CN119643450A - A green ceramic chip defect detection system and detection method - Google Patents
A green ceramic chip defect detection system and detection method Download PDFInfo
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- CN119643450A CN119643450A CN202411946194.4A CN202411946194A CN119643450A CN 119643450 A CN119643450 A CN 119643450A CN 202411946194 A CN202411946194 A CN 202411946194A CN 119643450 A CN119643450 A CN 119643450A
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Abstract
本发明属于缺陷检测技术领域，提供了一种生瓷片缺陷检测系统及检测方法，其中，检测系统包括平行面光源、透光载物基板、图像采集模块、控制模块和显示屏；透光载物基板设置在所述平行面光源的上方，用于放置所述生瓷片；图像采集模块设置在所述透光载物基板的上方，用于采集所述生瓷片的实时透光图像；控制模块用于接收所述实时透光图像，并将所述实时透光图像上的亮度值与标准透光图像上的亮度值进行比较，以判断所述生瓷片是否合格。本发明提供的一种生瓷片缺陷检测系统及检测方法，能提高检测结果的准确性，减少检测过程中对图像分析的运算量，从而提高了检测效率。
The present invention belongs to the technical field of defect detection, and provides a raw ceramic sheet defect detection system and detection method, wherein the detection system includes a parallel plane light source, a light-transmitting carrier substrate, an image acquisition module, a control module and a display screen; the light-transmitting carrier substrate is arranged above the parallel plane light source, and is used to place the raw ceramic sheet; the image acquisition module is arranged above the light-transmitting carrier substrate, and is used to acquire a real-time light-transmitting image of the raw ceramic sheet; the control module is used to receive the real-time light-transmitting image, and compare the brightness value on the real-time light-transmitting image with the brightness value on the standard light-transmitting image, so as to judge whether the raw ceramic sheet is qualified. The raw ceramic sheet defect detection system and detection method provided by the present invention can improve the accuracy of the detection result, reduce the amount of calculation of image analysis in the detection process, and thus improve the detection efficiency.
Description
Technical Field
The invention relates to the technical field of defect detection, in particular to a system and a method for detecting green ceramic chip defects.
Background
In multilayer ceramic electronic components manufactured by using multilayer ceramic cofiring technology, green ceramic chips are used as key raw materials, and the quality of the green ceramic chips directly affects the performance and reliability of the final product. After the production of the green ceramic chip is finished, the quality of the green ceramic chip is controlled generally, so that the defects of unevenness, holes, cracks or scratches and the like are avoided, and the subsequent processing and use of the ceramic chip are affected. The traditional detection mode is to put the product under a microscope, observe through the manual work, has the problems of complex operation, high detection intensity and low detection efficiency.
In the prior art, the invention with publication number CN118583875A discloses a system for detecting internal defects of a raw ceramic chip, the invention with publication number CN104677276A discloses a method for identifying and detecting small holes of the raw ceramic chip, and the prior art has the following problems:
1. The light source adopts divergent light, the shade size formed by the divergent light passing through the green ceramic chip is not in accordance with the actual size, and the projected contour shadow has larger error, thereby influencing the accuracy of the result;
2. In some use scenes, a plurality of round green ceramic tiles with different specifications and types are required to be cut from the cast rectangular green ceramic tiles, and when the prior art is utilized for defect detection, the defect detection is carried out on the whole rectangular green ceramic tile, so that the operation amount of image analysis is increased, and the detection efficiency is lower.
Disclosure of Invention
In view of the foregoing, it is an object of the present invention to provide a system and method for detecting green tile defects, which solves or at least alleviates one or more of the above-mentioned problems or other problems of the prior art.
