WO2004036658A1 - 太陽電池およびそれを用いた太陽電池モジュール - Google Patents
太陽電池およびそれを用いた太陽電池モジュール Download PDFInfo
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- WO2004036658A1 WO2004036658A1 PCT/JP2003/013101 JP0313101W WO2004036658A1 WO 2004036658 A1 WO2004036658 A1 WO 2004036658A1 JP 0313101 W JP0313101 W JP 0313101W WO 2004036658 A1 WO2004036658 A1 WO 2004036658A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/48—Back surface reflectors [BSR]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/484—Refractive light-concentrating means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/488—Reflecting light-concentrating means, e.g. parabolic mirrors or concentrators using total internal reflection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
Definitions
- the present invention relates to a solar cell and a solar cell module using the solar cell, and more particularly, to a structure of a solar cell having excellent photoelectric conversion efficiency.
- a solar cell As a conventional solar cell, there are known a solar cell in which a light receiving surface electrode and a back surface electrode are respectively formed on both sides of a silicon substrate having a pn junction, and a solar cell module (for example, JP-A-10-101030) 6)).
- a solar cell module for example, JP-A-10-101030
- the light receiving surface electrode in order to widen the light receiving area as much as possible, a solid pattern (comb type) having a thin line portion and a thick line portion crossing each other is used.
- the back electrode one formed by printing / baking a paste-like electrode material mainly composed of aluminum on the entire back surface of the silicon substrate is used.
- solar cells are arranged in a plane, one light receiving surface electrode of the adjacent solar cells and the other back surface electrode are connected in series with a wiring material such as copper, glass plate or moisture-proof film It is appropriately sealed by
- silicon substrates are being made thinner to reduce manufacturing costs, and silicon substrates have been thinned to a thickness of about 300 m. Plates have become commonplace.
- the thickness of the silicon substrate is reduced to about 250 ⁇ m or less, the long wavelength region is Incident light is less likely to be absorbed by the silicon substrate, much of which reaches the backside of the silicon substrate.
- Incident light in the long wavelength region reaching the back surface of the silicon substrate is reflected by the back surface electrode and returned to the inside of the silicon substrate again.
- the reflectance is about 70% or so.
- the present invention has been made in consideration of the above circumstances, and provides a solar cell having excellent photoelectric conversion efficiency even if the thickness of the photoelectric conversion layer is thin, and a solar cell module using the solar cell. is there.
- the present invention comprises a photoelectric conversion layer having a front surface and a rear surface, and a reflection layer provided on the rear surface of the photoelectric conversion layer, and the reflection layer is formed by alternately laminating a plurality of light transmission layers having different refractive indexes. And, when light is incident from the surface of the photoelectric conversion layer, the present invention provides a solar cell characterized by reflecting light of a specific wavelength among the light to the photoelectric conversion layer.
- the back surface electrode and the reflection layer are provided on the back surface of the photoelectric conversion layer, and the reflection layer reflects light of a specific wavelength among the light incident from the surface of the photoelectric conversion layer to the photoelectric conversion layer.
- the reflective layer is made of an organic material, and a light transmitting layer of a first material having a refractive index of 1.45 to 1.65, and a second material of a refractive index of 1.70 to 1.90.
- Transmissive layers are alternately laminated, the thickness of the translucent layer of each single layer is in the range of 50 to 160 nm, and 50 to 500 translucent layers are laminated. It may be
- the organic material constituting the reflective layer may be an organic polymer material.
- the wavelength of light reflected by the reflective layer may be 800 to 1 10 0 nm.
- the photoelectric conversion layer may locally have a back electrode on the back surface.
- the photoelectric conversion layer may have a back electrode locally on the back surface, and the back electrode may have an area occupancy ratio to the back surface of the photoelectric conversion layer in the range of 1 to 20%.
- the photoelectric conversion layer may be made of a silicon substrate having a pn junction layer, and the thickness thereof may be in the range of 100 to 250 m.
- the solar cell according to the present invention includes a plurality of solar cells arranged in a plane and a connecting member for connecting adjacent solar cells in series, and each solar cell includes the solar cell according to the present invention It also provides solar cell modules.
- FIG. 1 is a cross-sectional view schematically showing a configuration of a solar cell according to Embodiment 1 of the present invention.
