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USD576574S1 - Light emitting diode module - Google Patents

Light emitting diode module Download PDF

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Publication number
USD576574S1
USD576574S1 US29/294,524 US29452408F USD576574S US D576574 S1 USD576574 S1 US D576574S1 US 29452408 F US29452408 F US 29452408F US D576574 S USD576574 S US D576574S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
diode module
view
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/294,524
Inventor
Masahiko Kobayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYAKAWA, MASAHIKO
Application granted granted Critical
Publication of USD576574S1 publication Critical patent/USD576574S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

FIG. 1 is a perspective view of a light emitting diode module according to my new design;
FIG. 2 is a front view of the same module;
FIG. 3 is a rear view of the same module;
FIG. 4 is a top plan view of the same module;
FIG. 5 is a bottom view of the same module;
FIG. 6 is a left side view of the same module;
FIG. 7 is a right side view of the same module; and,
FIG. 8 is a sectional view of the same module taken along lines 8—8 in FIG. 4.

Claims (1)

    CLAIM
  1. I claim the ornamental design for a light emitting diode module, as shown.
US29/294,524 2007-07-17 2008-01-15 Light emitting diode module Expired - Lifetime USD576574S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-019321 2007-07-17
JP2007019321 2007-07-17

Publications (1)

Publication Number Publication Date
USD576574S1 true USD576574S1 (en) 2008-09-09

Family

ID=39734668

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/294,524 Expired - Lifetime USD576574S1 (en) 2007-07-17 2008-01-15 Light emitting diode module

Country Status (1)

Country Link
US (1) USD576574S1 (en)

Cited By (68)

* Cited by examiner, † Cited by third party
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US20060278882A1 (en) * 2005-06-10 2006-12-14 Cree, Inc. Power lamp package
US20070235845A1 (en) * 2006-03-28 2007-10-11 Cotco Holdings Limited, A Hong Kong Corporation Apparatus, system and method for use in mounting electronic elements
US20070252250A1 (en) * 2006-04-26 2007-11-01 Cotco Holdings Limited, A Hong Kong Corporation Apparatus and method for use in mounting electronic elements
US20080041625A1 (en) * 2006-08-16 2008-02-21 Cotco Holdings Limited, A Hong Kong Corporation Apparatus, system and method for use in mounting electronic elements
USD593224S1 (en) * 2008-11-20 2009-05-26 Electronic Controls Company LED lighting assembly
USD593229S1 (en) * 2008-11-20 2009-05-26 Electronic Controls Company LED lighting assembly
USD598578S1 (en) * 2008-11-20 2009-08-18 Electronic Controls Company LED lighting assembly
USD598579S1 (en) * 2008-11-20 2009-08-18 Electronic Controls Company LED lighting assembly
US20090283781A1 (en) * 2008-05-16 2009-11-19 Cree Hong Kong Limited Mini V SMD
USD605142S1 (en) * 2009-04-24 2009-12-01 Edison Opto Corporation Light emitting diode illumination cell
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100155748A1 (en) * 2009-01-14 2010-06-24 Cree Hong Kong Limited Aligned multiple emitter package
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
USD628966S1 (en) * 2009-12-22 2010-12-14 Panasonic Corporation Light-emitting diode
USD628965S1 (en) * 2009-12-22 2010-12-14 Panasonic Corporation Light-emitting diode
US20110001151A1 (en) * 2009-07-06 2011-01-06 Cree, Inc. Led packages with scattering particle regions
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
USD640643S1 (en) * 2010-04-07 2011-06-28 Everlight Electronics Co., Ltd. Light emitting diode
USD640645S1 (en) * 2006-08-09 2011-06-28 Cree, Inc. Lamp package
US20110186865A1 (en) * 2010-01-29 2011-08-04 Cree Hong Kong Limited Wide angle oval light emitting diode package
USD643381S1 (en) * 2010-04-07 2011-08-16 Everlight Electronics Co., Ltd. Light emitting diode
USD645416S1 (en) 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
USD645419S1 (en) 2010-06-22 2011-09-20 Panasonic Corporation Light emitting diode
USD645420S1 (en) 2010-06-22 2011-09-20 Panasonic Corporation Light emitting diode
USD649521S1 (en) * 2010-02-12 2011-11-29 Everlight Electronics Co., Ltd. Light emitting diode
USD650341S1 (en) 2010-06-22 2011-12-13 Panasonic Corporation Light emitting diode
USD650342S1 (en) 2010-06-22 2011-12-13 Panasonic Corporation Light emitting diode
USD651989S1 (en) * 2010-04-09 2012-01-10 Everlight Electronics Co., Ltd. Light emitting diode
USD658317S1 (en) * 2009-10-29 2012-04-24 Koninklijke Philips Electronics N.V. Luminaire
USD670010S1 (en) 2010-07-23 2012-10-30 Everlight Electronics Co., Ltd. Light emitting diode
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
USD684282S1 (en) * 2011-09-29 2013-06-11 Grand General Accessories Manufacturing Double offset light used on trucks
USD686364S1 (en) * 2012-10-19 2013-07-16 So Bright Electronics Co., Ltd. LED lens
USD690443S1 (en) * 2011-06-06 2013-09-24 Citizen Electronics Co., Ltd. Light-emitting diode
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
USD711840S1 (en) 2012-06-11 2014-08-26 Cree, Inc. LED package
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
USD718258S1 (en) 2012-09-02 2014-11-25 Cree, Inc. LED package
USD718725S1 (en) 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD725613S1 (en) 2012-06-15 2015-03-31 Cree, Inc. LED package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
USD758977S1 (en) * 2015-06-05 2016-06-14 Kingbright Electronics Co. Ltd. LED component
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
USD766471S1 (en) * 2013-03-28 2016-09-13 Tridonic Jennersdorf Gmbh LED module
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD770062S1 (en) * 2015-02-03 2016-10-25 KAISTAR Lighting (Xiamen) Co., Ltd Light-Emitting Unit
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
USD845252S1 (en) * 2017-02-24 2019-04-09 Citizen Electronics Co., Ltd. Switch
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
USD912303S1 (en) * 2015-04-07 2021-03-02 Flos S.P.A. Table lamp
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD996377S1 (en) 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