The invention provides a green ceramic tile defect detection system which comprises a parallel surface light source, a light-transmitting object carrying substrate, an image acquisition module, a control module and a display screen, wherein the light-transmitting object carrying substrate is arranged above the parallel surface light source and used for placing the green ceramic tile, the image acquisition module is arranged above the light-transmitting object carrying substrate and used for acquiring a real-time light-transmitting image of the green ceramic tile, the control module is used for receiving the real-time light-transmitting image and comparing a brightness value on the real-time light-transmitting image with a brightness value on a standard light-transmitting image to judge whether the green ceramic tile is qualified or not, and the display screen is used for displaying judgment results of the real-time light-transmitting image and the control module.
The device comprises a control module, a parallel surface light source, a transparent carrying substrate, at least three first marking devices, a control module and a brightness value comparison module, wherein the first marking devices are arranged between the parallel surface light source and the transparent carrying substrate, the at least three first marking devices are distributed around the circumference of the transparent carrying substrate, the first marking devices are used for generating first optical marks on the green ceramic chips, the first marking devices are electrically connected with the control module, the control module is used for receiving the real-time transparent image, determining a circular detection area on the real-time transparent image according to the at least three first optical marks, and comparing the brightness value of the detection area with the brightness value on a standard transparent image to judge whether the green ceramic chips are qualified.
Further, the first marking device comprises a first mounting seat, a first motor, a first mounting arm and a first point light source, wherein the first motor is arranged on the first mounting seat, one end of the first mounting arm is sleeved on an output shaft of the first motor, and the first point light source is arranged at the other end of the first mounting arm.
Further, the device also comprises a second marking device arranged between the parallel surface light source and the light-transmitting object carrying substrate, the second marking device is electrically connected with the control module and is used for generating a movable second optical mark, and the second optical mark is used for marking the circle center position of the detection area.
Further, the second marking device comprises a second mounting seat, a second motor, a second mounting arm, a third motor, a third mounting arm and a second point light source, wherein the second motor is arranged on the second mounting seat, one end of the second mounting arm is sleeved on an output shaft of the second motor, the third motor is arranged at the other end of the second mounting arm, one end of the third mounting arm is sleeved on an output shaft of the third motor, and the second point light source is arranged at the other end of the third mounting arm.
Further, the light-transmitting box comprises a box body with an open top, wherein the parallel surface light source, the first mounting seat and the second mounting seat are arranged in the box body, and the light-transmitting object-carrying substrate is arranged at the open top of the box body.
Further, the color and/or brightness of the first point light source is different from that of the parallel surface light source, and the color and/or brightness of the second point light source is different from that of the parallel surface light source.
In a second aspect, the present invention provides a method for detecting a defect of a green tile, comprising the steps of:
irradiating the green ceramic chip and generating at least three first optical marks on the surface of the green ceramic chip;
acquiring a real-time light transmission image of a green ceramic tile, wherein the real-time light transmission image comprises at least three first optical marks;
Determining a circular detection area on the real-time light transmission image based on the at least three first optical marks;
And comparing the brightness value of the detection area with the brightness value on the standard light-transmitting image to judge whether the green ceramic tile is qualified or not.
Further, the method also comprises the following steps:
And if the detection result of the green ceramic chip is qualified, generating a second optical mark at the center of the detection area.
The invention has the beneficial effects that:
1. according to the system and the method for detecting the defects of the raw ceramic chips, provided by the invention, the raw ceramic chips are irradiated by using the parallel surface light source, so that the shadow area on the back of the detected raw ceramic chips presents high-precision dimension and clear edge contour contrast, and the accuracy of a detection result is improved;
2. According to the system and the method for detecting the defects of the raw ceramic chips, provided by the invention, the first optical marks are generated through the at least three first marking devices, so that the detection area can be rapidly determined, and then, only the images in the detection area are compared and analyzed, so that the operation amount of image analysis is reduced, and the detection efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.
