[go: up one dir, main page]

WO2007125830A1 - 接着材テープ - Google Patents

接着材テープ Download PDF

Info

Publication number
WO2007125830A1
WO2007125830A1 PCT/JP2007/058634 JP2007058634W WO2007125830A1 WO 2007125830 A1 WO2007125830 A1 WO 2007125830A1 JP 2007058634 W JP2007058634 W JP 2007058634W WO 2007125830 A1 WO2007125830 A1 WO 2007125830A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
adhesive tape
base material
bonded
circuit board
Prior art date
Application number
PCT/JP2007/058634
Other languages
English (en)
French (fr)
Inventor
Toshiyuki Yanagawa
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2007534401A priority Critical patent/JP4715847B2/ja
Priority to EP07742069A priority patent/EP2017315A4/en
Priority to US12/296,701 priority patent/US20100021667A1/en
Publication of WO2007125830A1 publication Critical patent/WO2007125830A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Definitions

  • the present invention relates to an adhesive tape including a base material and an adhesive.
  • an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a pair chip mounting, and the circuit board are bonded and fixed, or the circuit boards are bonded and fixed.
  • Adhesive tape is used as one of the methods for electrically connecting each other.
  • Patent Documents 1 and 2 disclose an adhesive tape in which an electrode connecting adhesive is applied to a base material.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-284005
  • Patent Document 2 Japanese Patent Laid-Open No. 2004-200605
  • the adhesive tape has a wide range of applications from IC drive application power supply to power supply applications, and it is rare that two or more types of adhesive tapes are used in the same product. Absent. Furthermore, in recent years, the use positions of these multiple adhesive tapes may approach as the size of panels increases, the frame becomes narrower, and space is saved.
  • Such an adhesive tape is attached to an adhesive device, for example, in a state of being wound around a reel, and a starting end portion of the adhesive tape is pulled out and attached to a scraping reel. And contact The adhesive tape unwound from the dressing reel is pressure-bonded from the base material side to the crimp circuit board or the like with a heating and pressurizing head, and the remaining base material is taken up onto the scraping reel.
  • An object of the present invention is to provide an adhesive tape that can maintain the adhesiveness of the adhesive regardless of the bonding form.
  • the adhesive tape of the present invention is an adhesive tape comprising a tape-shaped base material and an adhesive material provided on the main surface of the base material, and the base material is divided into the base material. And a notch that can be peeled off.
  • the adhesive tape of the present invention since the notch is provided in the base material, the incision force of the base material can be easily divided and peeled off.
  • the adhesive back surface of the adhesive tape is first fixed to the substrate. In this state, the base material Only the -side region of the base material is peeled off from the notch provided in the substrate, the adhesive corresponding to the region is exposed, and one member to be bonded is fixed to the exposed portion. Thereafter, the other side region of the remaining base material is peeled, the adhesive corresponding to that region is exposed, and the other adherend is fixed to the exposed portion.
  • the region used in the subsequent process of bonding the other member to be bonded of the adhesive may be exposed to the air or the like because it is still protected by the base material after the one member to be bonded is bonded. Absent. In this way, the area corresponding to the bonding area of the adhesive on the base material is peeled off immediately before use, preventing dust and water in the air from adhering to the adhesive and maintaining the adhesiveness of the adhesive. can do.
  • the cut is preferably provided along the longitudinal direction of the substrate.
  • the cut is linear and is provided at least 0.3 mm inside from at least one end of the substrate.
  • both side regions of the base material with respect to the cut have a certain width.
  • the base material after peeling off at the notch has an appropriate strength with respect to the longitudinal direction of the adhesive tape. Therefore, the peeled base material extends in the width direction of the adhesive tape at an unexpected location. It can be surely prevented from being cut.
  • the base material after peeling has a predetermined width, the area of the adhesive exposed after peeling has an appropriate width, so that the base plate and the member to be bonded are bonded well. be able to.
  • the adhesive preferably has conductive particles dispersed therein.
  • conductive particles having a specific volume are dispersed, an anisotropic conductive adhesive is formed, so that the substrate and the member to be bonded can be electrically connected.
  • the adhesiveness of the adhesive can be maintained regardless of any adhesive form using the same single adhesive tape. This will, for example, increase the opportunity to create new electronic devices and produce electronic devices. It is possible to reduce defects and improve the production efficiency of electronic devices.
  • FIG. 1 is a perspective view of an adhesive tape according to the present embodiment.
  • FIG. 2 is a cross-sectional view taken along line II-II of the adhesive tape shown in FIG.
  • FIG. 3 is a perspective view showing a state where the base material of the adhesive tape shown in FIG. 1 is partially peeled off.
  • FIG. 4 is a perspective view showing a state where the adhesive tape shown in FIG. 1 is wound around a reel.
  • FIG. 5 is a schematic side view of a bonding apparatus to which the adhesive tape shown in FIG. 1 is attached.
  • FIG. 6 is a perspective view showing an example of how to use the adhesive tape shown in FIG. 1.
  • FIG. 7 is a cross-sectional view showing an example of how to use the adhesive tape shown in FIG.
  • FIG. 8 is a perspective view showing an example of a method of using the adhesive tape shown in FIG.
  • FIG. 9 is a cross-sectional view showing an example of how to use the adhesive tape shown in FIG.
  • FIG. 10 is a perspective view showing an example of a method of using the adhesive tape shown in FIG.
  • FIG. 11 is a perspective view showing an example of how to use the adhesive tape shown in FIG. 1. Explanation of symbols
  • FIG. 1 is a perspective view of an adhesive tape 1 according to the present embodiment.
  • FIG. 2 is a cross-sectional view taken along line II-II of the adhesive tape 1 shown in FIG.
  • an adhesive tape 1 includes a tape-shaped base material 10 and one main body of the base material 10. And an adhesive 20 formed on the surface 11.
  • the length of the adhesive tape 1 is, for example, about 50 to 20 Om, and the width is, for example, about 0.5 to 10 mm.
  • the substrate 10 is, for example, OPP (oriented polypropylene), polytetrafluoroethylene, PET
  • the base material 10 is provided with a cut 12 for dividing the base material 10 and separating it.
  • the cuts 12 are continuously provided along the longitudinal direction of the substrate 10 from the start end to the end of the substrate 10.
  • the notch 12 extends from the surface of the substrate 10 (the surface on the opposite side of the adhesive 20) 13 to the middle of the adhesive 20 at the center in the width direction of the substrate 10.
