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WO2003097287A1 - Procede d'assemblage d'un element de jointage destine a etre assemble a un contre-element au moyen d'un alliage contenant de l'argent et du cuivre - Google Patents

Procede d'assemblage d'un element de jointage destine a etre assemble a un contre-element au moyen d'un alliage contenant de l'argent et du cuivre Download PDF

Info

Publication number
WO2003097287A1
WO2003097287A1 PCT/DE2003/001321 DE0301321W WO03097287A1 WO 2003097287 A1 WO2003097287 A1 WO 2003097287A1 DE 0301321 W DE0301321 W DE 0301321W WO 03097287 A1 WO03097287 A1 WO 03097287A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
copper
joining
silver
counterpart
Prior art date
Application number
PCT/DE2003/001321
Other languages
German (de)
English (en)
Inventor
Roman Renz
Klaus Gessner
Lutz Kellmann
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003097287A1 publication Critical patent/WO2003097287A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Definitions

  • the invention relates to a method for joining a joining part with a counterpart by means of an alloy having silver and copper components, in which at least one metal layer is applied to the stainless steel part before joining, and a joining process under vacuum or a protective gas atmosphere at a temperature between 650 and 850 ° C is carried out.
  • Such a method is already known from DE 40 26 394 C2.
  • the method disclosed there serves to produce a soldering connection between beryllium and stainless steel or beryllium and nickel, the connection of these parts being brought about by an alloy containing silver and copper components.
  • a thin metal layer is applied to the stainless steel surface, which consists of a noble metal, the noble metal used being completely miscible with the alloy containing silver-copper components.
  • the soldering process is then carried out at a temperature between 650 ° C and 750 ° C.
  • a disadvantage of the aforementioned method is that an additional solder must be arranged in the connection area between the parts to be connected to one another during the actual soldering process.
  • a 0.2 mm thick foil is therefore placed as solder at the soldering point and the soldering process is then carried out at a temperature between 650 and 750 ° C. It is also known to produce a contact arrangement for a vacuum interrupter by soldering a contact carrier to a contact piece, a solder material being arranged between these joining parts and melting in a vacuum, the joining parts being pressed against one another.
  • DE 199 02 500 AI discloses a method for producing a contact arrangement for a vacuum holding tube, in which the contact piece is pressed flat against the contact carrier directly before assembly. Before the actual joining process, which is carried out at high temperatures, the solder material is arranged directly adjacent to the gap, so that the solder material is melted under vacuum by supplying heat and penetrates into the gap between the contact carrier and contact piece in the liquid state. With this method, too, the appropriate positioning of the solder with respect to the connection points of the components to be joined is complex and cost-intensive in view of the precise design of the parts to be joined.
  • the object of the invention is therefore to improve the method mentioned at the outset so that an expensive positioning of a separate solder at the connection point of the parts to be joined or a complex design of the parts to be held together to hold the parts to be joined when assembling is superfluous.
  • the invention achieves this object in that a silver layer is applied to the joining part and a copper layer is applied to the counterpart, or in that a silver layer is applied to the joining part and the counterpart consists of copper, the joining part and the counterpart being used to form the Contain silver and copper Alloy are in contact with each other during the joining process.
  • the invention achieves the object in that a copper layer and a silver layer are applied to the joining part, the joining part and the counterpart being joined together by the alloy containing silver and copper components being in contact with one another during the joining process.
  • the metals required to form the alloy are applied as firmly adhering layers to the joining part before the actual joining process, which is carried out at high temperatures and under a vacuum or a protective gas atmosphere.
  • a vacuum or a protective gas atmosphere For example, nitrogen, argon or the like can be used as the protective gas.
  • the shielding gas used should advantageously have a low dew point.
  • the pressure of the vacuum is expediently not greater than 10 "4 mbar.
  • a complex positioning of a separate solder during the joining process, for example in the form of a film, is thus dispensed with and simplifies the joining process.
  • the alloy required for connecting the joining parts is formed by diffusion and melting the applied metal layers or the surface layer of a counterpart made of copper.
  • the copper and silver layers can expediently be arranged directly adjacent to one another during the joining process.
  • the silver layer is applied as the outermost layer on a copper layer or swept a copper layer as the outermost layer on one
  • a further third metal layer for example a titanium layer, can be applied between the layers of silver and copper.
  • the third metal layer would then be an outermost layer, which would be formed either on the silver layer of the joining part or on the copper layer of the counterpart.
  • the third metal layer would be applied between the silver layer and the copper layer. The one developing in these cases
  • alloy contains not only silver and copper parts but also parts of the third metal.
  • the temperatures set during the joining process are below the melting temperatures of silver and copper, which are 961 ° C for silver and 1083 ° C for copper. During the joining process, there is therefore a diffusion-related mixing of silver and copper and possibly the third metal before the layers melt.
  • Such alloys have a reduced melting point compared to pure metals.
  • the melting point of an alloy consisting only of silver and copper assumes its lowest value at approximately 780 ° C. If the temperatures set during the joining process at the contact point between the joining parts are in the range of 780 ° C., liquid phases with a composition of the copper-silver eutectic are therefore preferably generated.