- FIG. 2 is a cross sectional view schematically showing a configuration of a solar cell module according to a second embodiment of the present invention.
- FIG. 3 is a graph showing the reflection characteristics of the reflective layer provided in the solar cell shown in FIG.
- FIG. 4 is an explanatory view showing a method of forming a reflective layer.
- FIG. 5 is an explanatory view schematically showing a cross-sectional structure of a reflective layer provided in the solar cell shown in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- the solar cell according to the present invention comprises a photoelectric conversion layer and a reflection layer provided on the back surface of the photoelectric conversion layer, and the reflection layer is formed by alternately laminating a plurality of light transmission layers having mutually different refractive indexes, And, it is characterized in that it is configured to be able to reflect the light of long wavelength among the light incident from the surface of the photoelectric conversion layer to the photoelectric conversion layer.
- a silicon substrate having a pn junction layer and having a thickness of about 100 to 250 ⁇ can be used as the photoelectric conversion layer.
- the reason why the thickness of the silicon substrate is set to about 100 to 250 Atm is that the above range is preferable in order to achieve both the reduction of the manufacturing cost and the strength of the silicon substrate. . That is, when the thickness of the silicon substrate is greater than 250 ⁇ m, the effect of reducing the manufacturing cost is not very high. If the thickness of the silicon substrate is smaller than 100 ⁇ , the mechanical strength of the substrate is too small, as a result, the solar cell is susceptible to cracking and chipping during the manufacturing process, which lowers the yield. In addition, when such a thin silicon substrate is used, the loss with respect to long wavelength light having a wavelength of 800-1100 nm among incident light becomes large, and the photoelectric conversion efficiency of the solar cell is lowered. There is a fear.
- the short wavelength light is absorbed near the surface of the silicon substrate, so even if the silicon substrate is thin, it does not reach the back side, but long wavelength light of 800 to 110 nm is thin silicon. This is because the substrate does not absorb sufficiently and reaches the back surface of the silicon substrate.
- the reflective layer provided on the back surface of the photoelectric conversion layer is about 80 to 100% to long wavelength light having a wavelength of about 800 to 110 nm. Configured to exhibit a high reflectivity.
- the spectral sensitivity to light in the wavelength region of about 110 to 120 nm is low, so reflection of light on the wavelength region of at least about 800 to 110 nm is possible. It is important to increase the rate.
- the reflective layer as described above has, for example, a light-transmissive layer having a refractive index of 1.45 to 1.65, and a transparent layer having a refractive index of 1.70 to 1.90. It can be configured by alternately laminating the light layers.
- the refractive index difference between the light transmitting layers adjacent to each other is effective to be about 0.55 to 0.55, and more preferably about 0.3 to 0.4. It is.
- the number of laminated light transmitting layers can be about 50 to 500 layers.
- the light transmitting layer for example, a layer made of an organic polymer material having a thickness of 50 to 160 nm can be used.
- polyester resin for example, polyester resin, naphthol resin, phenol resin, beige resin, furan resin, etc. are used.
- polyester resin and furan resin are preferably used.
- polyester resin for example, a copolymer of ethylene glycol and 2, 3-naphthalenedicarboxylic acid (C 10 H 6 (C00H) 2 ), which has a polycyclic aromatic ring such as a naphthalene ring, is used. be able to.
- furan resin for example, polybutyl furan, poly (2-vinyl tetra hydrofuran), etc. can be used.
- an inorganic material such as glass
- an organic polymer material is preferable from the viewpoint of reflection characteristics, production cost and the like.
- thermoplasticity of a resin as described in U.S. Pat. Nos. 3,773,822 and 3,848,606, is used. be able to.
- a multilayer film forming apparatus as described in US Pat. No. 5,383,234 can be used.
- the multi-layered film formed using such an apparatus is further divided into a plurality of multi-layered films, and several hundred layers are formed by repetitively stacking layers as described in US Pat. No. 5,090,478.
- the selective reflectance for selectively reflecting light of a predetermined range in a multilayer reflective film is “0. S. Heavens,“ Optical Properties of Thin Solid Films ”, Butterworths Science (1955) [This Description The following is being done It can be calculated using equations (1) to (3). Equations (1) to (3) calculate the reflectance R ( ⁇ ) of the multilayer film at normal incidence.