  • the base material 10 is divided into a divided base material 10a and a divided base material 10b with the notch 12 as a boundary. Then, as shown in FIG. 3, only one of the divided base materials 10a and 10b can be easily peeled from the notch 12 as a starting point, and the corresponding region of the adhesive 20 can be exposed. Of course, it is also possible to expose the entire surface of the adhesive 20 by peeling off the divided substrates 10a and 10b at the same time.
  • the notch 12 is provided at least one end portion force of the base material 10 at an inner side of 0.3 mm or more.
  • the divided base material 10a or the divided base material 10b after peeling off with the notch 12 as a boundary will have an appropriate strength in the longitudinal direction of the adhesive tape 1. Thereby, it is possible to prevent the separated divided base material 10a or the divided base material 10b from being cut in the width direction of the adhesive tape 1 at an unexpected location. Further, since the width of the divided base material 1 Oa or the divided base material 10b after peeling is 0.3 mm or more, a sufficient bonding area of the adhesive 20 exposed after peeling is secured.
  • the adhesive 20 is heated and pressurized by the heating and pressurizing head 43 described later, it is prevented that the unpeeled substrate 10 becomes a step with respect to the adhesive 20 and sufficient pressure is not applied to the adhesive 20. Therefore, it leads to suppression of poor contact.
  • the adhesive 20 is made of, for example, a thermoplastic resin, a thermosetting resin, or a mixed system thereof.
  • thermoplastic resin include styrene resin and polyester resin
  • thermosetting resin include epoxy resin and silicone resin.
  • the adhesive 20 may be composed of a thermal radical type resin that can be bonded at a low temperature and in a short time with high reactivity.
  • thermal radical coagulant include acrylic adhesives.
  • the conductive material 21 may be dispersed in the adhesive 20 so that the dispersion amount is 0.1 to 30% by volume with respect to the entire adhesive component. It functions as an anisotropic conductive adhesive that conducts electricity only to.
  • the conductive particles 21 include gold (Au), silver (Ag), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), antimony (Sb), tin (Sn), solder It is made of metal such as gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder, etc. on the surface of a spherical core material with a polymer force such as carbon, graphite, polystyrene, etc. Particles formed with a conductive layer, and those formed with a surface layer of gold (Au), silver (Ag), nickel (Ni), solder, etc. on the surface of conductive particles are used.
  • the adhesive tape 1 is wound around a reel 30 in which side plates 32 are attached to both ends of a winding core 31.
  • the handleability of the adhesive tape 1 can be improved, for example, it can be easily attached to an adhesive device 40 described later.
  • the notch 12 of the base material 10 is provided along the longitudinal direction of the base material 10, the base material strength in the pulling direction (longitudinal direction) of the adhesive tape 1 is sufficiently ensured. This facilitates the supply of the adhesive tape 1 by the reel 30.
  • the reel 30 around which the adhesive tape 1 is wound is attached to an adhesive device 40 as shown in FIG.
  • the bonding apparatus 40 includes a sledge-grip linole 41, a support base 42 disposed between the linole 30 and the sashing reel 41, and a heating and pressurization provided above the support base 42. Head 43 is provided. The starting end portion of the adhesive tape 1 is drawn out so as to pass between the support base 42 and the heating and pressing head 43 and attached to the scraping reel 41.
  • the circuit board 50 is placed on the support base 42. As shown in FIG. 6, on the upper surface of the circuit board 50, a plurality of electrodes 51 and a plurality of electrodes 52 are provided in parallel. Wiring A plurality of electrodes 61 electrically connected to the electrodes 51 are provided on the lower surface of the circuit 60 (see FIG. 8), and a plurality of electrodes 71 electrically connected to the electrodes 52 are provided on the lower surface of the wiring circuit 70. Is installed (see Figure 11). Then, the back surface of the adhesive material 20 of the adhesive tape 1 is attached to the upper surface of the circuit board 50 so that the electrodes 51 and 52 of the circuit board 50 are covered with the divided base materials 10a and 10b of the adhesive tape 1, respectively.
  • the heating and pressing head 43 is moved downward by directing the force toward the circuit board 50, and the adhesive tape 1 is heated and pressed against the circuit board 50 as shown in FIG. Thereby, the adhesive 20 is pressure-bonded to the circuit board 50 so as to cover the electrodes 51 and 52. Thereafter, the heating and pressing head 43 is retracted upward. In this state, as shown in FIG. 8, the crimped portion of the divided substrate 10a is peeled off from the adhesive 20 along the notch 12, and the adhesive 20 in that portion is exposed. At this time, the region of the divided base material 10b adjacent to the peeled portion is not peeled off, and the adhesive 20 in the region is continuously protected by the divided base material 10b.
  • the wiring circuit 60 is bonded and fixed to the circuit board 50.
  • the wiring circuit 60 is arranged on the circuit board 50 so that the electrode 51 of the circuit board 50 and the electrode 61 of the wiring circuit 60 are aligned.
  • the heating / pressurizing head 43 is moved downward by directing the wiring circuit 60, and the wiring circuit 60 is heated and pressurized via the polytetrafluoroethylene material 44, which is a cushion material, as shown in FIG. .
  • the circuit board 50 and the wiring circuit 60 are bonded via the adhesive 20, and each electrode 51 of the circuit board 50 and each corresponding electrode 61 of the wiring circuit 60 are electrically connected. Connected.
  • the circuit board 50 and the wiring circuit 70 are bonded and fixed in the same manner. Accordingly, as shown in FIG. 11, the wiring circuit 60 and the wiring circuit 70 are adjacently mounted on the circuit board 50 via the adhesive 20. Note that the peeled base material 10 is taken up on a take-up reel 41.
  • the adhesive tape 1 When the adhesive tape 1 is used in this way, the region of the adhesive 20 where the wiring circuit 70 is bonded is still protected by the divided base material 10b after the wiring circuit 60 is bonded to the circuit board 50. Therefore, the area is not exposed to air or the like. This prevents dust and moisture in the air from adhering to the adhesive 20 and prevents the adhesive 20 from adhering (adhesive strength and solidification characteristics). Sex etc.) can be maintained.
  • the division of the base material 10 is not necessary.
  • the substrate 10 may be peeled over the entire width without being cut off.
  • the force notches 12 that are continuously provided in the longitudinal direction from the start end to the end of the base material 10 may be provided intermittently at regular intervals.
  • the notch 12 is provided so as to extend from the surface 13 of the base material 10 to the middle of the adhesive material 20, but may be provided so as to extend from the surface 13 of the base material 10 to the main surface 11.
  • the adhesive 20 is an anisotropic conductive adhesive, but the type of adhesive is not limited to this.
  • an insulating adhesive material in which insulating spacer particles are dispersed may be used.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　接着材テープ１は、テープ状の基材１０と、基材１０の主面１１上に設けられたテープ状の接着材２０とを備える。基材１０には、当該基材１０を分割して剥離させるための直線状の切り込み１２が基材１０の長手方向に沿って設けられている。

