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US4693303A - Liquid cooling module with springy contact elements and an aperture plate slidable thereover - Google Patents

Liquid cooling module with springy contact elements and an aperture plate slidable thereover Download PDF

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Publication number
US4693303A
US4693303A US06/876,381 US87638186A US4693303A US 4693303 A US4693303 A US 4693303A US 87638186 A US87638186 A US 87638186A US 4693303 A US4693303 A US 4693303A
Authority
US
United States
Prior art keywords
thermally conductive
liquid cooling
contact elements
conductive member
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/876,381
Other languages
English (en)
Inventor
Yoshikatsu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Assigned to NEC CORPORATION reassignment NEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: OKADA, YOSHIKATSU
Application granted granted Critical
Publication of US4693303A publication Critical patent/US4693303A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to liquid cooling of small heat generating electronic components.
  • a prior art liquid cooling module provides cooling of LSI (large-scale integration) chips mounted on one side of a ceramic substrate.
  • the chips are respectively enclosed within recesses formed on one surface of a thermally conductive member which is in thermal contact with a liquid cooling member.
  • Screws are used to couple the thermally conductive member and the cooling member together to ensure good face-to-face thermal contact therebetween.
  • the screws should be fabricated to close tolerances for precision tightening and the surfaces of the thermally conductive member and the liquid cooling member be polished to a mirror finish.
  • these contacting members must be of a thickness sufficient to prevent them from being warped by polishing processes, with a resultant decrease in thermal conduction efficiency.
  • Another disadvantage is that utmost care should be exercised in tightening the screws so that the face-to-face contact between the contacting members are uniform at all points of the contact surfaces.
  • the liquid cooling module of the invention comprises a substrate on which heat generating components to be cooled are mounted, a thermally conductive member secured to the substrate enclosing the heat generating components and a liquid cooling member having a chamber in which liquid is flowed.
  • the thermally conductive member has a pair of two-motion coupling means one on each side thereof and the liquid cooling member has a pair of two-motion coupling means respectively engageable with the two-motion coupling means of the thermally conductive member when they are moved toward each other in a first direction and subsequently moved in a second direction with respect to each other normal to the first direction.
  • An array of thermally conductive, springy contact elements are arranged between the thermally conductive member and the liquid cooling member.
  • An aperture plate having an array of apertures corresponding to the contact elements is slidably mounted over the contact elements for holding the contact elements in compression to permit the coupling means of the thermally conductive member and liquid cooling member to move in the second direction when the aperture plate is in a first position and allowing the contact elements to partially extend through the corresponding apertures to establish thermal contact between the thermally conductive member and the cooling member when the slidable member is in a second position.
  • FIG. 1 is an exploded perspective view of a prior art liquid cooling module
  • FIG. 2 is a cross-sectional view of a part of the prior art liquid cooling module
  • FIG. 3 is an exploded perspective view of a liquid cooling module according to the present invention.
  • FIG. 4 is a cross-sectional view taken along the lines 4--4 of FIG. 3;
  • FIGS. 5 and 6 are side views of the cooling module of FIG. 3.
  • FIG. 7 is a cross-sectional view useful for describing the operation of the aperture plate.
  • FIGS. 1 and 2 Prior to the description of the present invention, reference is first made to FIGS. 1 and 2 in which is shown a prior art liquid cooling module for providing cooling of LSI chips 1 to be cooled.
  • Chips 1 are mounted on one side of a ceramic substrate 2 which has holes 2a at the corners thereof for it to be coupled to a thermally conductive member 3 by screws 5.
  • Thermally conductive member 3 is formed with a plurality of recesses 3b corresponding to chips 1, respectively.
  • Thermally conductive elements 7 are disposed on chips 1 and immersed in thermally conductive liquid 8 within respective recesses 3b to provide efficient conduction of heat generated by the LSI chips 1 to the conductive member 3.
  • Thermally conductive member 3 is in thermal contact with and cooled by a liquid cooling member 4 in which cooling liquid 9 is supplied from an inlet port 10 to an outlet port 11.
  • a plurality of holes 4a are provided along the edges and at the center of the cooling member 4 to permit screws 6 to be threadably engage with threaded holes 3a on conductive member 3.
  • the screws 6 should be fabricated to close tolerances for precision tightening and that the surfaces of the contacting members 3 and 4 must be polished to a mirror finish.
  • the contacting members must be of a thickness sufficient to prevent them from being warped by polishing processes.
  • FIG. 3 there is shown a liquid cooling module according to an embodiment of the present invention.
  • This cooling module comprises a ceramic substrate 20 on which LSI chips 1 are mounted.
  • a thermal conducting member 30, which is coupled to the substrate 20 by screws 50, comprises a housing 31 formed with a plurality of recesses 32 on the lowerside thereof as illustrated in FIG. 4 and a rectangular recess 33 on the upperside thereof.
  • Each of the lowerside recesses 32 is filled with thermally conductive liquid 34 in which a thermally conductive element 35 is disposed on the corresponding chip 1 to conduct heat generated by that chip to the housing 31.
  • To the bottom surface of upperside recess 33 are secured thermally conductive spring elements 36 arranged in a matrix array in positions preferably corresponding to the locations of chips 1.
  • Each spring element comprises a leaf spring having a lower flat end portion firmly secured to provide a high thermal conductivity path from the housing 31 to a liquid cooling member 40 and an upper curved end portion pressure-contacting with one surface of the cooling member 40.
  • a slidable aperture plate 37 having an array of rectangular apertures 37a is slidably mounted through a slit 38 over the spring elements 36 so that each element 36 extends upward through a corresponding one of the apertures 37a into contact with the cooling member 40.
  • Cooling member 40 has a chamber 41. Cooling liquid is supplied from inlet port 42 into the chamber 41 and discharged through the outlet port 43.
  • Thermal conducting member 30 is formed with a pair of notches 39 one on each side wall thereof and cooling member 40 is formed with a pair of lugs 44 extending downward from opposite side walls thereof for engaging with the notches 39.
  • the lug 44 has a vertically extending portion 44a and a horizontally extending portion 44b and the notch 39 has a vertically extending portion 39a and a horizontally extending portion 39b.
  • the vertically extending portion 39a has a width slightly greater than the length of the horizontally extending portion 44b of the lug to permit the latter to engage with the notch simply by a snap action exerted on the cooling member 40 in a vertical direction and by a subsequent horizontal movement to the left to permit the horizontally extending portion 44b to engage with the horizontally extending portion 39b as illustrated in FIG. 6, thus establishing a thermal contact between the conducting member 30 and cooling member 40.
  • the slide aperture plate 37 Prior to the coupling between the two members 30 and 40, the slide aperture plate 37 is withdrawn slightly as indicated in FIG. 7 so that the thermal contact elements 36 are out of alignment with corresponding apertures 37a and held in compression under the slide plate 37. With the slide plate 37 being partially withdrawn, the two members 30 and 40 are brought together to insert the lugs 39 into the vertically extending portions 39a of the notches and then moved in a horizontal direction with respect to each other to insert the horizontally extending lug portions 44b into the horizontally extending notch portions 39b so that the conducting member 30 presents a flat surface. Therefore, there is substantially no frictional resistance during the horizontal slide movement.
  • the slide member 37 With the lugs 44 being engaged fully with the notches 44, the slide member 37 is pushed into the original position to permit thermal contact elements 36 to align with and extend through its apertures 37a into contact with the cooling member 40. Thermal contact elements 36 exert spring forces in a vertical direction. This establishes thermal contact between the members 30 and 40, while pressing the upper edges of horizontally extending lug portions 44b against the upper edges of the horizontally extending notch portions 39b to establish firm coupling between the members 30 and 40.
  • the present invention allows a low-profile structure for the conducting member 30 and cooling member 40 to increase heat conduction efficiency and simplifies the manufacturing process with a resultant cost reduction.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US06/876,381 1985-06-20 1986-06-19 Liquid cooling module with springy contact elements and an aperture plate slidable thereover Expired - Fee Related US4693303A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60134842A JPS61292944A (ja) 1985-06-20 1985-06-20 集積回路パツケ−ジの液体冷却構造
JP60-134842 1985-06-20