- M j is the characteristic matrix of the homogeneous first layer single layer film
- M is the characteristic matrix of the homogeneous multilayer film
- m 12 , m 21 , m 22 are diagonal elements of the product matrix of the characteristic matrix corresponding to each layer
- 77. , 7-1 + 1 and 7J j are the effective refractive indices of the medium on the incident side, silicon, and the j-th layer film
- multiple refractive indices ⁇ ” ⁇ ” ⁇ i ⁇ ”for absorbing media.
- n j is a principal refractive index
- i is an imaginary unit
- ⁇ is an extinction coefficient
- 5j (2 ⁇ / ⁇ ) Njdj and dj is the thickness of the j-th layer film.
- ⁇ is the wavelength of the incident light.
- the photoelectric conversion layer has a light receiving surface An electrode may be provided.
- the light receiving surface electrode for example, a comb-shaped electrode formed by printing and firing a paste-like electrode material containing silver or aluminum as the main component can be used.
- the photoelectric conversion layer locally has a back electrode on the back surface, and the reflective layer is provided on the entire back surface of the photoelectric conversion layer.
- the reflection layer since the reflection layer has the function of reflecting the light reaching the back surface of the photoelectric conversion layer, the area ratio of the back surface electrode on the back surface of the photoelectric conversion layer is reduced, It is necessary to increase the area occupancy of the reflective layer.
- the back electrode preferably has an area occupancy ratio to the back surface of the photoelectric conversion layer in the range of about 1 to 20%.
- the electrical resistance may be excessive and the photoelectric conversion efficiency may be reduced.
- the area occupancy of the reflective layer relatively decreases and it becomes impossible to sufficiently reflect long-wavelength light of about 800 to 1 10 0 nm , There is a risk of lowering the photoelectric conversion efficiency.
- the back electrode can be formed, for example, by printing / baking a paste-like electrode material mainly composed of silver or aluminum, but it is also possible to use silver or ITO (indium-tin oxide).
- Transparent conductive materials such as S n 0 2 (oxide oxide) and Z ⁇ ⁇ can be used.
- the shape can be any shape, When using um paste or silver, for example, a comb may be used.
- a transparent conductive material When a transparent conductive material is used, there is no risk of shielding the reflective layer from light, so it is not necessary to be provided locally as described above.
- a film shape covering the entire back surface of the photoelectric conversion layer It may be provided.
- the back surface electrode is provided locally on the back surface of the photoelectric conversion layer in the solar cell according to the present invention, the warpage of the solar cell caused by the formation of the back surface electrode is reduced.
- a solar cell according to the present invention comprising: a plurality of solar cells arranged in a plane; and a connecting member for connecting adjacent solar cells in series. It also provides a solar cell module consisting of
- FIG. 1 schematically shows the structure of a silicon solar cell according to Embodiment 1 of the present invention.
- FIG. 1 schematically shows the structure of a silicon solar cell according to Embodiment 1 of the present invention.
- the solar cell 1 according to Example 1 includes: a photoelectric conversion layer 2, a light receiving surface electrode 3 provided on the front surface of the photoelectric conversion layer 2, and a back surface electrode 5 provided on the rear surface of the photoelectric conversion layer 2.
- the reflective film (reflective layer) 4, and the reflective film 4 is formed by alternately laminating a plurality of light transmissive layers having different refractive indexes, and of the light incident from the surface of the photoelectric conversion layer 2 The light of long wavelength is configured to be reflected to the photoelectric conversion layer 2.
- the photoelectric conversion layer 2 is a substrate 2 a made of polycrystalline p-type silicon having a thickness of about 250 nm, and an n + diffusion layer 2 formed on the light receiving surface side and the back surface side of the substrate 2 a respectively. It consists of b and p + diffusion layer 2 c.
- an antireflective film 6 is formed on the light receiving surface side of the photoelectric conversion layer 2, and a passivation layer 7 covering the back surface side of the photoelectric conversion layer 2 is formed between the photoelectric conversion layer 2 and the reflective film 4. .
