WO2006043378A1 - ポリアセタール樹脂組成物および成形品 - Google Patents
ポリアセタール樹脂組成物および成形品 Download PDFInfo
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- WO2006043378A1 WO2006043378A1 PCT/JP2005/016870 JP2005016870W WO2006043378A1 WO 2006043378 A1 WO2006043378 A1 WO 2006043378A1 JP 2005016870 W JP2005016870 W JP 2005016870W WO 2006043378 A1 WO2006043378 A1 WO 2006043378A1
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- WIPO (PCT)
- Prior art keywords
- acid
- polyacetal resin
- weight
- parts
- resin composition
- Prior art date
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- 229930182556 Polyacetal Natural products 0.000 title claims abstract description 80
- 229920006324 polyoxymethylene Polymers 0.000 title claims abstract description 80
- 239000011342 resin composition Substances 0.000 title claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 98
- 239000011347 resin Substances 0.000 claims abstract description 98
- 229920001225 polyester resin Polymers 0.000 claims abstract description 52
- 239000004645 polyester resin Substances 0.000 claims abstract description 52
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical group OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims abstract description 22
- ZMKVBUOZONDYBW-UHFFFAOYSA-N 1,6-dioxecane-2,5-dione Chemical group O=C1CCC(=O)OCCCCO1 ZMKVBUOZONDYBW-UHFFFAOYSA-N 0.000 claims abstract description 15
- LOWXIIGCOBSYKX-UHFFFAOYSA-N 1,4-dioxocane-5,8-dione Chemical group O=C1CCC(=O)OCCO1 LOWXIIGCOBSYKX-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims description 41
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 19
- 238000002425 crystallisation Methods 0.000 claims description 19
- 230000008025 crystallization Effects 0.000 claims description 19
- 239000003963 antioxidant agent Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 16
- 125000004122 cyclic group Chemical group 0.000 claims description 15
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 claims description 12
- 150000004292 cyclic ethers Chemical class 0.000 claims description 11
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 10
- 150000001412 amines Chemical class 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 9
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 8
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 230000003078 antioxidant effect Effects 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002530 phenolic antioxidant Substances 0.000 claims description 2
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims 1
- 229920000954 Polyglycolide Polymers 0.000 abstract description 14
- 239000004633 polyglycolic acid Substances 0.000 abstract description 14
- -1 for example Polymers 0.000 description 85
- 239000002253 acid Substances 0.000 description 38
- 238000000034 method Methods 0.000 description 30
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 25
- 239000000047 product Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 22
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 19
- 239000003054 catalyst Substances 0.000 description 19
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 18
- 229920000642 polymer Polymers 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 14
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 14
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 12
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 12
- 238000004898 kneading Methods 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 11
- 229910015900 BF3 Inorganic materials 0.000 description 10
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 10
- 239000007795 chemical reaction product Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000006872 improvement Effects 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 150000002009 diols Chemical class 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000003381 stabilizer Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 7
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 150000002736 metal compounds Chemical class 0.000 description 7
- 239000008188 pellet Substances 0.000 description 7
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 7
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229940014800 succinic anhydride Drugs 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000001361 adipic acid Substances 0.000 description 6
- 235000011037 adipic acid Nutrition 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229960004275 glycolic acid Drugs 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920002961 polybutylene succinate Polymers 0.000 description 6
- 239000004631 polybutylene succinate Substances 0.000 description 6
- 238000006068 polycondensation reaction Methods 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 6
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 6
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 5
- RKDVKSZUMVYZHH-UHFFFAOYSA-N 1,4-dioxane-2,5-dione Chemical compound O=C1COC(=O)CO1 RKDVKSZUMVYZHH-UHFFFAOYSA-N 0.000 description 5
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 5
- 239000004386 Erythritol Substances 0.000 description 5
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 5
- 229910019142 PO4 Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 150000001733 carboxylic acid esters Chemical class 0.000 description 5
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 5
- 229940009714 erythritol Drugs 0.000 description 5
- 235000019414 erythritol Nutrition 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- 239000002685 polymerization catalyst Substances 0.000 description 5
- 235000013772 propylene glycol Nutrition 0.000 description 5
- 239000001384 succinic acid Substances 0.000 description 5
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- 229940043375 1,5-pentanediol Drugs 0.000 description 4
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 4
- WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 description 4
- AXFYFNCPONWUHW-UHFFFAOYSA-N 3-hydroxyisovaleric acid Chemical compound CC(C)(O)CC(O)=O AXFYFNCPONWUHW-UHFFFAOYSA-N 0.000 description 4
- REKYPYSUBKSCAT-UHFFFAOYSA-N 3-hydroxypentanoic acid Chemical compound CCC(O)CC(O)=O REKYPYSUBKSCAT-UHFFFAOYSA-N 0.000 description 4
- ALRHLSYJTWAHJZ-UHFFFAOYSA-N 3-hydroxypropionic acid Chemical compound OCCC(O)=O ALRHLSYJTWAHJZ-UHFFFAOYSA-N 0.000 description 4
- FMHKPLXYWVCLME-UHFFFAOYSA-N 4-hydroxy-valeric acid Chemical compound CC(O)CCC(O)=O FMHKPLXYWVCLME-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 4
- 150000001805 chlorine compounds Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000113 differential scanning calorimetry Methods 0.000 description 4
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 229910000000 metal hydroxide Inorganic materials 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 4
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
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- 238000012545 processing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 4
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 4
- AUAGGMPIKOZAJZ-UHFFFAOYSA-N 1,3,6-trioxocane Chemical compound C1COCOCCO1 AUAGGMPIKOZAJZ-UHFFFAOYSA-N 0.000 description 3
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 3
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 3