Description

明 細 書
接着材テープ
技術分野
[0001] 本発明は、基材と接着材とを備える接着材テープに関するものである。
背景技術
[0002] 一般に、液晶パネル、 PDP (プラズマディスプレイパネル）、 EL (蛍光ディスプレイ） パネル、ペアチップ実装等の電子部品と回路基板を接着固定したり、あるいは回路 基板同士を接着固定して、両者の電極同士を電気的に接続する方法の一つとして、 接着材テープが用いられている。例えば、特許文献 1及び 2には、電極接続用の接 着材が基材に塗布された接着材テープが開示されている。
特許文献 1：特開 2001— 284005号公報
特許文献 2：特開 2004— 200605号公報
発明の開示
発明が解決しょうとする課題
[0003] ところで、接着材テープの用途は、 IC駆動用途力も電源供給用途まで多岐にわた つており、同一製品内で用途に合わせた 2種類以上の複数の接着材テープが使用さ れることも珍しくない。さらに近年では、パネルの大型化や狭額縁化、省スペース化 に伴 ヽ、これら複数の接着材テープの使用位置が接近する場合がある。
[0004] 通常は、上記のようにそれぞれの用途に合わせて複数の接着材テープを使い分け る。し力し近年では、複数の用途に対して、 1種類の接着材テープを共通に用いて接 続する試みが行われている。特に、上記のように複数の接着材テープの使用位置が 接近する場合は、同一の接着材テープによって、幅方向に対する右側と左側とで異 なる用途の被接着部材を接着する試みが行われている。この場合には、接着材テー プの使用量の低減による原価低減や、産業廃棄物の削減による環境負荷の低減な どの禾 lj点、がある。
[0005] このような接着材テープは、例えばリールに巻き取られた状態で接着装置に装着さ れ、接着材テープの始端部を引き出して卷取りリールに取り付けられる。そして、接 着材リールから巻き出された接着材テープが基材側から加熱加圧ヘッドで圧着回路 基板などに圧着され、残った基材が卷取りリールに巻き取られる。
[0006] この場合、基材を接着材から剥離してから被接着部材を接着するまでの時間は、 接着材の表面状態の変化などを考慮すると短ければ短いほどよぐ逆に基材剥離後 力 一定時間以上経過する場合は、例えば空気や空気中の水分に接着材の接着部 分が晒される状態となり、接着材の種類によっては接着性低下などの接続不具合が 生じる可能性がある。また、接着材を使用している室内の清浄度などの環境によって は、微量の塵やほこりなどが接着材上に付着する可能性が生じる懸念があり、これら が接着の際に異物となって、上記と同様接続不具合が生じる可能性がある。
[0007] このため、上記のように、同一の接着材テープで、幅方向に対する右側と左側とで 異なる用途の被接着部材を接着する際に、一方の被接着部材の接着工程と他方の 被接着部材の接着工程との間の時間が長くなる場合は、一方の被接着部材を接着 してから他方の被接着部材を接着するまでの間、接着材のうち当該他の被接着部材 を接着する部分が空気等に晒されることになる。そのため、その部分に空気中の塵 や水分が付着することで接着材の接着性が低下するおそれがあり、ひいては当該他 の被接着部材の接着に不具合が生じるおそれがある。この問題を回避するには、被 接着部材の接着工程を変更することも考えられるが、生産工程上それが許されない 場合もある。
[0008] 本発明の目的は、接着形態にかかわらず接着材の接着性を維持することができる 接着材テープを提供することである。
課題を解決するための手段
[0009] 本発明の接着材テープは、テープ状の基材と、基材の主面上に設けられた接着材 とを備える接着材テープであって、基材には、当該基材を分割して剥離できる切り込 みが設けられて 、ることを特徴とする。
[0010] 本発明の接着材テープによれば、基材に切り込みが設けられているので、その切り 込み力 基材を容易に分割して剥離することが可能になる。このような接着材テープ を用いて、例えば異なる用途の 2つの被接着部材を 1つの基板に接近させて接着固 定する場合、まず接着材テープの接着材裏面を基板に固定する。この状態で、基材 に設けられた切り込みに対して基材のー側領域のみを剥離し、その領域に対応する 接着材を露出させ、その露出部分に一方の被接着部材を固定する。その後、残って いる基材の他側領域を剥離し、その領域に対応する接着材を露出させ、その露出部 分に他方の被接着部材を固定する。ここで、接着材のうち他方の被接着部材を接着 する後工程で使用される領域は、一方の被接着部材を接着した後も引き続き基材に より保護されるため空気等に晒されることがない。このように、基材における接着材の 接着領域に対応する領域を使用直前に剥離することで、接着材に空気中の塵や水 分が付着することを防止し、接着材の接着性を維持することができる。
[0011] 本発明の接着材テープでは、切り込みは、基材の長手方向に沿って設けられてい ることが好ましい。
[0012] この場合、接着材テープの引っ張り方向（長手方向）の基材強度が確保されるため 、リール等による接着材テープの供給を効果的に実施することができる。
[0013] 本発明の接着材テープでは、切り込みは直線状であり、基材の少なくとも一方の端 部から 0. 3mm以上内側に設けられて 、ることが好まし 、。
[0014] この場合、切り込みに対する基材の両側領域は、いずれもある程度の幅を有する。
そのため、切り込みを境に剥離した後の基材は、接着材テープの長手方向に対して 適度な強度を有することになるので、剥離した基材が予期せぬ箇所で接着材テープ の幅方向に切れることを確実に防止できる。また、剥離後の基材が所定の幅を有す ることで、剥離後に露出する接着材の領域が適度な広さを有するようになるため、基 板と被接着部材とを良好に接着することができる。
