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USD473199S1 - Portion of semiconductor device - Google Patents

Portion of semiconductor device Download PDF

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Publication number
USD473199S1
USD473199S1 US29/161,325 US16132502F USD473199S US D473199 S1 USD473199 S1 US D473199S1 US 16132502 F US16132502 F US 16132502F US D473199 S USD473199 S US D473199S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
mirror image
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/161,325
Inventor
Shigeki Sako
Masahiro Ootomo
Kazuyoshi Fukuda
Takahiro Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUDA, KAZUYOSHI, OOTOMO, MASAHIRO, IDE, TAKAHIRO, SAKO, SHIGEKI
Application granted granted Critical
Publication of USD473199S1 publication Critical patent/USD473199S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, bottom and right side perspective view of a portion of semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.
The broken line portions are shown for illustrative purpose only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a portion of semiconductor device, as shown and described.
US29/161,325 2001-11-30 2002-05-29 Portion of semiconductor device Expired - Lifetime USD473199S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-035199 2001-11-30
JP2001035199 2001-11-30

Publications (1)

Publication Number Publication Date
USD473199S1 true USD473199S1 (en) 2003-04-15

Family

ID=18898674

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/161,325 Expired - Lifetime USD473199S1 (en) 2001-11-30 2002-05-29 Portion of semiconductor device

Country Status (1)

Country Link
US (1) USD473199S1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD480371S1 (en) 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD720310S1 (en) * 2011-06-17 2014-12-30 Soraa, Inc. Triangular semiconductor die
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD763806S1 (en) * 2012-12-12 2016-08-16 Soraa, Inc. Triangular semiconductor die
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259559S (en) 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
US5105257A (en) 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5309018A (en) 1992-04-28 1994-05-03 Rohm Co., Ltd. Lead frame having deformable supports
US5585670A (en) 1995-09-05 1996-12-17 Mitsubishi Electric Semiconductor Software Co. Semiconductor device package
US5925927A (en) 1996-12-18 1999-07-20 Texas Instruments Incoporated Reinforced thin lead frames and leads
USD416872S (en) 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6020625A (en) 1998-03-27 2000-02-01 Mitsubishi Denki Kabushiki Kaisha Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame
US6093957A (en) 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US6177718B1 (en) 1998-04-28 2001-01-23 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259559S (en) 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
US5105257A (en) 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5309018A (en) 1992-04-28 1994-05-03 Rohm Co., Ltd. Lead frame having deformable supports
US5585670A (en) 1995-09-05 1996-12-17 Mitsubishi Electric Semiconductor Software Co. Semiconductor device package
US5925927A (en) 1996-12-18 1999-07-20 Texas Instruments Incoporated Reinforced thin lead frames and leads
US6093957A (en) 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD416872S (en) 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6020625A (en) 1998-03-27 2000-02-01 Mitsubishi Denki Kabushiki Kaisha Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame
US6177718B1 (en) 1998-04-28 2001-01-23 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Extract of Denpa Shimbun (newspaper) showing a AV decoder system LSI (MN677521) for a DVD player.
Extract of Denpa Shimbun (newspaper) showing a CCD signal processor (VSP2101).
Extract of Denpa Shimbun (newspaper) showing a PAM built-in microcomputer (MB91110).
Extract of Denpa Shimbun (newspaper) showing a Scan USB (NET 1031).
Toshiba Catalog of micro controller (TMP86CM25F).

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD480371S1 (en) 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD720310S1 (en) * 2011-06-17 2014-12-30 Soraa, Inc. Triangular semiconductor die
USD763806S1 (en) * 2012-12-12 2016-08-16 Soraa, Inc. Triangular semiconductor die
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device

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