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USD477580S1 (en) * 2002-01-30 2003-07-22 Nichia Corporation Light emitting diode
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USD522469S1 (en) * 2002-09-26 2006-06-06 Nichia Corporation Light emitting diode
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USD542743S1 (en) * 2005-03-31 2007-05-15 Seoul Semiconductor Co., Ltd. LED with a lens
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US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6914267B2 (en) * 1999-06-23 2005-07-05 Citizen Electronics Co. Ltd. Light emitting diode
USD477580S1 (en) * 2002-01-30 2003-07-22 Nichia Corporation Light emitting diode
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
US6770498B2 (en) * 2002-06-26 2004-08-03 Lingsen Precision Industries, Ltd. LED package and the process making the same
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USD522469S1 (en) * 2002-09-26 2006-06-06 Nichia Corporation Light emitting diode
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US20110012143A1 (en) * 2005-01-10 2011-01-20 Cree, Inc. Solid state lighting component
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US8217412B2 (en) 2005-01-10 2012-07-10 Cree, Inc. Solid state lighting component
US8698171B2 (en) 2005-01-10 2014-04-15 Cree, Inc. Solid state lighting component
US20060278882A1 (en) * 2005-06-10 2006-12-14 Cree, Inc. Power lamp package
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US20070235845A1 (en) * 2006-03-28 2007-10-11 Cotco Holdings Limited, A Hong Kong Corporation Apparatus, system and method for use in mounting electronic elements
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US20100052126A1 (en) * 2006-04-26 2010-03-04 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US20070252250A1 (en) * 2006-04-26 2007-11-01 Cotco Holdings Limited, A Hong Kong Corporation Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
USD681573S1 (en) 2006-08-09 2013-05-07 Cree, Inc. Lamp package
USD640645S1 (en) * 2006-08-09 2011-06-28 Cree, Inc. Lamp package
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US20080041625A1 (en) * 2006-08-16 2008-02-21 Cotco Holdings Limited, A Hong Kong Corporation Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
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USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
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US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US20090283781A1 (en) * 2008-05-16 2009-11-19 Cree Hong Kong Limited Mini V SMD
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
USD593224S1 (en) * 2008-11-20 2009-05-26 Electronic Controls Company LED lighting assembly
USD598579S1 (en) * 2008-11-20 2009-08-18 Electronic Controls Company LED lighting assembly
USD598578S1 (en) * 2008-11-20 2009-08-18 Electronic Controls Company LED lighting assembly
USD593229S1 (en) * 2008-11-20 2009-05-26 Electronic Controls Company LED lighting assembly
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20100155748A1 (en) * 2009-01-14 2010-06-24 Cree Hong Kong Limited Aligned multiple emitter package
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
USD605142S1 (en) * 2009-04-24 2009-12-01 Edison Opto Corporation Light emitting diode illumination cell
US20110001151A1 (en) * 2009-07-06 2011-01-06 Cree, Inc. Led packages with scattering particle regions
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
USD658317S1 (en) * 2009-10-29 2012-04-24 Koninklijke Philips Electronics N.V. Luminaire
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US8350370B2 (en) 2010-01-29 2013-01-08 Cree Huizhou Opto Limited Wide angle oval light emitting diode package
US20110186865A1 (en) * 2010-01-29 2011-08-04 Cree Hong Kong Limited Wide angle oval light emitting diode package
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US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
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USD670010S1 (en) 2010-07-23 2012-10-30 Everlight Electronics Co., Ltd. Light emitting diode
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
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US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

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