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WO2009116165A1 - トレイ搬送装置およびそれを備えた電子部品試験装置 - Google Patents

トレイ搬送装置およびそれを備えた電子部品試験装置 Download PDF

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Publication number
WO2009116165A1
WO2009116165A1 PCT/JP2008/055255 JP2008055255W WO2009116165A1 WO 2009116165 A1 WO2009116165 A1 WO 2009116165A1 JP 2008055255 W JP2008055255 W JP 2008055255W WO 2009116165 A1 WO2009116165 A1 WO 2009116165A1
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WO
WIPO (PCT)
Prior art keywords
tray
test
holding
tested
transport
Prior art date
Application number
PCT/JP2008/055255
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
健一 島田
佳貴 竹内
Original Assignee
株式会社アドバンテスト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドバンテスト filed Critical 株式会社アドバンテスト
Priority to PCT/JP2008/055255 priority Critical patent/WO2009116165A1/ja
Priority to TW098105427A priority patent/TWI490970B/zh
Publication of WO2009116165A1 publication Critical patent/WO2009116165A1/ja

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to a tray transport apparatus for transporting a tray that can accommodate various electronic components (hereinafter also referred to as IC devices) such as semiconductor integrated circuit elements, and an electronic component test apparatus including the tray transport apparatus. .
  • IC devices electronic components
  • semiconductor integrated circuit elements semiconductor integrated circuit elements
  • an electronic component test apparatus In the manufacturing process of an IC device, an electronic component test apparatus is used to test the performance and function of the IC device in a packaged state.
  • a handler constituting the electronic component testing apparatus includes a loader unit, a chamber unit, an unloader unit, and a storage unit.
  • the loader unit reloads the IC device from the customer tray to the test tray, and loads the test tray into the chamber unit.
  • the customer tray is a tray for storing a pre-test or a tested IC device.
  • the pre-test IC device is supplied to the handler from the previous process while being stored in the customer tray. Then, it is sent out from the handler to the subsequent process while being accommodated in the customer tray.
  • the test tray is a dedicated tray that is circulated and conveyed in the handler.
  • the chamber portion applies a high or low temperature thermal stress to the IC device with the IC device mounted on the test tray, and then presses the IC device against the socket provided in the test head.
  • a tester constituting the electronic component testing apparatus performs a test of the IC device via the test head.
  • the unloader unit sorts out the test tray containing the tested IC device from the chamber unit, and places the IC device on the customer tray according to the test result, thereby classifying the product into a category such as a non-defective product or a defective product.
  • the storage unit supplies the customer tray containing the IC device before the test to the loader unit, and accepts the customer tray containing the tested IC device from the unloader unit.
  • the storage unit includes a stocker that stores a plurality of customer trays in a stacked state, a lifting device that feeds and unloads the customer tray to and from the loader unit and the unloader unit by moving the customer tray up and down, a stocker, and a lifting device And a tray transfer device for transferring the customer tray between the printer and the customer.
  • the tray transfer device When exchanging the customer tray mounted on the lifting device, the tray transfer device must reciprocate between the stocker and the lifting device, which is likely to cause a neck process.
  • the number of IC devices that can be simultaneously tested in the electronic component test apparatus (the number of simultaneous measurements) is inevitably increased, it is necessary to speed up the replacement operation of the customer tray, and this tendency becomes remarkable.
  • the problem to be solved by the present invention is to provide a tray conveying device and an electronic component testing device capable of shortening replacement work.
  • a tray transport apparatus for transporting a tray capable of accommodating an electronic device under test, the storage means storing the tray, the holding means holding the tray, and the tray temporarily.
  • a tray transfer device is provided (see claim 1).
  • the storage means is a storage plate that can be temporarily stored by holding the tray only by being placed by the transport means.
  • the holding means contains a first holding means for holding a pre-test tray that contains the electronic device under test before testing, and houses the electronic device under test that has been tested.
  • a second holding means for holding the tested tray, and the storage means is preferably disposed between the first holding means and the second holding means. Item 2).
  • the moving distance of the tray by the conveying means from the holding means to the storage means is shorter than the moving distance of the tray by the conveying means from the holding means to the storing means. It is preferable (see claim 3).
  • the storage means includes a first storage means for storing a pre-test tray containing the electronic device under test before testing, and a test containing the tested electronic device under test. It is preferable to include a second storing means for storing a finished tray and a third storing means for storing an empty tray that does not contain the electronic device under test (see claim 4).
  • the at least one transporting unit includes first and second transporting units capable of independently transporting the tray
  • the control unit includes A first transport unit transports the tray between the first storage unit, the first holding unit, the storage unit, and a third storage unit, and the second transport unit performs the storage. Controlling the first and second transport means to transport the tray between the means, the second holding means, the second storage means, and the third storage means. Is preferable (see claim 5).