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 3
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- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
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- 238000005886 esterification reaction Methods 0.000 description 3
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- 238000010438 heat treatment Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 150000004692 metal hydroxides Chemical class 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000747 poly(lactic acid) Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
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- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- AFENDNXGAFYKQO-VKHMYHEASA-N (S)-2-hydroxybutyric acid Chemical compound CC[C@H](O)C(O)=O AFENDNXGAFYKQO-VKHMYHEASA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
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- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 2
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- BSAVPJGOVIUDJY-UHFFFAOYSA-N 2-(2,2-dimethylbutyl)propanedioic acid Chemical compound CC(CC(C(=O)O)C(=O)O)(CC)C BSAVPJGOVIUDJY-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- NGEWQZIDQIYUNV-UHFFFAOYSA-N 2-hydroxy-3-methylbutyric acid Chemical compound CC(C)C(O)C(O)=O NGEWQZIDQIYUNV-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
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- ULKFLOVGORAZDI-UHFFFAOYSA-N 3,3-dimethyloxetan-2-one Chemical compound CC1(C)COC1=O ULKFLOVGORAZDI-UHFFFAOYSA-N 0.000 description 2
- WPMYUUITDBHVQZ-UHFFFAOYSA-M 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=CC(CCC([O-])=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-M 0.000 description 2
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 2
- 229940006015 4-hydroxybutyric acid Drugs 0.000 description 2
- PHOJOSOUIAQEDH-UHFFFAOYSA-N 5-hydroxypentanoic acid Chemical compound OCCCCC(O)=O PHOJOSOUIAQEDH-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
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- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- QVJWWHAXEYDKPT-UHFFFAOYSA-N C1C(C(C)(C)C)=C(O)C(C(C)(C)C)=CC1C=CC(=O)NCCCCCCNC(=O)C=CC1C=C(C(C)(C)C)C(O)=C(C(C)(C)C)C1 Chemical compound C1C(C(C)(C)C)=C(O)C(C(C)(C)C)=CC1C=CC(=O)NCCCCCCNC(=O)C=CC1C=C(C(C)(C)C)C(O)=C(C(C)(C)C)C1 QVJWWHAXEYDKPT-UHFFFAOYSA-N 0.000 description 1
- FZGBQGVDPLWBMY-UHFFFAOYSA-N CC(C(=O)O)C(C(=O)O)C.C(CCC(=O)O)(=O)O Chemical class CC(C(=O)O)C(C(=O)O)C.C(CCC(=O)O)(=O)O FZGBQGVDPLWBMY-UHFFFAOYSA-N 0.000 description 1
- GQGUAQFLHIXXPR-UHFFFAOYSA-N CC1=C(C(=C(C(=C1CC1(CC(=CC(=C1)C(C)(C)C)C(C)(C)C)O)C)CC1(CC(=CC(=C1)C(C)(C)C)C(C)(C)C)O)C)CC1(CC(=CC(=C1)C(C)(C)C)C(C)(C)C)O Chemical compound CC1=C(C(=C(C(=C1CC1(CC(=CC(=C1)C(C)(C)C)C(C)(C)C)O)C)CC1(CC(=CC(=C1)C(C)(C)C)C(C)(C)C)O)C)CC1(CC(=CC(=C1)C(C)(C)C)C(C)(C)C)O GQGUAQFLHIXXPR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- 101000843477 Escherichia coli (strain K12) RNA-binding protein Hfq Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229910021551 Vanadium(III) chloride Inorganic materials 0.000 description 1
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
- 239000012346 acetyl chloride Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- DAMJCWMGELCIMI-UHFFFAOYSA-N benzyl n-(2-oxopyrrolidin-3-yl)carbamate Chemical compound C=1C=CC=CC=1COC(=O)NC1CCNC1=O DAMJCWMGELCIMI-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- UROGBLCMTWAODF-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) hexanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 UROGBLCMTWAODF-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- HNDAFHXJOOETRX-UHFFFAOYSA-N butane;2-tert-butyl-5-methylbenzene-1,4-diol Chemical compound CCCC.CC1=CC(O)=C(C(C)(C)C)C=C1O HNDAFHXJOOETRX-UHFFFAOYSA-N 0.000 description 1
- OVYQSRKFHNKIBM-UHFFFAOYSA-N butanedioic acid Chemical compound OC(=O)CCC(O)=O.OC(=O)CCC(O)=O OVYQSRKFHNKIBM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
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- 239000000806 elastomer Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- CESXSDZNZGSWSP-UHFFFAOYSA-L manganese(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Mn+2].CC([O-])=O.CC([O-])=O CESXSDZNZGSWSP-UHFFFAOYSA-L 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- WRDZMZGYHVUYRU-UHFFFAOYSA-N n-[(4-methoxyphenyl)methyl]aniline Chemical compound C1=CC(OC)=CC=C1CNC1=CC=CC=C1 WRDZMZGYHVUYRU-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- KCRLWVVFAVLSAP-UHFFFAOYSA-N octyl dihydrogen phosphite Chemical compound CCCCCCCCOP(O)O KCRLWVVFAVLSAP-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- NAHIZHJHSUSESF-UHFFFAOYSA-N perchloryl acetate Chemical compound CC(=O)OCl(=O)(=O)=O NAHIZHJHSUSESF-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical compound OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 description 1
- IYDGMDWEHDFVQI-UHFFFAOYSA-N phosphoric acid;trioxotungsten Chemical compound O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.OP(O)(O)=O IYDGMDWEHDFVQI-UHFFFAOYSA-N 0.000 description 1
- OBCUTHMOOONNBS-UHFFFAOYSA-N phosphorus pentafluoride Chemical compound FP(F)(F)(F)F OBCUTHMOOONNBS-UHFFFAOYSA-N 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920009537 polybutylene succinate adipate Polymers 0.000 description 1
- 239000004630 polybutylene succinate adipate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- PJYXVICYYHGLSW-UHFFFAOYSA-J tetrachloroplumbane Chemical compound Cl[Pb](Cl)(Cl)Cl PJYXVICYYHGLSW-UHFFFAOYSA-J 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- AHJWSRRHTXRLAQ-UHFFFAOYSA-N tetramethoxymethane Chemical compound COC(OC)(OC)OC AHJWSRRHTXRLAQ-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- AQWKGXFXWCQPDB-UHFFFAOYSA-N trimethoxy(methoxymethoxy)methane Chemical compound COCOC(OC)(OC)OC AQWKGXFXWCQPDB-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- AZSKHRTUXHLAHS-UHFFFAOYSA-N tris(2,4-di-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(=O)(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C AZSKHRTUXHLAHS-UHFFFAOYSA-N 0.000 description 1
- XUHUMYVYHLHMCD-UHFFFAOYSA-N tris(2-cyclohexylphenyl) phosphite Chemical compound C1CCCCC1C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C1CCCCC1)OC1=CC=CC=C1C1CCCCC1 XUHUMYVYHLHMCD-UHFFFAOYSA-N 0.000 description 1
- HBYRZSMDBQVSHO-UHFFFAOYSA-N tris(2-tert-butyl-4-methylphenyl) phosphite Chemical compound CC(C)(C)C1=CC(C)=CC=C1OP(OC=1C(=CC(C)=CC=1)C(C)(C)C)OC1=CC=C(C)C=C1C(C)(C)C HBYRZSMDBQVSHO-UHFFFAOYSA-N 0.000 description 1
- SZPHBONKPMLMCA-UHFFFAOYSA-N tris(2-tert-butylphenyl) phosphite Chemical compound CC(C)(C)C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C(C)(C)C)OC1=CC=CC=C1C(C)(C)C SZPHBONKPMLMCA-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- ZMPODEGAECKFEA-UHFFFAOYSA-N tris[2,4-bis(2-methylbutan-2-yl)phenyl] phosphite Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)CC)C(C)(C)CC)OC1=CC=C(C(C)(C)CC)C=C1C(C)(C)CC ZMPODEGAECKFEA-UHFFFAOYSA-N 0.000 description 1
- HQYCOEXWFMFWLR-UHFFFAOYSA-K vanadium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[V+3] HQYCOEXWFMFWLR-UHFFFAOYSA-K 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
Definitions
- the present invention relates to a polyacetal resin composition and a molded article thereof.