  • the counterpart consists of copper or has a copper layer applied before the joining process.
  • the counterpart is by no means necessary that the counterpart is made of copper. More appropriate
  • Manufacturing materials of the counterpart are, for example
  • the invention in particular simplifies the manufacturing process of vacuum interrupters, since in these cases, on the one hand, high demands are placed on the connection points between the joining part and the counterpart, on the other hand the mutual holding of the joining parts to one another and the additional solder arrangement are made more difficult due to the complex structure of the joining parts.
  • connections according to the invention are formed only in the immediate vicinity of the applied layers or at the contact point of the parts to be joined. According to the invention, there is no running of an external solder into a contact gap.
  • the silver layer is applied as an outermost layer on a copper layer.
  • an outermost layer is to be understood as the layer which is applied as the last layer before the joining process under vacuum or under protective gas and temperatures in the range of the melting point of the alloy to the joining part or the counterpart and which is facing and in contact with the counterpart or the joining part during the joining process.
  • the copper layer and the silver layer are arranged adjacent to one another during the joining process. The formation of an alloy consisting solely of silver and copper is therefore preferred.
  • the counterpart consists of copper or a copper layer has, the silver layer with a thickness of 10 to
  • the setting of the thickness of the silver layer depends on the selected application method and can be set, for example, in the case of galvanic processes via the current density and the duration. In the context of the invention, however, the metal layer can also be applied by rolling on a metal foil of the desired thickness or by flame spraying.
  • the copper layer and the silver layer are applied with a thickness of 10-100 ⁇ m.
  • the setting of the respective layer thickness depends on the application method chosen in each case. According to the invention, however, it is by no means necessary for the layer thicknesses of the silver and copper layers to be the same. Rather, the procedural adjustment of the layer thickness should take place with regard to the desired composition of the alloy. For example, if an alloy containing only silver and copper parts is to be produced, the composition of which corresponds to the eutectic, the ratio of the layer thicknesses should essentially correspond to the mixing ratio of the metals in the eutectic. In this sense, it would be advantageous, for example, to apply an approximately 70 ⁇ m thick silver layer and an approximately 30 ⁇ m copper layer.
  • a gold layer for activating the stainless steel part is applied as the innermost metal layer in both variants of the invention.
  • the gold layer is applied first and directly to the joining part or the counterpart, which is then advantageously made of stainless steel. Deviating from this However, activation with other layers, for example a nickel layer, is also possible.
  • the gold layer has a thickness between 0.2 ⁇ m and 10 ⁇ m.
  • All metal layers are expediently applied galvanically.
  • Other application methods are carried out, for example, by rolling a metal foil or flame spraying the desired metals.
  • the joining part is a stainless steel part.
  • a stainless steel part is degreased, subjected to a suitable cleaning process and finally rinsed with water. This is followed by the application of a 1 ⁇ m gold layer to activate the surface of the stainless steel by immersing it in a commercially available gold bath under electrolysis conditions. After rinsing again with water, a 20 ⁇ m thick silver layer is applied by immersing it in a commercially available silver bath under electrolysis conditions.
  • the stainless steel part pretreated in this way is then brought together with a copper part and the joining parts are exposed to a vacuum of less than 10 ⁇ 4 mbar, the temperature being set to the working temperature of the copper-silver eutectic.
  • a vacuum less than 10 ⁇ 4 mbar
  • the temperature being set to the working temperature of the copper-silver eutectic.
  • a 1 ⁇ m thick gold layer, then a 30 ⁇ m thick copper layer and finally a 70 ⁇ m thick silver layer are applied to the stainless steel part as a joining part, as described above. This is followed by several rinsing processes.
  • the coated stainless steel part and an uncoated stainless steel part are exposed to a vacuum of less than 10 ⁇ 4 mbar and the working temperature of the silver-copper eutectic, which are in contact with one another during this joining process, so that the melting of the Copper and silver layer and their diffusion-related mixing an alloy is formed with the composition of the copper-silver eutectic.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un procédé d'assemblage d'un élément de jointage destiné à être assemblé à un contre-élément au moyen d'un alliage contenant de l'argent et du cuivre, selon lequel au moins une couche métallique est appliquée sur l'élément de jointage avant assemblage, et un processus d'assemblage est effectué sous vide ou sous une atmosphère de gaz inerte à une température de 650 à 900 °C. L'invention vise à s'affranchir d'un positionnement délicat d'alliage d'apport séparé sur la zone d'assemblage des éléments, ou d'une conception complexe des éléments ou de l'alliage fondu. A cet effet, une couche d'argent est appliquée sur l'élément de jointage, et une couche de cuivre est appliquée sur le contre-élément, ou ce dernier est réalisé en cuivre, lesdits éléments étant en contact lors du processus d'assemblage pour la formation de l'alliage contenant de l'argent et du cuivre. Dans un autre mode de réalisation, une couche d'argent et une couche de cuivre sont appliquées sur l'élément de jointage, l'élément de jointage et le contre-élément étant en contact lors du processus d'assemblage au moyen de l'alliage contenant de l'argent et du cuivre.
PCT/DE2003/001321 2002-05-21 2003-04-16 Procede d'assemblage d'un element de jointage destine a etre assemble a un contre-element au moyen d'un alliage contenant de l'argent et du cuivre WO2003097287A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10223242 2002-05-21
DE10223242.3 2002-05-21

