WO2003044507A1

WO2003044507A1 - Inspecting method for end faces of brittle-material-made substrate and device therefor

Info

Publication number: WO2003044507A1
Application number: PCT/JP2002/012032
Authority: WO
Inventors: Hideaki Funada; Hiroaki Yoshimura
Original assignee: Mitsuboshi Diamond Industrial Co., Ltd.
Priority date: 2001-11-20
Filing date: 2002-11-18
Publication date: 2003-05-30
Also published as: AU2002349646A1; KR20040044410A; JPWO2003044507A1; TW200300493A; KR100565413B1; JP3875236B2; CN1537227A; TWI232931B; CN1261751C

Abstract

An inspecting device for the end faces of a brittle-material-made substrate, comprising light sources (16a, 17a, 16b, 17b) for applying light beams to the end faces (Va, Vb) of the brittle-material-made substrate (2) placed horizontally on a table (1) moving in a specified direction, and a quantity-of-light detecting means (14a, 15a, 14b, 15b) for receiving light beams reflected from the end faces (Va, Vb) of the substrate (2), whereby the device judges the end faces (Va, Vb) of the substrate (2) have a chip when the light quantity of a received reflected beam is above a specified upper limit or below a specified lower limit.

Description

Method and apparatus for inspecting the end surface of a brittle material substrate

The present invention relates to a method and apparatus for inspecting an end face of a brittle material substrate. Background art

A liquid crystal display panel is usually formed by providing a liquid crystal layer between liquid crystal panel substrates which are a pair of glass substrates. A large number of wires are provided on the surface of one liquid crystal panel substrate, and electrode terminals of the wires are provided on the surfaces of the side edges adjacent to each other. A plurality of such liquid crystal panel substrates can be manufactured at the same time by dividing a large area liquid crystal panel substrate.

A glass substrate, which is a kind of brittle material substrate, is scribed along the scribe line by forming a scribe line on the glass surface by a scribing device and then applying a bending moment to the glass substrate by a breaking device. A plurality of liquid crystal panel substrates are simultaneously manufactured by dividing the liquid crystal panel substrate as well. In addition, wiring and electrode terminals are provided in advance in the respective regions of the liquid crystal panel substrate to be divided, and the wiring and electrode terminals are provided at the end of the liquid crystal panel substrate which is divided. It is formed.

When manufacturing such a liquid crystal panel substrate by dividing such a bulky liquid crystal panel substrate, when a chipping occurs on the end face of the liquid crystal panel substrate which has been cut, this chipping causes a previously provided electrode terminal or a post process There is a possibility that the electrode terminal manufactured at will be damaged. In addition, if this chip develops into a shell-like crack (chip pattern), there is a risk that the electrode terminal provided on the liquid crystal panel substrate may be cut. Thus, when a liquid crystal display panel is manufactured using a liquid crystal panel substrate having a defect at its end face, Since the manufactured liquid crystal display panel does not operate properly and becomes a defective product, there is a problem that the yield is lowered and the manufacturing cost of the liquid crystal display panel is increased.

In order to prevent such a problem, when the liquid crystal panel substrate is manufactured by dividing the liquid crystal panel substrate, a defect on the end face of the liquid crystal panel is generated before the manufactured liquid crystal panel substrate is transported to a later step. It is important to discover the presence or absence.

Conventionally, after manufacturing a liquid crystal panel substrate by dividing a maza-I liquid crystal panel substrate, the presence or absence of a chipping or the like on the end face of the liquid crystal panel substrate is inspected visually. There is a risk of missing a minute chip or the like on the edge of the panel substrate. In addition, an inspector is required to visually check the side edge portion of the liquid crystal panel substrate, which is a factor that increases the manufacturing cost of the liquid crystal display panel.

With respect to such inspection method, a method is also considered in which a portion near the end face of the liquid crystal panel substrate is imaged by an imaging device and image processing is performed on the imaged image data to inspect the presence or absence of defects such as chipping. It is done. However, in order to detect the presence or absence of a defect such as a chip by such a method, it is necessary to three-dimensionally process the image data, and moreover, the shape of the chip or the like which is regarded as a defect is not uniform. There is a problem that an inexpensive inspection device can not be realized because it is not easy to judge the quality by the image data.

