents include silane compounds such as vinyltrimethoxysilane, dimethyldimethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, tetramethoxysilane, phenyltrimethoxysilane, and diphenyldimethoxysilane; and methyl orthoformate And ester compounds such as ethyl orthoformate, methyl orthoacetate, and ethyl orthoacetate.
- dehydrating agents may be used alone or in combination of two or more. Of these, vinyltrimethoxysilane is preferable.
- the content of the dehydrating agent in the floor structure adhesive is preferably 0.5 to 20 parts by weight, more preferably 1 to 15 parts by weight, with respect to 100 parts by weight of the polyoxyalkylene polymer. Part is particularly preferred. If the content of the dehydrating agent in the floor structure adhesive is too low, the effect obtained by the dehydrating agent may not be sufficient. Further, if the content of the dehydrating agent in the floor structure adhesive is too high, the storage stability and handleability of the floor structure adhesive may be lowered.
- the floor structure adhesive of the present invention may contain other additives such as antioxidants, ultraviolet absorbers, pigments, dyes, anti-settling agents, and solvents. Of these, antioxidants and ultraviolet absorbers are preferred.
- antioxidants examples include hindered phenolic antioxidants, monophenolic antioxidants, bisphenolic antioxidants, and polyphenolic antioxidants.
- the content of the antioxidant in the floor structure adhesive is preferably 0.1 to 20 parts by weight and more preferably 0.3 to 10 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer.
- UV absorbers examples include benzotriazole UV absorbers and benzophenone UV absorbers, and benzotriazole UV absorbers are preferred.
- the content of the ultraviolet absorber in the floor structure adhesive is preferably 0.1 to 20 parts by weight, more preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the polyoxyalkylene polymer.
- a polyoxyalkylene polymer having a trimethoxysilyl group, calcium carbonate, a silanol condensation catalyst, and other additives as required may be in a predetermined weight ratio. It can carry out by the method of mixing. Mixing is preferably performed under reduced pressure.
- the adhesive for floor structures of the present invention is used for floor structures.
- the floor structure is constructed by bonding and integrating a floor finishing material on a floor base material laid on a floor base via an adhesive layer.
- the floor structure of the present invention includes a floor base, a floor base material laid on the floor base, an adhesive layer formed on the floor base material and bonded and integrated with the floor base material. And a floor finishing material laid on the adhesive layer and bonded and integrated with the adhesive layer.
- the floor structure of the present invention comprises a polyoxyalkylene polymer having a trimethoxysilyl group, calcium carbonate, and a silanol condensation catalyst, and is obtained by curing an adhesive for floor structure that does not contain an aminosilane coupling agent.
- the agent layer is used.
- the floor finishing material and the floor base material are each bonded and integrated with the adhesive layer.
- FIG. 1 shows an example of a schematic sectional view of a floor structure in which the floor structure adhesive of the present invention is used.
- the floor structure shown in FIG. 1 includes a floor base material 30 laid on a floor base 1 via a spacer 2, and an adhesive formed on the floor base material 30 and bonded and integrated with the floor base material 30. And a floor finish 20 laid on the adhesive layer 10 and bonded and integrated with the adhesive layer 10.
- the floor base material 30 is laid on the floor base 1 via the spacer 2 in order to keep the floor base 1 and the floor base material 30 in a non-contact state.
- the floor base material 30 may be directly laid on the floor base 1 without the spacer 2 interposed therebetween.
- a floor structure is constructed as follows, for example. First, a floor base material 30 is laid on the floor base 1 via a spacer 2 as necessary. Next, after applying the floor structure adhesive on the floor base material 30, the floor finishing material 20 is laid on the coated floor structure adhesive to obtain a laminate. Thereafter, the adhesive layer 10 is formed by curing the floor structure adhesive, and the floor base material 30 and the floor finish material 20 are bonded and integrated by the adhesive layer 10 to thereby form the floor structure. Construction is done. The curing of the floor structure adhesive is not particularly limited, and is performed, for example, by leaving the laminate.