[0015] 本発明の接着材テープでは、接着材は、導電性粒子が分散されて!ヽることが好ま しい。特に、特定の体積の導電性粒子が分散されている場合、異方導電性接着剤と なるため、基板と被接着部材とを電気的に接続することが可能となる。
発明の効果
[0016] 本発明によれば、基材に切り込みを設けることにより、基材の一部領域のみを剥離 して接着材の対応する領域を露出させることができる。したがって、同じ一つの接着 材テープを用いたあらゆる接着形態にかかわらず、接着材の接着性を維持すること ができる。これにより、例えば電子機器新製品の創出機会の増大、電子機器の生産 における不具合の低減及び電子機器の生産効率の向上を図ることができる。
図面の簡単な説明
[0017] [図 1]図 1は本実施形態に係る接着材テープの斜視図である。
[図 2]図 2は図 1に示す接着材テープの Π— II線断面図である。
[図 3]図 3は図 1に示す接着材テープの基材を部分的に剥離した状態を示す斜視図 である。
[図 4]図 4は図 1に示す接着材テープがリールに巻かれた状態を示す斜視図である。
[図 5]図 5は図 1に示す接着材テープが取り付けられる接着装置の概略側面図である
[図 6]図 6は図 1に示す接着材テープの使用方法の一例を示す斜視図である。
[図 7]図 7は図 1に示す接着材テープの使用方法の一例を示す断面図である。
[図 8]図 8は図 1に示す接着材テープの使用方法の一例を示す斜視図である。
[図 9]図 9は図 1に示す接着材テープの使用方法の一例を示す断面図である。
[図 10]図 10は図 1に示す接着材テープの使用方法の一例を示す斜視図である。
[図 11]図 11は図 1に示す接着材テープの使用方法の一例を示す斜視図である。 符号の説明
[0018] 1 接着材テープ
10 基材
11 主面
12 切り込み
20 接着材。
発明を実施するための最良の形態
[0019] 以下、添付図面を参照しながら本発明の実施形態を詳細に説明する。なお、図面 の説明において同一の要素には同一の符号を付し、重複する説明を省略する。
[0020] まず、図 1〜図 4を用いて、本発明に係る接着材テープ 1の一実施形態について説 明する。図 1は、本実施形態に係る接着材テープ 1の斜視図である。図 2は、図 1に 示す接着材テープ 1の Π— II線断面図である。
[0021] 各図において、接着材テープ 1は、テープ状の基材 10と、この基材 10の一方の主 面 11上に形成された接着材 20とを備える。接着材テープ 1の長さは例えば 50〜20 Om程度であり、幅は例えば 0. 5〜10mm程度である。
[0022] 基材 10は、例えば、 OPP (延伸ポリプロピレン）、ポリテトラフルォロエチレン、 PET
(ポリエチレンテレフタレート）等力も成る。これらは、表面をシリコーン処理されたもの であってもよい。これらのような材料を用いることにより、基材 10の強度を高めたり、接 着材 20に対する基材 10の剥離性を高めたりすることができる。もっとも、基材 10の材 料はこれらに限定されな!ヽ。
[0023] 基材 10には、当該基材 10を分割して剥離させるための切り込み 12が設けられて いる。この切り込み 12は、基材 10の始端から終端にかけて基材 10の長手方向に沿 つて連続的に設けられている。切り込み 12は、基材 10の幅方向中央において基材 1 0の表面 (接着材 20の反対側の面） 13から接着材 20に至る途中まで延びている。基 材 10は、この切り込み 12を境にして分割基材 10aと分割基材 10bとに分けられる。そ して、図 3に示すように、切り込み 12を始点として分割基材 10a、 10bのいずれか一 方のみを容易に剥離し、接着材 20の対応する領域を露出させることができる。もちろ ん、分割基材 10a、 10bを同時に剥離することで、接着材 20を全面露出させることも 可能である。
[0024] ここで、切り込み 12は、基材 10の少なくとも一方の端部力も 0. 3mm以上内側に設 けられているのが好ましい。この場合には、切り込み 12を境に剥離した後の分割基 材 10a又は分割基材 10bは、接着材テープ 1の長手方向に対して適度な強度を有 すること〖こなる。これにより、剥離した分割基材 10a又は分割基材 10bが予期せぬ箇 所で接着材テープ 1の幅方向に切れることを防止できる。また、剥離後の分割基材 1 Oa又は分割基材 10bの幅は 0. 3mm以上であることから、剥離後に露出する接着材 20の接着面積が十分確保されるようになる。更に、後述する加熱加圧ヘッド 43により 接着材 20を加熱加圧する際に、未剥離の基材 10が接着材 20に対する段差となつ て接着材 20に十分な圧力が付与されなくなることが防止されるため、接触不良の抑 制につながる。
[0025] 接着材 20は、例えば、熱可塑性榭脂、熱硬化性榭脂又はこれらの混合系から成る 。熱可塑性榭脂としては、例えば、スチレン榭脂系、ポリエステル榭脂系が挙げられ、 熱硬化性榭脂としては、例えば、エポキシ榭脂系、シリコーン榭脂系が挙げられる。 また、接着材 20は、反応性が高ぐ低温度 ·短時間で接着することが可能な熱ラジカ ル系榭脂により構成されてもよい。熱ラジカル系榭脂により構成される接着材としては 、例えばアクリル系接着材が挙げられる。
