CN103477431B - 具有穿孔衬里的热界面衬垫材料 - Google Patents
具有穿孔衬里的热界面衬垫材料 Download PDFInfo
- Publication number
- CN103477431B CN103477431B CN201280014758.XA CN201280014758A CN103477431B CN 103477431 B CN103477431 B CN 103477431B CN 201280014758 A CN201280014758 A CN 201280014758A CN 103477431 B CN103477431 B CN 103477431B
- Authority
- CN
- China
- Prior art keywords
- heat
- interface device
- hot interface
- backing layer
- perforation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/002—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for interchangeability, i.e. component parts being especially adapted to be replaced by another part with the same or a different function
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11159691.2 | 2011-03-25 | ||
EP11159691 | 2011-03-25 | ||
PCT/IB2012/051244 WO2012131519A1 (en) | 2011-03-25 | 2012-03-15 | Thermal interface pad material with perforated liner |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103477431A CN103477431A (zh) | 2013-12-25 |
CN103477431B true CN103477431B (zh) | 2016-08-17 |
Family
ID=45895448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280014758.XA Expired - Fee Related CN103477431B (zh) | 2011-03-25 | 2012-03-15 | 具有穿孔衬里的热界面衬垫材料 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10049959B2 (zh) |
EP (1) | EP2689454B1 (zh) |
JP (1) | JP6105549B2 (zh) |
CN (1) | CN103477431B (zh) |
RU (1) | RU2612270C2 (zh) |
WO (1) | WO2012131519A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2671923C1 (ru) * | 2018-01-17 | 2018-11-07 | Владимир Степанович Кондратенко | Устройство отвода тепла от тепловыделяющих объектов |
DE102018120139B4 (de) * | 2018-08-17 | 2025-02-20 | Illinois Tool Works Inc. | Batteriesystem für ein Kraftfahrzeug |
RU206203U1 (ru) * | 2021-06-02 | 2021-08-30 | Общество с ограниченной ответственностью "Т8 Сенсор" (ООО "Т8 Сенсор") | Лазерный модуль |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4693303A (en) * | 1985-06-20 | 1987-09-15 | Nec Corporation | Liquid cooling module with springy contact elements and an aperture plate slidable thereover |
CN1185655A (zh) * | 1996-12-16 | 1998-06-24 | 国际商业机器公司 | 具有可压缩热沉结构的电子封装 |
US6064573A (en) * | 1998-07-31 | 2000-05-16 | Litton Systems, Inc. | Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4235283A (en) * | 1979-12-17 | 1980-11-25 | International Business Machines Corporation | Multi-stud thermal conduction module |
US4748495A (en) * | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
JP2000269671A (ja) * | 1999-03-19 | 2000-09-29 | Toshiba Corp | 電子機器 |
JP3847068B2 (ja) | 2000-09-11 | 2006-11-15 | アルプス電気株式会社 | 薄膜磁気ヘッド及びその製造方法 |
US20040261981A1 (en) | 2002-11-13 | 2004-12-30 | Surface Logix, Inc. | Thermal interface composit structure and method of making same |
US7200006B2 (en) | 2004-06-03 | 2007-04-03 | International Business Machines Corporation | Compliant thermal interface for electronic equipment |
US7646608B2 (en) | 2005-09-01 | 2010-01-12 | Gm Global Technology Operations, Inc. | Heat transfer plate |
CN100448040C (zh) * | 2006-01-12 | 2008-12-31 | 聚鼎科技股份有限公司 | 具有温度控制功能的发光二极管装置 |
US7849914B2 (en) | 2006-05-02 | 2010-12-14 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
US7694719B2 (en) | 2007-01-04 | 2010-04-13 | International Business Machines Corporation | Patterned metal thermal interface |
US7834447B2 (en) | 2007-05-22 | 2010-11-16 | Centipede Systems, Inc. | Compliant thermal contactor |
US7935770B2 (en) | 2007-07-03 | 2011-05-03 | Bausch & Lomb Incorporated | Surface active prepolymers with both fluorine-containing groups and hydrophilic groups |
US7625104B2 (en) * | 2007-12-13 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Light emitting diode for mounting to a heat sink |
KR100910054B1 (ko) * | 2007-12-18 | 2009-07-30 | 에스엘 주식회사 | Led방열 장치 |
CN101562964B (zh) * | 2008-04-14 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | 导热介质保护盖及具有该保护盖的散热装置 |
CN201422225Y (zh) * | 2009-04-25 | 2010-03-10 | 鸿富锦精密工业(深圳)有限公司 | 散热器组合 |
JP2011114197A (ja) | 2009-11-27 | 2011-06-09 | Nec Corp | 伝熱シート、及び、この伝熱シートを備えた電子機器 |
US8957316B2 (en) * | 2010-09-10 | 2015-02-17 | Honeywell International Inc. | Electrical component assembly for thermal transfer |
-
2012
- 2012-03-15 RU RU2013147641A patent/RU2612270C2/ru not_active IP Right Cessation
- 2012-03-15 US US14/006,438 patent/US10049959B2/en not_active Expired - Fee Related
- 2012-03-15 WO PCT/IB2012/051244 patent/WO2012131519A1/en active Application Filing
- 2012-03-15 JP JP2014500509A patent/JP6105549B2/ja not_active Expired - Fee Related
- 2012-03-15 CN CN201280014758.XA patent/CN103477431B/zh not_active Expired - Fee Related
- 2012-03-15 EP EP12711271.2A patent/EP2689454B1/en not_active Not-in-force
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4693303A (en) * | 1985-06-20 | 1987-09-15 | Nec Corporation | Liquid cooling module with springy contact elements and an aperture plate slidable thereover |
CN1185655A (zh) * | 1996-12-16 | 1998-06-24 | 国际商业机器公司 | 具有可压缩热沉结构的电子封装 |
US6064573A (en) * | 1998-07-31 | 2000-05-16 | Litton Systems, Inc. | Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
CN103477431A (zh) | 2013-12-25 |
US20140008050A1 (en) | 2014-01-09 |
WO2012131519A1 (en) | 2012-10-04 |
JP6105549B2 (ja) | 2017-03-29 |
RU2612270C2 (ru) | 2017-03-03 |
JP2014512094A (ja) | 2014-05-19 |
EP2689454B1 (en) | 2016-03-02 |
US10049959B2 (en) | 2018-08-14 |
RU2013147641A (ru) | 2015-04-27 |
EP2689454A1 (en) | 2014-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170314 Address after: The city of Eindhoven in Holland Patentee after: KONINKL PHILIPS NV Address before: The city of Eindhoven in Holland Patentee before: Koninkl Philips Electronics NV |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Eindhoven Patentee after: Signify Holdings Ltd. Address before: The city of Eindhoven in Holland Patentee before: PHILIPS LIGHTING HOLDING B.V. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20210315 |