USD803171S1

USD803171S1 - Array of triangular semiconductor dies

Info

Publication number: USD803171S1
Application number: US29/539,504
Authority: US
Inventors: Rajat Sharma; Andrew Felker; William D. Houck
Original assignee: Soraa Inc
Current assignee: Korrus Inc
Priority date: 2011-06-17
Filing date: 2015-09-15
Publication date: 2017-11-21
Anticipated expiration: 2032-11-21
Also published as: USD739363S1; USD720310S1; USD743356S1

Description

FIG 1 is a first embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a second embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 5 is a front perspective view thereof;

FIG. 6 is a rear perspective view thereof;

FIG. 7 is a third embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 8 is a front perspective view thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a fourth embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 11 is a front perspective view thereof;

FIG. 12 is a rear perspective view thereof;

FIG. 13 is a fifth embodiment of a top plan view of an array of triangular semiconductor dies showing our new design;

FIG. 14 is a front perspective view thereof; and,

FIG. 15 is a rear perspective view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The separations between the top and bottom layers of the triangle and the brackets around the space indicate that no particular length is claimed.

Claims

CLAIM

The ornamental design for an array of triangular semiconductor dies, as shown and described.