USD593042S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD593042S1 USD593042S1 US29/322,063 US32206308F USD593042S US D593042 S1 USD593042 S1 US D593042S1 US 32206308 F US32206308 F US 32206308F US D593042 S USD593042 S US D593042S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- elevation view
- ornamental design
- side elevation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
The broken lines define portions of the heat sink that form no part of the claimed design.
Claims (1)
- The ornamental design for a heat sink, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-002160 | 2008-01-31 | ||
JP2008002160 | 2008-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD593042S1 true USD593042S1 (en) | 2009-05-26 |
Family
ID=40652473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/322,063 Expired - Lifetime USD593042S1 (en) | 2008-01-31 | 2008-07-29 | Heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | USD593042S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD615503S1 (en) * | 2007-06-20 | 2010-05-11 | Nidec Corporation | Heat sink |
USD657089S1 (en) * | 2010-04-10 | 2012-04-03 | Lg Innotek Co., Ltd. | LED lamp |
US20140138067A1 (en) * | 2012-11-19 | 2014-05-22 | Nidec Corporation | Heat sink and heat sink fan |
USD836571S1 (en) * | 2017-02-15 | 2018-12-25 | SAIJOINX Co., Ltd. | Heat sink |
USD838251S1 (en) * | 2017-02-15 | 2019-01-15 | SAIJOINX Co., Ltd. | Heat sink |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794685A (en) | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
US6657862B2 (en) * | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
US6671172B2 (en) | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US6714415B1 (en) * | 2003-03-13 | 2004-03-30 | Intel Corporation | Split fin heat sink |
US6779593B1 (en) | 2003-04-30 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | High performance cooling device with heat spreader |
USD500745S1 (en) | 2004-05-25 | 2005-01-11 | Cooler Master Co., Ltd. | Heat-dissipation fins |
USD501450S1 (en) | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD509485S1 (en) | 2003-12-09 | 2005-09-13 | Fujikura Ltd. | Heat sink |
USD509484S1 (en) | 2003-12-09 | 2005-09-13 | Fujikura Ltd. | Heat sink |
USD511326S1 (en) | 2003-06-25 | 2005-11-08 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD516526S1 (en) | 2003-06-25 | 2006-03-07 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US20060126303A1 (en) * | 2004-12-11 | 2006-06-15 | Foxconn Technology Co., Ltd | Heat dissipating device |
USD541229S1 (en) | 2004-05-13 | 2007-04-24 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US7269013B2 (en) * | 2006-01-09 | 2007-09-11 | Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. | Heat dissipation device having phase-changeable medium therein |
USD561120S1 (en) | 2006-09-28 | 2008-02-05 | Delta Electronics, Inc. | Heat dissipating module |
USD564460S1 (en) | 2007-01-25 | 2008-03-18 | Nidec Corporation | Heat sink fan |
USD568829S1 (en) * | 2006-10-12 | 2008-05-13 | Nidec Corporation | Heat sink |
USD570301S1 (en) | 2004-05-13 | 2008-06-03 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
-
2008
- 2008-07-29 US US29/322,063 patent/USD593042S1/en not_active Expired - Lifetime
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794685A (en) | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
US6657862B2 (en) * | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
US6671172B2 (en) | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
US6714415B1 (en) * | 2003-03-13 | 2004-03-30 | Intel Corporation | Split fin heat sink |
US6779593B1 (en) | 2003-04-30 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | High performance cooling device with heat spreader |
USD501450S1 (en) | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD511326S1 (en) | 2003-06-25 | 2005-11-08 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD516526S1 (en) | 2003-06-25 | 2006-03-07 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD509485S1 (en) | 2003-12-09 | 2005-09-13 | Fujikura Ltd. | Heat sink |
USD509484S1 (en) | 2003-12-09 | 2005-09-13 | Fujikura Ltd. | Heat sink |
USD541229S1 (en) | 2004-05-13 | 2007-04-24 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD563910S1 (en) | 2004-05-13 | 2008-03-11 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD570301S1 (en) | 2004-05-13 | 2008-06-03 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD500745S1 (en) | 2004-05-25 | 2005-01-11 | Cooler Master Co., Ltd. | Heat-dissipation fins |
US20060126303A1 (en) * | 2004-12-11 | 2006-06-15 | Foxconn Technology Co., Ltd | Heat dissipating device |
US7269013B2 (en) * | 2006-01-09 | 2007-09-11 | Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. | Heat dissipation device having phase-changeable medium therein |
USD561120S1 (en) | 2006-09-28 | 2008-02-05 | Delta Electronics, Inc. | Heat dissipating module |
USD568829S1 (en) * | 2006-10-12 | 2008-05-13 | Nidec Corporation | Heat sink |
USD564460S1 (en) | 2007-01-25 | 2008-03-18 | Nidec Corporation | Heat sink fan |
Non-Patent Citations (2)
Title |
---|
Otsuki et al.; "Heat Sink Fan"; U.S. Appl. No. 29/282,739, filed Jul. 27, 2007. |
Otsuki et al.; "Heat Sink, Heat Sink Fan, and Method for Manufacturing the Same"; U.S. Appl. No. 29/299,170, filed Dec. 20, 2007. |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD615503S1 (en) * | 2007-06-20 | 2010-05-11 | Nidec Corporation | Heat sink |
USD657089S1 (en) * | 2010-04-10 | 2012-04-03 | Lg Innotek Co., Ltd. | LED lamp |
US20140138067A1 (en) * | 2012-11-19 | 2014-05-22 | Nidec Corporation | Heat sink and heat sink fan |
US9252073B2 (en) * | 2012-11-19 | 2016-02-02 | Nidec Corporation | Heat sink and heat sink fan |
USD836571S1 (en) * | 2017-02-15 | 2018-12-25 | SAIJOINX Co., Ltd. | Heat sink |
USD838251S1 (en) * | 2017-02-15 | 2019-01-15 | SAIJOINX Co., Ltd. | Heat sink |
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