- Polyacetal resin has been used in a very wide range of fields in recent years as a typical engineering resin with excellent physical properties such as mechanical properties and electrical properties, and chemical properties such as chemical resistance and heat resistance. With the expansion of the field of use, further improvements in the properties as materials have been required.
- polyacetal resin is generally molded by injection molding, extrusion molding, etc., and is used for industrial use as a molded product. With the recent increase in the accuracy of industrial products, polyacetal resin has been developed. There is a case where a high degree of dimensional stability is required even for a molded product. In addition, there are many requests from the market to improve the impact resistance of polyacetal resins.
- polyacetal resin molding material GP-A 6-207080 having a specific crystallization time blended with additives and polyolefin, polylactic acid resin, polyacetal resin and others A resin composition UP-A 2003-342460) containing a thermoplastic resin is proposed.
- these resin compositions tend to vary in effect, and the reproducibility of the effect may be insufficient.
- Polyglycolic acid is one of the aliphatic polyesters that has a very high density, high melting point, excellent mechanical properties, and has recently been attracting attention as an environmentally low impact plastic with natural disintegration. -72529).
- the crystallization rate of polydalicolic acid is faster than other aliphatic polyesters such as polylactic acid, and a wide range of uses such as molded products by injection molding, sheets and films are expected in the future, but the crystallization rate is even faster. Materials are also expected to meet the needs of a wide range of customers in the future.
- the present invention provides a polyacetal resin composition
- a polyacetal resin composition comprising a polyacetal resin (a) and a polyester resin (b) and satisfying the following requirements (I) or (I I):
- an object of the present invention is to provide a polyacetal resin composition and a molded product excellent in dimensional stability and impact resistance.
- the present invention is based on 100 parts by weight of the polyacetal resin (a), and 0.1 to 100 parts by weight of the polyester resin (b) in which the ethylene succinate unit or the butylene succinate unit occupies 70 to 100 mol% of the main chain.
- the present invention relates to a molded article formed by molding the polyacetal resin composition, particularly a molded article in which the polyester resin (b) is dispersed with an equivalent circle diameter of 1,0 m or less.
- the present invention it becomes possible to provide a resin composition and a molded product excellent in dimensional stability and impact resistance characteristics, and it is possible to further improve the quality of the polyacetal resin.
- the polyacetal resin (a) used in the present invention is a polymer compound having an oxymethylene group (one CH 2 0—) as a main structural unit. It may be any one of oxymethylene homopolymers, copolymers containing other structural units in addition to oxymethylene groups (including block copolymers), etc., and the molecule has not only a linear structure but also a branched or crosslinked structure. May be.
- homopolymers are produced by polymerization of anhydrous formaldehyde or trioxane, a cyclic trimer of formaldehyde. It is usually stabilized against thermal decomposition by terminal cap.
- the copolymer is generally formaldehyde or a cyclic oligomer of formaldehyde represented by the general formula ((: ()) n (where n is an integer of 3 or more), for example, trioxane, cyclic ether and / or cyclic formal.
- the polyacetal resin (a) used in the present invention is stabilized against thermal decomposition by removing the unstable portion at the end by hydrolysis. From the viewpoint of the stability of the hue of the resin composition to be prepared and the molded product thereof, a polyacetal resin copolymer is particularly preferable.
- the trioxane used as the main raw material for the polyacetyl resin copolymer is generally obtained by reacting an aqueous formaldehyde solution in the presence of an acidic catalyst, and is purified by a method such as distillation.
- the trioxane used for polymerization is preferably one containing as little impurities as possible, such as water, methanol and formic acid.
- cyclic ethers and Z or cyclic formal compounds used as comonomers include ethylene oxide, propylene oxide, butylene oxide, styrene oxide, oxetane, tetrahydrofuran, trioxepane, 1,3-dioxolane, ethylene
- examples include glycol formal, propylene glycol formal, diethylene glycol formal, triethylene glycol formal, 1,4-butanediol formal, 1,5-pentanediol formal, 1,6-hexanediol formal, and the like.
- ethylene oxide, 1,3-dioxolane, 1,4-bub One type or two or more types selected from the group consisting of tandiol formal and jetylene glycol formal are preferable, and 1,3-dioxolan is particularly preferable.
- the particularly preferred copolymerization ratio of these cyclic ethers and / or cyclic formal compounds is 0.5 to 20% by weight.
- the polyacetal resin copolymer is generally obtained by a method in which an appropriate amount of molecular weight modifier is further added and cationic polymerization is performed using a cationic polymerization catalyst.
- the molecular weight regulator include low molecular weight acetal compounds having an alkoxy group such as methylal, methoxymethylal, dimethoxymethylal, trimethoxymethylal, oxymethylenedi-n-butyl ether, methanol, ethanol, butanol, etc. Alcohols, ester compounds, acid compounds, water and the like. Among them, a low molecular weight acetal compound having an alkoxy group is particularly preferable.
- Cationic polymerization catalysts used in the production of the polyacetal resin copolymer include lead tetrachloride, tin tetrachloride, titanium tetrachloride, aluminum trichloride, zinc chloride, vanadium trichloride, antimony trichloride, phosphorus pentafluoride, pentafluoride.
- Trifluoride such as antimony trifluoride, boron trifluoride, boron trifluoride jetyl etherate, boron trifluoride dibutyl etherate, boron trifluoride dioxanate, boron trifluoride atomic anhydrate, boron trifluoride triethylamine complex Boron coordination compounds, Perchloric acid, Acetyl perchlorate, t-Butyl monochloroate, Hydroxyacetic acid, Trichlorodiacetic acid, Trifluoroacetic acid, Trifluoromethanesulfonic acid, p-toluenesulfonic acid, and other inorganic and organic acids, Triethyloxy Umte Complex salt compounds such as rough mouth roborate, triphenylmethylhexafluoroantimonate, allyldiazonium hexafluorophosphine, allyldiazoniumtetrafolate, etc., jetylzin
- boron trifluoride especially boron trifluoride, boron trifluoride Jetle Teller, Boron trifluoride coordination compounds such as boron trifluoride dibutyl etherer, boron trifluoride dioxanate, boron fluoride acetane hydrate, and boron trifluoride triethylamine complex are preferred.
- These catalysts can also be used after diluting with an organic solvent or the like.
- the polymerization apparatus is not particularly limited, and a known apparatus is used, and a continuous polymerization apparatus with a biaxial paddle or the like is particularly preferably used.