- the floor base is not particularly limited, and examples include soil concrete and concrete floor slabs.
- Examples of members constituting the floor finishing material include plywood, medium density fiberboard (MDF), tile, vinyl chloride sheet, and stone.
- MDF medium density fiberboard
- tile vinyl chloride sheet
- stone stone.
- a plurality of floor finishing materials are arranged without gaps.
- the member constituting the floor base material examples include plywood, particle board, Kineta, gypsum board, slate board, and concrete board.
- a floor base material made of a wooden member such as plywood or particle board.
- a floor finish is bonded and integrated with a floor base material made of wood using a conventional adhesive, it will be difficult to peel the floor finish from the floor base material. Forcibly peel the floor finish from the floor base material. Then, a problem that a part of the floor base material peels off together with the floor finish and damages the floor base material is particularly likely to occur.
- the floor structure adhesive of the present invention is preferably used for bonding a floor base material made of a wooden member and a floor finishing material.
- a vibration damping composite 40 in which a vibration damping sheet 42 and a base base material 43 are bonded and integrated by an adhesive layer 41 can be used.
- the floor structure shown in FIG. 2 has the same configuration except that the vibration damping composite 40 is used in place of the floor base material 30 in the floor structure shown in FIG.
- Examples of the vibration damping sheet 42 include a sheet in which a high specific gravity substance is mixed in a synthetic resin or asphalt.
- Examples of the high specific gravity material include inorganic powders such as barium sulfate, and metal powders such as lead and iron.
- Examples of the synthetic resin include polyethylene, polyurethane, and vinyl chloride.
- the adhesive layer 41 a layer obtained by curing a conventionally known adhesive such as an epoxy-based adhesive or a urethane-based adhesive is used.
- the floor structure adhesive of the present invention can be cured by moisture in the air or moisture contained in the floor finishing material and the floor base material, and the floor finishing material can be bonded and integrated with the floor base material. Further, since the adhesive layer formed by curing the floor structure adhesive has an appropriate mechanical strength and rubber elasticity, by using the adhesive layer formed by curing the floor structure adhesive, The occurrence of gaps and squeaking in the floor structure can be greatly reduced. Furthermore, in a floor structure using an adhesive layer formed by curing an adhesive for floor structure, it can be easily peeled from the floor base material without damaging the floor base material. Therefore, the floor finishing material can be efficiently replaced when the floor finishing material is repaired.
- FIG. 1 is a schematic cross-sectional view of a floor structure that is a preferred embodiment of the present invention. It is a schematic cross section of the floor structure which is another preferred embodiment of the present invention.
- the gap test of an Example it is a schematic diagram of the floor base material by which the adhesive agent was apply
- the gap test of an Example it is a schematic diagram which shows the state by which the floor finishing material was fixed on the floor base material in which the adhesive agent was apply
- a floor squeal test it is a schematic diagram of a floor base material in which an adhesive is applied in a bead shape on one surface.
- a floor squeal test it is a schematic diagram showing a state in which a floor finishing material is bonded and integrated on a floor base material on which one side is coated with an adhesive in a bead shape.
- Examples 1 to 14, Comparative Examples 1 to 3 A polyoxyalkylene polymer having a main chain skeleton of polyoxypropylene and a trimethoxysilyl group at the end of the main chain skeleton via a urethane bond (viscosity at 25 ° C., 5,000 mPa ⁇ s, Bayer AG)
- the adhesive 60 ′ was cured to form an adhesive layer 60, and a joined body (I) in which the floor base material 70 and the floor finishing material 80 were respectively bonded and integrated with the adhesive layer 60 was obtained.
- the joined body (I) was dried for 1 week in an atmosphere of a temperature of 80 ° C. and a relative humidity of 2%. The dimension (mm) of the gap generated between the two floor finishing materials in the joined body (I) after drying was measured.
