USD541229S1 - Electronic component cooling apparatus - Google Patents
Electronic component cooling apparatus Download PDFInfo
- Publication number
- USD541229S1 USD541229S1 US29/216,926 US21692604F USD541229S US D541229 S1 USD541229 S1 US D541229S1 US 21692604 F US21692604 F US 21692604F US D541229 S USD541229 S US D541229S
- Authority
- US
- United States
- Prior art keywords
- cooling apparatus
- electronic component
- component cooling
- view
- elevation view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 20
Images
Description
FIG. 1 is a front elevation view of a first embodiment of an electronic component cooling apparatus showing our new design;
FIG. 2 is a rear elevation view of the first embodiment of the cooling apparatus;
FIG. 3 is a right side elevation view of the first embodiment of the cooling apparatus;
FIG. 4 is a left side elevation view of the first embodiment of the cooling apparatus;
FIG. 5 is a top plan view of the first embodiment of the cooling apparatus;
FIG. 6 is a bottom plan view of the first embodiment of the cooling apparatus;
FIG. 7 is a top plan reference view of the first embodiment of the cooling apparatus;
FIG. 8 is a longitudinal cross sectional view of the first embodiment of the cooling apparatus;
FIG. 9 is a perspective view of the first embodiment of the cooling apparatus;
FIG. 10 is a front elevation view of a second embodiment of an electronic component cooling apparatus showing our new design;
FIG. 11 is a rear elevation view of the second embodiment of the cooling apparatus;
FIG. 12 is a right side elevation view of the second embodiment of the cooling apparatus;
FIG. 13 is a left side elevation view of the second embodiment of the cooling apparatus;
FIG. 14 is a top plan view of the second embodiment of the cooling apparatus;
FIG. 15 is a bottom plan view of the second embodiment of the cooling apparatus;
FIG. 16 is a top plan reference view of the second embodiment of the cooling apparatus;
FIG. 17 is a longitudinal cross sectional view of the second embodiment of the cooling apparatus taken along line 17—17 in FIG. 16; and,
FIG. 18 is a perspective view of the third embodiment of the cooling apparatus.
Claims (1)
- The ornamental design for an electronic component cooling apparatus, as shown and described.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/249,884 USD563910S1 (en) | 2004-05-13 | 2006-10-25 | Electronic component cooling apparatus |
| US29/249,886 USD570301S1 (en) | 2004-05-13 | 2006-10-25 | Electronic component cooling apparatus |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004014192 | 2004-05-13 | ||
| JP2004014193 | 2004-05-13 | ||
| JP2004014194 | 2004-05-13 | ||
| JP2004-014193 | 2004-05-13 | ||
| JP2004-014194 | 2004-05-13 | ||
| JP2004-014195 | 2004-05-13 | ||
| JP2004-014192 | 2004-05-13 | ||
| JP2004014195 | 2004-05-13 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/249,884 Division USD563910S1 (en) | 2004-05-13 | 2006-10-25 | Electronic component cooling apparatus |
| US29/249,886 Division USD570301S1 (en) | 2004-05-13 | 2006-10-25 | Electronic component cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD541229S1 true USD541229S1 (en) | 2007-04-24 |
Family
ID=37951158
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/216,926 Expired - Lifetime USD541229S1 (en) | 2004-05-13 | 2004-11-10 | Electronic component cooling apparatus |
| US29/249,884 Expired - Lifetime USD563910S1 (en) | 2004-05-13 | 2006-10-25 | Electronic component cooling apparatus |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/249,884 Expired - Lifetime USD563910S1 (en) | 2004-05-13 | 2006-10-25 | Electronic component cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | USD541229S1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD564460S1 (en) | 2007-01-25 | 2008-03-18 | Nidec Corporation | Heat sink fan |
| USD570301S1 (en) * | 2004-05-13 | 2008-06-03 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US20080156461A1 (en) * | 2006-12-28 | 2008-07-03 | Nidec Corporation | Heat sink fan |
| US20080180912A1 (en) * | 2007-01-15 | 2008-07-31 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
| USD576567S1 (en) | 2007-02-13 | 2008-09-09 | Nidec Corporation | Heat sink fan |
| USD593042S1 (en) | 2008-01-31 | 2009-05-26 | Nidec Corporation | Heat sink |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785116A (en) | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| US5883449A (en) | 1996-08-07 | 1999-03-16 | Hunter Fan Company | Ceiling fan motors |
| US6419007B1 (en) * | 2001-03-30 | 2002-07-16 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
| US6480383B2 (en) * | 2000-09-29 | 2002-11-12 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US6698499B1 (en) | 1996-02-01 | 2004-03-02 | Agilent Technologies, Inc. | Cooling device and method |
| USD501450S1 (en) * | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| USD516526S1 (en) * | 2003-06-25 | 2006-03-07 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
-
2004
- 2004-11-10 US US29/216,926 patent/USD541229S1/en not_active Expired - Lifetime
-
2006
- 2006-10-25 US US29/249,884 patent/USD563910S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785116A (en) | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| US5975194A (en) | 1996-02-01 | 1999-11-02 | Hewlett Packard Company | Fan assisted heat sink device |
| US6152214A (en) | 1996-02-01 | 2000-11-28 | Agilent Technologies | Cooling device and method |
| US6698499B1 (en) | 1996-02-01 | 2004-03-02 | Agilent Technologies, Inc. | Cooling device and method |
| US5883449A (en) | 1996-08-07 | 1999-03-16 | Hunter Fan Company | Ceiling fan motors |
| US6480383B2 (en) * | 2000-09-29 | 2002-11-12 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US6419007B1 (en) * | 2001-03-30 | 2002-07-16 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
| USD501450S1 (en) * | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| USD516526S1 (en) * | 2003-06-25 | 2006-03-07 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD570301S1 (en) * | 2004-05-13 | 2008-06-03 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US20080156461A1 (en) * | 2006-12-28 | 2008-07-03 | Nidec Corporation | Heat sink fan |
| US8210241B2 (en) | 2006-12-28 | 2012-07-03 | Nidec Corporation | Heat sink fan |
| US20080180912A1 (en) * | 2007-01-15 | 2008-07-31 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
| US8256258B2 (en) | 2007-01-15 | 2012-09-04 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
| USD564460S1 (en) | 2007-01-25 | 2008-03-18 | Nidec Corporation | Heat sink fan |
| USD576567S1 (en) | 2007-02-13 | 2008-09-09 | Nidec Corporation | Heat sink fan |
| USD593042S1 (en) | 2008-01-31 | 2009-05-26 | Nidec Corporation | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| USD563910S1 (en) | 2008-03-11 |
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