- the polymerization temperature is preferably kept at 65 to 135.
- the deactivation after the polymerization is performed by adding a basic compound or an aqueous solution thereof to the product reaction product discharged from the polymerization machine after the polymerization reaction, or the reaction product in the polymerization machine.
- Basic compounds for neutralizing and deactivating the polymerization catalyst include ammonia, amines such as trytylamine, tryptylamine, triethanolamine, tributylamine, or aluminum, metal, and alkaline earth.
- Metal hydroxide salts and other known catalyst deactivators are used. Further, after the polymerization reaction, it is preferable to quickly add these aqueous solutions to the product to deactivate them. After the polymerization method and the deactivation method, washing, separation and recovery of unreacted monomers, drying, and the like are further performed by a conventionally known method as necessary.
- the melt index of the polyacetal resin (a) of the present invention is preferably in the range of 0.01 to 500 g / lOmin, particularly preferably in the range of 0.1 to 100 g / 10 min.
- succinic acid or a derivative thereof (dimethyl succinate)
- Succinic acid esters such as succinic acid succinic acid, succinic anhydride) and ethylene glycol or 1,4-butanediol, (ii) ring-opening polymerization with succinic anhydride and ethylene oxide, etc. Is exemplified.
- the polyester resin (b) used in the present invention may contain an ethylene succinate unit or a unit other than a butylene succinate unit in a range not exceeding 30 mol%, and the production of the above (i)
- polycondensation using a dicarboxylic acid component other than succinic acid or its derivative, or a diol component other than ethylene glycol or 1,4-butanediol It can be obtained by a ring-opening polymerization method using a part of an acid anhydride other than succinic anhydride or a cyclic ether component other than ethylene oxide.
- dicarboxylic acid components other than succinic acid or its derivatives include oxalic acid, malonic acid, dartaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, decanedicarboxylic acid, tun Aliphatic dicarboxylic acids having a linear or branched alkylene group such as decanedicarboxylic acid, dodecanedicarboxylic acid, octadecanedicarboxylic acid, 3,3-dimethylpentanedicarboxylic acid, dimer acid, maleic acid, Aliphatic dicarboxylic acids with unsaturated bonds such as itaconic acid and citraconic acid, alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid, fuuric acid, isofuric acid, telelatalic acid, 2,6-naphthalene range Naphthenic dicarboxylic acids such as carboxy
- adipic acid, terephthalic acid, and carboxylic acid esters and acid anhydrides thereof are preferable.
- These dicarboxylic acid components can be used alone or in combination of two or more, and the amount used is 0 to 30 mol% of the whole dicarboxylic acid component.
- the diol component other than ethylene glycol or 1,4 monobutanediol includes, for example, ethylene glycol (when 1,4-butanediol is the main composition), 1,4 monobutanediol (ethylene Glycol is the main composition), 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,2-pentanediol 2,4-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,2-hexanediol, neopentyldaricol , Fatty acids having linear or branched alkylene groups such as 3-methyl-1,5-pentane
- Long-chain aliphatic diols such as polyethylene diols, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, etc.
- Cyclohexanedicarboxylic alicyclic Jio le such as methanol and the like. These diol components can be used alone or in combination of two or more, and the amount used is 0 to 30 mol% of the whole diol component.
- oxycarboxylic acids include lactic acid, glycolic acid, 2-methyllactic acid, 3-hydroxypropionic acid, 3-hydroxy-1,2-dimethylpropionic acid, 2-hydroxybutyric acid, 3-hydroxybutyric acid, 4-hydroxy Butyric acid, 2-hydroxy-1-3-methylbutyric acid, 3-hydroxy-3-methyl-butyric acid, 2-hydroxy-3,3-dimethylbutyric acid, 3-hydroxyvaleric acid, 4-hydroxyvaleric acid, 5-hydroxyvaleric acid, 6- Examples include hydroxycaproic acid, 2-hydroxyisocabronic acid, lactone ring-opened products, and carboxylic acid esters thereof.
- cyclic esters include glycolide, lactide, / 3-propiolactone, i3-ptyrolactone, pivalolactone,) 3-methyl-1-] 3-propiolactone,] 3-methyl- ⁇ -valerolactone, ⁇ 5 _ Valerolacton, ⁇ -force prolactone, etc.
- carbonate compounds examples thereof include dimethyl carbonate, jetyl carbonate, dibutyl carbonate, diphenyl carbonate, and ethylene carbonate.
- These oxycarboxylic acid, cyclic ester, and carbonate ester compound components can be used alone or in combination of two or more thereof, and the amount used is 0 to 30 mol% of the total amount of ester or carbonate ⁇ units. .
- an oxycarboxylic acid having at least three hydroxyl groups and carboxyl groups such as malic acid, citrate, and tartaric acid, and alkyl esters thereof. It is also possible to use a small amount of trihydric or higher alcohols such as trimethylolpropane and pen erythritol.
- any of D-form, L-form, and racemate may be used.
- examples of the cyclic ether component other than ethylene oxide include propylene oxide, cyclohexene oxide, styrene oxide, epichlorohydrin, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ester. 1 ter, phenyldaricidyl ether, tetrahydrofuran, oxetane and the like.
- These cyclic ether components can be used alone or in combination of two or more, and the amount used is 0 to 3 mol% of the entire cyclic ether component.
- an acid anhydride other than succinic anhydride, a dicarboxylic acid, a diol, an aliphatic oxycarboxylic acid, a cyclic ester, a carbonic acid ester compound, etc. may be used as a part thereof.
- the polymerization of the polyester resin (b) in which the ethylene succinate unit or butylene succinate unit of the present invention occupies 70 to 100 mol% of the main chain is usually carried out in the presence of a catalyst.
- the catalysts can be used alone or in combination of two or more.
- the polymerization catalyst is not particularly limited.
- Organometallic compounds such as metal oxides, metal hydroxides, carbonates, phosphates, sulfates, nitrates, chlorides and other inorganic metal compounds, triarylamine, triethylamine, tri-n-octylamine, benzyldimethylamine Tertiary amines such as phosphoric acid, phosphomolybdic acid, heteropolyacids such as key tungstic acid and their alkali metal salts, sulfuric acid, p_toluene
- An organic or inorganic phosphorus compound can be used in combination with the metal compound catalyst.
- Specific examples include phosphoric acid, phosphoric anhydride, polyphosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, hypophosphorous acid, tripolyphosphoric acid and their metal salts, ammonium salts, chlorides.
- Esterified products alkyl or aryl acid phosphates, methylphosphonic acid, ethylphosphonic acid, phenylphosphonic acid, naphthylphosphonic acid, dibutylbutylphosphonate, dibutylhydrogen phosphite, tridecylphosphite, triphenylphosphite, diphenylisodecylphosphite, And trisisodecyl phosphite.