The present invention solves such problems, and provides a novel inspection method and apparatus capable of automatically detecting the presence or absence of a defect such as a chipping on the end face of a brittle material substrate. To aim. Disclosure of the invention

The inspection apparatus of the present invention comprises a table on which a brittle material substrate is placed horizontally, a table moving means for moving the table in a predetermined direction, and a table horizontal rotating means for rotating the table along the horizontal direction. Irradiating the end face portion of the brittle material substrate with light; A light source for detecting the amount of light reflected by the light source and received by the light source and reflected by the end face of the brittle material substrate; And determining means for determining the quality of the end face portion, thereby achieving the above object.

In the determination means, an upper limit value and a lower limit value of the light amount of the reflected light received by the light amount detection means are set in advance, and the light amount of the reflected light received by the light amount detection means exceeds the upper limit. Alternatively, when the value is below the lower limit value, it is determined that the end face portion of the brittle material substrate is a quality defect.

The determination means is characterized by distinguishing types of quality defects of the end face portion of the brittle material substrate.

The light source comprises: a first light source for emitting light in a direction perpendicular to the end face of the brittle material substrate; and a second light source for irradiating obliquely from both sides of the end face of the brittle material substrate The light quantity detection means detects a light quantity of light reflected from an end face of the brittle material substrate when the end face of the brittle material substrate is irradiated with light by the first light source. And a second light quantity detection means for detecting the light quantity of the reflected light from the end face of the brittle material substrate when the end face of the brittle material substrate is irradiated with light by the second light source; It is characterized in that at least one of the first light amount detecting means and the second light amount detecting means is used.

The light quantity detection means is a CCD camera.

The light quantity detection means is a light receiving element.

Imaging means for capturing the image data of the two sides forming the corner of the brittle material substrate and capturing the image data of the two sides forming the corner of the brittle material substrate, and based on the image data, It is characterized in that the position of the corner is recognized.

The imaging means is a CCD camera.

The inspection method of the present invention is a method of determining the quality of the end face portion of a brittle material substrate, and irradiating the end face portion with light so as to move relatively along the end face portion. And receiving the reflected light from the end face, and determining the quality of the end face based on the amount of light of the received reflected light, thereby achieving the above object. Be done.

In the determination step, when the upper limit value and the lower limit value of the light amount of the received reflected light are set in advance, and the light amount of the received reflected light exceeds the upper limit value or when the lower limit value is exceeded. It is characterized in that it is a step of judging that the end face portion of the brittle material substrate is poor in quality.

The determining step may further include the step of discriminating the type of the quality defect of the end face portion of the brittle material substrate.

The step of irradiating includes: a first irradiating step of irradiating light in a direction perpendicular to the end face portion of the brittle material substrate; and a second step of irradiating light in an oblique direction from both sides of the end face portion of the brittle material substrate The step of irradiating the light, wherein the step of receiving the light comprises the step of irradiating the end face portion of the brittle material substrate with light in the first irradiating step, the reflected light from the end face portion of the brittle material substrate When the end face portion of the brittle material substrate is irradiated with light by the first light receiving step for receiving the light quantity of light and the second irradiating step, the reflection of the light to be irradiated from the end face portion of the brittle material substrate A second light receiving step of receiving a light quantity of light, wherein at least one of the first light receiving step and the second light receiving step is performed. The step of receiving light is performed by a CCD camera. The light receiving step may be performed by a light receiving element.

Imaging the two sides forming the corner of the brittle material substrate and capturing image data of the two sides forming the corner of the brittle material substrate; and based on the image data, the corner of the brittle material substrate And a step of recognizing the position of.

The step of capturing the image data of the two sides may be performed by a CCD camera. Brief description of the drawings

FIG. 1 is a perspective view used to explain the detection principle of the present invention.

FIG. 2 is a perspective view of an inspection apparatus for inspecting an end face of a brittle material substrate according to an embodiment of the present invention.

FIG. 3 is a flow chart showing the control operation of the inspection apparatus of FIG. FIG. 4 is a flowchart showing details of step S14 in the flowchart of FIG.

FIG. 5 is a diagram showing a method of detecting a corner of a brittle material substrate.

FIG. 6 is a diagram showing a histogram showing the amount of light reflected from the end face of the brittle material substrate.

FIG. 7 is a view showing the positional relationship between the LED light source and the brittle material substrate used in the embodiment of the present invention.

FIG. 8 a is a view showing the positional relationship between a transmission light source used in one embodiment of the present invention and a transparent brittle material substrate to be inspected.