  • control means may be configured such that the first transport means holds the pre-test tray storing the electronic device under test before the test from the first storage means to the first holding means.
  • the empty tray in which the electronic device under test before being tested is emptied is conveyed from the first holding device to the storage device, and the second conveying device removes the electronic device under test.
  • An empty tray that is not accommodated is transported from the storage means or the third storage means to the second holding means, and the tested tray that contains the tested electronic component to be tested is contained in the second holding means. It is preferable to control the first and second conveying means so as to convey from the means to the second storage means (see claim 6).
  • control means is configured such that the second transport means transports the tested tray containing the tested electronic components to be tested from the second holding means to the storage means.
  • first transport means controls the first and second transport means so that the tested tray is transported from the storage means to the first holding means or the first storage means. It is preferable to do so (see claim 7).
  • the first and second holding means are capable of moving the tray along a first direction
  • the first and second transport means are The tray can be moved independently along the first direction and a second direction different from the first direction, and the first, second and third storages are possible.
  • the means is arranged along the second direction, and the first and second holding means and the storage means are arranged in the first direction with respect to the first to third storage means. It is preferable that it is located in (refer Claim 8).
  • the first transport means has a plurality of first gripping portions capable of gripping the tray, and the plurality of first gripping portions are the first gripping portions. It is preferable that they can move independently along the direction and can move together along the second direction (see claim 9).
  • the second conveying means has a plurality of second gripping portions capable of gripping the tray, and the plurality of second gripping portions include the first and the second gripping portions. It is preferable that they can move independently along the second direction (see claim 10).
  • each of the first and second holding portions can hold a plurality of the trays, and each of the storage means and the holding means can hold a plurality of the trays. There is preferably (see claim 11).
  • an electronic component testing apparatus used for testing the electronic device under test by bringing an input / output terminal of the electronic device under test into electrical contact with a contact portion of a test head.
  • an electronic component testing apparatus provided with the tray conveying device is provided (see claim 12).
  • a loader unit for transferring the electronic device under test from the tray to the second tray, and the electronic device under test loaded from the loader unit are mounted on the second tray.
  • the tray conveying device supplies the tray in which the electronic device under test before testing is accommodated to the loader unit, and receives the tray in which the electronic device under test has been accommodated from the unloader unit. Is preferable (see claim 13).
  • the tray replacement work can be shortened.
  • FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of the electronic component testing apparatus of FIG.
  • FIG. 3 is a conceptual diagram showing a tray handling method in the electronic component testing apparatus of FIG.
  • FIG. 4 is an exploded perspective view showing a stocker used in the electronic component testing apparatus of FIG.
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG.
  • FIG. 6 is a front view showing a storage unit of the electronic component testing apparatus of FIG.
  • FIG. 7 is a side view of the storage unit of FIG.
  • FIG. 8 is a front view illustrating a first transfer arm of the tray transfer device in the storage unit of FIG. 6.
  • FIG. 9 is a front view showing a second transfer arm of the tray transfer device in the storage unit of FIG.
  • FIG. 10 is a block diagram showing a control system of the storage unit of the electronic component test apparatus of FIG.
  • FIG. 11 is an exploded perspective view of a test tray used in the electronic component testing apparatus of FIG.
  • FIG. 12A is a schematic front view (No. 1) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12B is a schematic front view (No. 2) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12C is a schematic front view (No.
  • FIG. 12D is a schematic front view (No. 4) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12E is a schematic front view (No. 5) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12F is a schematic front view (No. 6) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12G is a schematic front view (No.
  • FIG. 12H is a schematic front view (No. 8) illustrating the first example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 12I is a schematic front view (No. 9) illustrating the first example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 12J is a schematic front view (No. 10) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12K is a schematic front view (No.
  • FIG. 12L is a schematic front view (No. 12) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12M is a schematic front view (No. 13) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 13A is a schematic front view (No. 1) illustrating a second example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 13B is a schematic front view (No.
  • FIG. 13C is a schematic front view (No. 3) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention.
  • FIG. 13D is a schematic front view (No. 4) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention.
  • FIG. 13E is a schematic front view (No. 5) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13F is a schematic front view (No. 6) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention.
  • FIG. 13G is a schematic front view (No. 7) illustrating the second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13H is a schematic front view (No. 8) illustrating the second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13I is a schematic front view (No. 9) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13J is a schematic front view (No. 10) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13K is a schematic front view (No. 11) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to the present embodiment
  • FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1
  • FIG. 3 is a concept showing a tray handling method in the electronic component testing apparatus of FIG. FIG.
  • FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus, and there is actually a portion in which the members arranged in the vertical direction are shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
  • the electronic component test apparatus tests (inspects) whether or not the IC device properly operates in a state where a high-temperature or low-temperature thermal stress is applied to the IC device, and the IC device is determined based on the test result. It is an apparatus for classifying, and includes a handler 1, a test head 5, and a tester 6. The test of the IC device by the electronic component test apparatus is performed in a state where the IC device is transferred from the customer tray KST to the test tray TST and mounted on the test tray TST.
  • the handler 1 in this embodiment includes a storage unit 200 that stores a customer tray KST that contains a pre-test or a tested IC device, and a customer tray KST supplied from the storage unit 200.
  • the IC device is mounted on the test tray TST, and the IC device is loaded in the test tray TST while applying a predetermined thermal stress to the loader unit 300 for feeding the test tray TST to the chamber unit 100 and the IC device.
  • the socket 50 mounted on the top of the test head 5 is connected to the tester 6 through the cable 7 shown in FIG.
  • the IC device electrically connected to the socket 50 is connected to the tester 6 via the cable 7, and a test signal is exchanged between the IC device and the tester 6.
  • a space 8 is formed in the lower portion of the handler 1, and the test head 5 is replaceably disposed in the space 8, and an opening 101 a formed in the main base (base) 101 of the handler 1.
  • the IC device and the socket 50 on the test head 5 can be brought into electrical contact with each other.
  • the socket 50 on the test head 5 is replaced with a socket suitable for the type after replacement.
  • ⁇ Storage unit 200> 4 is an exploded perspective view showing a stocker used in the electronic component testing apparatus of FIG. 1
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG. 1
  • FIG. 6 is an electronic component testing apparatus of FIG. 7 is a side view of the storage unit of FIG. 6
  • FIG. 8 is a front view of the first transfer arm of the tray transfer device in the storage unit of FIG. 6
  • FIG. 9 is the storage of FIG.
  • FIG. 10 is a block diagram showing a control system of a storage unit of the electronic component test apparatus of FIG. 1.
  • the storage unit 200 includes stockers 211 to 213 for storing customer trays KST, lifting devices 220A and 220B that can hold the customer trays KST and can be lifted and lowered, and stockers 211 to 213. And a tray transfer device 230 that conveys the customer tray KST between the lifting devices 220A and 220B.
  • the storage unit 200 includes a pre-test stocker 211 that stores a customer tray KST containing pre-test IC devices, and a customer that contains IC devices classified according to test results.
  • a tested stocker 212 for storing the tray KST and an empty tray stocker 213 for storing an empty customer tray KST that does not contain an IC device are provided.
  • these stockers 211 to 213 include a frame-like tray support frame 214 and an elevator 215 that can be moved up and down by entering from the lower part of the tray support frame 214.
  • a plurality of customer trays KST are stacked and accommodated in the tray support frame 214, and the stacked customer trays KST are moved up and down by an elevator 215.
  • the numbers of the pre-test stocker 211, the tested stocker 212, and the empty tray stocker 213 can be appropriately set as necessary.
  • the pre-test stocker 211, the tested stocker 212, and the empty tray stocker 213 are arranged side by side in the X-axis direction.
  • one stocker STK-B is provided in the storage unit 200 as the pre-test stocker 211.
  • seven stockers STK-1, STK-2,..., STK-7 are provided in the storage unit 200 as the tested stockers 212, and are sorted and stored in up to seven categories according to the test results. It is configured to be able to. In other words, in addition to distinguishing between non-defective products and defective products, it is possible to sort non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It has become.
  • empty tray stocker 213 two stockers STK-E are provided between STK-4 and STK-5.
  • empty customer trays KST to be sent to the window part 406 opened in the unloader part 400 are stacked.
  • the electronic component testing apparatus includes two first lifting devices 220A and five second lifting devices 220B.
  • the first lifting / lowering device 220 ⁇ / b> A is disposed in each of the two window portions 306 opened in the main base 101 in the loader unit 300.
  • one second lifting device 220B is disposed in each of the five window portions 406 opened in the main base 101 in the unloader portion 400.
  • each of the lifting devices 220 ⁇ / b> A and 220 ⁇ / b> B includes a Z-axis rail 211 provided so as to hang from the main base 101, and a table 222 provided on the Z-axis rail 221 so as to be able to be raised and lowered It is composed of, in particular an actuator (not shown), the table 222 it is possible to lift between the first restricting position H 1 and the second regulation position H 2.
  • First restricting position H 1 is the upper limit of the Z-axis direction of the table 222, the table 222 to the restricting position H 1 of the first is located, via the window 306 (or the window 406), customer tray The KST faces the loader unit 300 (or the unloader unit 400).
  • the second restricting position H 2 is the lower limit in the Z-axis direction of the table 222, in a state where the table 222 is positioned at the restricting position of H 2 the second, customer between the tray transfer apparatus 230 The tray KST is delivered.