- the substrate 2a made of polycrystalline p-type silicon of about 15 cm ⁇ about 15 cm, thickness of about 250 ⁇ m, and resistivity of about 1 ⁇ ⁇ cm is cleaned by a known method, and the volume ratio is Remove the fractured surface layer at the time of slicing in 1: 3 hydrofluoric acid (50%) ⁇ nitric acid mixed solution for about 1 minute.
- impurity diffusion is performed for about 20 minutes in a heat treatment furnace at about 950 ° C., and the sheet resistance value is about 50 ⁇ and the thickness is about 0.4 ⁇ m.
- an acid resistant tape is attached on the passivation layer 7, and the p + diffusion layer formed on the side surface and the light receiving surface of the substrate 2a is removed in the above-mentioned hydrofluoric acid / nitric acid mixed solution.
- the light receiving surface of the substrate 2a is etched with sodium hydroxide to form textured irregularities.
- the sodium hydroxide remaining on the substrate 2a is cleaned with an aqueous solution of hydrochloric acid, the semiconductor Si 2 0 2 coating agent is applied on the P + diffusion layer 2c and dried, and then heated to about 50 ° C.
- the coating agent is densified.
- the PSG (ring glass) layer on the light receiving side and the coating agent on the back side formed by the phosphorus diffusion are removed using an HF solution, and the surface concentration on the light receiving side of the substrate 2a is about 10 19 Form an n + diffusion layer 2 b of cm- 3 or more and a thickness of about 0.3 ⁇ .
- silane and ammonia are used as source gases, and an antireflective film 6 of about 700 A in thickness made of Si N x is formed on the n + diffusion layer 2 b by plasma CVD.
- the anti-reflection film 6, T i O x it is preferably formed of S i N x Considering S i O x Passhibeshiyon effect of the good force hydrotreated be formed like.
- the paste-like electrode material containing Ag powder is screen-printed on the anti-reflection film 6 and passivation layer 7 in a comb-shaped lid pattern, respectively, dried, and then dried. Baking in an infrared furnace and light receiving surface electrode 3 Form a back side electrode 5.
- the electrode material printed on the anti-reflection film 6 and the passivation layer 7 penetrates the anti-reflection film 6 and the passivation layer 7 respectively when fired, so that the light-receiving surface electrode 3 and the light-receiving surface electrode 3 are eventually obtained.
- the back surface electrode 5 is formed in contact with the n + diffusion layer 2 b and the p + diffusion layer 2 c.
- the area occupancy of the back electrode 5 with respect to the back surface of the substrate 2a is about 10%.
- a reflective film 4 is attached onto the passivation layer 7 so as to cover the back electrode 5, to complete the solar cell 1.
- a reflective film 4 is attached onto the passivation layer 7 so as to cover the back electrode 5, to complete the solar cell 1.
- the reflective film 4 of 14.6 cm square is used for a solar cell of size 1 5 cm square. Attach the center of the back surface of the solar cell and the center of the reflective film approximately along 0.2 cm from the edge of the solar cell. Since the surface layer of the reflective film in contact with the back surface of the solar cell is a viscous surface protection film, press firmly on the back surface of the solar cell and the reflective film 4 while pushing (air purge) during work.
- the reflective film 4 usually has a three-layer structure consisting of a surface protective film 8, a multilayer reflective film 9 and a back surface protective film 10, among which a multilayer reflective film 9 having high reflection characteristics 9 Is constructed by alternately laminating two types of light transmitting layers 51 and 52 (see FIG. 4) having mutually different refractive indexes over a total of 500 layers.
- the light transmitting layer 51 is formed of poly (2-Bulthe trahydrofuran) (hereinafter referred to as the first material), and its refractive index is about 1.5. 5 and the thickness of the monolayer film is about 145 nm.
- the translucent layer 52 is 2, 3-naphthalene dicarboxylic acid (C ⁇ H ⁇ COOH) And a copolymer of ethylene glycol and ethylene glycol (hereinafter referred to as a second material), the refractive index of which is 1.88, and the thickness of the single layer film is about 120 nm.
- a method of manufacturing the reflective film 4 which is one of the features of the present invention will be described with reference to FIG. 4 and FIG.
- a film 53 of a two-layer structure in which a light transmitting layer 52 made of a second material is laminated on a light transmitting layer 51 made of a first material is prepared.