FIG. 8 b is a view showing the positional relationship between the transmission light source used in one embodiment of the present invention and the transparent brittle material substrate to be inspected. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIG. 1 is a perspective view showing the principle of detecting the chipping of the end face of the brittle material substrate of the present invention. In the inspection method of the present invention, an LED light source 1 0 2 which irradiates a spot light 1 0 3 to an end face portion of a glass plate 1 1 0 1 which is a brittle material substrate moving at a constant speed in the arrow A direction A CCD camera 104 is used which emits light from the light source 102 and receives light reflected from the end face of the glass plate 101. The light from the end surface of the glass plate 101 is used by the CCD camera 104. The amount of reflected light is detected. Missing at end face of glass plate 101 If there is an injury, when the light emitted from the LED light source 102 is reflected by the chip, the amount of light reflected may be slightly reduced as compared with other parts where the chip does not exist, or vice versa. To increase.

Actually, when the end face portion of the glass plate 101 was irradiated with light from the light source 102 and the amount of the reflected light was detected, the chipping is a part where the amount of the reflected light is almost constant. Although it does not exist, in places where the amount of light of the reflected light significantly increases and where the amount of light significantly decreases, both are locations where chips are present. Therefore, the upper limit value and the lower limit value of the reflected light emitted from the LED light source 102 and reflected by the end face of the glass plate 101 are set in advance, and the upper limit for which the reflected light from the end face is set It is possible to judge that the end face has a chip (the end face is poor in quality) when it is further exceeded and below the lower limit value.

FIG. 2 is a perspective view showing an inspection apparatus 50 of an end surface portion of a brittle material substrate according to an embodiment of the present invention. The table 1 is disposed on the moving base 4 so as to fix the brittle material substrate 2 by vacuum suction, and can be rotated horizontally (in the direction indicated by the arrow)) on the moving base 4 by the servomotor 3 It has become. The movement base 4 is moved along the two rails 7 in the direction indicated by the arrow X by means of the servomotor 5 and the pole screw 6 pivoted thereby.

The bridge plate 9 supported by the columns 8 on both sides extends in the direction indicated by the arrow Y so as to straddle the rail 7. On the bridge plate 9, there is provided a movement base 12a which moves in the Y direction by means of the servo motor 10a and a pole screw 11a which is pivoted thereby. The moving base 12 a is provided with an inspection instrument mounting plate 13 a that extends in the X direction perpendicular to the slide plate 9 in a vertical state. In the same configuration as described above, a moving base 12 b moving in the Y direction is provided, and the moving base 12 b is an inspection that extends in the X direction perpendicular to the bridge plate 9 in a vertical state. Equipment mounting plate 13 b is provided.

One end face portion V a of the brittle material substrate 2 is attached to the inspection device mounting plate 13 a. For imaging, a pair of first CCD cameras 14a and second CCD cameras 15a, each of which is directed downward, are mounted side by side with appropriate spacing along the X direction. The lower end of the first CCD camera 14a provided on the far side of the ridge plate 9 has a “mouth” so as to surround the lower end of the first CCD camera 14a over the entire circumference so as to illuminate the imaging area from above. The first LED light source 16a arranged in the shape of "" is attached. The first LED light source 16a emits light coaxially with the optical axis of the first CCD camera 14a.

The imaging area of the second CCD camera 15a disposed in proximity to the bridge plate 9 is respectively illuminated by the light emitted from the pair of second LED light sources 17a having a predetermined length in the X direction. It is getting better. Each second LED light source 17a is attached to the inspection instrument mounting plate 13a by a suitable support member, and the above-mentioned brittle material substrate 2 which is the imaging area of the second CCD camera 15a. The end face V a is illuminated from both sides. As each second LED light source 17 a, for example, a white LED is used, but if it is a light source that can obtain the brightness necessary for imaging the end face portion Va of the brittle material substrate 2, There is no limit.

The other inspection instrument mounting plate 13 b includes a pair of third CCD cameras 14 b and a fourth CCD camera 1 respectively directed downward to image the other end face Vb of the brittle material substrate 2. 5b are mounted side by side with appropriate spacing along the X direction. The lower end of the third CCD camera 14 b provided on the far side of the plate 9 is surrounded by the lower end of the third CCD camera 14 b so as to illuminate the imaging area from above. The 3rd LED light source 16b arranged in a "mouth" shape is attached. The third LED light source 16 b emits light coaxially with the optical axis of the third CCD camera 14 b.