[0026] 接着材 20の中には導電性粒子 21が分散されていてもよぐ分散量が接着剤成分 全体に対して 0. 1〜30体積％であると、接着材 20は、垂直方向にのみ電気を通す 異方導電接着材として機能する。導電性粒子 21には、例えば、金 (Au)、銀 (Ag)、 白金（Pt)、ニッケル（Ni)、銅（Cu)、タングステン（W)、アンチモン（Sb)、スズ（Sn) 、はんだ等の金属粒子や、カーボン、黒鉛、ポリスチレン等の高分子力 なる球状の 核材の表面に金 (Au)、銀 (Ag)、ニッケル (Ni)、銅 (Cu)、はんだ等の金属からなる 導電層を形成してなる粒子、また、導電性を有する粒子の表面に金 (Au)、銀 (Ag)、 ニッケル (Ni)、はんだ等の表面層を形成してなるものが用いられる。
[0027] 接着材テープ 1は、図 4に示すように、巻き芯 31の両端に側板 32を取り付けたリー ル 30に巻かれている。接着材テープ 1をリール 30に巻くことで、後述する接着装置 4 0への取り付けが容易になるなど、接着材テープ 1の取扱性を向上させることができる 。このとき、基材 10の切り込み 12は基材 10の長手方向に沿って設けられているので 、接着材テープ 1の引っ張り方向 (長手方向）の基材強度が十分確保される。これに より、リール 30による接着材テープ 1の供給が行いやすくなる。
[0028] 次に、図 5〜図 11を用いて、接着材テープ 1の使用方法について説明する。具体 的には、接着材テープ 1を用いて回路基板 50に配線回路 60及び配線回路 70を接 着し、電気的接続を実現する方法を説明する。
[0029] 接着材テープ 1が巻かれたリール 30は、図 5に示すように、接着装置 40に取り付け られる。接着装置 40は、リーノレ 30の他に、卷取りリーノレ 41と、リーノレ 30と卷取りリー ル 41との間に配置された支持台 42と、この支持台 42の上方に設けられた加熱加圧 ヘッド 43とを備える。接着材テープ 1の始端部は、支持台 42と加熱加圧ヘッド 43との 間を通過するように引き出されて卷取りリール 41に取り付けられる。
[0030] まず、回路基板 50が支持台 42の上に置かれる。図 6に示すように、回路基板 50の 上面には、複数の電極 51と複数の電極 52とが並行して設けられている。なお、配線 回路 60の下面には、電極 51と電気的に接続される複数の電極 61が設けられ（図 8 参照）、配線回路 70の下面には、電極 52と電気的に接続される複数の電極 71が設 けられている（図 11参照）。そして、回路基板 50の電極 51、 52が接着材テープ 1のう ち分割基材 10a、 10bでそれぞれ覆われるように接着材テープ 1の接着材 20の裏面 を回路基板 50の上面に貼り付ける。
[0031] 次に、加熱加圧ヘッド 43を回路基板 50に向力つて下方に移動させ、図 7に示すよ うに、接着材テープ 1を回路基板 50に対して加熱加圧する。これにより、接着材 20が 電極 51、 52を覆うように回路基板 50に圧着される。その後、加熱加圧ヘッド 43を上 方に退避させる。その状態で、図 8に示すように、分割基材 10aのうち圧着された部 分を切り込み 12に沿って接着材 20から剥離し、その部分の接着材 20を露出させる 。このとき、剥離された部分と隣り合う分割基材 10bの領域は剥離されず、当該領域 の接着材 20は引き続き分割基材 10bによって保護される。
[0032] 次に、図 8に示すように、回路基板 50に配線回路 60を接着固定する。具体的には 、回路基板 50の電極 51と配線回路 60の電極 61とを合わせるように回路基板 50上 に配線回路 60を配置する。そして、加熱加圧ヘッド 43を配線回路 60に向力つて下 方に移動させ、図 9に示すように、クッション材であるポリテトラフルォロエチレン材 44 を介して配線回路 60を加熱加圧する。これにより、図 10に示すように、回路基板 50 と配線回路 60とが接着材 20を介して接着され、回路基板 50の各電極 51と対応する 配線回路 60の各電極 61とが電気的に接続される。
[0033] そして、分割基材 10bを切り込み 12に沿って剥離し、その領域に対応する接着材 2 0を露出させた後、回路基板 50と配線回路 70も同様の方法で接着固定する。これに より、図 11に示すように、配線回路 60と配線回路 70とが隣接して接着材 20を介して 回路基板 50に実装される。なお、剥離された基材 10は卷取りリール 41に巻き取られ る。
[0034] このように接着材テープ 1を使用した場合、接着材 20のうち配線回路 70が接着さ れる領域は、配線回路 60を回路基板 50に接着した後も引き続き分割基材 10bにより 保護されるため、当該領域が空気等に晒されることがない。これにより、接着材 20に 空気中の塵や水分が付着することを防止し、接着材 20の接着性 (接着力や固化特 性等)を維持することができる。
[0035] また、回路基板 50に一つの配線回路だけを接着固定する場合には、基材 10の分 割が不要である。この場合には、その配線回路を回路基板 50に接着する直前に、基 材 10を切り離さずに全幅にわたって剥離すればよい。
[0036] 以上、本発明をその実施形態に基づいて詳細に説明したが、本発明は上記実施 形態に限定されるものではない。本発明は、その要旨を逸脱しない範囲で以下のよう な様々な変形が可能である。
[0037] 上記実施形態では、基材 10の始端から終端にかけて長手方向に連続的に設ける ようにした力 切り込み 12は一定間隔で断続的に設けてもよい。また、上記実施形態 では、切り込み 12は、基材 10の表面 13から接着材 20に至る途中まで延びるように 設けたが、基材 10の表面 13から主面 11にかけて延びるように設けてもよい。更に、 上記実施形態では、接着材 20は異方導電性接着材であつたが、接着材の種類はこ れに限定されない。例えば、絶縁性のスぺーサ粒子を分散させたような絶縁性接着 材であってもよい。

