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WO2009075252A1 - エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物 - Google Patents

エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物 Download PDF

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Publication number
WO2009075252A1
WO2009075252A1 PCT/JP2008/072266 JP2008072266W WO2009075252A1 WO 2009075252 A1 WO2009075252 A1 WO 2009075252A1 JP 2008072266 W JP2008072266 W JP 2008072266W WO 2009075252 A1 WO2009075252 A1 WO 2009075252A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curing agent
resin curing
producing
resin composition
Prior art date
Application number
PCT/JP2008/072266
Other languages
English (en)
French (fr)
Inventor
Yoshifumi Urakawa
Hideo Miyata
Isao Yamagami
Katsumi Murofushi
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to JP2009545403A priority Critical patent/JP5653623B2/ja
Priority to KR1020107015320A priority patent/KR101187948B1/ko
Priority to CN2008801205853A priority patent/CN101896530B/zh
Priority to EP08860517A priority patent/EP2226347B1/en
Priority to US12/747,556 priority patent/US8242217B2/en
Publication of WO2009075252A1 publication Critical patent/WO2009075252A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
    • C07C323/50—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton
    • C07C323/51—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
    • C07C323/52—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　本発明は、エポキシ樹脂の硬化剤として、好適な可使時間を持ち、かつ良好な保存安定性を有し、さらに、硬化して得られるエポキシ樹脂硬化物の耐水性、硬度が良好なエポキシ樹脂硬化剤を提供することを目的とする。本発明は、チオール基に対してα位の炭素原子に置換基を有する２級あるいは３級の分岐チオール化合物を含むエポキシ樹脂硬化剤、および多価エポキシ化合物と前記エポキシ樹脂硬化剤とを含むことを特徴とするエポキシ樹脂組成物である。
PCT/JP2008/072266 2007-12-13 2008-12-08 エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物 WO2009075252A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009545403A JP5653623B2 (ja) 2007-12-13 2008-12-08 エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物
KR1020107015320A KR101187948B1 (ko) 2007-12-13 2008-12-08 에폭시 수지 경화제 및 그 제조 방법 및 에폭시 수지 조성물
CN2008801205853A CN101896530B (zh) 2007-12-13 2008-12-08 环氧树脂固化剂和其制造方法、以及环氧树脂组合物
EP08860517A EP2226347B1 (en) 2007-12-13 2008-12-08 Epoxy resin curing agent, method for producing the same, and epoxy resin composition
US12/747,556 US8242217B2 (en) 2007-12-13 2008-12-08 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-322329 2007-12-13
JP2007322329 2007-12-13

Publications (1)

Publication Number Publication Date
WO2009075252A1 true WO2009075252A1 (ja) 2009-06-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072266 WO2009075252A1 (ja) 2007-12-13 2008-12-08 エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物

Country Status (7)

Country Link
US (1) US8242217B2 (ja)
EP (1) EP2226347B1 (ja)
JP (1) JP5653623B2 (ja)
KR (1) KR101187948B1 (ja)
CN (1) CN101896530B (ja)
TW (1) TWI439485B (ja)
WO (1) WO2009075252A1 (ja)

Cited By (18)