  • the lifting devices 220A and 220B move the customer tray KST between the storage unit 200 and the loader unit 300 (or the unloader unit 400) by holding and lifting the customer tray KST on the table 222. It is possible.
  • the tray transfer device 230 includes an X-axis rail 231 installed along the X-axis direction between the main base 101 and the stockers 211 to 213, and is provided on the X-axis rail 231.
  • the first transfer arm 240 and the second transfer arm 250 are provided.
  • the first transfer arm 240 and the second transfer arm 250 can move on the X-axis rail 231 independently along the X-axis direction by an actuator (not shown).
  • the first transfer arm 240 includes a base 241 provided on the X-axis rail 241 so as to be movable in the X-axis direction, two Z-axis rails 242 and 245 fixed to the base 241, Two holding heads 243 and 246 are provided on the Z-axis rails 242 and 245 so as to be movable along the Z-axis direction, respectively.
  • the first holding head 243 is shown in a lowered state
  • the second holding head 246 is shown in a raised state.
  • the first moving arm 240 may be movable along the Y-axis direction.
  • the holding heads 243 and 246 can be moved independently along the Z-axis direction by an actuator (not shown). Since the two holding heads 243 and 246 are attached to the same base 241 via the Z-axis rails 242 and 245, they cannot move independently in the horizontal direction.
  • the holding heads 243 and 246 respectively have open and close gripping claws 244 and 247 for gripping the customer tray KST.
  • the holding heads 243 and 246 can respectively hold the two customer trays KST at the same time.
  • the number of customer trays KST that can be held simultaneously by the holding heads 243 and 246 is not particularly limited.
  • the first transfer arm 240 conveys the customer tray KST containing the IC device before the test from the pre-test stocker 211 to the first elevating device 220A, or from the first elevating device 220A to the storage plate 290.
  • the empty customer tray KST in which no IC device is accommodated is conveyed.
  • the first holding head 243 of the first transfer arm 240 conveys the customer tray containing the IC device before the test from the pre-test stocker 211 to the first lifting device 220A, and the second holding head. 246 transports an empty customer tray that does not contain an IC device from the first lifting device 220A to the storage plate 290.
  • the second transfer arm 250 includes two movable heads 260 and 270 provided on the X-axis rail 241 as shown in FIG.
  • the first and second movable heads 260 and 270 can be moved independently of each other along the X-axis direction by an actuator (not shown).
  • the movable heads 260 and 270 of the second moving arm 250 may be movable along the Y-axis direction.
  • the first movable head 260 includes a first base 261 provided on the X-axis rail 241 so as to be movable in the X-axis direction, a first Z-axis rail 262 fixed to the first base 261, and a Z-axis A first holding head 263 provided on the rail 262 so as to be movable along the Z-axis direction. In FIG. 9, the first holding head 263 is shown in a raised state.
  • the first holding head 263 can be moved along the Z-axis direction by an actuator (not shown). Further, the first holding head 263 has an openable first gripping claw 264 for gripping the customer tray KST downward. In the present embodiment, the first holding head 263 can grip two customer trays KST at the same time. The number of customer trays KST that can be simultaneously held by the first holding head 263 is not particularly limited.
  • the second movable head 270 also includes a second base 271 provided on the X-axis rail 241 so as to be movable along the X-axis direction, and a second Z-axis rail fixed to the second base 271. 272 and a second holding head 273 provided on the Z-axis rail 272 so as to be movable along the Z-axis direction. In FIG. 9, the second holding head 273 is shown in a lowered state.
  • the second holding head 273 can be moved along the Z-axis direction by an actuator (not shown). Further, the second holding head 273 has an openable first gripping claw 274 for gripping the customer tray KST downward. In the present embodiment, the second holding head 273 can simultaneously grip two customer trays KST. The number of customer trays KST that can be simultaneously gripped by the second holding head 273 is not particularly limited.
  • the second transfer arm 250 conveys an empty customer tray KST that does not contain an IC device from the storage plate 290 or the empty tray stocker 213 to the second lifting device 220B, or from the second lifting device 220B.
  • the customer tray KST containing the tested IC device is transported to the tested stocker 212.
  • the tray transfer device 230 is connected to the control device 280.
  • the control device 280 can control the operations of the first transfer arm 240 and the second transfer arm 250 by sending a control signal to each actuator (not shown) of the tray transfer device 230. Yes.
  • the lifting devices 220A and 220B are also connected to the control device 280.
  • the control device 280 sends a control signal to each actuator (not shown) of the lifting devices 220A and 220B, so that the lifting operation of the table 222 is performed. Can be controlled.
