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USD718258S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD718258S1
USD718258S1 US29/431,064 US201229431064F USD718258S US D718258 S1 USD718258 S1 US D718258S1 US 201229431064 F US201229431064 F US 201229431064F US D718258 S USD718258 S US D718258S
Authority
US
United States
Prior art keywords
led package
view
package
led
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/431,064
Inventor
Theodore Lowes
Eric J. Tarsa
Sten Heikman
Bernd Keller
John A. Edmond
Jesse Reiherzer
Hormoz Benjamin
Christopher P. Hussell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51902178&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=USD718258(S1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/431,064 priority Critical patent/USD718258S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUSSELL, CHRISTOPHER P., REIHERZER, JESSE, EDMOND, JOHN A., BENJAMIN, Hormoz, HEIKMAN, STEN, KELLER, BERND, LOWES, THEODORE, TARSA, ERIC J.
Priority to TW102308472F priority patent/TWD165762S/en
Priority to TW102301478F priority patent/TWD159498S/en
Application granted granted Critical
Publication of USD718258S1 publication Critical patent/USD718258S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of the first embodiment of an LED package;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevation view of one side thereof;
FIG. 4 is a side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top perspective view of the second embodiment of an LED package;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is a front elevation view of one side thereof;
FIG. 10 is a side elevation view thereof;
FIG. 11 is a top plan view thereof; and,
FIG. 12 is a bottom plan view thereof.
In the drawings, the broken lines depict unclaimed subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an LED package, as shown and described.
US29/431,064 2012-09-02 2012-09-02 LED package Active USD718258S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/431,064 USD718258S1 (en) 2012-09-02 2012-09-02 LED package
TW102308472F TWD165762S (en) 2012-09-02 2013-03-01 Part of led package
TW102301478F TWD159498S (en) 2012-09-02 2013-03-01 Led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/431,064 USD718258S1 (en) 2012-09-02 2012-09-02 LED package

Publications (1)

Publication Number Publication Date
USD718258S1 true USD718258S1 (en) 2014-11-25

Family

ID=51902178

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/431,064 Active USD718258S1 (en) 2012-09-02 2012-09-02 LED package

Country Status (2)

Country Link
US (1) USD718258S1 (en)
TW (2) TWD165762S (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731302S1 (en) * 2013-10-29 2015-06-09 Ice Ip S.A. Package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD739231S1 (en) * 2014-09-16 2015-09-22 Direct Pack, Inc. Container
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

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USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
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USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD631020S1 (en) 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
USD643713S1 (en) * 2010-03-15 2011-08-23 Clear Lam Packaging, Inc. Container and lid
USD649033S1 (en) * 2010-12-21 2011-11-22 Tripak Industrial USA LLC Container
US8089089B2 (en) * 2009-02-24 2012-01-03 Advanced Optoelectronic Technology, Inc. Side-emitting LED package and manufacturing method of the same
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
US20130026502A1 (en) * 2011-07-29 2013-01-31 Lg Innotek Co., Ltd. Light emitting device package and light emitting system
US20130193474A1 (en) * 2008-10-01 2013-08-01 Samsung Electronics Co., Ltd. Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
USD689209S1 (en) * 2011-01-31 2013-09-03 Cree, Inc. Lamp packages
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD693781S1 (en) * 2012-08-22 2013-11-19 Kabushiki Kaisha Toshiba Light-emitting diode
TWD158573S (en) 2012-06-11 2014-01-21 科銳公司 Led package
TWD158571S (en) 2012-12-10 2014-01-21 鴻海精密工業股份有限公司 Adaptor
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package

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USD506867S1 (en) * 2003-08-29 2005-07-05 Jacmel Jewelry, Inc. Jewelry box
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
USD731302S1 (en) * 2013-10-29 2015-06-09 Ice Ip S.A. Package
USD739231S1 (en) * 2014-09-16 2015-09-22 Direct Pack, Inc. Container
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Also Published As

Publication number Publication date
TWD165762S (en) 2015-02-01
TWD159498S (en) 2014-03-21

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