FIG. 1is a perspective view of a system for detecting defects of green ceramic chips according to an embodiment of the present invention;
FIG. 2 is a perspective view of a portion of the structure of FIG. 1;
FIG. 3 is a perspective view of a portion of the structure of FIG. 2;
FIG. 4 is a schematic view of the first marking device;
FIG. 5 is a flowchart of a method for detecting defects of green ceramic chips according to an embodiment of the present invention;
FIG. 6 is a flowchart of a method for detecting defects of green ceramic chips according to another embodiment of the present invention;
FIG. 7 is a flowchart of a method for detecting defects of green tiles according to another embodiment of the present invention;
reference numerals:
10. A parallel surface light source; 11, a light-transmitting object carrying substrate, 12, an image acquisition module, 13, a box body;
20. A first marking device; 21, a first mounting seat, 22, a first motor, 23, a first mounting arm, 24, a first point light source;
30. A second marking device; 31, a second mounting seat, 32, a second motor, 33, a second mounting arm, 34, a third motor, 35, a third mounting arm, 36 and a second point light source.
Detailed Description
Embodiments of the technical scheme of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and thus are merely examples, and are not intended to limit the scope of the present invention.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
As shown in fig. 1 to 4, the present embodiment provides a green tile defect detection system, which includes a parallel surface light source 10, a light-transmitting carrier substrate 11, an image acquisition module 12, a control module (not shown in the drawings), and a display screen (not shown in the drawings).
The parallel surface light source 10 is used for providing a parallel surface light source, the range of the surface light source is larger than or equal to the dimension of the green ceramic tile to be detected, and the parallel surface light source 10 is preferably a high-brightness parallel surface light source 10. The light-transmitting carrier substrate 11 is disposed above the parallel surface light source 10, the light-transmitting carrier substrate 11 is used for placing green ceramic chips, and the light-transmitting carrier substrate 11 may be a glass plate. The image acquisition module 12 is arranged above the light-transmitting object carrying substrate 11 and is used for acquiring real-time light-transmitting images of the raw ceramic tiles, and the image acquisition module 12 is a camera. The control module is electrically connected with the image acquisition module 12 and is used for receiving the real-time light transmission image and comparing the brightness value on the real-time light transmission image with the brightness value on the standard light transmission image to judge whether the green ceramic tile is qualified or not. The display screen is used for displaying the real-time light-transmitting image and the judging result of the control module.
In this embodiment, the parallel surface light source 10 irradiates the green ceramic tile, so that the shadow area at the back of the inspected green ceramic tile presents high-precision size and clear edge profile contrast, the accuracy of the detection result is improved, and the image capturing technology and the optical processing technology are used for processing and screening the back optical information, so that the qualified green ceramic tile is better screened.
In one embodiment, the light transmissive carrier substrate 11 further comprises at least three first marking devices 20 disposed between the parallel surface light source 10 and the light transmissive carrier substrate 11, and the at least three first marking devices 20 are distributed around the circumference of the light transmissive carrier substrate 11. The first marking device 20 is used for generating a first optical mark on the green ceramic tile, and the first marking device 20 is electrically connected with the control module. The control module is used for receiving the real-time light-transmitting image, determining a circular detection area on the real-time light-transmitting image according to the at least three first optical marks, and comparing the brightness value of the detection area with the brightness value on the standard light-transmitting image to judge whether the green ceramic tile is qualified or not.
In this embodiment, the at least three first optical marks are all generated under the control of the control unit, so that the detection area with a circular shape is determined by the at least three first optical marks, and the imaging size of the first optical marks is as small as possible, so that the range of the detection area is more accurate. The size of the detection area is matched with the size of the circular raw ceramic chip to be cut in the subsequent process, namely the diameter of the detection area is equal to or slightly larger than the diameter of the circular raw ceramic chip to be cut in the subsequent process. Through the arrangement, the detection area can be determined rapidly, and then the comparison and analysis are carried out only on the images in the detection area, so that the operation amount of image analysis is reduced, and the detection efficiency is improved.