The imaging region of the fourth CCD camera 15b disposed in proximity to the bridge plate 9 is illuminated by the light emitted from the pair of fourth LED light sources 17b having a predetermined length in the X direction. It is getting better. Each fourth LED light source 1 7 b has a suitable support Depending on the material, it is attached to the inspection instrument attachment plate 13 b and illuminates the end face portion V b of the brittle material substrate 2 which is the imaging region of the fourth CCD camera 15 b from both sides. As each fourth LED light source 17 b, for example, a white LED is used, but the light source can be limited as long as it is a light source that can obtain the brightness necessary for imaging the end face U of the brittle material substrate 2. There is nothing to do.

FIG. 3 shows a flowchart of the operation of the examination device 50, and the operation of the inspection device 50 will be described below according to the flowchart.

When the inspection is performed by the inspection apparatus 50, first, initial settings from step S1 to step S5 are performed.

In step S1, the first CCD camera 14a, the third CCD camera 14b, the second

The exposure time of the CCD camera 15a and the fourth CCD camera 15b is set, and in step S2, the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a and the fifth 4 Set the number of scan lines (default: eg 480) for the CCD camera 15b. In step S3, the fields of view of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b are set. Here, the field of view of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a and the fourth CCD camera 15b is the first CCD camera 14a, the third CCD camera 14b The second CCD camera 15a and the fourth CCD camera 15b are arbitrarily set within the range of the resolution of the camera itself (for example, 512 pixels x 480 pixels).

In step S4, various parameters necessary for processing the image data captured by the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b are set. Do. In step S5, the machine parameters necessary for automatically operating the inspection device 50 are set.

After the initial setting of the inspection device 50 is completed, in step S6, the automatic operation of the inspection device 50 is started. LED light source 16a, 16b, 1 7a and 1 7b It lights up to illuminate the imaging region of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a and the fourth CCD camera 15b. The spot sizes of these light sources are large enough to sufficiently cover the imaging region of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b. That is, the imaging area is illuminated with the brightness necessary for the CCD camera to image the imaging area and capture the image data of the imaging area with the accuracy necessary for the inspection by these light sources. In the next step S7, the brittle material substrate 2 is placed on the table 1 by the transfer port pot (not shown), and is fixed by suction. In step S8, drive the servomotor 3 and the servomotor 5 to image the corners C a and C b of the brittle material substrate 2 by the four CCD cameras 14 and 14 b or 15 a and 15 b. The table 1 on which the brittle material substrate 2 to be inspected is fixed by suction is positioned.

In step S9, the image data of the end face portion of the brittle material substrate 2 imaged using the four CCD cameras 14a and 14b or 15a and 15b is image-processed, and the end face portion of the brittle material substrate 2 is By performing image recognition, two sides of each of the two corners C a and C b of the brittle material substrate 2 are determined in a rectangular range. FIG. 5 is a diagram showing that, in step 9, two sides forming one of the two corners C a and C b of the brittle material substrate 2 are image-recognized within a rectangular range. is there. The image data is captured by the CCD camera as a line of pixels instead of pixels.

In step S10, two sides forming the corner C a are determined, the two sides are linearly approximated by calculation, the intersection of the two straight lines is calculated, and the position of one corner C a is recognized. In step S11, two sides forming the corner Cb are indicated, the two sides are linearly approximated by calculation, the intersection of the two straight lines is calculated, and the position of the other corner Cb is recognized. Ru.

Then, in step S12, Table 1 is a brittle material substrate to be inspected 2 The alignment is performed by rotating in the vertical direction by means of the servomotor 3 so that the end face of the head coincides with the moving direction of the table 1. Then, in step S13, the table 1 is moved in the X direction along the two rail ridges at a predetermined speed by the pole screw 6 rotated by the drive of the servo motor 5. While the table 1 moves in the X direction at a predetermined speed, in step 14 two sets of inspection devices, ie, the first inspection device (10a to l7a) and the second inspection device (10b) The both end portions V a and V b of the brittle material substrate 2 are inspected by ~ 17 b).

FIG. 4 is a flowchart showing the details of the inspection in step S14. The details of the inspection in step S14 will be described below with reference to the flowchart of FIG.

