WO2004108825A1 - 変性エポキシ樹脂の製造方法 - Google Patents
変性エポキシ樹脂の製造方法 Download PDFInfo
- Publication number
- WO2004108825A1 WO2004108825A1 PCT/JP2004/007679 JP2004007679W WO2004108825A1 WO 2004108825 A1 WO2004108825 A1 WO 2004108825A1 JP 2004007679 W JP2004007679 W JP 2004007679W WO 2004108825 A1 WO2004108825 A1 WO 2004108825A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rubber
- epoxy resin
- polymer particles
- water
- organic medium
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/24—Thermosetting resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Definitions
- the present invention relates to a method for producing a rubber-modified epoxy resin composition.
- the cured epoxy resin is excellent in many respects such as dimensional stability, mechanical strength, electrical insulation properties, heat resistance, water resistance, and chemical resistance.
- the cured epoxy resin has low rupture toughness and can exhibit very brittle properties, which are often problematic in a wide range of applications.
- a rubber component has been conventionally compounded in an epoxy resin.
- a method of blending rubbery polymer particles prepared in advance into particles using a polymerization method in an aqueous medium typified by emulsion polymerization, dispersion polymerization, and suspension polymerization is, for example, non-epoxy resin.
- a method of pulverizing a solidified product of a rubber-like polymer latex and then mixing it with an epoxy resin for example, Japanese Patent Application Laid-Open No. 5-29 5 2 3 7 and Japanese Patent No. 2 7 5 1 0 7 1)
- the rubber-like polymer is separated from water by taking it out as a coagulated product, but the handling and mixing process with the epoxy resin is complicated and industrially preferred. It ’s not good. Furthermore, when the rubber-like polymer is taken out as a coagulated product and then mixed and redispersed in the epoxy resin, the rubber-like polymer is contained in the epoxy resin even if a powder dispersion operation using a considerable mechanical shearing force is used. It is difficult to redisperse the polymer particles in the form of primary particles.
- the present invention provides a method for obtaining a rubber-modified epoxy resin composition in which rubber-like polymer particles are blended with an epoxy resin, and without removing the rubber-like polymer particles obtained in the form of an aqueous latex as a coagulated product, the water is removed in a rubber-like manner.
- An object is to provide a simple and efficient method capable of simultaneously removing impurities such as an emulsifying agent.
- the present invention relates to a method for producing an epoxy resin composition in which rubber-like polymer particles (B) are stably dispersed and mixed in an epoxy resin (A), and an aqueous latex of rubber-like polymer particles (B).
- an organic medium (C) that is partially soluble in water
- the aqueous layer is substantially separated from the rubber-like polymer particles (B) by contacting an organic medium (D) having a partial solubility in water of less than (C), and the resulting rubber-like polymer particles are obtained.
- the modified epoxy resin composition can be easily and efficiently modified by mixing the dispersion (F) composed of the polymer (B) and the mixed organic medium (C) and (D) with the epoxy resin (A) and removing volatile components. This is a manufacturing method for obtaining a product.
- the dispersion (F) with the epoxy resin (A) before mixing the dispersion (F) with the epoxy resin (A), it is preferable to contact and wash with water at least once. After contacting the aqueous latex of the polymer particles (B) with an organic medium (C) that is partially soluble in water and before contacting with the organic medium (D) at least once Contacting is a more preferred embodiment.
- the solubility of water in an organic medium (C) that exhibits partial solubility in water is preferably 9 to 40% by weight, and the organic medium (C) and the organic medium (D) are both two-component systems. A combination that does not form a boiling mixture is preferred.
- the polymer particles (B) in the production method of the present invention are one or more monomers selected from the group consisting of a gen-based monomer and a (meth) acrylic acid ester monomer.
- Rubber particle core composed of less than 50% by weight of a copolymerizable bur monomer, polysiloxane rubber-based elastic body, or a mixture thereof (B-1) 5 0-9 5 weight against 0/0, (meth) acrylic acid esters, aromatic Bulle, vinyl cyanide, unsaturated acid derivatives, (meth) acrylamide derivative conductor and one or more monomers selected from the group consisting of maleimide derivative It is preferably obtained by graft polymerization of 5 to 50% by weight of a shell layer (B-2) consisting of a body, and further, a shell layer (B-2) of rubber-like polymer particles (B).
- Epoxy during curing reaction Shi and more preferably contains as a constituent a monomer reactive with the resin or the curing agent.
- the aqueous latex of the rubber-like polymer particles (B) is contact-mixed with water and an organic medium (C) having partial solubility, and then the solubility of water is lower than that of (C).
- the rubber-like polymer particles (B), the organic medium (C) and the organic matter obtained by substantially separating the aqueous layer from the rubber-like polymer particles (B) by contacting and mixing the organic medium (D).
- This relates to the dispersion (F) comprising the medium (D).
- the present invention also relates to an epoxy resin composition obtained by the method for producing the epoxy resin composition, and further relates to a cured molded product obtained by curing the epoxy resin composition using a curing agent. .
- the present invention is a production method for obtaining an epoxy resin composition in which rubber-like polymer particles (B) are stably dispersed in an epoxy resin (A). More specifically, it is a production method in which the rubbery polymer (B) obtained in the state of an aqueous latex is simply and efficiently mixed and dispersed in the epoxy resin (A).
- the epoxy resin composition obtained by the present invention is an epoxy composition that is well dispersed in the liquid polymer (A) having rubber-like polymer particles (B) and an epoxy group.
- the epoxy resin (A) used in the present invention is a prepolymer having an epoxy group.
- the epoxy resin that can be used in the present invention is an epoxy resin also called a polyepoxide.
- diglycidyl ether of bisphenol A novolac type epoxy resin, tri- or tetrafunctional epoxy resin, and high molecular weight epoxy resin (for example, diglycidyl ether of bisphenol A polymerized with bisphenol A Or a homopolymer or copolymer obtained by polymerizing an unsaturated monoepoxide (for example, glycidyl (meth) acrylate, allylicaldyl ether).
- polyepoxide used in the present invention examples include polyalcohol and polyhydric phenol daricidyl ether, polyglycidylamine, polyglycidyl amide, polyglycidyl imide, polydaricidyl hydantoin, polydaricidyl thioether, epoxidized fatty acid or epoxy. Dry oils, epoxidized polyolefins, epoxidized unsaturated polyesters, and mixtures thereof. Many polyepoxides synthesized from polyhydric phenols are disclosed, for example, in U.S. Pat. No. 4,431,782.
- Polyepoxides are synthesized from monovalent, divalent, and trivalent phenols, including nopolac resins.
- Polyepoxides include polyepoxides based on polymers and copolymers of glycidyl (meth) atalylate and allylic glycidyl ether, in addition to epoxidized cycloolefin. Examples of suitable polyepoxides are further described in U.S. Pat. Nos. 3,840,735, 3,892,819, 3,944, No. 6 9 8 specification, No. 4, 0 1 4, 7 7 1 specification And those disclosed in the “Epoxy Resin Handbook” (Nikkan Kogyo Shimbun, 1987).
- the polyepoxide used in the present invention is as described above, but generally, one having an epoxy equivalent (EpoxyEquivarentweight) of 80 to 2000 can be mentioned.
- EpoxyEquivarentweight 80 to 2000 can be mentioned.
- These polyepoxides can be obtained by a well-known method, but as a commonly used method, for example, an excess amount of epihalohydrin is reacted with a polyhydric alcohol or polyhydric phenol in the presence of a base. It is obtained by.
- the polyepoxide used in the present invention may contain a monoepoxide as a reactive diluent, for example, an aliphatic glycidyl ether such as butyldaricidyl ether, phenyldaricidyl ether, or glycidyl glycidyl ether.
- a monoepoxide affects the stoichiometry of the polyepoxide formulation, but this adjustment is made by the amount of curing agent or other well-known methods.
- A) may contain a curing agent for the epoxy group-containing compound and Z or a curing accelerator. However, under the production conditions in the present invention, a substantially unintended curing reaction with an epoxy resin is caused.
- the rubber-like polymer particles (B) include a rubber particle core (B-1) composed of an elastomer or a polymer mainly containing a rubber-like polymer, and A core-shell type polymer composed of a shell layer (B-2) composed of a graft-polymerized polymer component is preferred.
- the polymer constituting the rubber particle core (B-1) is crosslinked, and the polymer constituting the rubber particle core (B-1) can swell in an appropriate solvent but does not substantially dissolve.
- Rubber particle core (B-1) is insoluble in epoxy resin (A).
- the gel content of the rubber particle core (B-1) is 60% by weight or more, preferably 80% by weight or more, more preferably 90% by weight or more, and further preferably 95% by weight or more.
- the glass transition temperature (Tg) of the polymer composing the rubber particle core (B-1) is o ° c or less, preferably 1 o ° c or less.
- the polymer constituting the rubber particle core (B-1) is at least one monomer selected from the group consisting of a gen-based monomer (conjugated gen-based monomer) and a (meth) acrylic acid ester-based monomer body 5 0 wt% or more, and other copolymerizable Bulle monomer 5 0 weight rubber elastic body composed of less than 0, polysiloxane rubber type elastic body, it is preferable to use a child these.
- (meth) acryl means acryl and / or methacryl.
- Examples of the conjugated gen monomer constituting the rubber elastic body include butadiene.
- (meth) acrylic acid ester monomer examples include butyric acrylate, 2-ethylhexyl acrylate, lauryl methacrylate, and the like, but plutyl acrylate and 2-ethylhexyl acrylate are particularly preferable. These can be used alone or in combination of two or more.
- Conjugated monomer-based monomer (meth) The amount of at least one monomer selected from the group consisting of acrylate monomers is preferably based on the total weight of the rubber elastic body. Is 50% by weight or more, more preferably 60% by weight or more. When the amount of the monomer used is less than 50% by weight, the toughness improving effect of the epoxy resin composition of the present invention tends to decrease.
- the rubber elastic body may be a copolymer of a conjugated monomer monomer or a (meth) acrylic acid ester monomer and a butyl monomer copolymerizable therewith.
- the vinyl monomer copolymerizable with the conjugation monomer or the (meth) acrylate monomer is selected from the group consisting of an aromatic bur monomer and a vinyl cyanide monomer.
- Monomer. Examples of the aromatic bur monomer include styrene, ⁇ -methyl styrene, and urnaphthalene, and examples of the vinyl cyanide monomer include (meth) acrylonitrile and substituted acrylonitrile. These can be used alone or in combination of two or more.