  • the tray transfer device 230 in the present embodiment has a height position at which the holding heads 243, 246, 263, and 273 can move horizontally without interfering with the table 222 of the elevating devices 220 ⁇ / b> A and 220 ⁇ / b> B.
  • M 1 and M 2 (hereinafter also simply referred to as movable positions M 1 and M 2 ).
  • the first movable position M 1 is lifting device 220A, is positioned between the first restricting position H 1 and second regulating position of H 2 220B.
  • the second movable position M 2 is lifting device 220A, is positioned between the second regulating position H 2 and stockers 211-213 of 220B.
  • a space having a size through which the holding heads 243, 246, 263, and 273 can pass is formed between the stockers 211 to 213 and the table 222 located at the second restriction position H2. ing.
  • both the holding heads 243, 246, 263, and 273 of the first transfer arm 240 and the second transfer arm 250 move in the horizontal direction at any movable position M 1 , M 2.
  • both the holding heads 243 and 246 are located at the first movable position M 1 (or the second movable position M 2 ), and the holding heads 243 and 246 are in the state. Is moved horizontally, or one holding head 243 is positioned at the first movable position M 1 (or the second movable position M 2 ) and the other holding head 246 is moved to the second movable position.
  • Both holding heads 243 and 246 can be moved in the horizontal direction while being positioned at M 2 (or the first movable position M 1 ).
  • the lifting device 220A while the 220B is moved up and down, the holding head 243,246,263,273 in the second movable position M 2 moves on the stocker 211-213 horizontally moved
  • the holding heads 243, 246, 263, and 273 can be moved horizontally regardless of the position of the table 222 of the elevating devices 220A and 220B.
  • the storage unit 200 includes a storage plate 290 for temporarily storing the customer tray KST.
  • the storage plate 290 is composed of a plate-like member, and the storage plate 290 can hold the customer tray KST only by placing the customer tray KST on the storage plate 290 by the tray transfer device 230. Yes.
  • the storage plate 290 in the present embodiment can hold six customer trays KST in a stacked manner. Note that the storage plate in the present invention is not particularly limited to a plate shape as long as the tray conveying means can be placed thereon.
  • the storage plate 290 is provided between the first movable position M 1 and the second movable position M 2 of the tray transfer device 230, and includes the first lifting device 220 A and the second lifting device. 220B and located above the stocker STK-3 of the tested stocker 212.
  • the moving distance of the customer tray KST by the first transfer arm 240 from the table 222 of the first lifting device 220A located at the second restriction position H2 to the storage table 290 is the table 222.
  • To the empty tray stocker 213 is relatively shorter than the moving distance of the customer tray by the first transfer arm 240.
  • the moving distance of the customer tray in the present invention includes moving distances in all directions.
  • FIG. 11 is an exploded perspective view of a test tray used in the electronic component testing apparatus of FIG.
  • the above-described customer tray KST is conveyed from the pre-test stocker 211 to the first lifting device 220A by the tray transfer device 230, and further opened to the main base 101 in the loader unit 300 by the first lifting device 220A. It is carried from the lower side of the main base 101 to the window portion 306 of the location.
  • the IC device loaded on the customer tray KST is once transferred to the precursor 305 by the device transport apparatus 310, where the mutual positional relationship between the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is reloaded on the test tray TST stopped by the loader unit 300 by the device transport apparatus 310.
  • the test tray TST has a plurality of attachments on both sides of the crosspiece 13 and on the side 12 a of the frame 12 facing the crosspiece 13.
  • the pieces 14 are provided protruding at equal intervals.
  • An insert accommodating portion 15 is configured by the space between the rails 13 or between the rails 13 and the side 12 a and the two attachment pieces 14.
  • Each insert accommodating portion 15 can accommodate one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. Therefore, attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16. As shown in FIG. 11, 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
  • inserts 16 have the same shape and the same dimensions, and an IC device is accommodated in each insert 16.
  • the device housing portion 18 of the insert 16 depends on the shape of the IC device to be housed, and is a rectangular recess in the example shown in FIG.
  • the loader unit 300 includes a device transfer device 310 that transfers IC devices from the customer tray KST to the test tray TST.
  • the device transport apparatus 310 includes two Y-axis rails 311 that are installed on the main base 101 along the Y-axis direction, an operation arm 312 that can move on the Y-axis rails 311 along the Y-axis direction,
  • the movable arm 312 is provided with a movable head 313 supported so as to be movable along the X-axis direction, and a plurality of suction pads (not shown) provided downward on the movable head 313. Each suction pad can be moved up and down by an actuator (not shown), and a plurality of IC devices can be transferred from the customer tray KST to the test tray TST at a time.
  • a precursor 305 is provided between the customer tray KST and the test tray TST.
