USD743356S1

USD743356S1 - Diamond-shaped semiconductor die

Info

Publication number: USD743356S1
Application number: US29/441,960
Authority: US
Inventors: Rajat Sharma; Andrew Felker; William D. Houck
Original assignee: Soraa Inc
Current assignee: Korrus Inc
Priority date: 2011-06-17
Filing date: 2013-01-11
Publication date: 2015-11-17
Anticipated expiration: 2029-11-17
Also published as: USD803171S1; USD739363S1; USD720310S1

Description

FIG. 1 is a top plan view of a first embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a top plan view of a second embodiment of a diamond-shaped semiconductor die showing our new design

FIG. 5 is a front perspective view thereof;

FIG. 6 is a rear perspective view thereof;

FIG. 7 is a top plan view of a third embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 8 is a front perspective view thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a top plan view of a fourth embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 11 is a front perspective view thereof;

FIG. 12 is a rear perspective view thereof;

FIG. 13 is a top plan view of a fifth embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 14 is a front perspective view thereof;

FIG. 15 is a rear perspective view thereof;

FIG. 16 is a top plan view of a sixth embodiment of a diamond-shaped semiconductor die showing our new design;

FIG. 17 is a front perspective view thereof; and,

FIG. 18 is a rear perspective view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The diamond-shaped semiconductor die is shown broken away in FIGS. 1-18 to indicate that no particular length is claimed.

Claims

CLAIM

The ornamental design for a diamond-shaped semiconductor die, as shown and described.