- the weight average molecular weight (Mw) of the polyester resin (b) in which the ethylene succinate unit or the butylene succinate unit of the present invention occupies 70 to 100 mol% of the main chain is from 10,000 to 1,000,000.
- the range is preferable, and the range of 20,000 to 500,000 is particularly preferable.
- the weight average molecular weight (Mw) is a value calculated by using a polymethyl methacrylate as a standard, which was determined by a GPC measuring device as described later in Examples.
- a resin composition is prepared using the polyacetal resin (a) and a polyester resin (b) in which the ethylene succinate unit or the butylene succinate unit occupies 70 to 100 mol% of the main chain.
- the composition ratio of (a) and (b) is as follows: Polyacetal resin (a) Polyester resin (b) in which ethylene succinate units or butylene succinate units account for 70 to 100 mol% of the main chain with respect to 100 parts by weight It must be ⁇ 100 parts by weight. Polyacetal resin (a) When 100 parts by weight is less than 0.5 parts by weight of polyester resin (b), where ethylene succinate units or butylene succinate units occupy 70 to 100 mol% of the main chain Sufficient improvement in resistance and impact resistance cannot be obtained.
- composition preparation method of the present invention is not particularly limited. Basically, the polyacetal resin (a) and a polyester resin in which ethylene succinate units or butylene succinate units occupy 70 to 100 mol% of the main chain ( b) is prepared by melt kneading. It is desirable that the processing conditions are kneading at a temperature of not less than the melting points of (a) and (b), preferably 175T: not less than 250 ° C and not less than 30 seconds.
- Preparation method There is no particular limitation on the specific state, and in general, it can be prepared by a known equipment and method as a method for preparing a synthetic resin composition. That is, mix the necessary ingredients,
- a kneading method using a single-screw or twin-screw extruder or other melt-kneading apparatus is common.
- a part or all of the resin component is finely pulverized, mixed and melt-extruded, and then a pellet is formed, or a part of the components constituting the composition is previously added.
- the composition of the present invention exhibits excellent dimensional stability as it is, but it can be stabilized by heat treatment at an appropriate temperature after the composition is prepared.
- the resin composition of the present invention can further contain various known stabilizers.
- examples of the antioxidant used in the composition of the present invention include phenolic (such as hindered phenols), amines (such as hindered amines), phosphorus, rhodium, hydroquinone, and quinoline antioxidants. Agents and the like.
- phenolic antioxidants include hindered phenols such as 2,2'-methylenebis (4-methyl-6-t-butylphenol), 4,4'-methylenbis (2,6-di-t_butyl). Phenol, 4, 4, -butylidenebis (3 monomethyl _ 6- t -butylphenol), 2, 6-di- t -butyl- p-cresol, 1, 3, 5-trimethyl-2, 4, 6-tris (3,5-di-t-butyl-l-hydroxybenzyl) benzene, 1,6-hexanediol-bis [3—
- amine-based antioxidants include hindered amines such as tri- or tetra-C 1-3 alkylpiperidine or derivatives thereof [eg, 4-methoxy-2, 2, 6,
- 6-tetramethylpiperidine 4-benzoyloxy-2, 2, 6, 6-tetramethylbiperidine, 4-phenoxy-1,2,2,6,6-tetramethylpiperidine, etc.] bis (tri, tetra or pen Alkyl piperidine) C 2-20 alkylene dicarboxylic acid ester [for example, bis (2, 2, 6, 6-tetramethyl-4-piperidyl) ogisalate, bis (2, 2, 6, 6-tetramethyl-4-piperidyl) ) Malonate, bis (2, 2, 6, 6-tetramethyl-4-piperidyl) adipate, bis (2, 2, 6, 6-tetramethyl-4-piperidyl) sebacate, bis (1, 2, 2, 6, 6-Pen evening methyl 4-piperidyl) Sebacate, bis (2, 2, 6, 6-tetramethyl 4-piperidyl) terephthalate], 1, 2_bis (2, 2, 6, 6 —Tetramethyl-4-piperidyloxy) ethane, Phenyl- 1 naph
- Phosphorus antioxidants include, for example, triisodecyl phosphite, trisnonyl phenyl phosphite, diphenyl isodecyl phosphite, phenyl sodecyl phosphite, 2,2-methylene bis 1-butylphenyl) octyl phosphite, 4, 4, —butylidenebis (3-methyl-6-t-butylphenyl) ditridecyl phosphite, ⁇ ris (branched C3-6 alkylphenyl) phosphite [eg, tris (2, 4-di-t-butylphenyl) phosphite, tris (2-tert-butyl-4 monomethylphenyl) phosphite, tris (2,4-di-t-amylphenyl) phosphite, tris (2-tert-butylphenyl) Phos
- triphenyl phosphate stabilizers for example, 4-phenoxy-9-one (4-hydroxyphenyl) ) _P_ cumenyloxy 3, 5, 8, 10—tetraoxa-1,9-diphosphapyro [5,5] undecane, tri
- hydroquinone antioxidants examples include 2, 5 Examples include quinoline antioxidants such as 6-ethoxy 2,2,4, -trimethyl-1,2-dihydroquinoline, and thio antioxidants. Examples thereof include dilauryl thiodipropionate and distearyl thiodipropionate.
- antioxidants can be used alone or in combination of two or more.
- the content of the antioxidant is, for example, from 0.1 to 5 parts by weight, preferably from 0.05 to 2.5 parts by weight, particularly from 0.1 to 0.1 parts by weight based on 100 parts by weight of the resin composition. It can be selected from a range of about 1 part by weight.
- heat stabilizer used in the resin composition of the present invention examples include metal hydroxides and inorganic salts, fatty acid metal salts, nitrogen-containing compounds such as amidine compounds and amide compounds, and the like.
- benzotriazole substances, benzophenone substances, aromatic benzoate substances, hindered amine substances (piperidine derivatives having a sterically hindered group) and the like are generally used.
- additives can be blended in the composition of the present invention in order to improve its physical properties according to the intended use.
- additives include various colorants, lubricants, mold release agents, nucleating agents, surfactants, heterogeneous polymers, organic polymer modifiers and inorganic, organic, metallic and other fibrous materials, powders, boards These fillers can be used, and one or more of these can be used in combination.
- the above-mentioned stabilizer, additive, etc. can be blended at any desired level, for example, once added to the polyacetal resin (a), the ethylene succinate unit or butylene succinate unit is 70 to 100 mol% of the main chain. Once added to the polyester resin (b), or the resin composition
- the resin composition of the present invention obtained by the above method comprises an injection molding method, a gas assist gun It is formed into a molded product by applying conventionally known molding methods such as extrusion molding, extrusion molding, blow molding, sheet molding, and film molding.