  • the precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, before the IC device to be transferred from the customer tray KST to the test tray TST is moved to the test tray TST, the IC device is once dropped into the precursor 305 so that the mutual positional relationship of the IC devices can be accurately determined. Therefore, it is possible to accurately transfer the IC device to the test tray TST.
  • test tray TST When IC devices are accommodated in all the inserts 16 of the test tray TST, the test tray TST is carried into the chamber unit 100 by the tray circulation device 102.
  • the first lifting / lowering device 220A lowers the empty tray and delivers it to the first transfer arm 240 of the tray transfer device 230.
  • the first transfer arm 240 temporarily stores the empty tray in the storage plate 290.
  • the second transfer arm 240 of the tray transfer device 230 conveys the empty tray from the storage plate 290 to the second lifting device 220B. .
  • test tray TST is loaded into the chamber unit 100 after the IC devices are loaded by the loader unit 300, and each IC device is tested while being accommodated in the test tray TST.
  • the chamber unit 100 includes a soak chamber 110 that applies a target high-temperature or low-temperature heat stress to the IC device accommodated in the test tray TST, and the heat stress in the soak chamber 110.
  • a soak chamber 110 that applies a target high-temperature or low-temperature heat stress to the IC device accommodated in the test tray TST, and the heat stress in the soak chamber 110.
  • the soak chamber 110 protrudes upward from the test chamber 120 as shown in FIG.
  • a vertical transfer device is provided in the soak chamber 110, and a plurality of test trays TST are held by the vertical transfer device until the test chamber 120 is empty. Waiting while being. Mainly, thermal stress of about ⁇ 55 to + 155 ° C. is applied to the IC device during this standby.
  • a test head 5 is arranged in the center of the test chamber 120.
  • a test tray TST is carried above the test head 5 by a horizontal conveying device conceptually shown in FIG. 3, and an IC device is formed by a pressing device (not shown). Is pressed against the socket 50 on the test head 5. As a result, the input / output terminals of the IC device are brought into electrical contact with the contact pins of the socket 50. In this state, the tester 6 executes the test of the IC device via the test head 5.
  • the result of this test is stored in the storage device of the electronic component test apparatus in association with, for example, the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST.
  • the unsoak chamber 130 also protrudes upward from the test chamber 110.
  • a vertical transfer device is provided in the interior.
  • the IC device when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by air blowing, and then the heat-removed IC device is carried out to the unloader unit 400.
  • the IC device when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return it to a temperature at which dew condensation does not occur, and then the removed IC device is unloaded. Carry out to 400.
  • An inlet for carrying the test tray TST from the main base 101 is formed in the upper part of the soak chamber 110.
  • an outlet for carrying out the test tray TST to the main base 101 is formed in the upper part of the unsoak chamber 130.
  • a tray circulation device 102 for taking the test tray TST out and in and out of the chamber unit 100 through these inlets and outlets is provided on the main base 101.
  • the tray circulation device 102 is configured to convey the test tray TST by, for example, a rotating roller. By this tray circulation device 102, the test tray TST carried out from the unsoak chamber 130 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.
  • the tested IC devices are transferred from the test tray TST carried out from the unsoak chamber 130 while being classified into customer trays KST corresponding to the test results.
  • five windows 406 are opened in the main base 101 in the unloader unit 400.
  • the customer tray KST carried from the storage part 200 by the 2nd lifting / lowering apparatus 220B is arrange
  • the unloader unit 400 includes two device classification devices 410 that transfer a tested IC device from the test tray TST to the customer tray KST. Similar to the device transport apparatus 310, the device classification apparatus 410 includes a Y-axis rail 411, a movable arm 412, and a movable head 413, and simultaneously loads a plurality of IC devices from the test tray TST to the customer tray KST. Is possible.
  • a second lifting device 202B for lifting and lowering the customer tray KST is provided below each window 406 .
  • the loaded customer tray KST loaded with the tested IC devices is loaded and lowered, and the second transfer arm 250 of the tray transfer device 230 receives the full tray, and the second transfer arm 250 The full tray is conveyed to the tested stocker 212 according to the test result.
  • the five window portions 406 are formed in the unloader portion 400, the five categories (test results) can be classified in real time.
  • the customer tray KST corresponding to 5 categories with high occurrence frequency is always positioned in the window 406, and the category with low occurrence frequency is placed in the buffer unit 405 (see FIG. 3).
  • the customer tray KST corresponding to the category may be temporarily stored and called to the window unit 406 at a predetermined timing.
  • FIGS. 13A to 13K are views of a customer tray transport method in the storage unit of the present embodiment. It is a schematic front view which shows two examples.
  • the shaded customer trays indicate trays that accommodate IC devices, and the non-shaded customer trays indicate empty trays that do not accommodate IC devices. .