- a light transmitting layer 51 made of a first material and a light transmitting layer 52 made of a second material are The sheet is formed while controlling the thickness through the fit block of the device. Thereafter, the formed light transmitting layer 51 and the light transmitting layer 52 are attached to each other, and then drawn out to form a film 53 having a two-layer structure of light transmitting layers 51 and 52 having different refractive indexes.
- the two-layered film 53 formed by the method as described in U.S. Pat. No. 5,095,478 is divided into five segments, 5,4,5,6,5,6 0 6 Divide into 2 parts and stack the divided segments 5 4, 5 6, 5 8, 6 0 6 2.
- the stacked segments 5 4, 5, 6, 5, 8, 60, 62 are rubbed with a lapping apparatus such as that described in US Pat. No. 5,095, 478, 1
- a multilayer reflective film 9a of 0 layer structure is formed.
- the division of the formed multilayer reflective film 9a and the repeated lamination and laminating are repeated in the same manner as the above-described process of forming the multilayer reflective film 9a to form a translucent layer of 500 layers.
- Form a multilayer reflective film 9 (see Figure 5).
- the surface protective layer 8 and the back surface protective layer 10 are formed, and the multilayer reflective film 9 is coated on the surface and the back surface, respectively.
- a reflective film 4 having a cross-sectional structure as shown in FIG. 5 is obtained.
- the reflection characteristics of the reflective film 4 manufactured in this manner are as shown in FIG. 2, and a reflectance of about 95% or more to light in a wavelength range of about 400 to 110 nm is obtained. It shows.
- the solar cell according to Comparative Example 1 is different from the solar cell according to Example 1 only in that the solar cell according to Comparative Example 1 includes a back electrode formed by printing / baking an aluminum paste on the entire back surface of photoelectric conversion layer 2. .
- the solar cell 1 according to the example 1 shows a photoelectric conversion efficiency of about 7.5%, It can be seen that the solar cell according to Example 1 exhibits a photoelectric conversion efficiency of about 14.6%.
- the solar cell according to Comparative Example 1 has a warpage of about 4 mm.
- a reflection film is provided on the back surface of the silicon substrate to improve the photoelectric conversion efficiency by increasing the reflectance for long wavelength light.
- FIG. 2 schematically shows the structure of a solar cell module according to a second embodiment of the present invention. It is a sectional view showing.
- a solar cell module 21 according to Example 2 arranges the solar cells 1 according to Example 1 described above (see FIG. 1) in a plane, and a solar cell adjacent to a surface electrode of the solar cell. Are connected in series with each other by a connecting member 22.
- the solar cell modules 21 are connected in series in four rows of 10 sheets per row of 40 solar cells.
- An aluminum wire is used as the connection member 2 2.
- a reflective film 24 cut so as to escape the connection electrode pad is attached on the back surface of each solar cell 1.
- a laminated body consisting of a resin sheet 25 made of EVA, a solar cell connected in series, a resin sheet 25 made of EVA, and a back surface protection sheet 26 are sequentially stacked on a glass plate 23 and set in a vacuum laminator device. After the vacuum degassing, heating, curing and sealing are performed to complete the solar cell module 21 according to Example 2. Comparative example 2
- the solar cell module 21 according to Example 2 has a photoelectric conversion efficiency of about 15.7%.
- the solar cell module according to Comparative Example 2 has a photoelectric conversion efficiency of about 13.2 %.
- the module non-defective rate is high (96% or more).
- the solar cell module according to Example 2 has a relatively large warp of the solar cell of about 4 mm, so the breakage rate of the solar cell is high and the module non-defective rate is low (approximately 84%).
- the embodiments and examples disclosed herein are illustrative of all points and not restrictive.
- the scope of the present invention is indicated not by the above description but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.
- the reflective films 4 and 24 which are the features of the present invention are the p + side electrodes ( The present invention can also be applied to a solar cell having a configuration in which the back surface electrode 5) and the n + side electrode (light receiving surface electrode 3) are both provided on the back surface of the photoelectric conversion layer 2.
- the solar cell 1 to which the reflective film 4 is attached is used.