In step S51, the brittle material substrate 2 on the moving table 1 is imaged with the first CCD camera 14a and the second CCD camera 15a to image the end portion Va of the brittle material substrate 2 Then, image data of the end face portion Va of the brittle material substrate 2 is taken in, and this image data is subjected to image processing. The imaging areas of the first CCD camera 14 a and the second CCD camera 15 a are, for example, 0.5 mn! ~ 2 mm. Similarly, in parallel with capturing of the images of the first CCD camera 14a and the second CCD camera 15a, the third CCD camera 14b and the fourth CCD camera 15b perform the same capturing of images.

In step S52, it is determined whether the table 1 has moved by a predetermined distance (for example, a length 40 mm corresponding to the imaging range). If it is determined that the table 1 has moved the predetermined distance, the process proceeds to step S53. If it is determined that the table 1 has not moved the predetermined distance, the steps S 51 and S 52 are repeated until it moves the predetermined distance (40 mm), and the first CCD camera 14 a and the second CCD camera 15 a are used. The end surface portion Va of the brittle material substrate 2 is imaged, image data of the end surface portion Va of the brittle material substrate 2 is taken in, and this image data is subjected to image processing. Also, at the same time, brittle materials are obtained by the third CCD camera 14 b and the fourth CCD camera 15 b. The end surface portion Vb of the substrate 2 is imaged, the image data of the end surface portion Vb of the brittle material substrate 2 is taken in, and this image data is subjected to image processing.

In step S53, the image data of the end surface portion V a of the brittle material substrate 2 over the predetermined distance (40 mm length) captured by the first CCD camera 14 a and the second CCD camera 15 a is compared with the end surface of the brittle material substrate 2 The presence or absence of chipping (quality of the end face) is judged. Similarly, with respect to the image data of the end face Vb of the brittle material substrate 2 over a predetermined distance (4 O mm length) captured by the third CCD camera 14b and the fourth CCD camera 15b, the end face of the brittle material substrate 2 The presence or absence of chipping (quality of the end face) is judged.

FIG. 6 is a diagram showing a histogram in which the amount of light reflected from the end face of the brittle material substrate 2 is displayed. In this histogram, the amount of light reflected from the end face of the brittle material substrate 2 processes the image data of the end face of the brittle material substrate 2 over a predetermined distance (40 mm long) captured by the CCD camera. Therefore, it is displayed as a concentration having a degree of gradation of 0 to 255 stages. The quality of the end face is determined based on the fact that the amount of light of the reflected light is between the determined maximum density, which is a predetermined upper limit, and the determined minimum density, which is a predetermined lower limit. That is, if the amount of light reflected from the end face portion is between the determination maximum density and the determination minimum density, it is determined that there is no abnormality in the end face portion, and the reflected light from the end face portion If the amount of light exceeds the judgment maximum density or falls below the judgment minimum density, it is judged that there is an abnormality at the end face.

When the quality of the end face portion of the brittle material substrate 2 is judged to be good or bad, the reflected light from the same portion of the end face portion of the brittle material substrate 2 imaged by the first CCD camera 14 a and the second CCD camera 15 a In some cases where both the light intensity is not between the judgment maximum density and the judgment minimum density, the end face of the brittle material substrate 2 imaged by the first CCD camera 14a and the second CCD camera 15a. In some cases, only one of the light amounts of the reflected light from the same place is not between the judgment maximum density and the judgment minimum density. Consider such a case The amount of light reflected from the same part of the end face of the brittle material substrate 2 captured by at least one of the first CCD camera 14a and the second CCD camera 15a If it is not between the density and the judged minimum density, it is judged that the quality of the end face portion is poor. Similarly, the amount of light reflected from the end face portion of the brittle material substrate 2 imaged by any one of the third CCD camera 14 b and the fourth CCD camera 15 b is between the judgment maximum density and the judgment minimum density. If not, it is determined that the quality of the end face portion is poor.

In step S 54, it is determined whether the scanning has been completed over the entire length of one side of the brittle material substrate 2. When scanning is not completed over the entire length of one side of the brittle material substrate 2, in step S51, generation of image data of the end face is performed again over the next predetermined distance (40 mm in length). Here, the judgment of the quality of the quality of the end face portion of the brittle material substrate 2 is divided into predetermined distance (40 mm long) because the table 1 is moved at a predetermined speed and collected at a predetermined distance (40 mm long) In the case of the selected schedule, the image determination can be performed within the movement time of the predetermined distance (40 mm long), and the movement speed and the predetermined distance of Table 1 are determined according to the processing capabilities of the image processing device and the sequencer. (In the explanation here, the set value of 40 mm length) can be changed. Further, when selecting an image processing apparatus and a CCD camera, the inspection capability of the inspection apparatus of the present invention and the moving speed of the table 1 depend on the memory of the selected image processing apparatus and the number of pixels of the CCD camera.