* Cited by examiner, † Cited by third party
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JP2010229258A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd エポキシ樹脂組成物、及び半導体装置
JP2011126822A (ja) * 2009-12-18 2011-06-30 Showa Denko Kk メルカプトカルボン酸多価アルコールエステルの製造方法
JP2013221091A (ja) * 2012-04-17 2013-10-28 Showa Denko Kk エポキシ樹脂組成物
US20130313693A1 (en) * 2010-11-05 2013-11-28 Henkel Ireland Limited Epoxy-thiol compositions with improved stability
JP2014001291A (ja) * 2012-06-18 2014-01-09 Nagase Chemtex Corp 一液型エポキシ樹脂組成物
WO2014084292A1 (ja) * 2012-11-28 2014-06-05 味の素株式会社 樹脂硬化剤および一液性エポキシ樹脂組成物
WO2015025505A1 (ja) * 2013-08-23 2015-02-26 株式会社Adeka 一液型硬化性樹脂組成物
JP2015189777A (ja) * 2014-03-27 2015-11-02 スリーボンドファインケミカル株式会社 エポキシ樹脂組成物
WO2016098305A1 (ja) * 2014-12-18 2016-06-23 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法
JP2017088825A (ja) * 2015-11-17 2017-05-25 株式会社スリーボンド 硬化性組成物
JP2017125179A (ja) * 2015-11-03 2017-07-20 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 改善された圧縮強度性能を有する速硬化性チオールエポキシ樹脂
JP2019123825A (ja) * 2018-01-18 2019-07-25 味の素株式会社 樹脂組成物
CN111377432A (zh) * 2020-03-24 2020-07-07 中国科学院化学研究所 一种煤溶剂热处理制备层状纳米碳材料的方法
CN112708110A (zh) * 2020-12-25 2021-04-27 山东益丰生化环保股份有限公司 一种高强度硫醇固化剂、其制备方法及环氧树脂胶黏剂
JP2022061763A (ja) * 2020-10-07 2022-04-19 本州化学工業株式会社 新規なポリチオール化合物
CN115073211A (zh) * 2022-06-27 2022-09-20 浙江大学杭州国际科创中心 一种纳米增强型渗透硬化剂及其制备方法
WO2023003011A1 (ja) * 2021-07-20 2023-01-26 昭和電工株式会社 チオール含有組成物、光硬化性組成物、熱硬化性組成物
CN115677982A (zh) * 2022-10-18 2023-02-03 智仑超纯环氧树脂(西安)有限公司 一种pH响应型环氧树脂固化剂及其制备方法和应用

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CN102477270A (zh) * 2010-11-23 2012-05-30 上海恩意材料科技有限公司 一种耐水性快速固化胶黏剂
BR112013015108A2 (pt) * 2010-12-17 2016-09-20 Dow Global Technologies Inc composição curável, processo para preparar uma composição ou um sistema curável, produto curado e processo para preparar um produto termorrígido
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KR102055869B1 (ko) * 2012-07-05 2019-12-13 쓰리본드 화인 케미칼 가부시키가이샤 시트형상 접착제 및 이 시트형상 접착제를 사용한 유기 el 패널
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CN104152092B (zh) * 2014-08-08 2016-08-17 宁波昌华铜制品有限公司 一种中央空调集水器用的粘合剂及其生产方法
WO2016056560A1 (ja) * 2014-10-08 2016-04-14 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010229258A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd エポキシ樹脂組成物、及び半導体装置
JP2011126822A (ja) * 2009-12-18 2011-06-30 Showa Denko Kk メルカプトカルボン酸多価アルコールエステルの製造方法
US20130313693A1 (en) * 2010-11-05 2013-11-28 Henkel Ireland Limited Epoxy-thiol compositions with improved stability
JP2014500895A (ja) * 2010-11-05 2014-01-16 ヘンケル アイルランド リミテッド 安定性が改善されたエポキシ−チオール組成物
JP2013221091A (ja) * 2012-04-17 2013-10-28 Showa Denko Kk エポキシ樹脂組成物
JP2014001291A (ja) * 2012-06-18 2014-01-09 Nagase Chemtex Corp 一液型エポキシ樹脂組成物
WO2014084292A1 (ja) * 2012-11-28 2014-06-05 味の素株式会社 樹脂硬化剤および一液性エポキシ樹脂組成物
US10144799B2 (en) 2013-08-23 2018-12-04 Adeka Corporation One-component curable resin composition
JPWO2015025505A1 (ja) * 2013-08-23 2017-03-02 株式会社Adeka 一液型硬化性樹脂組成物
WO2015025505A1 (ja) * 2013-08-23 2015-02-26 株式会社Adeka 一液型硬化性樹脂組成物
JP2015189777A (ja) * 2014-03-27 2015-11-02 スリーボンドファインケミカル株式会社 エポキシ樹脂組成物
WO2016098305A1 (ja) * 2014-12-18 2016-06-23 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法
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