- the adhesive 60 ' is bead-shaped (width 6mm, thickness 5mm) in the short direction of the floor base material 70 (conifer plywood: length 300mm x width 450mm x thickness 20mm). Two were applied so that Thereafter, a floor finishing material 80 (conifer plywood: length 300 mm ⁇ width 450 mm ⁇ thickness 12 mm) is laminated on the surface of the floor base material 70 to which the adhesive 60 ′ is applied, and pressure is applied to the floor finishing material 80 to below the floor. After spreading the adhesive 60 ′ between the ground material 70 and the floor finishing material 80, place a 10 kg weight on the center of the floor finishing material 80 and press the floor base material 70 and the floor finishing material 80 together.
- a laminate was obtained.
- the laminated body is cured for 2 weeks in an atmosphere of a temperature of 23 ° C. and a relative humidity of 55% to cure the adhesive 60 ′ to form an adhesive layer 60.
- the floor base material 70 and the floor finish 80 are adhesive layers.
- a joined body (II) bonded and integrated with 60 was obtained. As shown in FIG.
- the present invention it is possible to provide a floor structure in which generation of floor squeezing and gaps is reduced and the floor finishing material can be easily peeled off from the floor base material when the floor finishing material is repaired.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Floor Finish (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
トリメトキシシリル基(-Si(OCH3)3)を有するポリオキシアルキレン系重合体は、主鎖が、一般式:-(R-O)n-(式中、Rは炭素数が1~14のアルキレン基を表し、nは、繰り返し単位の数であって正の整数である。)で表される繰り返し単位を含有する重合体が好ましく挙げられる。ポリオキシアルキレン系重合体の主鎖骨格は一種のみの繰り返し単位からなっていてもよいし、二種以上の繰り返し単位からなっていてもよい。
測定装置 TOSOH社製 商品名「HLC-8121GPC/HT」
測定条件 カラム:TSKgelGMHHR-H(20)HT×3本
TSKguardcolumn-HHR(30)HT×1本
移動相:o-DCB 1.0mL/分
サンプル濃度:1mg/mL
検出器:ブライス型屈折計
標準物質:ポリスチレン(TOSOH社製 分子量:500~8420000)
溶出条件:145℃
SEC温度:145℃
本発明の床構造接着剤では、上述したポリオキシアルキレン系重合体と炭酸カルシウムとを組み合わせて用いることにより、適度な接着力を有する接着剤層を形成することができる。このような接着剤層によれば、床下地材と床仕上げ材とを接着一体化できる一方で、上記接着剤層を用いてなる床構造において床仕上げ材を改修する時には床下地材を損傷させることなく床仕上げ材を床下地材から容易に剥離することができる。さらに、本発明の床構造接着剤では、上述したポリオキシアルキレン系重合体と炭酸カルシウムとを組み合わせて用いることにより、上記接着剤層が柔軟になり過ぎないようにして、上記接着剤層に適度な機械的強度及び適度なゴム弾性を付与することも可能となる。したがって、このような接着剤層を用いてなる床構造における床鳴りや目隙の発生を高く低減することができる。