Claims

請求の範囲
[1] テープ状の基材と、前記基材の主面上に設けられた接着材とを備える接着材テー プであって、
前記基材には、当該基材を分割して剥離できる切り込みが設けられていることを特 徴とする接着材テープ。
[2] 前記切り込みは、前記基材の長手方向に沿って設けられていることを特徴とする請 求項 1に記載の接着材テープ。
[3] 前記切り込みは直線状であり、前記基材の少なくとも一方の端部力 0. 3mm以上 内側に設けられていることを特徴とする請求項 2に記載の接着材テープ。
[4] 前記接着材は、導電性粒子が分散されて!、ることを特徴とする請求項 1〜3の ヽず れか一項に記載の接着材テープ。
PCT/JP2007/058634 2006-04-24 2007-04-20 接着材テープ WO2007125830A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007534401A JP4715847B2 (ja) 2006-04-24 2007-04-20 接着材テープ
EP07742069A EP2017315A4 (en) 2006-04-24 2007-04-20 TAPE
US12/296,701 US20100021667A1 (en) 2006-04-24 2007-04-20 Adhesive tape

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006119084 2006-04-24
JP2006-119084 2006-04-24
JP2006-232554 2006-08-29
JP2006232554 2006-08-29

Publications (1)

Publication Number Publication Date
WO2007125830A1 true WO2007125830A1 (ja) 2007-11-08

Family

ID=38655356

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/058634 WO2007125830A1 (ja) 2006-04-24 2007-04-20 接着材テープ

Country Status (7)

Country Link
US (1) US20100021667A1 (ja)
EP (1) EP2017315A4 (ja)
JP (1) JP4715847B2 (ja)
KR (1) KR20090005209A (ja)
CN (1) CN102325430A (ja)
TW (1) TW200740951A (ja)
WO (1) WO2007125830A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082501A (ja) * 2013-11-22 2014-05-08 Lintec Corp 半導体ウエハ加工用接着シート及びこれを用いた半導体ウエハの加工方法
EP2344599A4 (en) * 2008-10-16 2015-06-17 Zephyros Inc RIBBON AND ROLL MATERIAL COMPRISING A PRESSURE SENSITIVE ADHESIVE
US10113322B2 (en) 2014-12-08 2018-10-30 Zephyros, Inc. Vertically lapped fibrous flooring
US10460715B2 (en) 2015-01-12 2019-10-29 Zephyros, Inc. Acoustic floor underlay system
US10755686B2 (en) 2015-01-20 2020-08-25 Zephyros, Inc. Aluminized faced nonwoven materials
US11541626B2 (en) 2015-05-20 2023-01-03 Zephyros, Inc. Multi-impedance composite