- the amount of these copolymerizable vinyl monomers used is preferably less than 50% by weight, more preferably 4%, based on the total weight of the rubber elastic body. Less than 0% by weight.
- a multifunctional monomer may be included as a component constituting the rubber elastic body in order to adjust the degree of crosslinking.
- the polyfunctional monomer include dibutene benzene, butanediol di (meth) acrylate, (iso) triallyl cyanurate, (meth) allyl acrylate, diaryl itaconate, and diaryl phthalate.
- the amount of the polyfunctional monomer used is 10% based on the total weight of the rubber elastic body. / 0 or less, preferably 5 weight. / 0 or less, more preferably 3% by weight or less. When the amount used exceeds 10% by weight, the toughness improving effect of the epoxy resin composition of the present invention tends to decrease.
- a chain transfer agent may be used to adjust the molecular weight and the degree of crosslinking of the polymer constituting the rubber elastic body, and examples thereof include alkyl mercabtan having 5 to 20 carbon atoms.
- the amount of the chain transfer agent used is 5% by weight or less, preferably 3% by weight based on the total weight of the rubber particle core (B-1). / 0 or less.
- the amount of the chain transfer agent used exceeds 5% by weight, the amount of the unbridged component of the rubber particle core (B-1) increases, and the epoxy resin obtained by using the epoxy resin composition of the present invention This is not preferable because it may adversely affect the heat resistance and rigidity of the cured product.
- the rubber particle core (B-1) it is also possible to use a polysiloxane rubber-based elastic body in place of or in combination with the rubber elastic body.
- a polysiloxane rubber-based elastic body is composed of alkyl or aryl disubstituted silyloxy units such as dimethylsilyloxy, methylphenylsilyloxy, diphenylsilyloxy, etc.
- Polysiloxane rubber can be used.
- a polyfunctional alkoxysilane compound is partially used at the time of polymerization, or a silane compound having a vinyl reactive group is allowed to undergo a radical reaction. Therefore, it is more preferable to introduce a crosslinked structure in advance.
- the shell layer (B-2) gives affinity to the epoxy resin so that the rubber-like polymer particles (B) are stably dispersed in the state of primary particles in the epoxy resin.
- the polymer constituting the shell layer (B-2) is graft-polymerized to the polymer constituting the rubber particle core (B-1), and is substantially bonded to the polymer constituting the rubber particle core (B-1). doing.
- Preference for the polymer constituting the shell layer (B— 2) Or 70% by weight, more preferably 80% by weight or more, and still more preferably 90% by weight. It is desirable that more than 0 is bonded to the rubber particle core (B-1).
- the shell layer (B-2) preferably has swelling property, compatibility or affinity for the organic medium (C) and the epoxy resin (A) described later. Further, the shell layer (B-2) may contain a monomer having reactivity with the epoxy resin (A) or the curing agent to be combined at the time of use depending on the necessity at the time of use. .
- the functional group of the reactive monomer contained in the shell layer (B-2) is epoxy resin (A) or cured under the conditions that the epoxy resin (A) reacts with the curing agent and cures. Those that can chemically react with the agent to form a bond are preferred.
- the polymer constituting the shell layer (B-2) is a polymer or copolymer obtained by copolymerizing one or more components selected from (meth) alkyl acrylate esters, aromatic biell compounds, and cyanide bur compounds.
- a polymer is preferred because it is easily available and has an affinity for the organic solvent (c).
- the chemical reactivity of the shell layer (B_2) when curing the epoxy resin is required, in addition to (meth) acrylic acid alkyl ester, aromatic bur compound or vinyl cyanide compound, hydroxy Alkyl (meth) acrylates, aminoalkyl (meth) acrylates, (meth) acrylates having reactive side chains such as epoxy alkyl (meth) acrylates, epoxy alkyl butyl ethers, unsaturated acid derivatives, ( It is preferable that it is composed of at least one monomer selected from the group consisting of (meth) acrylamide derivatives and opi maleimide derivatives from the viewpoint of high reactivity with an epoxy group or an epoxy curing agent.
- Examples of the (meth) acrylic acid alkyl ester include (meth) methyl acrylate, (meth) ethyl acrylate, (meth) acrylic acid butyl, (meth) acrylic acid 2_ethylhexyl, and the like.
- Examples of the aromatic vinyl include styrene and ⁇ -methylstyrene.
- Examples of cyanide bur include (meth) acrylonitrile.
- Examples of (meth) acrylic acid esters having a reactive side chain include (meth) acrylic acid 2-hydroxychetyl, (meth) acrylic acid 2-aminoethyl, (meth) glycidyl acrylate, and the like.
- Epoxy alkyl vinyl One example is glycidyl butyl ether.
- Examples of the unsaturated acid derivative include ⁇ , 3-unsaturated acid, ⁇ , i3-unsaturated acid anhydride, (meth) acrylic acid, itaconic acid, and crotonic acid.
- Examples of (meth) acrylamide derivatives include (meth) acrylamide (including N-substituents).
- Examples of the maleic acid derivative include maleic anhydride and maleic acid imide. These can be used alone or in combination of two or more.
- the preferred rubber particle core (B-1) Z shell layer (B-2) ratio (weight ratio) of the rubber-like polymer particles (B) is in the range of 50 0 50-95 / 5, more preferably Is from 6 0/4 0 to 9 0 1 0.
- the ratio of (B-1) / (B-2) goes out of 50/50 and the ratio of rubber particle core (B-1) decreases, the toughness improving effect of the epoxy resin composition of the present invention decreases.
- the ratio of the shell layer (B-2) falls outside 9/5/5, it tends to agglomerate during handling in the production method of the present invention, causing problems in operability, and the expected physical properties may not be obtained. is there.
- the rubber-like polymer particles (B) can be produced by a known method such as emulsion polymerization, suspension polymerization, and microsuspension polymerization. Of these, the production method by emulsion polymerization is particularly suitable.
- an aqueous latex that does not impair the emulsification stability even if the pH of the aqueous latex is neutral.
- alkyl or aryl sulfonic acid such as dioctyl sulfosuccinic acid or dodecyl benzene sulfonic acid, alkyl or aryl ether sulfonic acid, alkyl or aryl hydrocarbon such as dodecyl sulfuric acid, etc.
- Nonionic emulsifiers or dispersants such as alkali metal salts or ammonium salts of various acids such as alkyl or aryl carponic acid, alkyl or aryl ether carboxylic acid, and alkyl or aryl substituted polyethylene glycol Polyvinyl alcohol, alkyl substituted cellulose, poly Binirupirori pyrrolidone, polyacrylic Examples thereof include dispersants such as acid derivatives. These can be used alone or in combination of two or more.
- the aqueous layer has a property of being extracted and washed to a residual amount that does not affect the physical properties of the produced epoxy resin composition. preferable.
- the particle size of the rubber-like polymer particles (B) is not particularly limited, and the rubber-like polymer particles (B) can be stably obtained in an aqueous latex state.
- an average particle size of about 0.03 to 2 ⁇ m is preferable from the viewpoint of easy production. Is more preferably about 0.05 to 1 ⁇ .
- the content of the rubber-like polymer particles ( ⁇ ) is not particularly limited.
- the obtained epoxy resin composition can be used as a so-called masterbatch that is diluted with an epoxy resin so as to have a desired amount of rubber-like polymer particles ( ⁇ ).
- the epoxy resin used for the dilution may be the same as the epoxy resin ( ⁇ ) of the composition or may be a different type as required.
- the content of the rubber-like polymer particles ( ⁇ ) is 0.5 ⁇
- 8 0 wt% is exemplified, preferably 1-7 0% by weight, more preferably from 3 to 6 0 wt%, preferably in more 3 to 5 0 wt 0/0.
- the rubber-like polymer particles (beta) to zero.
- the organic medium (C) having partial solubility in water used in the present invention when the aqueous latex of the rubber-like polymer particles ( ⁇ ) is brought into contact with the organic medium (C), the rubber-like weight is used. It is necessary to be an organic medium in which mixing is achieved without the coalesced particles (B) being solidified and precipitated.
- the organic medium showing partial solubility in water (C) used in the present invention is at least one or more organic solvents or mixtures thereof, preferably, the water to the organic medium body in 2 5 D C (C)
- Examples of preferred organic medium (C) include esters such as methyl acetate, ethyl acetate, propyl acetate, and butyl acetate, ketones such as acetone, methyl ethyl ketone, jetyl ketone, and methyl isobutyl ketone, ethanol, ( Iso) Alcohols such as propanol and butanol, Tetrahydrofuran, Tetrahydropyran, Di-xane, Acetates / Les such as Jeti / Leete / Le, Aromatic hydrocarbons such as Benzene, Tolylene, Xylene, Methylene chloride, Black mouth Examples thereof include one or more organic solvents selected from halogenated hydrocarbons such as form or the like, or a mixture thereof, wherein the water solubility satisfies the above range.
- methyl ethyl ketone is preferably 50% by weight or more, more preferably 75% by weight. Particularly preferred is a mixture of
- the amount of the organic medium (C) may vary depending on the type of the rubbery polymer particles (B) or the amount of (B) contained in the aqueous latex of the rubbery polymer particles (B). Is 50 to 3500 parts by weight, more preferably 70 to 2500 parts by weight, and even more preferably 50 to 20 parts by weight with respect to 100 parts by weight of the latex of the rubber-like polymer particles (B). 0 parts by weight. If the amount of organic medium (C) is less than 50 parts by weight, depending on the type of organic medium (C), the amount of organic medium (C) forming the organic medium layer will be small, making it difficult to handle the organic medium layer. Tend to be. When exceeding 3 50 parts by weight, organic Production efficiency decreases due to an increase in the amount of solvent (C) removed.
- the organic medium (D) having a partial solubility in water of less than (C) preferably has a water solubility in the organic medium (D) at 25 ° C of preferably 8 wt% or less, more preferably 6 wt% or less,
- the organic solvent is preferably 4% by weight or less, or a mixture of two or more organic solvents. If the solubility of water in the organic medium (D) is 9% by weight or more, the effect of promoting the separation of the organic layer and the aqueous layer may be insufficient.
- Preferred organic media (D) include esters such as ethyl acetate, propyl acetate and butyl acetate, ketones such as jetyl ketone and methyl isobutyl ketone, ethereal such as jetino ether and butyl etherol, and aromatics such as benzene, toluene and xylene.