In one embodiment, the first marking device 20 includes a first mount 21, a first motor 22, a first mounting arm 23, and a first point light source 24. The first motor 22 is fixedly disposed on the first mount 21, and an axis of an output shaft of the first motor 22 extends in a vertical direction. One end of the first mounting arm 23 is sleeved on the output shaft of the first motor 22, so that the first mounting arm 23 swings back and forth in the horizontal plane under the driving of the first motor 22. The first point light source 24 is fixedly provided at the other end of the first mounting arm 23. The first point light source 24 may be a laser light source, which may provide a high brightness and high contrast light source.
In this embodiment, the first marking device 20 has a simple structure, and can change the position of the first point light source 24, thereby changing the imaging position of the first optical mark, so that detection areas with different sizes can be generated according to the correspondence.
In the first marking device 20, since the device body (e.g., the housing) of the first point light source 24 and the other end of the first mounting arm 23 may generate shadows around the first optical mark under the irradiation of the parallel surface light source 10, such shadows may misjudge the defect recognition of the detection area, it is preferable that the first point light source 24 is inclined at the other end of the first mounting arm 23, specifically, the upper end of the first point light source 24 is inclined toward the direction away from the one end of the first mounting arm 23 and the lower end is inclined toward the direction close to the one end of the first mounting arm 23, so that the optical path of the first point light source 24 is inclined upward, and finally, the shadows do not exist around the first optical mark, thereby avoiding interference of the shadows with the recognition of the defect in the detection area.
In one embodiment, the light-transmitting carrier substrate 11 further comprises a second marking device 30 disposed between the parallel surface light source 10 and the light-transmitting carrier substrate 11, the second marking device 30 is electrically connected with the control module, and the second marking device 30 is used for generating a movable second optical mark, and the second optical mark is used for marking the center position of the detection area. Specifically, after comparing the brightness value of the detection area with the brightness value on the standard light-transmitting image, if the green ceramic tile is judged to be qualified, the control module controls the second marking device 30 to work, so that the second marking device 30 generates a second optical mark at the circle center position of the detection area, and then a worker can mark the upper surface of the green ceramic tile with a marking pen according to the indication of the second optical mark, so that the circular green ceramic tile can be cut according to the marked circle center position in the subsequent process. Of course, the worker can make marks on the upper surface of the green ceramic tile by using a marking pen according to the indication of the first optical mark, and the whole circular area to be cut can be accurately determined in the subsequent process according to the three marks and the marked circle center position.
In one embodiment, the second marking device 30 includes a second mount 31, a second motor 32, a second mounting arm 33, a third motor 34, a third mounting arm 35, and a second point light source 36. The second motor 32 is fixedly disposed on the second mounting seat 31, an output shaft of the second motor 32 extends along a vertical direction, one end of the second mounting arm 33 is sleeved on the output shaft of the second motor 32, the other end of the second mounting arm 33 is provided with the third motor 34, the output shaft of the third motor 34 extends along the vertical direction, one end of the third mounting arm 35 is sleeved on the output shaft of the third motor 34, the other end of the third mounting arm 35 is provided with the second point light source 36, the second point light source 36 may be a laser light source identical to the first point light source 24, and of course, the color of the second point light source 36 may be different from that of the first point light source 24.
In this embodiment, the second motor 32 drives the second mounting arm 33 to swing, and the third motor 34 drives the third mounting arm 35 to swing, so as to realize movement of the second point light source 36, and the movement range of the second marking device 30 is large, so that when the second optical mark is not required to be generated, the second point light source 36, the third mounting arm 35, the third motor 34, the second mounting arm 33 and the second motor 32 are all located outside the irradiation range of the parallel surface light source 10, and thus, no interference is generated to defect detection of the green ceramic chip.
Preferably, the number of the first marking devices 20 is three, and the three first marking devices 20 and the second marking devices 30 are uniformly distributed around the circumference of the light-transmitting carrier substrate 11 together, that is, the angle between adjacent ones is 90 °.