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2315314B1 (en) * 2009-02-27 2012-10-31 Hitachi Chemical Company, Ltd. Reel for adhesive tape
CN102176337B (zh) * 2011-01-06 2013-01-09 天津大学 各向异性导电胶膜用复合导电粒子及制备方法
KR200476229Y1 (ko) * 2013-05-02 2015-02-11 주식회사 케이아이씨 알루미늄 실링 테이프
US10625356B2 (en) 2015-02-11 2020-04-21 Alpha Assembly Solutions Inc. Electrical connection tape
CN113119574B (zh) * 2019-12-31 2023-06-20 昊佰电子科技（上海）有限公司 一种大小头状模切卷料产品及其加工方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383186A (ja) * 1986-09-29 1988-04-13 Sekisui Chem Co Ltd 接着テ−プ
JPH063690A (ja) * 1992-06-22 1994-01-14 Tekuseru:Kk 転写用異方性接着剤テープの作成方法および装置
JPH071053U (ja) * 1993-06-01 1995-01-10 横浜ゴム株式会社 切断部を備えた粘着テープ
JP2001284005A (ja) 2000-03-28 2001-10-12 Hitachi Chem Co Ltd 異方導電材テープ
JP3086384U (ja) * 2001-11-30 2002-06-14 大明商事株式会社 両面テープ
JP2003183601A (ja) * 2001-12-17 2003-07-03 Lintec Corp ミシン目入り再剥離性テープ
JP2004200605A (ja) 2002-12-20 2004-07-15 Hitachi Chem Co Ltd 接着材テープの接続方法
JP3117147U (ja) * 2005-09-29 2006-01-05 日本ジッパーチュービング株式会社 電磁波シールド材個別分離型の剥離フィルム

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1286462A (en) * 1918-05-21 1918-12-03 Henry V Wesche Toy building-blocks.
US3648835A (en) * 1969-11-12 1972-03-14 Minnesota Mining & Mfg Marking tape
DE2404682A1 (de) * 1974-02-01 1975-08-07 Jackstaedt & Co Wilhelm Selbstklebefolie
US4007835A (en) * 1975-02-28 1977-02-15 Pellon Corporation Fuse and fold fabric
US4297403A (en) * 1980-02-06 1981-10-27 Monarch Marking Systems, Inc. Coreless pressure sensitive label supply roll
JPS62179365A (ja) * 1986-01-31 1987-08-06 Shiyoubee:Kk 複合食品
JPS6437449A (en) * 1987-08-03 1989-02-08 Sony Corp Production of synthetic granite
JPS6437449U (ja) * 1987-08-28 1989-03-07
JPH0339352A (ja) * 1989-07-06 1991-02-20 Toray Ind Inc 共重合ポリエステル組成物
US5234517A (en) * 1990-10-24 1993-08-10 Minnesota Mining And Manufacturing Company Composite laminate adhesive tape coiled in an endless roll form and process for forming the laminate adhesive tape roll
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP2509773B2 (ja) * 1991-12-05 1996-06-26 住友ベークライト株式会社 異方導電フィルムの製造方法
ZA94394B (en) * 1993-01-21 1995-07-20 Mcneil Ppc Inc Absorbent product provided in roll form
US5453141A (en) * 1993-10-01 1995-09-26 Rodriguez; Peter A. Transfer tape and method for cutting and spooling a web of paper
JP3284283B2 (ja) * 1993-10-12 2002-05-20 大日本印刷株式会社 巻取紙の紙継ぎ準備方法およびその連結用テープ
JPH0871491A (ja) * 1994-09-01 1996-03-19 Casio Comput Co Ltd 異方導電性接着剤の転写方法およびその装置
JPH0912986A (ja) * 1995-06-30 1997-01-14 Asahi Corp 防水シート
US5712210A (en) * 1995-08-30 1998-01-27 Minnesota Mining And Manufacturing Company Nonwoven abrasive material roll
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
US5682607A (en) * 1996-11-15 1997-11-04 Klein; Jeffrey A. Skin applique to provide protection from ultraviolet light
USD421528S (en) * 1996-12-18 2000-03-14 Abdulla Y Shakora Roll of sanitary bath wipes
JP3039352U (ja) * 1997-01-07 1997-07-15 ニチバン株式会社 植物栽培容器の封緘用粘着シ−ト
JPH10195397A (ja) * 1997-01-14 1998-07-28 Sekisui Chem Co Ltd 気密性粘着テープ
US5763038A (en) * 1997-02-25 1998-06-09 Minnesota Mining And Manufacturing Company Progressively perforated tape roll
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
US6772532B1 (en) * 2000-05-27 2004-08-10 Richard Honea Disposable tape measure system
DE10031214B4 (de) * 2000-06-27 2005-10-27 Silu Verwaltung Ag Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser
US6756102B1 (en) * 2001-07-12 2004-06-29 Stanko Galo Adhesive tape having serial segments with non-adherent gripping elements
USD472319S1 (en) * 2001-07-30 2003-03-25 Oltmann Brickley A Duct tape-type roll of medical bandages
USD492353S1 (en) * 2003-03-18 2004-06-29 Kenichi Fujii Adhesive tape
USD490855S1 (en) * 2003-03-18 2004-06-01 Kenichi Fujii Adhesive tape
USD490470S1 (en) * 2003-03-18 2004-05-25 Kenichi Fujii Adhesive tape
USD492354S1 (en) * 2003-03-18 2004-06-29 Kenichi Fujii Adhesive tape
US6831049B1 (en) * 2003-05-21 2004-12-14 Juan Pablo Torres Moreno Ultra bright headlight and tail light cleaner
JP4289102B2 (ja) * 2003-09-26 2009-07-01 パナソニック株式会社 組立装置および組立方法ならびに端子洗浄装置
JP3947532B2 (ja) * 2004-07-08 2007-07-25 住友ベークライト株式会社 異方導電性接着剤フィルム
JP2006032335A (ja) * 2005-07-06 2006-02-02 Hitachi Chem Co Ltd 異方導電性接着フィルム
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
USD572156S1 (en) * 2007-01-08 2008-07-01 Ron Payne Construction framing tape
USD625063S1 (en) * 2007-07-19 2010-10-05 Armaly Llc Sponge product
USD602988S1 (en) * 2008-04-17 2009-10-27 Leona Alicea Decorative imprinted adhesive
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD602989S1 (en) * 2008-10-22 2009-10-27 Leona Alicea Decorative imprinted adhesive
USD600284S1 (en) * 2009-03-26 2009-09-15 Plus Stationery Corp. Correction type tape with a security pattern
USD611541S1 (en) * 2009-03-26 2010-03-09 Plus Stationery Corp. Transparent correction type tape with a security pattern