  • the description in the figure and the following description do not limit the tray transfer source and transfer destination windows 306 and 406.
  • the customer tray is an empty tray KST e that does not contain an IC device.
  • the customer tray becomes empty tray KST e, as shown in FIG. 12B, descends first lifting device 220A that holds the empty tray KST e until second restricting position H 2.
  • the empty tray KST e is stacked on the customer tray KST f full of IC devices.
  • the first transfer arm 240 moves horizontally so that the second holding head 246 is positioned above the lowered first lifting device 220A. Then, as shown in FIG. 12D, the second holding head 246 descends to receive the empty tray KST e from the first lifting device 220A.
  • the full tray KSTf is exposed on the table 222 of the first lifting device 220A.
  • the first transfer arm 240 is horizontally moved a first movable position M 1 above, further, The second holding head 246 is lowered to place the empty tray KST e on the storage plate 290.
  • the first transfer arm 240 In the absence of the storage plate 290, the first transfer arm 240 must transport the empty tray KST e to the empty tray stocker 213. In contrast, in the present embodiment, by temporarily storing the empty tray KST e in storage plate 290, since the number of accesses to the stocker 211-213 of the first transfer arm 240 is reduced, the customer tray Exchange work can be shortened. If the storage plate 290 is full of customer trays, the first transfer arm 240 may move the empty tray KST e to the empty tray stocker 213.
  • the second holding head 246 of the first transfer arm 240 is raised to the first movable position M1, and as shown in FIG. 12H, the first transfer arm 240 is moved horizontally. It moves and retracts from above the storage plate 290 and the first lifting device 220A.
  • the first movable head 260 of the second transfer arm 250 moves horizontally on the first movable position M 1 and stops above the storage plate 290.
  • the 2nd raising / lowering apparatus 220B arrange
  • the customer tray held by the second lifting / lowering device 220B is fully loaded with IC devices by the device classification device 410 of the unloader unit 400, and becomes a full tray KST f .
  • the first holding head 263 of the first movable head 260 is lowered to receive the empty tray KST e from the storage plate 290. Further, the second lifting device 220B is lowered to the second regulation position H 2, the first lifting device 220A which has been lowered starts increasing.
  • the first holding head 263 of the first movable head 260 rises to a first movable position M 1.
  • the first elevating device 220 ⁇ / b> A moves up to the first restriction position H ⁇ b> 1 and the full tray KST f faces the loader unit 300 through the window unit 306.
  • the device transfer device 310 of the loader unit 300 resumes the reloading operation of the IC device before the test from the full tray KST f .
  • the first movable head 260 moves horizontally above the lowered second elevating device 220B, and the first holding head 263 descends to move to the second elevating device 220B.
  • the empty tray KST e is stacked on the full tray KST f originally held on the table 222 of the second lifting device 220.
  • a first holding head 263 is raised to the movable position M 1 first, the first movable head 260 is horizontally moved, lowered to have a second lifting device 220B Retreat from above.
  • the second lifting device 220B is first increased to the restricting position H 1, facing the unloader section 400 empty tray KST e via the window 406.
  • the device classification device 410 of the unloader unit 400 resumes loading of the tested IC device onto the empty tray KST e .
  • the empty tray is supplied from the empty tray stocker 213 to the second lifting device 220B by the first or second movable heads 260 and 270.
  • the customer tray KST r accommodating the required IC devices retested, the window 406 of the unloader section 400 by the tray transfer device 230, the window portion 306 of the loader unit 300 A method of transporting will be described.
  • FIGS. 13A to 13K show only the procedure for transporting the retest tray using the storage plate 290 extracted from the tray transporting operation.
  • the transfer arms 240 and 250 and the lifting / lowering devices 220A and 220B carry out a plurality of customer trays simultaneously and independently.
  • second tray from the second lifting device 220B of the table 222 located in the second regulating position H 2 until storage table 290
  • the moving distance of the retest tray by the transfer arm 250 may be relatively shorter than the moving distance of the retest tray by the second tray transfer arm 250 from the table 222 to the pre-test stocker 211.
  • the moving distance of the retest tray in the present invention includes moving distances in all directions.
  • the second lifting device 220B When an IC device that needs to be retested is loaded on the customer tray located in the first window 406 from the right in FIG. 13A, as shown in FIG. 13B, the second lifting device 220B lowered to the regulatory position H 2.
  • the retest tray KST r is stacked on an empty tray KST e that does not contain an IC device.
  • the first movable head 260 of the second transfer arm 250 moves horizontally above the lowered second elevating device 220A.
  • the second movable head 270 also moves horizontally in order to avoid interference with the first movable head 260.
  • the first holding head 263 of the first movable head 260 is lowered to receive the retest tray KST r from the second lifting device 220B.