- esters such as ethyl acetate, propyl acetate and butyl acetate
- ketones such as jetyl ketone and methyl isobutyl ketone
- ethereal such as jetino ether and butyl etherol
- aromatics such as benzene, toluene and xylene.
- the solubility of water selected from hydrocarbons, aliphatic hydrocarbons such as hexane, halogenated hydrocarbons such as methylene chloride, black mouth form, etc. satisfies the above range
- One or more organic solvents or a mixture thereof.
- the organic medium (D) can be used in an amount within a range effective to promote separation of the organic medium layer and the aqueous layer.
- the organic medium (C) to be used is 100 parts by weight, 20 to 100 parts by weight, more preferably 50 to 400 parts by weight, and still more preferably 50 to 20 parts by weight. 0 parts by weight. If the amount is less than 20 parts by weight, the effect of promoting the separation of the organic layer and the aqueous layer tends to be unsatisfactory. If the amount exceeds 100 parts by weight, the removal amount of the organic medium increases, resulting in an increase in production efficiency. descend.
- a combination of the organic medium (C) and the organic medium (D) in addition to the above-mentioned requirements, a combination in which (C) and (D) are a two-component system and does not substantially exhibit azeotrope, Is more preferable from the viewpoint of facilitating the recovery, separation and reuse of the organic medium.
- Examples of such a combination include a combination of methyl ethyl ketone and methyl isobutyl ketone, but the present invention is not limited to this.
- the rubber-like polymer particles (B) obtained in the form of an aqueous latex are removed from the rubber-like polymer particles (B) without removing them as a coagulated product. Is separated efficiently and then mixed with the epoxy resin (A). Specifically, from the so-called aqueous latex state in which the rubber-like polymer particles (B) are dispersed in the aqueous layer, the rubber-like polymer particles (B) are separated into two kinds of organic media (C). And (D) are taken out as a dispersion (F) stably dispersed in a layer (hereinafter referred to as a mixed organic medium layer) and then mixed with the epoxy resin (A).
- a dispersion (F) stably dispersed in a layer hereinafter referred to as a mixed organic medium layer
- two kinds of organic media (C) and (D) having different partial solubility in water satisfying the requirements of the present invention are sequentially added to the aqueous latex of rubber-like polymer particles (B) according to the method of the present invention.
- the mixture is quickly divided into two layers, a layer mainly composed of organic media (C) and (D) (mixed organic medium layer) and a layer mainly composed of water (hereinafter referred to as an “aqueous layer”).
- aqueous layer a layer mainly composed of water
- aqueous layer a layer mainly composed of water
- the rubber-like polymer particles (B) derived from the force latex.
- a mixture hereinafter referred to as the mixture (E)
- water derived from the aqueous latex of the rubber-like polymer particles (B) forms an aqueous layer in the mixture (E), but at least a part of the aqueous layer or in some cases substantially large.
- the part is emulsified and dispersed in a layer mainly composed of an organic medium (C) from which the rubber-like polymer particles (B) are extracted, and the mixed water is separated even after standing for a long time. Is difficult.
- the hydrophobicity of the mixed organic medium layer formed by mixing the organic medium (C) and the organic medium (D) is increased, and the mixture ( E) Rubber-like polymer particles that were emulsified and dispersed in a layer mainly composed of the organic medium (C)
- B) Water derived from the latex is removed to the aqueous layer, and further into the mixed organic medium layer A part of the aqueous layer is emulsified and dispersed again, or the mixed organic medium layer is emulsified and dispersed in the aqueous layer.
- the mixed organic medium layer thus obtained that is, the dispersion (F) composed of the mixed organic medium of the rubber-like polymer particles (B) and the organic medium (C) and (D), is organic
- the rubbery polymer (B) is present in a stably dispersed state in the mixed organic medium of the media (C) and (D).
- the rubber-like polymer particles (B) are substantially dispersed as primary particles in the dispersion (F).
- the amount of the rubber-like polymer particles (B) contained in the aqueous layer separated by such an operation is preferably 5% by weight or less based on the total amount of the rubber-like polymer particles (B). preferably 3 wt 0/0 or less, and most preferably is a state in which the rubber-like polymer particles (beta ') is not included in the substantive.
- the aqueous latex of rubber-like polymer particles ( ⁇ ) was mixed with a more hydrophobic organic medium (D) before contacting the organic medium (C) with partial solubility with water. In this case, it is not possible to obtain a mixture ( ⁇ ) in which the rubber-like polymer particles ( ⁇ ) are extracted in an organic medium containing the organic medium (D) as a main component.
- the contact in the operation so far is not only the contact between the aqueous latex of the rubber-like polymer particles ( ⁇ ) and the organic medium (C), or the mixture ( ⁇ ) and the organic medium (D), but also gently.
- the mixing of the two under a proper stirring condition may be included, and a special apparatus or method is not necessary, as long as the apparatus or method can obtain a good mixing state.
- the dispersion (F) obtained by performing such an operation is mixed with the epoxy resin ( ⁇ ).
- This mixing can be easily accomplished and can be carried out in a known manner without the use of special equipment or methods. For example, it can be carried out by a method and conditions used when dissolving an epoxy resin in an organic solvent.
- the rubber-like polymer particles ( ⁇ ) do not cause irreversible aggregation, and the rubber-like polymer particles ( ⁇ ) are well dispersed before and after mixing with the epoxy resin ( ⁇ ). Is maintained.
- the rubber-like polymer particles ( ⁇ ) are maintained in a state of being substantially dispersed independently with primary particles before and after mixing with the epoxy resin ( ⁇ ).
- the epoxy of the rubber-like polymer particles ( ⁇ ) is obtained.
- the desired epoxy resin composition can be obtained while maintaining a good dispersion state in the resin ( ⁇ ).
- a batch method in which the mixture is charged in a tank and heated to distill off volatile components under normal pressure or reduced pressure a method in which a dry gas is brought into contact with the mixture in the tank, and a continuous type using a thin film evaporator
- the present invention is not limited to these methods, an extruder equipped with a devolatilizer, or a method using a continuous stirring tank.
- Conditions such as temperature and required time for removing the volatile components can be appropriately selected within a range in which the epoxy resin (A) does not react or deteriorate the quality.
- the organic medium (C) and (D) can be used as they are without being removed.
- the rubber-like polymer particles (B) did not agglomerate and dispersed well in the remaining organic medium (C) and (D) mixed organic medium in the solution in which the epoxy resin (A) was dissolved.
- the state can be obtained.
- the amount of the organic medium (C) and (D) remaining in the epoxy resin composition can be appropriately selected within the range where there is no problem depending on the purpose of use of the epoxy resin composition.
- an epoxy resin (A) such as an emulsifier
- Substance components can be easily removed.
- the obtained dispersion (F) is washed with water at least once before being mixed with the epoxy resin (A), so that the contaminant (F) is removed from the dispersion (F). Components can be reduced or removed by extraction into the aqueous layer.
- the temperature at which the organic medium (C) is mixed with the rubber-like polymer particles (B) can change the partial solubility in water depending on the type of the organic solvent (C). Therefore, it is necessary to set in a range that does not impair the effects of the present invention. In addition, by utilizing such a property, it is possible to make the separation of the organic layer and the aqueous layer into a preferable state by appropriately setting the temperature.
- the rubber-like polymer particles (B) are mixed with the epoxy resin (A).
- the rubber-like polymer particles (B) can be efficiently taken out as a stable dispersed dispersion (F) in an organic medium without isolation as a coagulated product. Therefore, the rubber-like polymer particles (B) can be dispersed in the epoxy resin (A) while maintaining a good dispersion state.
- the amount of water to be separated from the mixture of epoxy resin (A) and rubber-like polymer particles (B) can be significantly suppressed as compared with the conventional method, which is advantageous in terms of production efficiency.
- the epoxy resin composition produced by the method of the present invention as described above can be used for paints, coating agents, aircraft parts and sports equipment, fibers such as structural materials, fillers, reinforced composite materials, adhesives, fixing materials, and semiconductor encapsulation.
- epoxy resins are usually used, such as agents and electronic materials such as electronic circuit boards, for example, by using part or all of the epoxy resin used as the composition of the present invention, It is possible to obtain an excellent cured molded product that is excellent in stability of the dispersion state of the rubber-like polymer particles (B) in the epoxy resin composition and in the cured product and has few impurities. it can.
- the amount of methanol-insoluble component was quantified, This was defined as the amount of the rubber-like polymer particle (B) component contained in the aqueous layer.
- 25 g of the epoxy resin composition obtained in each of the examples and comparative examples was mixed with 75 g of the same epoxy resin (Epicoat 821), and then 6 g of piberidine (manufactured by Tokyo Chemical Industry Co., Ltd.) as a curing agent. Stir and mix. This mixture was allowed to stand in a vacuum dryer and defoamed for 10 minutes under a nitrogen atmosphere and then at 60 ° C. under reduced pressure. This mixture was cast into a 100 ⁇ 150 ⁇ 3 mm size mold and then cured at 120 ° C. for 16 hours to obtain a cured molded product.
- Particle dispersion is 90% or more.
- the total number of rubber-like polymer particles (B) was selected by randomly selecting four areas at 5 cm square. And the number of rubber-like polymer particles (B) in which three or more are in contact (if one rubber-like polymer particle (B) is in contact with n, the number is n
- the particle dispersion ratio (%) (1 (B / BQ)) X 100 calculated by the following formula.
- the amount of residual emulsifier remains in the dispersion (F) before mixing with the epoxy resin (A).
- the amount of the emulsifier was measured by the following analysis method, and the ratio was expressed as a ratio (% by weight) when the total amount of the emulsifier used for the polymerization of the rubber-like polymer particles (B) was 100% by weight.
- the alkaline sodium borate solution was prepared by mixing a sodium tetraborate decahydrate 1.9% aqueous solution 50 Om 1 with a 0.4% sodium hydroxide solution 500 m 1.
- Mechiruechi ketone as the organic medium (C) component (hereinafter referred to as ME K: Solubility of water in 25 ° C, 11 weight 0/0) takes 500 g 420 g of an aqueous latex of rubber-like polymer particles (B) obtained in Production Example 1 was added and stirred. While stirring the resulting mixture (E) of the rubber-like polymer particles (B) and the organic medium (C), methyl isobutyl ketone (hereinafter referred to as MI BK: 25 ° C) is used as the organic medium (D). 450 g of water solubility (2% by weight) was added. Water separation from the mixed organic media layer was observed.