After the quality of the end face of the brittle material substrate 2 is judged to be poor in step 14, in step S15, the table 1 is rotated 90 ° and the table 1 is rotated 90 ° in response to the first inspection device (10a to l7a) and the second inspection device (10b to 17b) are moved to predetermined positions. Then, in step S16, the table 1 is started to move to a predetermined removal position, and then in step S17, the same inspection as in step S14 is performed on the end face of the remaining two sides. Ru.

In step S18, the table 1 is moved to the predetermined removal position after the inspection Do. Thereafter, in step SI9, the image data of the end face portion captured so far is reset, and in step S20, it is determined whether or not the brittle material substrate 2 to be inspected next is in a predetermined standby position. If the brittle material substrate 2 to be inspected next is in the predetermined standby position, the process returns to step S7, and the above-described series of inspections is repeated. If the brittle material substrate 2 to be inspected next is not in the predetermined standby position, the inspection ends.

As described above, an imaging means such as a CCD camera is required to recognize the corner of the brittle material substrate, but only the amount of light reflected from the edge of the brittle material substrate is detected to detect chipping at the edge. Instead of a CCD camera, it may be a simple light receiving element that is inexpensive, as long as it is only tested for its presence.

The present invention provides an inspection apparatus capable of detecting chipping of the end face of a brittle material substrate. In order to detect such chipping of the end face of the brittle material substrate, it is necessary to finely adjust the illumination angle and the like. In the present invention, the optical axes of the first LED light source 16a and the third LED light source 16b are made to substantially coincide with the imaging centers of the first CCD camera 14a and the third CCD camera 14b, and the second LED light source 17a, 17a, The end face of the brittle material substrate 2 is an angle of 30 ° to 60 ° (preferably, an angle of 30 ° to 45 °) with the surface of the brittle material substrate 2 as shown in FIG. By irradiating from both sides, it becomes possible to automatically detect the aforementioned chipping. Furthermore, as shown in Figs. 8a and 8b, when the lower surface of the transparent brittle material substrate 111 is irradiated from below with the transmission illumination 112, cracks and the like in the end surface portion and the inner surface of the transparent brittle material substrate are detected. be able to. FIG. 8 a is a side view showing the positional relationship between the transmitted illumination 1 12, the transparent brittle material substrate 11 1, and the CCD camera 1 13, and FIG. 8 b is a front view thereof. In the example shown in FIGS. 8A and 8B, the light passing through the transparent brittle material substrate 111 is inclined by about 60 ° in one direction with respect to the surface of the transparent brittle material substrate 111 in the CCD camera 1 13. It is configured to receive light.

Further, according to the inspection apparatus of the present invention, the light of the reflected light from the end face portion of the brittle material substrate is Based on the difference in concentration between the determination maximum concentration and the determination minimum concentration, the type of defect in quality of the end face of the brittle material substrate can be determined. The types of quality defects on the end face of brittle material substrates that can be determined include length measurement, chipping, edging, shell cracking, (when using the first LED light source 16a and the third LED light source 16b as light sources) In the case of using the second LED light source 17a and the fourth LED light source 17b as the light source, it may cause waviness, tearing of the seal of the bonded seal (in a brittle material substrate), cracking, etc. Egret, shellfish cracking, fracture residue, thin skin residue, (in the liquid crystal panel substrate), and so on. In addition, as a type of defect in quality of the end face portion of the transparent brittle material substrate that can be determined, when the camera is installed vertically to the transmission illumination as the light source, chipping, shell cracking, corner chipping, etc. may be mentioned. If the camera is installed at an angle to the transmitted light, which is the light source, cracks may occur. Industrial applicability

As described above, according to the present invention, the end face portion of the brittle material substrate is irradiated with light, and the light amount of the reflected light from the end face portion of the brittle material substrate exceeds the predetermined upper limit, and If it is lower than this, it is judged that there is a defect (defective quality) at the end face of the brittle material substrate, and the defect of the end face of the brittle material substrate is high, although the equipment configuration is relatively simple. It is possible to provide an inspection method and its device that can be detected with accuracy.