In one embodiment, the light-transmitting substrate 11 is disposed at the top opening of the case 13, and the parallel surface light source 10, the first mount 21 and the second mount 31 are disposed in the case 13. The case 13 is provided to prevent light leakage from the parallel surface light source 10, and to provide a foundation for mounting and fixing the first mount 21 and the second mount 31.
In one embodiment, the first point light source 24 is different from the parallel surface light source 10 in color and/or brightness, and the second point light source 36 is different from the parallel surface light source 10 in color and/or brightness. The color or brightness of the first point light source 24 and the second point light source 36 may be the same or different. Through the arrangement, the control module is convenient to identify the first optical mark and the second optical mark.
As shown in fig. 5, the present embodiment provides a method for detecting a green tile defect, which is implemented based on the above-mentioned green tile defect detecting system, and includes the following steps:
S101, irradiating the green ceramic chip, and generating at least three first optical marks on the surface of the green ceramic chip;
S102, acquiring a real-time light transmission image of a green ceramic tile, wherein the real-time light transmission image comprises at least three first optical marks;
s103, determining a circular detection area on the real-time light transmission image based on the at least three first optical marks;
S104, comparing the brightness value of the detection area with the brightness value on the standard light-transmitting image to judge whether the green ceramic tile is qualified or not.
In one embodiment, as shown in fig. 6, after step S104, the following steps are further included:
and S105, if the detection result of the green ceramic chip is qualified, generating a second optical mark at the center of the detection area.
In one embodiment, as shown in fig. 7, after step S104, the following steps are further included:
S106, if the detection result of the green ceramic tile is unqualified, determining whether a circular to-be-cut area which does not contain defects exists on the whole real-time light-transmitting image of the green ceramic tile, and if so, generating at least three third optical marks and a fourth optical mark, wherein the at least three third optical marks are used for indicating the edge of the to-be-cut area, the fourth optical mark is used for indicating the circle center of the to-be-cut area, and if not, judging that the final detection result of the green ceramic tile is unqualified.
In the foregoing embodiment, the center of the detection area and the center area of the green chip are generally coincident, so that the first optical mark and the second optical mark are more easily confirmed. However, if the detection area determined based on the rule has a defect, that is, the detection result of the green ceramic tile is unqualified, in this embodiment, the control module analyzes the entire real-time light-transmitting image of the green ceramic tile, that is, determines whether there is a circular area to be cut that does not include the defect on the entire real-time light-transmitting image of the green ceramic tile. The size of the area to be cut may be the size of the raw ceramic tile of the batch to be processed in the subsequent process, or may be smaller than the size of the raw ceramic tile of the batch to be processed, as long as the size meets the size requirement of the raw ceramic tile of other batches in the subsequent process. For example, the specifications of the round green ceramic tile to be cut are 320mm, 310mm, 300mm, 290mm and 280mm, and in a certain test, the diameter of the test area is 300mm, and the diameter of the newly determined area to be cut can be 300mm, 290mm or 280mm. If the to-be-cut region meeting the requirements exists, a third optical mark is generated through the first marking device 20, a fourth optical mark is generated through the second marking device 30, and a worker makes corresponding marks on the green ceramic tile according to the indication of the third optical mark and the fourth optical mark, so that the subsequent clear cutting range is facilitated.
In this embodiment, when the detection result of the detection area on the green ceramic tile is unqualified, other areas are searched on the green ceramic tile at this time, if the areas meeting the requirements exist, the green ceramic tile is still qualified, so that the number of defective products of the green ceramic tile can be reduced, and the production and processing costs of enterprises can be reduced.
In the description of the present invention, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
It should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, but not to limit the technical solution of the present invention, and although the detailed description of the present invention is given with reference to the above embodiments, it should be understood by those skilled in the art that the technical solution described in the above embodiments may be modified or some or all technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present invention, and all the modifications or substitutions are included in the scope of the claims and the specification of the present invention.
Claims (9)
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