- ME K Solubility of water in 25 ° C, 11 weight 0/0
- the dispersion (F) obtained was mixed with 340 g of epoxy resin (A) (Japan Epoxy Resin Co., Ltd., Epicoite 828), and the volatile matter was reduced in pressure at 80 ° C for 4 hours. Under reduced pressure, an epoxy resin composition in which rubber-like polymer particles (B) were dispersed in the epoxy resin (A) was obtained.
- the dispersion (F) and the epoxy resin (A) are mixed by shaking, and no strong mechanical stirring (stirring under high shear) is required.
- the epoxy value (EEW) was 245 gZe q.
- Example 1 500 g of methyl ethyl ketone (MEK) as an organic medium (C) was placed in a 3 L glass container kept at 25 ° C, and 420 g of rubber latex polymer particles (B) obtained in Production Example 1 And stirred. While stirring the resulting mixture (E), 450 g of MEK was added again. After adding ME K, 210 g of water was added and stirred. Stirring was stopped and the mixture was allowed to stand for 30 minutes. Unlike Example 1, almost no water layer was formed, and the organic medium layer was emulsified, and it was observed that it contained a large amount of water. It can be seen that the water separation effect is worse than the corresponding Example 1.
- MEK methyl ethyl ketone
- Example 1 The same operation as in Example 1 was performed, and an attempt was made to obtain an epoxy resin composition in which the rubber-like polymer particles (B) were mixed in the epoxy resin (A). However, the epoxy resin was not removed without removing a large amount of water. The objective epoxy resin composition as in Example 1 was not obtained.
- the obtained dispersion (F) was mixed with 204 g of epoxy resin (Epicoat 828) in the same manner as in Example 1, and then the volatile component was distilled off under reduced pressure to obtain an epoxy resin composition.
- the rubber-like polymer particles (B) were uniformly dispersed without aggregation.
- the amount of the remaining emulsifier in the dispersion (F) is 49% with respect to the amount of the emulsifier added during the production of the rubber-like polymer particles (B) latex. /. Met.
- a 1 L mixing tank maintained at 25 ° C was charged with 340 g of methylisoptyl ketone (water solubility at 2.0 ° C, 2.0 wt%) as an organic medium, and stirred with a three-stage paddle blade.
- the aqueous latex 252 g of the rubber-like polymer particles (B) obtained in Production Example 1 was mixed.
- To this was added 126 g of water and stirred. After the stirring was stopped, separation of the MI BK layer and the aqueous layer was confirmed, but there was no rubber-like polymer particles (B) in the MI BK layer, and rubber-like polymer particles (B) in the MI BK layer.
- a 1 L mixing tank maintained at 25 ° C is charged with 340 g of acetone (which is a water-soluble solvent and mutually soluble in water at an arbitrary ratio, that is, the solubility of water at 25 ° C is ⁇ ). While stirring with a three-stage paddle blade, 252 g of an aqueous latex of rubber-like polymer particles (B) obtained in Production Example 1 was added. The rubber-like polymer particles (B) were coagulated and a large number of large coagulated lumps were generated, making stirring difficult.
- acetone which is a water-soluble solvent and mutually soluble in water at an arbitrary ratio, that is, the solubility of water at 25 ° C is ⁇ .
- the aqueous layer at this time did not contain rubber-like polymer particles (B).
- 400 g of water was added to the dispersion (F) and mixed. After standing for 60 minutes, the aqueous layer was discharged to obtain dispersion (F). The water layer at this time did not contain rubber-like polymer particles (B).
- the obtained dispersion (F) was mixed with 204 g of an epoxy resin (Epicoat 828) in the same manner as in Example 1, and then the volatile component was distilled off under reduced pressure to obtain an epoxy resin composition.
- an epoxy resin Epoxy resin
- the rubber-like polymer particles (B) were uniformly dispersed without aggregation.
- the residual emulsifier in (F) was 26% by weight based on the emulsifier added in the latex.
- methyl ethyl ketone (MEK) was added to a 1 L mixing tank kept at 25 ° C., and the rubber-like polymer particles obtained in Production Example 1 (B ) was mixed with 252 g of aqueous latex, and stirring was stopped. 126 g of water was added and stirred. To the resulting mixture (E), 400 g of methyl isopropyl ketone as an organic medium (D) was added and stirred. Stirring was stopped and the mixture was allowed to stand for 30 minutes, and then the aqueous layer was discharged to obtain a dispersion (F). The aqueous layer at this time did not contain rubber-like polymer particles (B).
- MEK methyl ethyl ketone
- the obtained dispersion (F) was mixed with 204 g of an epoxy resin (Epicoat 828) in the same manner as in Example 1, and then the volatile component was distilled off under reduced pressure to obtain an epoxy resin composition.
- an epoxy resin Epoxy resin
- the rubber-like polymer particles (B) were uniformly dispersed without aggregation.
- the amount of the remaining emulsifier in the dispersion (F) was 32% by weight with respect to the amount of the emulsifier added during the production of the rubber-like polymer particles (B) latex.
- the obtained dispersion (F) was mixed with 204 g of an epoxy resin (Epicoat 828) in the same manner as in Example 1, and then the volatile component was distilled off under reduced pressure to obtain an epoxy resin composition.
- an epoxy resin Epoxy resin
- the rubber-like polymer particles (B) were uniformly dispersed as primary particles without aggregation.
- the amount of the remaining emulsifier in the dispersion (F) was 10% by weight with respect to the amount of the emulsifier added during the production of the rubber-like polymer particles (B) latex.
- the epoxy value (EEW) was 248 g / e q.
- methyl ethyl ketone (MEK) was added to a 1 L mixing tank kept at 25 ° C., and the rubber-like polymer particles obtained in Production Example 1 (B ) was mixed with 252 g of aqueous latex, and stirring was stopped. 126 g of water was added and stirred. While stirring the obtained organic layer (E), 400 g of ethyl acetate (water solubility at 25 ° C., 3.4% by weight) as component (D) was added and stirred. After standing for 30 minutes, the aqueous layer was discharged and separated from the dispersion (F). The water layer at this time did not contain rubber-like polymer particles (B). Dispersion (F) Leave for 30 minutes Thereafter, the aqueous layer was discharged and separated from the dispersion (F). The water layer at this time also did not contain rubbery polymer particles (B).
- MEK methyl ethyl ketone
- the obtained dispersion (F) was mixed with 204 g of an epoxy resin (Epicoat 828) in the same manner as in Example 1, and then the volatile component was distilled off under reduced pressure to obtain an epoxy resin composition.
- an epoxy resin Epoxy resin
- the rubber-like polymer particles (B) were uniformly dispersed as primary particles without aggregation.
- the amount of the remaining emulsifier in the dispersion (F) was 32% by weight based on the amount of the emulsifier added during the production of the rubber-like polymer particles (B) latex.
- Dispersion state of body particles (B) INDUSTRIAL APPLICABILITY
- a rubber-modified epoxy resin composition having a good dispersion state of rubber-like polymer particles (B) and having few impurities and excellent quality can be obtained simply and easily. It becomes possible to manufacture efficiently.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2526461A CA2526461C (en) | 2003-06-09 | 2004-05-27 | Process for producing modified epoxy resin |
EP04735123.4A EP1632533B1 (en) | 2003-06-09 | 2004-05-27 | Process for producing modified epoxy resin |
PL04735123T PL1632533T3 (pl) | 2003-06-09 | 2004-05-27 | Sposób wytwarzania modyfikowanej żywicy epoksydowej |
US10/558,759 US8222324B2 (en) | 2003-06-09 | 2004-05-27 | Process for producing modified epoxy resin |
ES04735123T ES2412804T3 (es) | 2003-06-09 | 2004-05-27 | Procedimiento para producir resina epoxi modificada |
JP2005506770A JP4668788B2 (ja) | 2003-06-09 | 2004-05-27 | 変性エポキシ樹脂の製造方法 |
US13/372,231 US8680180B2 (en) | 2003-06-09 | 2012-02-13 | Process for producing modified epoxy resin |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-164416 | 2003-06-09 | ||
JP2003164416 | 2003-06-09 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10558759 A-371-Of-International | 2004-05-27 | ||