本発明の床構造用接着剤は、シラノール縮合触媒を含有している。シラノール縮合触媒とは、ポリオキシアルキレン系重合体が含有するトリメトキシシリル基が加水分解することなどにより形成されたシラノール基同士の脱水縮合反応を促進させるための触媒である。なお、シラノール基とは、ケイ素原子に直接結合しているヒドロキシ基(≡Si-OH)を意味する。
本発明の床構造用接着剤は、アミノシランカップリング剤を含有しない。アミノシランカップリング剤を床構造用接着剤が含んでいると、床構造用接着剤の接着性が高くなり過ぎ、床仕上げ材を床構造から剥離することが困難となる。
本発明の床構造用接着剤は、エポキシシランカップリング剤を含んでいることが好ましい。エポキシシランカップリング剤を含む床構造用接着剤を硬化させてなる接着剤層によれば、上記接着剤層を用いてなる床構造において床鳴りや目隙が発生することを高く低減できる。
本発明の床構造用接着剤は、中空状充填材を含んでいることが好ましい。中空状充填材によれば、これを含む床構造用接着剤を硬化させてなる接着剤層により適度な機械的強度及び適度なゴム弾性を付与することが可能となり、上記接着剤層を用いてなる床構造における床鳴りや目隙の発生を高く低減できる。
本発明の床構造用接着剤は、薄片状無機充填剤を含んでいることが好ましい。薄片状無機充填剤を用いることにより、床構造用接着剤を硬化させてなる接着剤層に、より適度な機械的強度及びゴム弾性を付与することが可能となり、接着剤層を用いてなる床構造における床鳴りや目隙の発生を高く低減できる。
本発明の床構造用接着剤は、脱水剤をさらに含んでいることが好ましい。脱水剤によれば、床構造用接着剤を保存している際に、空気中などに含まれている水分によって床構造用接着剤が硬化することを抑制することができる。
本発明の床構造用接着剤は、酸化防止剤、紫外線吸収剤、顔料、染料、沈降防止剤、及び溶剤など他の添加剤を含んでいてもよい。なかでも、酸化防止剤、及び紫外線吸収剤が好ましく挙げられる。
本発明の床構造用接着剤は、床構造に用いられる。床構造は、床基盤上に敷設された床下地材上に、接着剤層を介して床仕上げ材が接着一体化されることによって構築される。本発明の床構造は、床基盤と、上記床基盤上に敷設されている床下地材と、上記床下地材上に形成されており且つ上記床下地材と接着一体化している接着剤層と、上記接着剤層上に敷設されており且つ上記接着剤層と接着一体化している床仕上げ材とを含んでいる。
主鎖骨格がポリオキシプロピレンであり、且つ主鎖骨格の末端にウレタン結合を介してトリメトキシシリル基を有しているポリオキシアルキレン系重合体(25℃における粘度5,000mPa・s、バイエル社製 製品名「Desmoseal(登録商標)XP2749」)、重質炭酸カルシウム(白石カルシウム社製 製品名「ホワイトンSB」)、膠質炭酸カルシウム(白石カルシウム社製 製品名「カルファイン200M」)、シラノール縮合触媒1(ジブチル錫ビス(トリエトキシシリケート) 日東化成社製 製品名「ネオスタンS-303」)、シラノール縮合触媒2(1,8-ジアザビシクロ[5.4.0]ウンデカ-7-エン、サンアプロ社製 製品名「DBU」)、アミノシランカップリング剤(N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、信越化学工業社製 製品名「KBM-603」)、エポキシシランカップリング剤(3-グリシドキシプロピルトリメトキシシラン、信越化学工業社製 製品名「KBM-403」)、ガラスバルーン(平均一次粒子径45μm、真密度0.37g/cm3、住友スリーエム社製 製品名「グラスバブルズ K37」)、フライアッシュバルーン(平均一次粒子径130μm、真密度0.75g/cm3、オメガ社製 製品名「オメガスフィアーズ SG」)、薄片状無機充填剤(薄片状タルク、平均粒子径25μm、日本タルク株式会社製 製品名「MS-KY」)、脱水剤(ビニルトリメトキシシラン)、及びヒンダードフェノール系酸化防止剤(BASF社製 製品名「IRGANOX(登録商標)1010」)を、それぞれ表1に示した配合量となるようにして、密封した攪拌機中で減圧しながら均一になるまで混合することにより接着剤を調製した。
接着剤について、以下の評価を行った。結果を表1に示す。
床下地材70(針葉樹合板:縦300mm×横1800mm×厚み20mm)を80℃で1週間加熱することにより乾燥させた後、図3に示すように、床下地材70の短手方向に接着剤60' をビード状(幅6mm、厚さ5mm)に相互の間隔が6mmとなるようにして6本塗布した。その後、図4に示すように、床下地材70の接着剤60'が塗布された面上に、2枚の床仕上げ材80(針葉樹合板:縦303mm×横900mm×厚み12mm)を、一方の床仕上げ材80の短手方向一端面と、他方の床仕上げ材80の短手方向他端面とが接触するようにして積層することにより積層体を得た。次に、積層体の床仕上げ材80の四隅部に釘81を打ち、床仕上げ材80を床下地材70に固定した後、積層体を温度23℃、相対湿度55%の雰囲気下で2週間養生させることにより、接着剤60' を硬化させて接着剤層60とし、床下地材70及び床仕上げ材80がそれぞれ接着剤層60と接着一体化している接合体(I)を得た。そして、この接合体(I)を温度80℃、相対湿度2%の雰囲気下で1週間、乾燥させた。乾燥後の接合体(I)における2枚の床仕上げ材間に生じた目隙の寸法(mm)を測定した。
