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USD576572S1 - Light emitting diode module - Google Patents

Light emitting diode module Download PDF

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Publication number
USD576572S1
USD576572S1 US29/294,417 US29441708F USD576572S US D576572 S1 USD576572 S1 US D576572S1 US 29441708 F US29441708 F US 29441708F US D576572 S USD576572 S US D576572S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
diode module
view
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/294,417
Inventor
Yasunori Hata
Masahiko Kobayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HATA, YASUNORI, KOBAYAKAWA, MASAHIKO
Assigned to ROHM CO, LTD. reassignment ROHM CO, LTD. CORRECTIVE COVER SHEET TO ADD ASSIGNOR ON ASSIGNMENT PREVIOUSLY RECORDED ON REEL 020389, FRAME 0811. Assignors: HATA, YASUNORI, KOBAYAKAWA, MASAHIKO
Application granted granted Critical
Publication of USD576572S1 publication Critical patent/USD576572S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a light emitting diode module according to my new design;
FIG. 2 is a front view of the same module;
FIG. 3 is a rear view of the same module;
FIG. 4 is a top plan view of the same module;
FIG. 5 is a bottom view of the same module;
FIG. 6 is a left side view of the same module;
FIG. 7 is a right side view of the same module; and,
FIG. 8 is a sectional view of the same module taken along lines 88 in FIG. 4.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a light emitting diode module, as shown.
US29/294,417 2007-07-13 2008-01-10 Light emitting diode module Expired - Lifetime USD576572S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007019119 2007-07-13
JP2007-019119 2007-07-13

Publications (1)

Publication Number Publication Date
USD576572S1 true USD576572S1 (en) 2008-09-09

Family

ID=39734666

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/294,417 Expired - Lifetime USD576572S1 (en) 2007-07-13 2008-01-10 Light emitting diode module

Country Status (2)

Country Link
US (1) USD576572S1 (en)
TW (1) TWD126298S1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266817A (en) * 1992-05-18 1993-11-30 Lin Paul Y S Package structure of multi-chip light emitting diode
US5841154A (en) * 1995-10-17 1998-11-24 Alps Electric Co., Ltd. Light-emitting diode device with reduced scatter
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
USD491897S1 (en) * 2002-07-09 2004-06-22 Nichia Corporation Light emitting diode
USD491898S1 (en) * 2002-07-31 2004-06-22 Nichia Corporation Light emitting diode
USD515519S1 (en) * 2005-02-16 2006-02-21 Kabushiki Kaisha Toshiba Light emitting semiconductor device
US20070045823A1 (en) * 2005-08-26 2007-03-01 Cool Options, Inc. Thermally conductive thermoplastics for die-level packaging of microelectronics
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266817A (en) * 1992-05-18 1993-11-30 Lin Paul Y S Package structure of multi-chip light emitting diode
US5841154A (en) * 1995-10-17 1998-11-24 Alps Electric Co., Ltd. Light-emitting diode device with reduced scatter
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
USD491897S1 (en) * 2002-07-09 2004-06-22 Nichia Corporation Light emitting diode
USD525949S1 (en) * 2002-07-09 2006-08-01 Nichia Corporation Light emitting diode
USD491898S1 (en) * 2002-07-31 2004-06-22 Nichia Corporation Light emitting diode
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
USD515519S1 (en) * 2005-02-16 2006-02-21 Kabushiki Kaisha Toshiba Light emitting semiconductor device
US20070045823A1 (en) * 2005-08-26 2007-03-01 Cool Options, Inc. Thermally conductive thermoplastics for die-level packaging of microelectronics

Also Published As

Publication number Publication date
TWD126298S1 (en) 2008-12-01

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