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USD593042S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD593042S1
USD593042S1 US29/322,063 US32206308F USD593042S US D593042 S1 USD593042 S1 US D593042S1 US 32206308 F US32206308 F US 32206308F US D593042 S USD593042 S US D593042S
Authority
US
United States
Prior art keywords
heat sink
view
elevation view
ornamental design
side elevation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/322,063
Inventor
Takamasa Yamashita
Takaya Otsuki
Akira Hirakawa
Tatsuya AKASE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Corp
Original Assignee
Nidec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Corp filed Critical Nidec Corp
Assigned to NIDEC CORPORATION reassignment NIDEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Otsuki, Takaya, AKASE, TATSUYA, HIRAKAWA, AKIRA, YAMASHITA, TAKAMASA
Application granted granted Critical
Publication of USD593042S1 publication Critical patent/USD593042S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevation view of a heat sink according to our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.
The broken lines define portions of the heat sink that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US29/322,063 2008-01-31 2008-07-29 Heat sink Expired - Lifetime USD593042S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-002160 2008-01-31
JP2008002160 2008-01-31

Publications (1)

Publication Number Publication Date
USD593042S1 true USD593042S1 (en) 2009-05-26

Family

ID=40652473

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/322,063 Expired - Lifetime USD593042S1 (en) 2008-01-31 2008-07-29 Heat sink

Country Status (1)

Country Link
US (1) USD593042S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD615503S1 (en) * 2007-06-20 2010-05-11 Nidec Corporation Heat sink
USD657089S1 (en) * 2010-04-10 2012-04-03 Lg Innotek Co., Ltd. LED lamp
US20140138067A1 (en) * 2012-11-19 2014-05-22 Nidec Corporation Heat sink and heat sink fan
USD836571S1 (en) * 2017-02-15 2018-12-25 SAIJOINX Co., Ltd. Heat sink
USD838251S1 (en) * 2017-02-15 2019-01-15 SAIJOINX Co., Ltd. Heat sink

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5794685A (en) 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6671172B2 (en) 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6714415B1 (en) * 2003-03-13 2004-03-30 Intel Corporation Split fin heat sink
US6779593B1 (en) 2003-04-30 2004-08-24 Hewlett-Packard Development Company, L.P. High performance cooling device with heat spreader
USD500745S1 (en) 2004-05-25 2005-01-11 Cooler Master Co., Ltd. Heat-dissipation fins
USD501450S1 (en) 2003-06-10 2005-02-01 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD509485S1 (en) 2003-12-09 2005-09-13 Fujikura Ltd. Heat sink
USD509484S1 (en) 2003-12-09 2005-09-13 Fujikura Ltd. Heat sink
USD511326S1 (en) 2003-06-25 2005-11-08 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD516526S1 (en) 2003-06-25 2006-03-07 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US20060126303A1 (en) * 2004-12-11 2006-06-15 Foxconn Technology Co., Ltd Heat dissipating device
USD541229S1 (en) 2004-05-13 2007-04-24 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
USD561120S1 (en) 2006-09-28 2008-02-05 Delta Electronics, Inc. Heat dissipating module
USD564460S1 (en) 2007-01-25 2008-03-18 Nidec Corporation Heat sink fan
USD568829S1 (en) * 2006-10-12 2008-05-13 Nidec Corporation Heat sink
USD570301S1 (en) 2004-05-13 2008-06-03 Sanyo Denki Co., Ltd. Electronic component cooling apparatus

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5794685A (en) 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6671172B2 (en) 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6714415B1 (en) * 2003-03-13 2004-03-30 Intel Corporation Split fin heat sink
US6779593B1 (en) 2003-04-30 2004-08-24 Hewlett-Packard Development Company, L.P. High performance cooling device with heat spreader
USD501450S1 (en) 2003-06-10 2005-02-01 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD511326S1 (en) 2003-06-25 2005-11-08 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD516526S1 (en) 2003-06-25 2006-03-07 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD509485S1 (en) 2003-12-09 2005-09-13 Fujikura Ltd. Heat sink
USD509484S1 (en) 2003-12-09 2005-09-13 Fujikura Ltd. Heat sink
USD541229S1 (en) 2004-05-13 2007-04-24 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD563910S1 (en) 2004-05-13 2008-03-11 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD570301S1 (en) 2004-05-13 2008-06-03 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD500745S1 (en) 2004-05-25 2005-01-11 Cooler Master Co., Ltd. Heat-dissipation fins
US20060126303A1 (en) * 2004-12-11 2006-06-15 Foxconn Technology Co., Ltd Heat dissipating device
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
USD561120S1 (en) 2006-09-28 2008-02-05 Delta Electronics, Inc. Heat dissipating module
USD568829S1 (en) * 2006-10-12 2008-05-13 Nidec Corporation Heat sink
USD564460S1 (en) 2007-01-25 2008-03-18 Nidec Corporation Heat sink fan

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Otsuki et al.; "Heat Sink Fan"; U.S. Appl. No. 29/282,739, filed Jul. 27, 2007.
Otsuki et al.; "Heat Sink, Heat Sink Fan, and Method for Manufacturing the Same"; U.S. Appl. No. 29/299,170, filed Dec. 20, 2007.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD615503S1 (en) * 2007-06-20 2010-05-11 Nidec Corporation Heat sink
USD657089S1 (en) * 2010-04-10 2012-04-03 Lg Innotek Co., Ltd. LED lamp
US20140138067A1 (en) * 2012-11-19 2014-05-22 Nidec Corporation Heat sink and heat sink fan
US9252073B2 (en) * 2012-11-19 2016-02-02 Nidec Corporation Heat sink and heat sink fan
USD836571S1 (en) * 2017-02-15 2018-12-25 SAIJOINX Co., Ltd. Heat sink
USD838251S1 (en) * 2017-02-15 2019-01-15 SAIJOINX Co., Ltd. Heat sink

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