US13/372,231 Division US8680180B2 (en) | 2003-06-09 | 2012-02-13 | Process for producing modified epoxy resin |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004108825A1 true WO2004108825A1 (ja) | 2004-12-16 |
Family
ID=33508814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/007679 WO2004108825A1 (ja) | 2003-06-09 | 2004-05-27 | 変性エポキシ樹脂の製造方法 |
Country Status (11)
Country | Link |
---|---|
US (2) | US8222324B2 (ja) |
EP (3) | EP1632533B1 (ja) |
JP (1) | JP4668788B2 (ja) |
KR (1) | KR100780582B1 (ja) |
CN (1) | CN100447196C (ja) |
CA (2) | CA2789741C (ja) |
ES (1) | ES2412804T3 (ja) |
MY (1) | MY137365A (ja) |
PL (1) | PL1632533T3 (ja) |
TW (1) | TWI359843B (ja) |
WO (1) | WO2004108825A1 (ja) |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1780239A1 (en) * | 2004-08-18 | 2007-05-02 | Kaneka Corporation | Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
WO2008060545A1 (en) | 2006-11-13 | 2008-05-22 | Henkel Corporation | Benzoxazine compositions with core shell rubbers |
WO2008105189A1 (ja) * | 2007-02-28 | 2008-09-04 | Kaneka Corporation | ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法 |
WO2009014037A1 (ja) * | 2007-07-25 | 2009-01-29 | Kaneka Corporation | 樹脂組成物、および該樹脂組成物を用いた重縮合体 |
WO2009034966A1 (ja) | 2007-09-11 | 2009-03-19 | Kaneka Corporation | 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物 |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
EP2135909A1 (en) | 2008-06-12 | 2009-12-23 | Henkel Corporation | Next generation, highly toughened two part structural epoxy adhesive compositions |
US7649060B2 (en) | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
JP2010270328A (ja) * | 2009-04-24 | 2010-12-02 | Mitsubishi Rayon Co Ltd | 重合体粒子含有分散体及び重合体粒子含有樹脂組成物の製造方法 |
US7847034B2 (en) | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
JP2011026503A (ja) * | 2009-07-28 | 2011-02-10 | Kaneka Corp | ポリマー微粒子含有液状樹脂組成物、及びその製造方法 |
JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
WO2012035112A1 (en) | 2010-09-15 | 2012-03-22 | Loctite (R&D) Limited | Two-part, cyanoacrylate/cationically curable adhesive systems |
US8716377B2 (en) | 2008-05-09 | 2014-05-06 | Henkel Ag & Co. Kgaa | Polymerizable composition |
WO2014140804A2 (en) | 2013-03-15 | 2014-09-18 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
US8932718B2 (en) * | 2006-07-07 | 2015-01-13 | Valspar Sourcing, Inc. | Coating systems for cement composite articles |
US9133064B2 (en) | 2008-11-24 | 2015-09-15 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
JP2015534591A (ja) * | 2012-09-07 | 2015-12-03 | ダウ グローバル テクノロジーズ エルエルシー | 強化マスターブレンド |
JP2016199673A (ja) * | 2015-04-09 | 2016-12-01 | 株式会社カネカ | 接着性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
JP2018500440A (ja) * | 2014-12-24 | 2018-01-11 | アルケマ フランス | 多段ポリマー組成物、その調製方法、その使用及びそれを含む組成物 |
WO2019189621A1 (ja) * | 2018-03-30 | 2019-10-03 | 株式会社カネカ | 熱硬化性マトリクス樹脂に対する分散性が改善された粉粒体 |
WO2019203273A1 (ja) * | 2018-04-20 | 2019-10-24 | 株式会社カネカ | コアシェルポリマー粒子含有溶剤組成物の製造方法 |
WO2020035440A1 (en) | 2018-08-13 | 2020-02-20 | Henkel IP & Holding GmbH | A two-part cyanoacrylate curable adhesive system |
WO2020035442A1 (en) | 2018-08-13 | 2020-02-20 | Henkel Ag & Co. Kgaa | A two-part cyanoacrylate curable adhesive system |
WO2020138263A1 (ja) * | 2018-12-27 | 2020-07-02 | 株式会社カネカ | 樹脂組成物およびその利用 |
WO2020178082A1 (en) | 2019-03-04 | 2020-09-10 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
WO2020196921A1 (ja) | 2019-03-28 | 2020-10-01 | 株式会社カネカ | 樹脂組成物の製造方法および樹脂組成物 |
JP2020164561A (ja) * | 2019-03-28 | 2020-10-08 | 株式会社カネカ | 粉粒体の製造方法および粉粒体 |
US11618839B2 (en) | 2016-07-08 | 2023-04-04 | Cemedine Co., Ltd. | Structure adhesive composition exhibiting favorable thread breakage and capable of stitch coating |
WO2024003053A1 (en) | 2022-06-28 | 2024-01-04 | Henkel Ag & Co. Kgaa | Method of underwater bonding |
US11884813B2 (en) | 2017-09-06 | 2024-01-30 | Mitsubishi Chemical Corporation | Macromonomer copolymer, epoxy resin composition, adhesive, molding material, and cured product |
Families Citing this family (138)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2589583T3 (es) * | 2003-09-18 | 2016-11-15 | Kaneka Corporation | Procedimiento para producir partículas de polímero elástico y procedimiento para producir una composición de resina que las contiene |
CN101287794A (zh) | 2005-08-24 | 2008-10-15 | 亨克尔两合股份公司 | 具有改进的耐冲击性的环氧组合物 |
EP1948574B1 (en) | 2005-11-15 | 2010-01-06 | Valspar Sourcing, Inc. | Crush resistant latex topcoat composition for fiber cement substrates |
US9783622B2 (en) * | 2006-01-31 | 2017-10-10 | Axalta Coating Systems Ip Co., Llc | Coating system for cement composite articles |
CA2655125C (en) | 2006-06-02 | 2014-10-14 | Valspar Sourcing, Inc. | High performance aqueous coating compositions |
CN101517029B (zh) | 2006-07-31 | 2013-10-16 | 汉高股份及两合公司 | 可固化的环氧树脂-基粘合剂组合物 |
WO2008045270A1 (en) | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
US8088245B2 (en) | 2007-04-11 | 2012-01-03 | Dow Global Technologies Llc | Structural epoxy resins containing core-shell rubbers |
CN101679828B (zh) | 2007-04-11 | 2012-07-25 | 陶氏环球技术公司 | 耐热性结构环氧树脂 |
EP2344561B1 (en) | 2007-06-20 | 2015-07-29 | Dow Global Technologies LLC | Crash durable epoxy adhesives with very low sensitivity to temperature variations |
CN101772472B (zh) * | 2007-08-01 | 2016-04-20 | 威士伯采购公司 | 用于水泥复合制品的涂层体系 |
BRPI0814496A2 (pt) | 2007-08-17 | 2015-02-03 | Dow Global Technologies Inc | Adesivo epóxi bicomponente e método para montar um primeiro membro num segundo membro |
CA2703907C (en) | 2007-10-30 | 2016-11-01 | Henkel Ag & Co. Kgaa | Epoxy paste adhesives resistant to wash-off |
US20110003946A1 (en) * | 2008-01-18 | 2011-01-06 | Klaus-Volker Schuett | Curable reaction resin system |
JP5504266B2 (ja) * | 2008-07-29 | 2014-05-28 | ダウ グローバル テクノロジーズ エルエルシー | 自動車空孔部において強度を付与し、エネルギーを散逸させるための、強化された膨張可能なエポキシ樹脂 |
KR101562420B1 (ko) * | 2008-07-31 | 2015-10-21 | 주식회사 다이셀 | 광 반도체 밀봉용 수지 조성물과 이것을 사용한 광 반도체 장치 |
CN102119201B (zh) * | 2008-08-11 | 2013-07-03 | 陶氏环球技术有限责任公司 | 含有用酚和羟基封端的丙烯酸酯或羟基封端的甲基丙烯酸酯封端的弹性体增韧剂的单组分结构环氧树脂粘合剂 |
EP2316883B1 (en) * | 2008-08-12 | 2018-01-24 | Kaneka Corporation | Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
EP2223966B1 (en) | 2009-02-25 | 2017-08-16 | 3M Innovative Properties Company | Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
CN102333837A (zh) | 2009-02-26 | 2012-01-25 | 陶氏环球技术有限责任公司 | 包含二聚脂肪酸/环氧树脂加合物和多元醇的单组分环氧树脂结构粘合剂 |
AU2010286611B2 (en) | 2009-08-31 | 2013-07-11 | Cytec Technology Corp. | High performance adhesive compositions |
EP2496657B1 (en) | 2009-11-05 | 2016-04-27 | Dow Global Technologies LLC | Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes |
GB201005444D0 (en) | 2010-03-31 | 2010-05-19 | 3M Innovative Properties Co | Epoxy adhesive compositions comprising an adhesion promoter |
WO2012000171A1 (en) | 2010-06-29 | 2012-01-05 | Dow Global Technologies Llc | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
EP2588554B1 (en) | 2010-06-29 | 2014-11-19 | Dow Global Technologies LLC | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
BR112013010668A2 (pt) | 2010-12-26 | 2021-03-23 | Dow Global Technologies Llc | adesivo estrutural de uma parte e método de aplicação de adesivo estrutural |
GB201100568D0 (en) * | 2011-01-13 | 2011-03-02 | Cytec Engineered Materials Ltd | Particle reinforced polymer composition |
BR112013019506A2 (pt) | 2011-02-24 | 2019-09-24 | Toray Industries | estrutura, composição, pré-impregnado, interfase reforçada e método |
EP2725060A4 (en) * | 2011-06-27 | 2015-04-15 | Daicel Corp | HARDENABLE RESIN COMPOSITION FOR REFLECTING LIGHT AND OPTICAL SEMICONDUCTOR DEVICE |
JP5901994B2 (ja) * | 2012-02-23 | 2016-04-13 | 東洋ゴム工業株式会社 | ゴム用配合剤及びゴム組成物の製造方法 |
US20140378579A1 (en) * | 2012-03-12 | 2014-12-25 | Dsm Ip Assets B.V. | Thermosetting resin compositions |
WO2013141955A2 (en) | 2012-03-21 | 2013-09-26 | Dow Global Technologies Llc | Wash-off resistant epoxy and use thereof |
JP6240659B2 (ja) | 2012-03-23 | 2017-11-29 | ダウ グローバル テクノロジーズ エルエルシー | 難燃性の構造用エポキシ樹脂接着剤および金属部材を接合するためのプロセス |
WO2013151835A1 (en) | 2012-04-02 | 2013-10-10 | Dow Global Technologies Llc | Epoxy adhesive, manufacture and use thereof |
BR112014032019A2 (pt) | 2012-08-27 | 2017-06-27 | Dow Global Technologies Llc | adesivo, método para fazer um adesivo de epóxi e kit |
US9006470B2 (en) | 2012-11-08 | 2015-04-14 | Eastman Chemical Company | Method of synthesizing low color furan diesters |
US9029579B2 (en) | 2012-11-08 | 2015-05-12 | Eastman Chemical Company | Method of synthesizing low color furan diesters |