Publications (1)

Publication Number Publication Date
WO2003097287A1 true WO2003097287A1 (fr) 2003-11-27

Family

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Family Applications (1)

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PCT/DE2003/001321 WO2003097287A1 (fr) 2002-05-21 2003-04-16 Procede d'assemblage d'un element de jointage destine a etre assemble a un contre-element au moyen d'un alliage contenant de l'argent et du cuivre

Country Status (1)

Country Link
WO (1) WO2003097287A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007048299A1 (de) * 2007-10-08 2009-04-09 Behr Gmbh & Co. Kg Mehrschichtlot
CN102069253A (zh) * 2010-12-29 2011-05-25 哈尔滨电机厂有限责任公司 水冷汽轮发电机水循环系统水接头与连接块钎焊工艺
US8961144B2 (en) 2011-06-30 2015-02-24 General Electric Company Turbine disk preform, welded turbine rotor made therewith and methods of making the same
DE102009053666B4 (de) * 2008-11-18 2015-05-28 Nhk Spring Co., Ltd. Lötverfahren und Verbundbauteile, die mittels dieses Verfahrens verbunden sind

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB540961A (en) * 1940-11-05 1941-11-06 Cyril Lawrence George Ashby Improvements in and relating to the hard soldering of copper and copper-base articles
GB609490A (en) * 1944-07-24 1948-10-01 Joseph Kinney Jr Improvements in or relating to multi-ply metal stock and method of making same
GB931672A (en) * 1958-10-29 1963-07-17 Emi Ltd Improvements in or relating to a method of securing gems to metal members
US3560172A (en) * 1968-05-31 1971-02-02 Honeywell Inc Iron-silicon magnetostrictive laminated material and elements
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
DE4026394A1 (de) * 1990-08-21 1992-02-27 Kernforschungsz Karlsruhe Verfahren zur herstellung einer loettechnischen verbindung zwischen beryllium und edelstahl
US5156322A (en) * 1988-07-22 1992-10-20 Hoechst Ceramtec Aktiengesellschaft Process for the production of a solder coating on metallized materials
EP0810051A1 (fr) * 1996-05-31 1997-12-03 Peter Märzheuser Elément de liaison ainsi que sa fabrication

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB540961A (en) * 1940-11-05 1941-11-06 Cyril Lawrence George Ashby Improvements in and relating to the hard soldering of copper and copper-base articles
GB609490A (en) * 1944-07-24 1948-10-01 Joseph Kinney Jr Improvements in or relating to multi-ply metal stock and method of making same
GB931672A (en) * 1958-10-29 1963-07-17 Emi Ltd Improvements in or relating to a method of securing gems to metal members
US3560172A (en) * 1968-05-31 1971-02-02 Honeywell Inc Iron-silicon magnetostrictive laminated material and elements
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
US5156322A (en) * 1988-07-22 1992-10-20 Hoechst Ceramtec Aktiengesellschaft Process for the production of a solder coating on metallized materials
DE4026394A1 (de) * 1990-08-21 1992-02-27 Kernforschungsz Karlsruhe Verfahren zur herstellung einer loettechnischen verbindung zwischen beryllium und edelstahl
EP0810051A1 (fr) * 1996-05-31 1997-12-03 Peter Märzheuser Elément de liaison ainsi que sa fabrication

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007048299A1 (de) * 2007-10-08 2009-04-09 Behr Gmbh & Co. Kg Mehrschichtlot
DE102009053666B4 (de) * 2008-11-18 2015-05-28 Nhk Spring Co., Ltd. Lötverfahren und Verbundbauteile, die mittels dieses Verfahrens verbunden sind
CN102069253A (zh) * 2010-12-29 2011-05-25 哈尔滨电机厂有限责任公司 水冷汽轮发电机水循环系统水接头与连接块钎焊工艺
US8961144B2 (en) 2011-06-30 2015-02-24 General Electric Company Turbine disk preform, welded turbine rotor made therewith and methods of making the same

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