  • the first holding head 263 is lowered to the second movable position M 2, placing the re-test trays KST r a storage plate 290.
  • the first lifting device 220A second from the right in FIG. 13E starts to descend.
  • the first lifting device 220A is thereby lowered to the second regulation position H 2
  • the first movable head 260 is raised to the movable position M 1 first.
  • the second lifting device 220B that has been lowered is raised to a first restricting position H 1.
  • the device transport apparatus 410 of the unloader unit 400 resumes loading of IC devices that require retesting into the empty tray KST e .
  • the first movable head 260 moves horizontally and retracts from above the storage plate 290. Further, the first transfer arm 240 moves in the horizontal direction so that the second holding head 246 is positioned above the storage plate 290.
  • the second holding head 246 descends and receives the retest tray KST r from the storage plate 290.
  • the first transfer arm 240 and the second transfer arm 250 must each access the tested stocker 212 that stores the retest tray.
  • by storing temporarily retested trays KST r in storage plate 290 since the number of accesses to the stocker is reduced, it is possible to shorten the replacement of the customer tray.
  • the first transfer arm 240 moves horizontally so as to be positioned above the first lifting device 220A.
  • the second holding head 246 is lowered to place the retest tray KST r on the table 222 of the first lifting device 220A.
  • the first lifting device 220A is first increased to the restricting position H 1, retest trays KST r faces the loader section 300 through the window 306.
  • Device conveying apparatus 310 of the loader unit 300 to re-test IC devices, reloading IC devices from retested tray KST r the test tray TST.
  • the first transfer arm 240 may move the retest KST r to the pre-test stocker 211. Further, by using the first holding head 243 of the first transfer arm 240 may carry a re-test tray TST r from storage plate 290 to the first lifting device 220A.
  • the customer tray KST is temporarily deposited in the storage plate 290, so that the number of accesses to the stockers 211 to 213 of the tray transfer device 230 can be reduced.
  • the customer tray KST replacement time in 406 can be shortened.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2008/055255 2008-03-21 2008-03-21 トレイ搬送装置およびそれを備えた電子部品試験装置 WO2009116165A1 (ja)

Priority Applications (2)

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PCT/JP2008/055255 WO2009116165A1 (ja) 2008-03-21 2008-03-21 トレイ搬送装置およびそれを備えた電子部品試験装置
TW098105427A TWI490970B (zh) 2008-03-21 2009-02-20 A pallet handling device, and an electronic component testing device provided with the device

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PCT/JP2008/055255 WO2009116165A1 (ja) 2008-03-21 2008-03-21 トレイ搬送装置およびそれを備えた電子部品試験装置

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CN114035009A (zh) * 2020-07-21 2022-02-11 株式会社爱德万测试 电子部件处理装置及电子部件试验装置
DE102022132969A1 (de) 2022-12-12 2024-06-13 Singulus Technologies Aktiengesellschaft Anlage und Verfahren für das Handling von Trays

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US11527425B2 (en) * 2019-12-31 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for tray cassette warehousing

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JP2000356665A (ja) * 1999-06-14 2000-12-26 Advantest Corp 電子部品基板用トレイ、電子部品基板の試験装置および試験方法
WO2003091741A1 (fr) * 2002-04-25 2003-11-06 Advantest Corporation Appareil d'essai de composants electroniques
WO2008032396A1 (fr) * 2006-09-15 2008-03-20 Advantest Corporation Plateau d'essai et dispositif d'essai de composant électronique ainsi équipé

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JP3689215B2 (ja) * 1997-02-20 2005-08-31 株式会社ルネサステクノロジ 半導体デバイスのテスト用搬送装置
US7196508B2 (en) * 2005-03-22 2007-03-27 Mirae Corporation Handler for testing semiconductor devices

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JP2000356665A (ja) * 1999-06-14 2000-12-26 Advantest Corp 電子部品基板用トレイ、電子部品基板の試験装置および試験方法
WO2003091741A1 (fr) * 2002-04-25 2003-11-06 Advantest Corporation Appareil d'essai de composants electroniques
WO2008032396A1 (fr) * 2006-09-15 2008-03-20 Advantest Corporation Plateau d'essai et dispositif d'essai de composant électronique ainsi équipé

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114035009A (zh) * 2020-07-21 2022-02-11 株式会社爱德万测试 电子部件处理装置及电子部件试验装置
DE102022132969A1 (de) 2022-12-12 2024-06-13 Singulus Technologies Aktiengesellschaft Anlage und Verfahren für das Handling von Trays
DE102022132969B4 (de) 2022-12-12 2024-10-10 Singulus Technologies Aktiengesellschaft Anlage und Verfahren für das Handling von Trays

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TWI490970B (zh) 2015-07-01

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