- a molded article using the composition of the present invention comprises a polyacetal resin (a) and a polyester resin in which the ethylene succinate unit or the butylene succinate unit occupies 70 to 100 mol% of the main chain (b) ).
- the polyester resin (b) is preferably dispersed with the following equivalent circle diameter, and particularly preferably 0.5 m or less.
- the equivalent circle diameter is evaluated by the method described later in Examples.
- a molded article using the resin composition of the present invention obtained as described above is excellent in dimensional stability and impact resistance, and can further improve the quality of the polyacetyl resin.
- the mechanism is not clear, but an ethylene succinate resin or a butylene succinate resin that is well finely dispersed and highly compatible with polyacetylene resin works well. It is guessed. (Invention U I)
- Invention (II) includes a polyacetal resin (a) and a polyester resin (b ′), wherein the glycolic acid unit is a main chain with respect to the polyacetal resin (a) 0.5 parts by weight or more and less than 100 parts by weight. It is a polyacetal resin composition containing 100 parts by weight of a polyglycolic acid-based polyester resin (b ′) occupying 70 to 100 mol%. In other words, it is a polyglycolic acid polyester resin composition containing the above (a) and (b ′). In view of the actual situation, an object of the present invention is to provide a polydaricholic acid-based polyester resin composition having an improved crystallization rate.
- the present invention provides a polyacetal resin (a) 0.5 parts by weight or more and 100 parts by weight with respect to 100 parts by weight of a poly (dallycolic acid) polyester resin (b ′) in which glycolic acid units occupy 70 to 100 mol% of the main chain. It is related with the polyester resin composition formed by mix
- the production method of the polyglycolic acid-based polyester resin (b ′) in which the glycolic acid unit used in the present invention occupies 70 to 100 mol% of the main chain includes (i) glycolide which is a cyclic dimer ester of glycolic acid. And a method by polycondensation of glycolic acid and / or a carboxylic acid ester thereof, and the like.
- the glycolide used in the above (i) can be obtained by a sublimation depolymerization method or a solution phase depolymerization method of a glycolic acid oligomer, and it is particularly preferable to use glycolide having a high purity.
- glycolic acid unit is represented by _O 1 CH 2 —CO— and can also be referred to as an oxymethylene force sulfonyl unit.
- the polyester resin (b ′) used in the present invention may contain units other than glycolic acid units in a range not exceeding 30 mol%, and in the production method (i) above, other than darlicolide.
- Components other than glycolic acid and / or its carboxylic acid ester may be used as part of the reaction component in the production method of i). Examples of other components mentioned here include a dicarboxylic acid component, a diol component, an oxycarboxylic acid component, a cyclic ester component, and a carbonate ester compound component. These components may be used alone or in combination of two or more. it can.
- dicarboxylic acid component examples include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, decanedicarboxylic acid, undecanedicarboxylic acid, dodecanedicarboxylic acid , Ok Unsaturated bonds such as aliphatic dicarboxylic acid having a linear or branched alkylene group such as dicarboxylic acid, 3,3-dimethylpentanedicarboxylic acid, dimer acid, maleic acid, itaconic acid, citraconic acid Aliphatic dicarboxylic acid having a cycloaliphatic acid, alicyclic dicarboxylic acid such as cyclohexane dicarboxylic acid, phthalic acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid such as 2,6-naphthalenedicarboxylic
- diol component examples include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,2-butanediol, 1,3-butanediol, 2,3— Butanediol, 1,5_pentanediol, 1,2-pentanediol, 2,4-pentanediol, 1,6-hexanediol, 1,7_heptanediol, 1,8-octanediol, 1, 9-nonanediol, 1,2-hexanediol, neopentyldarlicol, 3 monomethyl-1,5, -pentanediol, 2,2-jetyl-1,3-propanediol, diethylene glycol, triethylene glycol, di Aliphatic diols having a linear or branched alkylene group such as propylene glycol,
- oxycarboxylic acid component examples include lactic acid, 2-methyllactic acid, 3-hydroxypropionic acid, 3-hydroxy-1,2-dimethylpropionic acid, 2-hydroxybutyric acid, 3-hydroxybutyric acid, and 4-hydroxybutyric acid.
- 2-hydroxy-3-methylbutyric acid, 3-hydroxy-3-methylbutyric acid, 2-hydroxy-3, 3-dimethyl Examples include butyl butyric acid, 3-hydroxyvaleric acid, 4-hydroxyvaleric acid, 5-hydroxyvaleric acid, 6-hydroxycabronic acid, 2-hydroxyisocabronic acid, lactone ring-opened products, and carboxylic acid esters thereof. .
- cyclic ester component examples include lactide, 3-propiolactone, ⁇ -ptyrolactone, pivalolactone, / 3-methyl-] 3-propiolactone, / 3-methylone ⁇ 5-valerolactone, ⁇ -valerolactone , ⁇ -force prolactone and the like.
- carbonate compound examples include dimethyl carbonate, dimethyl carbonate, dibutyl carbonate, diphenyl carbonate, and ethylene carbonate.
- an oxycarboxylic acid having at least three or more hydroxyl groups and carboxyl groups such as malic acid, citrate, and tartaric acid, and alkyl esters thereof.
- an oxycarboxylic acid having at least three or more hydroxyl groups and carboxyl groups such as malic acid, citrate, and tartaric acid, and alkyl esters thereof.
- trimethylolpropane, pen evening erisuri! It is also possible to use a small amount of trihydric or higher alcohol such as one.
- any of D-form, L-form, and racemate may be used.
- the polymerization of the poly (dalycolic acid) polyester resin (b ′) in which the glycolic acid unit used in the present invention accounts for 70 to 100 mol% of the main chain is usually carried out in the presence of a catalyst.
- the catalysts can be used alone or in combination of two or more.
- the polymerization catalyst is not particularly limited.
- An organic or inorganic phosphorus compound can be used in combination with the above metal compound catalyst.
- Specific examples include phosphoric acid, anhydrous phosphoric acid, polyphosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, hypophosphorous acid, tripolyphosphoric acid and their metal salts, ammonium salts, chlorides.
- Esterified products alkyl or aryl acid phosphates, methylphosphonic acid, ethylphosphonic acid, phenylphosphonic acid, naphthylphosphonic acid, dibutylbutylphosphonate, dibutylhydrogen phosphite, tridecylphosphite, triphenylphosphite, diphenylisodecylphosphite, And trisisodecyl phosphite.
- the weight average molecular weight (Mw) of the polyglycolic acid polyester resin (b ′) in which the glycolic acid unit used in the present invention occupies 70 to 100 mol% of the main chain is 10,000 to 1,0. Those in the range of 00,000 are preferred, and those in the range of 20,000 to 500,000 are particularly preferred.