- the solar cell 1 before the reflective film 4 is attached is connected to the connecting member 2. After electrically connecting using 2, one reflective film of approximately the same size as the light receiving area of the solar cell module 2 1 is disposed to cover the back surface of all the solar cells 1 and modularized. Yo.
- the step of cutting the reflective film 4 according to the size of the photoelectric conversion layer 2 and the step of aligning the reflective film 4 with the photoelectric conversion layer 2 can be omitted.
- the resin sheet 25 and the back surface protection sheet 26 formed of EVA may be used as a surface protection layer and a back surface protection layer of the reflection film.
- the back surface side of the solar cell module can be constituted only by the reflective film.
- the adhesion between the solar cell 1, the reflection film 4, the resin sheet 25, and the back surface protection sheet 26 in Example 2 is improved. This reduces the time required for the air venting process and improves the productivity of the solar cell module.
- a high photoelectric conversion efficiency can be obtained while using a thin silicon substrate as the photoelectric conversion layer.
- the manufacturing cost can be reduced by using a thin silicon substrate as the photoelectric conversion layer.
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2004544937A JP3866747B2 (ja) | 2002-10-15 | 2003-10-14 | 太陽電池モジュール |
AU2003272986A AU2003272986A1 (en) | 2002-10-15 | 2003-10-14 | Solar cell and solar cell module using same |
US11/103,474 US7858873B2 (en) | 2002-10-15 | 2005-04-12 | Photovoltaic cell and photovoltaic module employing the same |
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JP2002-300795 | 2002-10-15 | ||
JP2002300795 | 2002-10-15 |
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US11/103,474 Continuation-In-Part US7858873B2 (en) | 2002-10-15 | 2005-04-12 | Photovoltaic cell and photovoltaic module employing the same |
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WO2004036658A1 true WO2004036658A1 (ja) | 2004-04-29 |
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US (1) | US7858873B2 (ja) |
JP (1) | JP3866747B2 (ja) |
AU (1) | AU2003272986A1 (ja) |
TW (1) | TWI238536B (ja) |
WO (1) | WO2004036658A1 (ja) |
Cited By (13)
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JP2010538466A (ja) * | 2007-08-29 | 2010-12-09 | フエロ コーポレーション | 太陽電池におけるファイヤースルー用の厚膜ペースト |
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JP5323827B2 (ja) * | 2008-06-23 | 2013-10-23 | 三菱電機株式会社 | 光起電力装置およびその製造方法 |
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JP2010153740A (ja) * | 2008-12-26 | 2010-07-08 | Ulvac Japan Ltd | 結晶太陽電池及び結晶太陽電池の製造方法 |
JP2011165754A (ja) * | 2010-02-05 | 2011-08-25 | Denso Corp | 太陽電池モジュール |
JP2012084747A (ja) * | 2010-10-13 | 2012-04-26 | National Institute Of Advanced Industrial & Technology | 結晶シリコン太陽電池の作製方法 |
JP2013115434A (ja) * | 2011-11-25 | 2013-06-10 | Qinghua Univ | 太陽電池及びその製造方法 |
US8809675B2 (en) | 2011-12-16 | 2014-08-19 | Tsinghua University | Solar cell system |
US9012767B2 (en) | 2011-12-16 | 2015-04-21 | Tsinghua University | Solar cell system |
US8785218B2 (en) | 2011-12-29 | 2014-07-22 | Tsinghua University | Solar cell system manufacturing method |
US8871533B2 (en) | 2011-12-29 | 2014-10-28 | Tsinghua University | Method for making solar cell and solar cell system |
US9349890B2 (en) | 2011-12-29 | 2016-05-24 | Tsinghua University | Solar cell and solar cell system |
US9349894B2 (en) | 2011-12-29 | 2016-05-24 | Tsinghua University | Solar cell and solar cell system |
Also Published As
Publication number | Publication date |
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JP3866747B2 (ja) | 2007-01-10 |
JPWO2004036658A1 (ja) | 2006-02-16 |
TW200415798A (en) | 2004-08-16 |
US20050178431A1 (en) | 2005-08-18 |
US7858873B2 (en) | 2010-12-28 |
AU2003272986A1 (en) | 2004-05-04 |
TWI238536B (en) | 2005-08-21 |
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