US9688891B2 (en) | 2012-12-27 | 2017-06-27 | Toray Industries, Inc. | Fiber reinforced polymer composite with a hard interphase |
EP3024871B1 (en) | 2013-07-26 | 2022-12-07 | Zephyros Inc. | Thermosetting adhesive films including a fibrous carrier |
EP3428214B1 (en) * | 2013-10-29 | 2019-09-04 | Kaneka Corporation | Polymer fine particle-containing curable resin composition having improved storage stability |
US9096733B2 (en) * | 2013-11-20 | 2015-08-04 | Zeon Chemicals L.P. | Process for producing coalesced rubber microparticles and their blends with epoxy resins |
US20160297960A1 (en) * | 2013-12-13 | 2016-10-13 | Blue Cube Ip Llc | Epoxy composition containing core-shell rubber |
KR102341570B1 (ko) | 2014-04-14 | 2021-12-22 | 다우 글로벌 테크놀로지스 엘엘씨 | 프리-겔 오븐용 에폭시 수지 조성물 |
KR102407087B1 (ko) | 2014-07-23 | 2022-06-10 | 다우 글로벌 테크놀로지스 엘엘씨 | 개선된 워시-오프 저항성을 갖는 구조용 접착제 및 이의 분배 방법 |
DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
FR3031108B1 (fr) | 2014-12-24 | 2018-08-17 | Arkema France | Composition comprenant un polymere a phases multiples, son procede de preparation et son utlisation |
FR3031109B1 (fr) | 2014-12-24 | 2018-08-17 | Arkema France | Composition de polymeres, son procede de preparation, son utilisation et composition la comprenant |
BR112017015236A2 (pt) | 2015-02-11 | 2018-01-09 | Dow Global Technologies Llc | adesivos curáveis em baixa temperatura e uso dos mesmos |
JP6624545B2 (ja) | 2015-03-31 | 2019-12-25 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、金属張積層板、絶縁シート、プリント配線板、プリント配線板の製造方法及びパッケージ基板 |
WO2016179010A1 (en) | 2015-05-01 | 2016-11-10 | Lord Corporation | Adhesive for rubber bonding |
WO2016191403A1 (en) | 2015-05-28 | 2016-12-01 | Dow Global Technologies Llc | A two part (2k) epoxy adhesive composition for bonding oily metals |
KR102641039B1 (ko) | 2015-06-02 | 2024-02-28 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 접착제용의 차단된 폴리우레탄 강화제 |
US10471655B2 (en) | 2015-09-04 | 2019-11-12 | Carbon, Inc. | Cyanate ester dual resins for additive manufacturing |
CN108291011B (zh) | 2015-09-09 | 2021-03-02 | 卡本有限公司 | 用于增材制造的环氧双重固化树脂 |
KR102626998B1 (ko) | 2015-09-10 | 2024-01-19 | 다우 글로벌 테크놀로지스 엘엘씨 | 높은 종횡비의 충전제를 갖는 높은 모듈러스의 강인화된 1성분 에폭시 구조용 접착제 |
WO2017044401A1 (en) | 2015-09-10 | 2017-03-16 | Dow Global Technologies Llc | One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance |
EP3356452A4 (en) | 2015-09-28 | 2019-08-07 | Toray Industries, Inc. | PRE-IMPREGNATED HAVING RESIN COMPOSITIONS WITH VARIABLE CURING SPEED |
CN105176003B (zh) * | 2015-10-16 | 2018-05-18 | 固德电材系统(苏州)股份有限公司 | 纳米核壳橡胶粒子增韧的环氧树脂复合物及其制备方法 |
US11891485B2 (en) | 2015-11-05 | 2024-02-06 | Carbon, Inc. | Silicone dual cure resins for additive manufacturing |
CA3005058A1 (en) | 2015-11-12 | 2017-05-18 | Zephyros, Inc. | Controlled glass transition polymeric material and method |
US10414904B2 (en) | 2015-11-12 | 2019-09-17 | The Euclid Chemical Company | Low-dust filler for composite building product |
WO2017087663A1 (en) | 2015-11-17 | 2017-05-26 | Zephyros, Inc. | Additive manufacturing materials system |
US20210197737A1 (en) * | 2015-11-30 | 2021-07-01 | Zephyros, Inc. | Adhesive resins and films for composites and tapes and methods of using the same |
US20170157715A1 (en) * | 2015-12-02 | 2017-06-08 | Bellman-Melcor Development, Llc | Brazing Ring with Spikes and Method for Securing a Brazing Ring to a Tube |
US10377928B2 (en) | 2015-12-10 | 2019-08-13 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
US10351661B2 (en) | 2015-12-10 | 2019-07-16 | Ppg Industries Ohio, Inc. | Method for producing an aminimide |
CN108475008B (zh) | 2015-12-22 | 2020-11-06 | 卡本有限公司 | 一种形成三维物体的方法 |
WO2017112521A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Production of flexible products by additive manufacturing with dual cure resins |
US10787583B2 (en) | 2015-12-22 | 2020-09-29 | Carbon, Inc. | Method of forming a three-dimensional object comprised of a silicone polymer or co-polymer |
US10647054B2 (en) | 2015-12-22 | 2020-05-12 | Carbon, Inc. | Accelerants for additive manufacturing with dual cure resins |
JP7189015B2 (ja) | 2015-12-22 | 2022-12-13 | カーボン,インコーポレイテッド | 二重硬化樹脂を用いた積層造形のための二重前駆体樹脂システム |
WO2017112571A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products |
US10815405B2 (en) | 2016-01-19 | 2020-10-27 | Dow Global Technologies Llc | One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same |
US11192344B2 (en) | 2016-01-20 | 2021-12-07 | Zephyros, Inc. | Thermoplastic epoxy materials with core shell phase |
EP3423539B1 (en) | 2016-03-02 | 2020-11-18 | 3M Innovative Properties Company | Composition including epoxy adhesive and aluminum flakes and method for making the same |
CN105910983B (zh) * | 2016-04-12 | 2018-11-16 | 北京化工大学 | 一种通过颗粒分散率定量评估复合材料层间性能的方法 |
WO2017179536A1 (ja) * | 2016-04-12 | 2017-10-19 | 株式会社カネカ | 硬化性組成物及び接着剤 |
CN106084660B (zh) * | 2016-06-21 | 2018-09-11 | 固德电材系统(苏州)股份有限公司 | 一种增韧型环氧树脂及其制备方法和应用 |
US10472474B2 (en) | 2016-06-22 | 2019-11-12 | Hexcel Corporation | Semipreg with thermoplastic toughened novolac-based epoxy resin matrix |
US10106661B2 (en) | 2016-06-22 | 2018-10-23 | Hexcel Corporation | Composite material with thermoplastic toughened novolac-based epoxy resin matrix |
US10577472B2 (en) | 2018-02-01 | 2020-03-03 | Hexcel Corporation | Thermoplastic particle-toughened prepreg for use in making composite parts which tolerate hot and wet conditions |
US20180023244A1 (en) | 2016-07-19 | 2018-01-25 | Hexcel Corporation | Composite carbon fibers |
CN110023056B (zh) | 2016-11-21 | 2021-08-24 | 卡本有限公司 | 通过递送反应性组分用于后续固化来制造三维物体的方法 |
CN106674903B (zh) * | 2016-12-29 | 2019-04-30 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及含有它的预浸料、覆金属箔层压板和印制电路板 |
JP2020508381A (ja) | 2017-02-26 | 2020-03-19 | ダウ グローバル テクノロジーズ エルエルシー | 潜在性硬化剤の混合物を含有する一液型強化エポキシ接着剤 |
US10239255B2 (en) | 2017-04-11 | 2019-03-26 | Molecule Corp | Fabrication of solid materials or films from a polymerizable liquid |
WO2018217321A1 (en) | 2017-05-26 | 2018-11-29 | Dow Global Technologies Llc | Electrochemical grafting of carbon fibers with aliphatic amines for improved composite strength |
US11135766B2 (en) | 2017-06-29 | 2021-10-05 | Carbon, Inc. | Products containing nylon 6 produced by stereolithography and methods of making the same |
WO2019005237A1 (en) | 2017-06-29 | 2019-01-03 | Dow Global Technologies Llc | EPOXY-FIBER REINFORCED COMPOSITES, PROCESS FOR FORMING COMPOSITES, AND EPOXY RESIN COMPOSITION USED THEREFOR |
EP3652250A1 (en) | 2017-07-12 | 2020-05-20 | Hexcel Composites Limited | Resin composition |
FR3068977B1 (fr) | 2017-07-12 | 2020-09-04 | Arkema France | Composition comprenant un polymere a phases multiples et un polymere (meth)acrylique, son procede de preparation et son utilisation |
FR3068979B1 (fr) | 2017-07-12 | 2020-07-31 | Arkema France | Composition d'adhesif (meth)acrylique, son procede de preparation et son utilisation |
FR3068980B1 (fr) | 2017-07-12 | 2020-10-02 | Arkema France | Composition d'adhesif epoxy comprenant un polymere a etapes multiples et un polymere (meth)acrylique, son procede de preparation et son utilisation |
EP3661990A1 (en) * | 2017-07-31 | 2020-06-10 | 3M Innovative Properties Company | Curable composition including epoxy resin and curable solid filler |
CN111315839B (zh) | 2017-08-15 | 2022-09-20 | Ddp特种电子材料美国公司 | 室温可固化的双组分增韧的环氧粘合剂 |
CN111315819A (zh) | 2017-10-06 | 2020-06-19 | 3M创新有限公司 | 可固化组合物、由其制得的制品,及其制造和使用方法 |
JP7348181B2 (ja) | 2017-12-12 | 2023-09-20 | ヘクセル コーポレイション | 熱可塑性強化ノボラック系エポキシ樹脂マトリックスを備えたセミプレグ |
US10858541B2 (en) * | 2017-12-19 | 2020-12-08 | Rohm And Haas Electronic Materials Llc | Curable composition |
US10894868B2 (en) | 2017-12-21 | 2021-01-19 | Hexcel Corporation | Composite carbon fibers |
US11674063B2 (en) | 2018-01-08 | 2023-06-13 | Ddp Specialty Electronic Materials Us, Llc | Epoxy resin adhesive compositions |
KR20240090704A (ko) | 2018-02-09 | 2024-06-21 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 코팅 조성물 |
WO2019215533A1 (en) | 2018-05-09 | 2019-11-14 | 3M Innovative Properties Company | Curable and cured compositions |
EP3814445B1 (en) | 2018-06-14 | 2023-04-19 | 3M Innovative Properties Company | Method of treating a surface, surface-modified abrasive particles, and resin-bond abrasive articles |
US11168237B2 (en) | 2018-06-14 | 2021-11-09 | 3M Innovative Properties Company | Adhesion promoters for curable compositions |
EP3807337B1 (en) | 2018-06-15 | 2024-06-12 | Dow Global Technologies Llc | Toughened epoxy compositions |