Publications (1)

Publication Number Publication Date
US4693303A true US4693303A (en) 1987-09-15

Family

ID=15137738

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/876,381 Expired - Fee Related US4693303A (en) 1985-06-20 1986-06-19 Liquid cooling module with springy contact elements and an aperture plate slidable thereover

Country Status (3)

Country Link
US (1) US4693303A (fr)
JP (1) JPS61292944A (fr)
FR (1) FR2583921B1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
US20070256810A1 (en) * 2006-05-02 2007-11-08 Clockspeed, Inc. Cooling apparatus for microelectronic devices
US20120120599A1 (en) * 2010-11-12 2012-05-17 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
WO2012131519A1 (fr) 2011-03-25 2012-10-04 Koninklijke Philips Electronics N.V. Matériau de tampon d'interface thermique à revêtement perforé
US9917034B2 (en) 2014-09-26 2018-03-13 Semicaps Pte Ltd Method and apparatus for cooling a semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
JP7334433B2 (ja) * 2019-03-19 2023-08-29 日本電気株式会社 放熱構造及び電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Antonetti et al., Compliant Cold Plate Cooling Scheeme, IBM Tech. Disc. Bulletin, 11/78. *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
US20070256810A1 (en) * 2006-05-02 2007-11-08 Clockspeed, Inc. Cooling apparatus for microelectronic devices
US7849914B2 (en) 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
US20120120599A1 (en) * 2010-11-12 2012-05-17 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
US8891240B2 (en) * 2010-11-12 2014-11-18 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
WO2012131519A1 (fr) 2011-03-25 2012-10-04 Koninklijke Philips Electronics N.V. Matériau de tampon d'interface thermique à revêtement perforé
CN103477431A (zh) * 2011-03-25 2013-12-25 皇家飞利浦有限公司 具有穿孔衬里的热界面衬垫材料
CN103477431B (zh) * 2011-03-25 2016-08-17 皇家飞利浦有限公司 具有穿孔衬里的热界面衬垫材料
RU2612270C2 (ru) * 2011-03-25 2017-03-03 Филипс Лайтинг Холдинг Б.В. Материал подушки теплового сопряжения с перфорированной подкладкой
US10049959B2 (en) 2011-03-25 2018-08-14 Philips Lighting Holding B.V. Thermal interface pad material with perforated liner
US9917034B2 (en) 2014-09-26 2018-03-13 Semicaps Pte Ltd Method and apparatus for cooling a semiconductor device

Also Published As

Publication number Publication date
JPS61292944A (ja) 1986-12-23
JPH0426549B2 (fr) 1992-05-07
FR2583921B1 (fr) 1989-04-07
FR2583921A1 (fr) 1986-12-26

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Legal Events

Date Code Title Description
AS Assignment

Owner name: NEC CORPORATION, 33-1, SHIBA 5-CHOME, MINATO-KU, T

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OKADA, YOSHIKATSU;REEL/FRAME:004581/0361

Effective date: 19860611

Owner name: NEC CORPORATION,JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OKADA, YOSHIKATSU;REEL/FRAME:004581/0361

Effective date: 19860611

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Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

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Year of fee payment: 4

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Year of fee payment: 8

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Lapsed due to failure to pay maintenance fee

Effective date: 19990915

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362