- the weight average molecular weight (Mw) is a value calculated by using a polymethyl methacrylate as a standard, which was determined by a GPC measuring device as described later in Examples.
- the polyacetal resin (a) used in the present invention is as described in the above invention (I).
- the cyclic ether and / or cyclic formal compound used in the production of the polyacetal resin copolymer ethylene oxide, propylene oxide, butylene oxide, epichlorohydrin, epiphine mohydrin, styrene oxide, oxetane, 3, 3-bis (chloromethyl) oxetane, tetrahydrofuran, trioxepane, 1,3-dioxolan, ethylene glycol formal, propylene glycol formal, diethylene glycol formal, triethylene glycol formal, 1,4 dibutanediol formal, 1,5-pentanediol Formal, 1, 6-hexanediol formal and the like.
- one or more selected from the group consisting of ethylene oxide, 1,3-dioxolan, 1,4-butanediol formal, and diethylene glycol formal are preferable, and 1,3-dioxolane is particularly preferable.
- a particularly preferred copolymer composition of these cyclic ethers and / or cyclic formal compounds is 0.5 to 20% by weight.
- a resin composition is prepared using the polyglycolic acid-based polyester resin (b ′) in which the glycolic acid unit occupies 70 to 100 mol% of the main chain and the polyacetal resin (a).
- the composition ratio of (a) and (b ′) is such that the polyacetal resin (a) is 0.5 parts by weight or more and less than 100 parts by weight with respect to 100 parts by weight of the polyester resin (b).
- the polyacetal resin (a) is preferably 1 to 50 parts by weight.
- the method for preparing the composition of the present invention is not particularly limited, but is basically polyester.
- the resin (b ′) and the polyacetal resin (a) are prepared by melt-kneading the components.
- the treatment conditions are preferably kneaded for at least 30 seconds at a temperature not less than the melting points of (b ') and (a), preferably not less than 210 and not more than 250 ° C.
- the specific embodiment of the preparation method is not particularly limited, and can be generally prepared by a known equipment and method as a preparation method of the synthetic resin composition. That is, a general method is to mix necessary components and knead them using a single or twin screw extruder or other melt kneading apparatus.
- a part or all of the resin component is finely pulverized, mixed and melt-extruded, and then a method of forming the pellet, or a part of the components constituting the composition is previously prepared. It is also possible to use a method of melt-kneading (master batch) and further kneading this with the remaining other components to obtain a composition of a predetermined component or a molded product.
- the resin composition of the present invention can further contain various known stabilizers.
- an antioxidant from the viewpoint of the stability of the hue of the resin composition pellets and Z or the molded product.
- examples of the antioxidant used in the composition of the present invention include phenol-based (such as hindered phenols), amine-based (such as hindered amines), phosphorus-based, xio-based, hydroquinone-based, quinoline-based antioxidants. Etc. Specific examples thereof are the same as those in the invention (I).
- the above-mentioned stabilizers, additives and the like can be added at any stage, for example, once added to the polyester resin (b ′), once added to the polyacetal resin (a), or the resin composition. It may be added at the time of preparation, or may be added and mixed immediately before obtaining the final molded product.
- the polyglycolic acid-based polyester resin composition of the present invention obtained as described above has an improved crystallization speed and can further improve the quality.
- the polyester resin composition preferably has a temperature difference (Tm ⁇ T c) between its melting point (Tm) and crystallization temperature (T c) of 35 t: or less.
- Tm melting point
- T c crystallization temperature measured by DSC (differential scanning calorimetry), as will be described later in the examples.
- DSC differential scanning calorimetry
- the resin composition of the present invention can be applied to conventionally known molding methods in various fields such as injection molding, extrusion molding, blow molding, sheet molding, film molding, and fiber molding. . Brief Description of Drawings
- FIG. 1 is an SEM observation photograph of the resin composition of Example 3.
- reaction product discharged from the polymerizer was passed through a crusher quickly, and added to a 60 ° C aqueous solution containing 0.05% by weight of triethylamine to deactivate the catalyst. Furthermore, crude polyacetal resin was obtained after separation, washing and drying.
- the obtained polymer had a melt index (measured at 190 ° C under a load of 2160 g in accordance with AS TM D- 1 2 3 8) of 9.5 gZ10 min.
- the copolymer composition was confirmed to be 3.4% by weight by proton NMR measurement using hexafluoroisopropanol d 2 as a solvent.
- trioxane 100 parts by weight and methylal as a molecular weight regulator 0.1 weight Part was continuously added at a predetermined ratio, and 0.002 part by weight of boron trifluoride as a catalyst was continuously added and fed to perform bulk polymerization.
- the reaction product discharged from the polymerizer was quickly passed through a crusher, and added to 60 aqueous solution containing 0.05% by weight of ligethylamine to deactivate the catalyst. Further, after separation, washing, and drying, a crude polyacetal resin was obtained.
- this crude polyacetal and acetic anhydride were reacted at a temperature of 145 ° C. for 1 hour to stabilize the ends. Subsequently, for 100 parts by weight of the obtained polyacetal resin, 0.3 wt. Of penyu erythrityl-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] is used as a stabilizer. Partly added and melt-kneaded at 210 ° C. with a twin-screw extruder to obtain a pellet-like polyacetal resin homopolymer (a-2). The resulting polymer had a melt index (measured according to A S TM D — 1 2 3 8) of 12.2 gZ10 min.
- Measurement was carried out at 40 ° C. by using a GPC measurement apparatus and using HFIP (hexafluoroisopropanol) ZlOmM sodium trifluoroacetate as an eluent. Polymethyl methacrylate was used as a standard sample.
- a batch stirrer In a nitrogen atmosphere, a batch stirrer is charged with 32.3 parts by weight of ethylene glycol, 47.2 parts by weight of succinic acid, and manganese (II) acetate tetrahydrate as a catalyst. Under normal pressure, 145 to 220 The mixture was stirred at a temperature of ° C to conduct an esterification reaction. Subsequently, the reaction solution was transferred to a batch type stirring apparatus equipped with a double helical blade, tetra-n-butyl titanate and polyphosphoric acid were added as catalysts, and the reaction solution was stirred at a temperature of 220 ° C. under reduced pressure. The polycondensation reaction was carried out with stirring for 2 hours. The reaction product was discharged, cooled in a water bath, and cut with a cutter to obtain a pellet-shaped polyethylene succinate resin (b — 2). The weight average molecular weight of the obtained polymer was 54,000.