図5に示すように、床下地材70(針葉樹合板:縦300mm×横450mm×厚み20mm)の短手方向に接着剤60' をビード状(幅6mm、厚さ5mm)に相互の間隔が300mmとなるようにして2本塗布した。その後、床下地材70の接着剤60' が塗布された面上に、床仕上げ材80(針葉樹合板:縦300mm×横450mm×厚み12mm)を積層し、床仕上げ材80に圧力を加えて床下地材70と床仕上げ材80との間の接着剤60' を押し広げた後、床仕上げ材80の中央部に10kgの重りを乗せて床下地材70と床仕上げ材80とを圧着させることにより積層体を得た。この積層体を温度23℃、相対湿度55%の雰囲気下で2週間養生させることにより、接着剤60' を硬化させて接着剤層60とし、床下地材70及び床仕上げ材80が接着剤層60とそれぞれ接着一体化している接合体(II)を得た。接合体(II)の床下地材70の長手方向の両端部を、図6に示すように、2本の支持台90で支持した後、接合体(II)の床仕上げ材80の長手方向における中央部b に床仕上げ材80の短手方向に向かって500mm/分の速度で3mmの変位(たわみ)が生じるように曲げ応力を加えて、床仕上げ材80の剥離又は割れによる床鳴りの発生を評価した。なお、表1における「良(good)」及び「不良(bad)」はそれぞれ下記の通りである。
良:床鳴りの発生がなかった。
不良:床鳴りの発生があった。
針葉樹合板(縦300mm×横1800mm×厚み20mm)に接着剤をビード状(幅6mm、厚さ5mm、長さ1800mm)に塗布し、温度23℃、相対湿度50%の雰囲気下に7日間放置させることにより硬化させて、硬化物を得た。そして、スクレーパーにより硬化物をその長さ方向における一端部から他端部へ向かって針葉樹合板から引き剥がし、全ての硬化物を針葉樹合板から引き剥がすことに要した時間(秒)を測定した。
上記床鳴り試験における手順と同様にして、床下地材70及び床仕上げ材80が接着剤層60と接着一体化している接合体(II)を得た。そして、この接合体(II)における床下地材70から床仕上げ材80をバールによって剥離させた。この時、床下地材70を損傷させることなく、床下地材70から床仕上げ材80を剥離させることが可能であったものを「良(good)」とし、床下地材70から床仕上げ材80を剥離させる際に、床下地材70の少なくとも一部が床仕上げ材80と共に剥離して床下地材70に損傷が発生したものを「不良(bad)」とした。
2 スペーサー
10 接着剤層
20 床仕上げ材
30 床下地材
40 制振性複合体
41 接着剤
42 下地基材
43 制振シート
Claims (8)
- 床基盤上に敷設された床下地材上に、床仕上げ材を接着するための床構造用接着剤において、
トリメトキシシリル基を有するポリオキシアルキレン系重合体と、炭酸カルシウムと、シラノール縮合触媒とを含有し、且つアミノシランカップリング剤を含有しないことを特徴とする床構造用接着剤。 - シラノール縮合触媒が、有機錫系化合物及び/又はシクロアミジン系化合物を含むことを特徴とする請求項1に記載の床構造用接着剤。
- 中空状充填材を含有することを特徴とする請求項1に記載の床構造用接着剤。
- 薄片状無機充填剤を含有することを特徴とする請求項1に記載の床構造用接着剤。
- 床基盤と、上記床基盤上に敷設されている床下地材と、上記床下地材上に形成されており且つ上記床下地材と接着一体化している接着剤層と、上記接着剤層上に敷設されており且つ上記接着剤層と接着一体化している床仕上げ材とを含み、
上記接着剤層が、トリメトキシシリル基を有するポリオキシアルキレン系重合体、炭酸カルシウム、及びシラノール縮合触媒を含有し、且つアミノシランカップリング剤を含有しない床構造用接着剤を硬化させてなるものであることを特徴とする床構造。 - シラノール縮合触媒が、有機錫系化合物及び/又はシクロアミジン系化合物を含むことを特徴とする請求項5に記載の床構造。
- 床構造用接着剤が、中空状充填材を含有することを特徴とする請求項5に記載の床構造。
- 床構造用接着剤が、薄片状無機充填剤を含有することを特徴とする請求項5に記載の床構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012552597A JP5324002B1 (ja) | 2011-09-30 | 2012-09-28 | 床構造用接着剤及び床構造 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-217426 | 2011-09-30 | ||
JP2011217426 | 2011-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013047838A1 true WO2013047838A1 (ja) | 2013-04-04 |
Family