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383186A (ja) * 1986-09-29 1988-04-13 Sekisui Chem Co Ltd 接着テ−プ
JPH063690A (ja) * 1992-06-22 1994-01-14 Tekuseru:Kk 転写用異方性接着剤テープの作成方法および装置
JPH071053U (ja) * 1993-06-01 1995-01-10 横浜ゴム株式会社 切断部を備えた粘着テープ
JP2001284005A (ja) 2000-03-28 2001-10-12 Hitachi Chem Co Ltd 異方導電材テープ
JP3086384U (ja) * 2001-11-30 2002-06-14 大明商事株式会社 両面テープ
JP2003183601A (ja) * 2001-12-17 2003-07-03 Lintec Corp ミシン目入り再剥離性テープ
JP2004200605A (ja) 2002-12-20 2004-07-15 Hitachi Chem Co Ltd 接着材テープの接続方法
JP3117147U (ja) * 2005-09-29 2006-01-05 日本ジッパーチュービング株式会社 電磁波シールド材個別分離型の剥離フィルム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2017315A4

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2344599A4 (en) * 2008-10-16 2015-06-17 Zephyros Inc RIBBON AND ROLL MATERIAL COMPRISING A PRESSURE SENSITIVE ADHESIVE
US9151040B2 (en) 2008-10-16 2015-10-06 Zephyros, Inc. Tape material and roll comprising pressure sensitive adhesive
JP2014082501A (ja) * 2013-11-22 2014-05-08 Lintec Corp 半導体ウエハ加工用接着シート及びこれを用いた半導体ウエハの加工方法
US10113322B2 (en) 2014-12-08 2018-10-30 Zephyros, Inc. Vertically lapped fibrous flooring
US11542714B2 (en) 2014-12-08 2023-01-03 Zephyros, Inc. Vertically lapped fibrous flooring
US10460715B2 (en) 2015-01-12 2019-10-29 Zephyros, Inc. Acoustic floor underlay system
US10755686B2 (en) 2015-01-20 2020-08-25 Zephyros, Inc. Aluminized faced nonwoven materials
US11541626B2 (en) 2015-05-20 2023-01-03 Zephyros, Inc. Multi-impedance composite

Also Published As

Publication number Publication date
KR20090005209A (ko) 2009-01-12
US20100021667A1 (en) 2010-01-28
JPWO2007125830A1 (ja) 2009-09-10
EP2017315A1 (en) 2009-01-21
JP4715847B2 (ja) 2011-07-06
TW200740951A (en) 2007-11-01
CN102325430A (zh) 2012-01-18
EP2017315A4 (en) 2011-05-25

Similar Documents

Publication Publication Date Title
JP4715847B2 (ja) 接着材テープ
CN203690322U (zh) 带有导电性粘接剂层的太阳能电池单元
JP4434281B2 (ja) 接着剤テープの接続方法及び接着剤テープ接続体
JP5318840B2 (ja) 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体
CN211529131U (zh) 一种电容屏触控膜结构、电容屏及显示设备
JP4239585B2 (ja) 接着剤テープの接続方法及び接着剤テープ接続体
JP2008303067A (ja) 接着材リール及びこれを用いた回路接続体の製造方法
JP2011029207A (ja) フィルム積層体、フィルム積層体の貼付方法、フィルム積層体を用いた接続方法及び接続構造体
JP2004202738A5 (ja)
CN101512840A (zh) 各向异性导电带及其制造方法以及使用其的连接结构体和电路部件的连接方法
JP2003066479A (ja) 液晶パネルへのｔａｂ部品の圧着方法
JP2004196540A (ja) 接着材テープの接続方法
JP4333140B2 (ja) 接着剤テープの製造方法
JP2009004354A (ja) 接着材リール及びこれを用いた回路接続体の製造方法
NL2034742B1 (en) Connection System
JP3463539B2 (ja) 異方導電性接着剤付き可撓性回路基板および製造方法
JP4349450B2 (ja) 接着材テープの接続方法及び接着材テープ接続体
JP2007331949A (ja) 接着材リール
JP4626952B2 (ja) 接着シート
JP2005330296A (ja) 接着材テープの接続方法
JP2002229055A (ja) 液晶表示装置及びその製造方法
KR100613025B1 (ko) 교체가 용이한 이방성 도전 필름
JP2005330296A5 (ja)
JP2505751Y2 (ja) 耐屈曲性熱圧着接続部材
CN101426874A (zh) 粘接材料带

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2007534401

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07742069

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 200780014578.0

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2007742069

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020087028520

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12296701

Country of ref document: US