CN111040130A (zh) | 2018-10-15 | 2020-04-21 | 沙特基础工业全球技术有限公司 | 可固化的高热环氧组合物、其固化的环氧组合物、其制造方法和包含其的制品 |
US20210403700A1 (en) | 2018-10-15 | 2021-12-30 | 3M Innovative Properties Company | Composition including a polythiol, a polyepoxide, an amine catalyst, and a conductive filler and methods relating to the composition |
US20210340311A1 (en) | 2018-11-19 | 2021-11-04 | 3M Innovative Properties Company | Polymer comprising hydroxy groups and tertiary amine groups suitable for use as a catalyst |
US20220002606A1 (en) | 2018-11-19 | 2022-01-06 | 3M Innovative Properties Company | Composition including a polythiol, a polyepoxide, a polymeric catalyst, and a conductive filler and methods relating to the composition |
CN209643071U (zh) | 2018-11-21 | 2019-11-15 | 奥特斯(中国)有限公司 | 一种部件载体 |
GB2579582B (en) * | 2018-12-04 | 2022-08-31 | Hexcel Composites Ltd | Adhesive composition |
WO2020131675A1 (en) | 2018-12-21 | 2020-06-25 | Carbon, Inc. | Energy absorbing dual cure polyurethane elastomers for additive manufacturing |
CN109592990B (zh) * | 2019-02-01 | 2021-10-26 | 刘沛灵 | 一种胶凝性发泡混凝土及其制备方法 |
CN113993965A (zh) | 2019-04-25 | 2022-01-28 | 3M创新有限公司 | 用于结构粘合剂应用的增粘剂 |
KR20220024046A (ko) | 2019-06-18 | 2022-03-03 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | 내습성이 개선된 강인화된 1액형 에폭시 접착제 |
FR3097866B1 (fr) | 2019-06-26 | 2022-01-21 | Arkema France | Composition comprenant un composé renfermant deux groupes polymérisables, un polymère à étages multiples et un polymère thermoplastique, son procédé de préparation, son utilisation et article la comprenant |
WO2021003047A1 (en) | 2019-07-03 | 2021-01-07 | Hexcel Corporation | Matrix resins toughened with hybrid polyamide particles |
US11485833B2 (en) | 2019-10-23 | 2022-11-01 | Hexcel Corporation | Thermoplastic toughened matrix resins containing nanoparticles |
EP3825355A1 (de) | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Formulierungen mit hohen glasübergangstemperaturen für laminate |
EP3825341A1 (de) | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Matrixharz für laminate mit hoher transparenz, geringer vergilbung und hohen glasübergangstemperaturen |
FR3103817B1 (fr) | 2019-11-29 | 2021-12-17 | Arkema France | Composition comprenant un polymère à étapes multiples et un polymère (méth)acrylique, son procédé de préparation et son utilisation |
US20230095658A1 (en) | 2020-02-28 | 2023-03-30 | Carbon, Inc. | One part moisture curable resins for additive manufacturing |
US20230078824A1 (en) | 2020-02-28 | 2023-03-16 | Carbon, Inc. | Methods of making a three-dimensional object |
WO2021202655A1 (en) | 2020-04-03 | 2021-10-07 | Carbon, Inc. | Resins and methods for additive manufacturing of energy absorbing three-dimensional objects |
US11655329B2 (en) | 2020-04-24 | 2023-05-23 | Carbon, Inc. | Delayed action catalysts for dual cure additive manufacturing resins |
WO2021222086A1 (en) | 2020-04-28 | 2021-11-04 | Carbon, Inc. | Methods of making a three-dimensional object |
US20230265279A1 (en) | 2020-09-11 | 2023-08-24 | 3M Innovative Properties Company | Color Stable Epoxy Compositions |
KR102419869B1 (ko) * | 2020-10-15 | 2022-08-04 | 주식회사 현대폴리텍 | 속경화 에폭시 수지 프리프레그 및 그 제조방법 |
EP4347679A1 (en) | 2021-06-03 | 2024-04-10 | Carbon, Inc. | Methods for the rapid production of blocked prepolymers |
EP4355837B1 (en) | 2021-06-14 | 2025-02-26 | 3M Innovative Properties Company | Two-part curable compositions |
WO2023012543A1 (en) | 2021-08-02 | 2023-02-09 | 3M Innovative Properties Company | Hydrosilylation based beta-diketone primers for adhesion to metal |
US20240301559A1 (en) | 2021-08-02 | 2024-09-12 | 3M Innovative Properties Company | Thiol-ene based beta-diketone primers for adhesion to metal |
US11884000B2 (en) | 2021-08-27 | 2024-01-30 | Carbon, Inc. | One part, catalyst containing, moisture curable dual cure resins for additive manufacturing |
EP4482886A1 (en) | 2022-02-22 | 2025-01-01 | 3M Innovative Properties Company | Color stable epoxy compositions |
FR3134393A1 (fr) | 2022-04-12 | 2023-10-13 | Arkema France | Composition comprenant un polymère à étages multiples et un polymère (méth)acrylique, son procédé de préparation et son utilisation |
WO2024141855A1 (en) | 2022-12-27 | 2024-07-04 | 3M Innovative Properties Company | Dielectric curable composition and dielectric curable composition component |
WO2024236441A1 (en) | 2023-05-12 | 2024-11-21 | 3M Innovative Properties Company | Curable compositions with low storage modulus |
KR102618826B1 (ko) * | 2023-05-31 | 2023-12-29 | 회명산업 주식회사 | 스티렌 부타디엔 고무의 유기용매 분산용액을 제조하는 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778851A (en) | 1985-06-26 | 1988-10-18 | The Dow Chemical Company | Rubber-modified epoxy compounds |
JPH0326716A (ja) * | 1989-06-23 | 1991-02-05 | Japan Synthetic Rubber Co Ltd | 変性エポキシ組成物の製造方法 |
JPH05295237A (ja) | 1992-04-17 | 1993-11-09 | Japan Synthetic Rubber Co Ltd | 変性エポキシ組成物の製造方法 |
JPH06107910A (ja) | 1992-09-30 | 1994-04-19 | Nippon Zeon Co Ltd | エポキシ樹脂組成物、その製造方法および接着剤 |
JP2002030122A (ja) * | 2000-07-14 | 2002-01-31 | Techno Polymer Co Ltd | エポキシ樹脂改質剤及びエポキシ樹脂組成物並びにこれを用いた回路基板及びic封止材 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3948698A (en) | 1967-09-06 | 1976-04-06 | Hercules Incorporated | Solid propellant compositions having epoxy cured, carboxy-terminated rubber binder |
US3804735A (en) | 1972-04-10 | 1974-04-16 | Continental Can Co | Photopolymerizable compositions prepared from beta-hydroxy esters and polyitaconates |
US3892819A (en) | 1973-03-21 | 1975-07-01 | Dow Chemical Co | Impact resistant vinyl ester resin and process for making same |
US3856883A (en) * | 1973-05-29 | 1974-12-24 | Ford Motor Co | Graded rubber particles having hydroxy functionality and a polymeric crosslinking agent |
DE2349979A1 (de) | 1973-10-04 | 1975-04-17 | Bayer Ag | Uv-licht-haertende massen hoher reaktivitaet |
US3957912A (en) * | 1973-12-26 | 1976-05-18 | Monsanto Company | Method for preparation of abs type resins |
DE2910154A1 (de) * | 1979-03-15 | 1980-09-25 | Bayer Ag | Kautschukdispersionen |
US4431782A (en) | 1981-07-27 | 1984-02-14 | The Dow Chemical Company | Process for the preparation of radiation-curable, water-thinnable vinyl ester resins |
US4419496A (en) * | 1982-02-22 | 1983-12-06 | The Dow Chemical Company | Particle agglomeration in rubber latices |
CA1281454C (en) * | 1985-12-25 | 1991-03-12 | Teruhiko Sugimori | Method for producing thermoplastic resins |
JP2627554B2 (ja) * | 1989-01-31 | 1997-07-09 | 日本ゼオン株式会社 | ポリエステル繊維の処理方法及びポリエステル繊維とニトリル基含有高飽和共重合体ゴムとの接着方法 |
JPH089833B2 (ja) * | 1989-08-17 | 1996-01-31 | 旭硝子株式会社 | 防汚加工剤 |
JP2840866B2 (ja) * | 1989-11-28 | 1998-12-24 | 日本ゼオン株式会社 | ニトリル基含有高飽和共重合体ゴムと有機合成繊維との接着剤組成物 |
ES2175061T3 (es) * | 1995-11-29 | 2002-11-16 | Vantico Ag | Particulas nucleo-cascara (core-shell) y composiciones que contienen estas resinas epoxireticulables. |
JPH1121413A (ja) * | 1997-07-02 | 1999-01-26 | Kanegafuchi Chem Ind Co Ltd | シクロオレフィン系共重合体樹脂組成物及びその製造方法 |
JP2000204220A (ja) * | 1999-01-13 | 2000-07-25 | Kanegafuchi Chem Ind Co Ltd | メタクリル系樹脂用改質剤 |
JP2000239476A (ja) * | 1999-02-22 | 2000-09-05 | Kanegafuchi Chem Ind Co Ltd | 非晶性ポリオレフィン系樹脂組成物 |
JP2001123044A (ja) * | 1999-10-27 | 2001-05-08 | Hitachi Chem Co Ltd | プリント配線板用絶縁樹脂組成物 |
CZ20031466A3 (cs) * | 2000-11-29 | 2003-08-13 | Vantico Ag | Systém plněné epoxidové pryskyřice mající vysoké hodnoty mechanické pevnosti |
US20080051524A1 (en) * | 2006-08-28 | 2008-02-28 | Henkel Corporation | Epoxy-Based Compositions Having Improved Impact Resistance |
-
2004
- 2004-05-27 CA CA2789741A patent/CA2789741C/en not_active Expired - Fee Related
- 2004-05-27 US US10/558,759 patent/US8222324B2/en active Active
- 2004-05-27 JP JP2005506770A patent/JP4668788B2/ja not_active Expired - Fee Related
- 2004-05-27 EP EP04735123.4A patent/EP1632533B1/en not_active Expired - Lifetime
- 2004-05-27 EP EP12157306A patent/EP2481773A3/en not_active Withdrawn
- 2004-05-27 WO PCT/JP2004/007679 patent/WO2004108825A1/ja active Application Filing
- 2004-05-27 CA CA2526461A patent/CA2526461C/en not_active Expired - Fee Related
- 2004-05-27 CN CNB2004800151576A patent/CN100447196C/zh not_active Expired - Lifetime
- 2004-05-27 KR KR1020057022655A patent/KR100780582B1/ko active IP Right Grant
- 2004-05-27 EP EP10176326A patent/EP2258773A1/en not_active Ceased
- 2004-05-27 PL PL04735123T patent/PL1632533T3/pl unknown
- 2004-05-27 ES ES04735123T patent/ES2412804T3/es not_active Expired - Lifetime
- 2004-06-02 TW TW093115834A patent/TWI359843B/zh not_active IP Right Cessation