ID=47995862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/075246 WO2013047838A1 (ja) | 2011-09-30 | 2012-09-28 | 床構造用接着剤及び床構造 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5324002B1 (ja) |
WO (1) | WO2013047838A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014065076A1 (ja) * | 2012-10-22 | 2014-05-01 | 積水フーラー株式会社 | 床構造用接着剤 |
JP2015205955A (ja) * | 2014-04-17 | 2015-11-19 | 日本特殊陶業株式会社 | ウェハ加熱装置用の接着剤及びこれを用いたウェハ加熱装置 |
JP2017137473A (ja) * | 2016-02-04 | 2017-08-10 | 積水フーラー株式会社 | 室温硬化性接着剤 |
US10077486B2 (en) | 2013-08-09 | 2018-09-18 | Jfe Steel Corporation | High-strength cold-rolled steel sheet and method of manufacturing the same |
JP2019218466A (ja) * | 2018-06-19 | 2019-12-26 | 積水フーラー株式会社 | 硬化性組成物 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7072187B2 (ja) * | 2017-03-29 | 2022-05-20 | 積水フーラー株式会社 | 床構造体及びその施工方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1088818A (ja) * | 1996-09-11 | 1998-04-07 | Cemedine Co Ltd | 床のリフォーム工法 |
JP2000154637A (ja) * | 1997-12-18 | 2000-06-06 | Sekisui Chem Co Ltd | 床構成体及びその施工方法 |
JP2010529221A (ja) * | 2007-06-01 | 2010-08-26 | コンストラクション リサーチ アンド テクノロジー ゲーエムベーハー | フローリング接着剤 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2865534B2 (ja) * | 1993-09-22 | 1999-03-08 | 積水化学工業株式会社 | 接着性テープおよび粘着性テープ |
JP2000044773A (ja) * | 1998-07-28 | 2000-02-15 | Konishi Co Ltd | 1液湿気硬化型組成物 |
JP4590927B2 (ja) * | 2004-05-12 | 2010-12-01 | 横浜ゴム株式会社 | 接着剤組成物 |
JP5420894B2 (ja) * | 2006-02-16 | 2014-02-19 | 株式会社カネカ | 硬化性組成物 |
-
2012
- 2012-09-28 JP JP2012552597A patent/JP5324002B1/ja active Active
- 2012-09-28 WO PCT/JP2012/075246 patent/WO2013047838A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1088818A (ja) * | 1996-09-11 | 1998-04-07 | Cemedine Co Ltd | 床のリフォーム工法 |
JP2000154637A (ja) * | 1997-12-18 | 2000-06-06 | Sekisui Chem Co Ltd | 床構成体及びその施工方法 |
JP2010529221A (ja) * | 2007-06-01 | 2010-08-26 | コンストラクション リサーチ アンド テクノロジー ゲーエムベーハー | フローリング接着剤 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014065076A1 (ja) * | 2012-10-22 | 2014-05-01 | 積水フーラー株式会社 | 床構造用接着剤 |
JP5507778B1 (ja) * | 2012-10-22 | 2014-05-28 | 積水フーラー株式会社 | 床構造用接着剤 |
US9695346B2 (en) | 2012-10-22 | 2017-07-04 | Sekisui Fuller Company, Ltd. | Adhesive for floor structure |