- a batch stirrer In a nitrogen atmosphere, a batch stirrer is charged with 36.25 parts by weight of 1,4-monobutanediol, 43.18 parts by weight of succinic acid, and tetraisopropyl titanate as a catalyst. Under normal pressure, 90 to 215 ° C The esterification reaction was carried out at a temperature of continue, The reaction solution was transferred to a batch stirrer equipped with a double helical blade, and the reaction solution was stirred at a temperature of 225 and stirred for 6 hours under reduced pressure to carry out a polycondensation reaction. The reaction product was discharged, cooled in a water bath, and cut with a cutter to obtain a pellet-shaped polybutylene succinate resin (b-3). The weight average molecular weight of the obtained polymer was 68,000.
- Production Example 6 Preparation of polybutylene succinate-adipate copolymer resin (b-4) Under a nitrogen atmosphere, a batch stirrer similar to Production Example 3 was charged with 1,4 1-butanediol 34.8 parts by weight, succinic acid 34 6 parts by weight, 10.8 parts by weight of adipic acid (molar ratio of succinic acid to adipic acid 80:20), and tetraisopropyl titanate and phenylphosphonic acid as a catalyst were charged at 90 to 215 under normal pressure. The mixture was stirred at a temperature to conduct an esterification reaction.
- reaction solution was transferred to a batch stirrer equipped with a double helical blade, and the reaction solution was stirred at a temperature of 220 ° C. and stirred under reduced pressure for 6 hours to carry out a polycondensation reaction.
- the reaction product was discharged, cooled in a water bath, and cut with a cutter to obtain pellets of polybutylene succinate and adipate copolymer resin (b-4).
- the weight average molecular weight of the obtained polymer was 47,000.
- the copolymer composition of adipic acid was confirmed to be 20 mol% based on the total acid by proton NMR measurement using hexafluoroisopropanol d2 as a solvent.
- Polybutylene succinate resin (b-3) obtained in Production Example 5 10.1 parts by weight of hexamethylene diisocyanate was added to 16.5 parts by weight, and 180-200 ° C for 1 hour. A high molecular weight reaction was performed. The reaction product was discharged, cooled in a water bath, and cut with a cutter to obtain a pellet-like high molecular weight polybutylene succinate resin (b-5). The weight average molecular weight of the obtained polymer was 144,000.
- polyacetal resin (a-1, a-2) and polyester The resin (b-l to b-5) is mixed in advance, and then melted and kneaded at a resin temperature of 21 (T to prepare a pellet-like composition using a twin-screw extruder, followed by injection molding.
- ISO test specimens were molded using a machine, and the equivalent circle diameter, dimensional stability, and impact resistance characteristics of the dispersed particles were evaluated, and the results are shown in Table 1.
- polyacetal resin (a-1) The same evaluation was performed for the case of using only No. 1. The results are also shown in Table 1.
- I S O tensile test specimens were molded, and the specimens were left in an air-conditioned room at a temperature of 23 and a humidity of 50% for 24 hours, and then the dimensions (length in the longitudinal direction) of the specimens were measured accurately. Thereafter, the test piece was treated under the conditions of 70 ° C. ⁇ 2 hours, left again in the air-conditioned room for 24 hours, and the dimensions were measured. Based on the difference (absolute value) between the dimension after processing and the initial dimension, the dimensional stability was indicated by the following index.
- the reaction product was discharged, cooled in a water bath, cut into a pellet by a cutter, and further dried under reduced pressure at 150 to obtain a polyglycolic acid resin (b-6).
- the weight average molecular weight of the obtained polymer was 55,000.
- the weight average molecular weight was measured by the following method.
- the polymer obtained in Production Example 8 was subjected to solid phase polymerization at 210 ° C. under a reduced pressure of 0.1 lmbar for 25 hours to obtain a high molecular weight polyglycolic acid resin (b-7).
- the obtained polymer had a weight average molecular weight of 120,000.
- polyester resin (b'-6, b'-7) and polyacetylene resin (a-1, a-2) were mixed in advance, and then, using a twin screw extruder, A melt-kneading treatment was carried out at a resin temperature of 225 ° C. to prepare a pellet-like composition, and then an ISO test piece was molded with an injection molding machine to evaluate the crystallization speed.
- Table 2 polyester resin (b'-6, b'-7) and polyacetylene resin (a-1, a-2) were mixed in advance, and then, using a twin screw extruder, A melt-kneading treatment was carried out at a resin temperature of 225 ° C. to prepare a pellet-like composition, and then an ISO test piece was molded with an injection molding machine to evaluate the crystallization speed.
- Table 2 For comparison, the same evaluation was performed when only the polyester resin (b'-6) was used. The results are also shown in Table 2.
- the crystallization rate was evaluated by the following method.
- polyester resin (b'-1) and erythrityl-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] are not added.
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CN111944290A (zh) * | 2020-08-28 | 2020-11-17 | 上海浦景化工技术股份有限公司 | 一种适用于高温井的可降解材料及其制品与应用 |
US20230183420A1 (en) * | 2021-12-10 | 2023-06-15 | Chang Chun Plastics Co., Ltd. | Aliphatic polyester composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03126751A (ja) * | 1989-10-11 | 1991-05-29 | Toray Ind Inc | ポリオキシメチレン樹脂組成物 |
JPH03212443A (ja) * | 1990-01-18 | 1991-09-18 | Asahi Chem Ind Co Ltd | ポリオキシメチレン樹脂組成物 |
JPH0665468A (ja) * | 1992-08-17 | 1994-03-08 | Asahi Chem Ind Co Ltd | 生分解性ポリアセタール樹脂組成物 |
JP2004250555A (ja) * | 2003-02-19 | 2004-09-09 | Toray Ind Inc | ポリアセタール樹脂を主成分とする成形品 |
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JPH03126751A (ja) * | 1989-10-11 | 1991-05-29 | Toray Ind Inc | ポリオキシメチレン樹脂組成物 |
JPH03212443A (ja) * | 1990-01-18 | 1991-09-18 | Asahi Chem Ind Co Ltd | ポリオキシメチレン樹脂組成物 |
JPH0665468A (ja) * | 1992-08-17 | 1994-03-08 | Asahi Chem Ind Co Ltd | 生分解性ポリアセタール樹脂組成物 |
JP2004250555A (ja) * | 2003-02-19 | 2004-09-09 | Toray Ind Inc | ポリアセタール樹脂を主成分とする成形品 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111944290A (zh) * | 2020-08-28 | 2020-11-17 | 上海浦景化工技术股份有限公司 | 一种适用于高温井的可降解材料及其制品与应用 |
CN111944290B (zh) * | 2020-08-28 | 2022-09-06 | 上海浦景化工技术股份有限公司 | 一种适用于高温井的可降解材料及其制品与应用 |
US20230183420A1 (en) * | 2021-12-10 | 2023-06-15 | Chang Chun Plastics Co., Ltd. | Aliphatic polyester composition |
US11926699B2 (en) * | 2021-12-10 | 2024-03-12 | Chang Chun Plastics Co., Ltd. | Aliphatic polyester composition |
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