- 2004-06-07 MY MYPI20042190A patent/MY137365A/en unknown
-
2012
- 2012-02-13 US US13/372,231 patent/US8680180B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778851A (en) | 1985-06-26 | 1988-10-18 | The Dow Chemical Company | Rubber-modified epoxy compounds |
US4778851B1 (en) | 1985-06-26 | 1999-02-09 | David E Henton | Rubber-modified epoxy compounds |
JPH0326716A (ja) * | 1989-06-23 | 1991-02-05 | Japan Synthetic Rubber Co Ltd | 変性エポキシ組成物の製造方法 |
JP2751071B2 (ja) | 1989-06-23 | 1998-05-18 | ジェイエスアール株式会社 | 変性エポキシ組成物の製造方法 |
JPH05295237A (ja) | 1992-04-17 | 1993-11-09 | Japan Synthetic Rubber Co Ltd | 変性エポキシ組成物の製造方法 |
JPH06107910A (ja) | 1992-09-30 | 1994-04-19 | Nippon Zeon Co Ltd | エポキシ樹脂組成物、その製造方法および接着剤 |
JP2002030122A (ja) * | 2000-07-14 | 2002-01-31 | Techno Polymer Co Ltd | エポキシ樹脂改質剤及びエポキシ樹脂組成物並びにこれを用いた回路基板及びic封止材 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1632533A4 |
Cited By (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1780239A4 (en) * | 2004-08-18 | 2011-11-16 | Kaneka Corp | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALANT AND EPOXY RESIN MOLD |
EP1780239A1 (en) * | 2004-08-18 | 2007-05-02 | Kaneka Corporation | Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
US7649060B2 (en) | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
US8932718B2 (en) * | 2006-07-07 | 2015-01-13 | Valspar Sourcing, Inc. | Coating systems for cement composite articles |
US9593051B2 (en) | 2006-07-07 | 2017-03-14 | Valspar Sourcing, Inc. | Coating systems for cement composite articles |
US10640427B2 (en) | 2006-07-07 | 2020-05-05 | Axalta Coating Systems IP Co. LLC | Coating systems for cement composite articles |
WO2008060545A1 (en) | 2006-11-13 | 2008-05-22 | Henkel Corporation | Benzoxazine compositions with core shell rubbers |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
WO2008105189A1 (ja) * | 2007-02-28 | 2008-09-04 | Kaneka Corporation | ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法 |
JP5544162B2 (ja) * | 2007-02-28 | 2014-07-09 | 株式会社カネカ | ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法 |
US8217098B2 (en) | 2007-02-28 | 2012-07-10 | Kaneka Corporation | Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof |
WO2009014037A1 (ja) * | 2007-07-25 | 2009-01-29 | Kaneka Corporation | 樹脂組成物、および該樹脂組成物を用いた重縮合体 |
WO2009034966A1 (ja) | 2007-09-11 | 2009-03-19 | Kaneka Corporation | 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物 |
JP5605825B2 (ja) * | 2007-09-11 | 2014-10-15 | 株式会社カネカ | 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物 |
US8742014B2 (en) | 2007-09-11 | 2014-06-03 | Kaneka Corporation | Liquid resin composition and cured product using the liquid resin composition |
US7847034B2 (en) | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
US8716377B2 (en) | 2008-05-09 | 2014-05-06 | Henkel Ag & Co. Kgaa | Polymerizable composition |
EP2135909A1 (en) | 2008-06-12 | 2009-12-23 | Henkel Corporation | Next generation, highly toughened two part structural epoxy adhesive compositions |
US9133064B2 (en) | 2008-11-24 | 2015-09-15 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
JP2010270328A (ja) * | 2009-04-24 | 2010-12-02 | Mitsubishi Rayon Co Ltd | 重合体粒子含有分散体及び重合体粒子含有樹脂組成物の製造方法 |
JP2011026503A (ja) * | 2009-07-28 | 2011-02-10 | Kaneka Corp | ポリマー微粒子含有液状樹脂組成物、及びその製造方法 |
US8580888B2 (en) | 2010-09-15 | 2013-11-12 | Henkel Ireland Limited | Two-part, cyanoacrylate/cationically curable adhesive systems |
US8742048B2 (en) | 2010-09-15 | 2014-06-03 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate /cationically curable adhesive systems |
WO2012035112A1 (en) | 2010-09-15 | 2012-03-22 | Loctite (R&D) Limited | Two-part, cyanoacrylate/cationically curable adhesive systems |
WO2012169498A1 (ja) * | 2011-06-09 | 2012-12-13 | デクセリアルズ株式会社 | 異方性導電材料 |
JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
JP2015534591A (ja) * | 2012-09-07 | 2015-12-03 | ダウ グローバル テクノロジーズ エルエルシー | 強化マスターブレンド |
US8981027B2 (en) | 2013-03-15 | 2015-03-17 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
WO2014140804A2 (en) | 2013-03-15 | 2014-09-18 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
JP2018500440A (ja) * | 2014-12-24 | 2018-01-11 | アルケマ フランス | 多段ポリマー組成物、その調製方法、その使用及びそれを含む組成物 |
JP2016199673A (ja) * | 2015-04-09 | 2016-12-01 | 株式会社カネカ | 接着性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
US11618839B2 (en) | 2016-07-08 | 2023-04-04 | Cemedine Co., Ltd. | Structure adhesive composition exhibiting favorable thread breakage and capable of stitch coating |
US11884813B2 (en) | 2017-09-06 | 2024-01-30 | Mitsubishi Chemical Corporation | Macromonomer copolymer, epoxy resin composition, adhesive, molding material, and cured product |
CN111936574A (zh) * | 2018-03-30 | 2020-11-13 | 株式会社钟化 | 相对于热固化性基质树脂的分散性得以改善了的粉粒体 |
WO2019189621A1 (ja) * | 2018-03-30 | 2019-10-03 | 株式会社カネカ | 熱硬化性マトリクス樹脂に対する分散性が改善された粉粒体 |
CN111936574B (zh) * | 2018-03-30 | 2023-12-29 | 株式会社钟化 | 相对于热固化性基质树脂的分散性得以改善了的粉粒体 |
WO2019203273A1 (ja) * | 2018-04-20 | 2019-10-24 | 株式会社カネカ | コアシェルポリマー粒子含有溶剤組成物の製造方法 |
JP7295847B2 (ja) | 2018-04-20 | 2023-06-21 | 株式会社カネカ | コアシェルポリマー粒子含有溶剤組成物の製造方法 |
JPWO2019203273A1 (ja) * | 2018-04-20 | 2021-05-13 | 株式会社カネカ | コアシェルポリマー粒子含有溶剤組成物の製造方法 |
WO2020035442A1 (en) | 2018-08-13 | 2020-02-20 | Henkel Ag & Co. Kgaa | A two-part cyanoacrylate curable adhesive system |
WO2020035440A1 (en) | 2018-08-13 | 2020-02-20 | Henkel IP & Holding GmbH | A two-part cyanoacrylate curable adhesive system |
US12030971B2 (en) | 2018-08-13 | 2024-07-09 | Henkel Ag & Co. Kgaa | Two-part cyanoacrylate curable adhesive system |
US12103997B2 (en) | 2018-08-13 | 2024-10-01 | Henkel Ag & Co. Kgaa | Two-part cyanoacrylate curable adhesive system |
JPWO2020138263A1 (ja) * | 2018-12-27 | 2021-11-04 | 株式会社カネカ | 樹脂組成物およびその利用 |
JP7391043B2 (ja) | 2018-12-27 | 2023-12-04 | 株式会社カネカ | 樹脂組成物およびその利用 |
WO2020138263A1 (ja) * | 2018-12-27 | 2020-07-02 | 株式会社カネカ | 樹脂組成物およびその利用 |
WO2020178082A1 (en) | 2019-03-04 | 2020-09-10 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
US12203013B2 (en) | 2019-03-04 | 2025-01-21 | Henkel Ag & Co. Kgaa | Two-part, cyanoacrylate/cationically curable adhesive systems |
JP2020164561A (ja) * | 2019-03-28 | 2020-10-08 | 株式会社カネカ | 粉粒体の製造方法および粉粒体 |
JP7249845B2 (ja) | 2019-03-28 | 2023-03-31 | 株式会社カネカ | 粉粒体の製造方法および粉粒体 |
WO2020196921A1 (ja) | 2019-03-28 | 2020-10-01 | 株式会社カネカ | 樹脂組成物の製造方法および樹脂組成物 |
WO2024003053A1 (en) | 2022-06-28 | 2024-01-04 | Henkel Ag & Co. Kgaa | Method of underwater bonding |
Also Published As
Publication number | Publication date |
---|---|
ES2412804T3 (es) | 2013-07-12 |
US8680180B2 (en) | 2014-03-25 |
CA2789741A1 (en) | 2004-12-16 |
JPWO2004108825A1 (ja) | 2006-08-03 |
KR20060036912A (ko) | 2006-05-02 |
US20120142820A1 (en) | 2012-06-07 |
CN100447196C (zh) | 2008-12-31 |
EP2258773A1 (en) | 2010-12-08 |
CA2526461C (en) | 2013-03-19 |
PL1632533T3 (pl) | 2013-08-30 |
EP1632533B1 (en) | 2013-04-10 |
EP2481773A3 (en) | 2012-09-05 |
KR100780582B1 (ko) | 2007-11-29 |
EP2481773A2 (en) | 2012-08-01 |
US8222324B2 (en) | 2012-07-17 |
JP4668788B2 (ja) | 2011-04-13 |
US20070027233A1 (en) | 2007-02-01 |
CA2789741C (en) | 2014-11-04 |
MY137365A (en) | 2009-01-30 |
CN1798805A (zh) | 2006-07-05 |
EP1632533A4 (en) | 2008-06-25 |
TW200502309A (en) | 2005-01-16 |
TWI359843B (en) | 2012-03-11 |
CA2526461A1 (en) | 2004-12-16 |
EP1632533A1 (en) | 2006-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004108825A1 (ja) | 変性エポキシ樹脂の製造方法 | |
JP4761965B2 (ja) | ゴム状重合体粒子の製造方法およびこれを含有する樹脂組成物の製造方法 | |
TWI389968B (zh) | 半導體封裝劑用環氧樹脂組合物及環氧樹脂成形材料 | |
EP2123711A1 (en) | Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof | |
JP2004315572A (ja) | エポキシ樹脂組成物の製造方法 | |
CN110637061A (zh) | 溶剂组合物及其制造方法 | |
JP2005248109A (ja) | ゴム状重合体粒子の製造方法およびこれを含有する樹脂組成物の製造方法 | |
JP5208003B2 (ja) | ポリマー微粒子分散組成物、及びその製造方法 | |
JP2006045292A (ja) | ゴム状重合体粒子の製造方法およびこれを含有する樹脂組成物の製造方法 | |
JP2010018667A (ja) | 重合体粒子含有分散体及び重合体粒子含有樹脂組成物の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005506770 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004735123 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2526461 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020057022655 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20048151576 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007027233 Country of ref document: US Ref document number: 10558759 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 2004735123 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020057022655 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 10558759 Country of ref document: US |