US10077486B2 (en) | 2013-08-09 | 2018-09-18 | Jfe Steel Corporation | High-strength cold-rolled steel sheet and method of manufacturing the same |
JP2015205955A (ja) * | 2014-04-17 | 2015-11-19 | 日本特殊陶業株式会社 | ウェハ加熱装置用の接着剤及びこれを用いたウェハ加熱装置 |
JP2017137473A (ja) * | 2016-02-04 | 2017-08-10 | 積水フーラー株式会社 | 室温硬化性接着剤 |
JP2019218466A (ja) * | 2018-06-19 | 2019-12-26 | 積水フーラー株式会社 | 硬化性組成物 |
JP7179279B2 (ja) | 2018-06-19 | 2022-11-29 | 積水フーラー株式会社 | 硬化性組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP5324002B1 (ja) | 2013-10-23 |
JPWO2013047838A1 (ja) | 2015-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5324002B1 (ja) | 床構造用接着剤及び床構造 | |
ES2609639T3 (es) | Composición adhesiva endurecible por humedad y procedimiento para instalar suelos de madera dura | |
US20100071849A1 (en) | Polymeric materials and also adhesive and coating compositions composed thereof and based on multi-alkoxysilyl-functional prepolymers | |
JP5507778B1 (ja) | 床構造用接着剤 | |
JP5636141B1 (ja) | 接着剤組成物 | |
KR20140123573A (ko) | 오르가닐옥시실란-종결 폴리머를 기재로 한 가교결합성 조성물 | |
KR20150031479A (ko) | 오르가닐옥시실란-종결 중합체를 기재로 하는 다성분 가교성 조성물 | |
ES2994427T3 (en) | Polyurethane composition for the manufacture of floors, especially for marine applications | |
JP6223240B2 (ja) | 室温硬化性接着剤 | |
KR20170097704A (ko) | 오르가닐-옥시실란-종결화된 중합체를 기반으로 하는 가교 코팅 화합물 | |
JP6162448B2 (ja) | 床構造用接着剤及び床構造 | |
JP2021504183A (ja) | 床材の下塗りおよび接着のための新しい系 | |
JP6417065B2 (ja) | 硬化性組成物 | |
ES2674428T3 (es) | Procedimiento de instalación de parqué con estabilidad dimensional mejorada | |
US20220119593A1 (en) | Multi-component crosslinkable masses based on organyloxysilane-terminated polymers | |
JP6712414B2 (ja) | 室温硬化性接着剤 | |
JP2018193536A (ja) | シーリング材組成物、シーリング目地構造、シーリング目地構造の施工方法 | |
JP7325077B2 (ja) | 硬化性組成物 | |
JP2000273432A (ja) | 床構成体 | |
JP2000265646A (ja) | 床構成体 | |
JP7590749B2 (ja) | 硬化性組成物 | |
JP6509023B2 (ja) | 室温硬化性接着剤 | |
JP2005264126A (ja) | 接着剤及びそれを用いた床構造体 | |
JP7493151B2 (ja) | タイル施工方法及び接着剤組成物 | |
JP2018168692A (ja) | 床構造体及びその施工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2012552597 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12835866 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 25.09.14) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12835866 Country of ref document: EP Kind code of ref document: A1 |