Claims

The scope of the claims

1. A table on which the brittle material substrate is placed horizontally,

Table moving means for moving the table in a predetermined direction;

Table horizontal rotation means for rotating the table along the horizontal direction, Light source for irradiating light to the end face of the brittle material substrate,

A light amount detection unit that receives light reflected by the light source and reflected from the end face of the brittle material substrate;

A determination unit that determines the quality of the end face based on the amount of light reflected by the end face received by the light amount detection means;

An inspection apparatus for a brittle material substrate end face portion comprising:

2. The upper limit value and the lower limit value of the light amount of the reflected light received by the light amount detection means are set in advance, and the light amount of the reflected light received by the light amount detection means is the upper limit value. The apparatus for inspecting an end face of a brittle material substrate according to claim 1, wherein the end face of the brittle material substrate is judged to be poor in quality when it exceeds or falls below the lower limit value.

3. The inspection apparatus for the brittle material substrate end face according to claim 1, wherein the judging means distinguishes types of quality defects of the end face of the brittle material substrate.

4. The light source comprises: a first light source for emitting light in a direction perpendicular to the end face of the brittle material substrate; and a second light source for emitting light obliquely from both sides of the end face of the brittle material substrate Have

The light quantity detection means comprises: a first light quantity detection means for detecting the quantity of light reflected from the end face of the brittle material substrate when the first light source irradiates light to the end face of the brittle material substrate; And a second light amount detection means for detecting a light amount of light reflected from the end face of the brittle material substrate when the end face of the brittle material substrate is irradiated with light by the second light source. Equipped

At least one light of the first light quantity detection means and the second light quantity detection means The inspection apparatus of the brittle material substrate end face portion according to any one of claims 1 or 2, characterized in that an amount detection means is used.

5. The inspection apparatus for an edge portion of a brittle material substrate according to claim 1, wherein the light amount detection means is a CCD camera.

6. The inspection apparatus of the end face portion of a brittle material substrate according to claim 1, wherein the light quantity detection means is a light receiving element.

7. An imaging means for imaging the two sides forming the corner of the brittle material substrate and capturing image data of the two sides forming the corner of the brittle material substrate, including: imaging means for capturing the brittle material substrate based on the image data The apparatus for inspecting an edge portion of a brittle material substrate according to claim 1, wherein a position of a corner is recognized.

8. The inspection apparatus for a brittle material substrate end face according to claim 7, wherein the imaging means is a CCD camera.

9. A method of determining the quality of the end face portion of a brittle material substrate,

Irradiating the end face with light so as to move relatively along the end face; receiving reflected light from the end face;

Determining the quality of the end face based on the amount of the received reflected light;

The inspection method of the brittle material substrate end face part characterized by including.

1 0. In the determining step, the upper limit value and the lower limit value of the light amount of the received reflected light are set in advance, and the light amount of the received reflected light exceeds the upper limit, or the lower limit value The method according to claim 9, wherein the end surface portion of the brittle material substrate is determined to be poor in quality when the temperature is less than.

11. The method of inspecting an edge portion of a brittle material substrate according to claim 9, wherein the step of determining further includes a step of discriminating types of quality defects of the edge portion of the brittle material substrate.

The step of irradiating includes: a first irradiating step of irradiating light in a direction perpendicular to the end face of the brittle material substrate; and irradiating light in a diagonal direction from both sides of the end face of the brittle material substrate And a second irradiating step,

The light receiving step is a first light receiving step for receiving the amount of light reflected from the end face of the brittle material substrate when the end face of the brittle material substrate is irradiated with light by the first irradiation step. A second step of irradiating the end face portion of the brittle material substrate with light by the second irradiating step, the second step of receiving the light quantity of the reflected light from the end face portion of the brittle material substrate of the irradiating light; Including the step of receiving light;

The method according to any one of claims 9 or 10, wherein at least one of the first light receiving step and the second light receiving step is performed.

The method according to claim 9, wherein the light receiving step is performed by a CCD camera.

The inspection method of the brittle material substrate end face portion according to claim 9, wherein the light receiving step is performed by a light receiving element.

15: Imaging the two sides forming the corner of the brittle material substrate and capturing image data of the two sides forming the corner of the brittle material substrate;

The method according to claim 9, further comprising the step of: recognizing the position of the corner of the brittle material substrate based on the image data.

16. The method of inspecting an edge portion of a brittle material substrate according to claim 15, wherein the step of capturing image data of the two sides is performed by a CCD camera.