US3795037A - Electrical connector devices - Google Patents
Electrical connector devices Download PDFInfo
- Publication number
- US3795037A US3795037A US00311602A US3795037DA US3795037A US 3795037 A US3795037 A US 3795037A US 00311602 A US00311602 A US 00311602A US 3795037D A US3795037D A US 3795037DA US 3795037 A US3795037 A US 3795037A
- Authority
- US
- United States
- Prior art keywords
- rails
- blanks
- metal
- stack
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/64—Means for preventing incorrect coupling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
Definitions
- An electrical connector comprises a plurality of elon- 52 us. Cl. 29/628, 29/629, 339/59 M, gated flexible conductors embedded in and extending 339/61 M between surface of, a block of elastomeric insulating [51] Int. Cl H0lr 43/00 materiaL [58] Field of Search.... 174/35 GC, 68,5; 339/59 M,
- the invention relates to electrical connector devices.
- micro-circuit techniques have allowed the size of individual micro-circuit elements to be significantly reduced. While a large number of circuits may be packaged in a very small volume by such techniques, a corresponding number of electrical connections must be made to such micro-circuit packages.
- One problem with forming such electrical connections is that the dimensions and physical tolerances of the connections to microcircuit packages are extremely small and such connections are difficult to produce by conventional techniques.
- an electrical connector comprising a plurality of elongated flexible conductive members embedded in, and each extending between surface areas of, a block of elastomeric insulating material with the extremities of the conductive members being exposed at said surface areas.
- such a connector can provide several conductive paths between two conductors each in contact with an appropriate part of a different one of said surface areas.
- these surface areas are substantially parallel opposite faces of a slab constituting said block. Then, it is generally mostuseful for said appropriate parts to be in register with each other through the block. A small clamping pressure is sufficient for good contact.
- the extremities of the conductive members project from the block surface.
- the projection may be of a different material, e.g. an intermediate required for good bonding with a final layer of a noble metal.
- a method of making an electrical connector using metal blanks having side rails interconnected by uniformly spaced parallel strip members comprising 'the steps of making a stack of said blanks in register with each other and disposed alternately with spacer blanks of similar shape to said metal blanks but without the strip members, and fillingthe space between the side rails of the stack with liquid, settable elastomeric, insulating material, setting said material, and removing said side rails.
- FIG. 1 shows a resilient member of the invention having a rectilinear configuration
- FIG. 2 shows a resilient member of the invention having a curvilinear configuration
- FIG. 3 shows resilient member of the invention em- DESCRIPTION OF THE PREFERRED EMBODIMENTS
- a resilient connector 10 of the present invention having surfaces 11 and which serves as a tem- 12 at the top and bottom of the member, respectively.
- Member 10 may be formed from any suitable electri- A device 1 in which a plurality of resilient members or 40 may be employed is shown in FIG. 3. Each resilient member 10 is embedded in an elastomeric material 21 which both physically and electrically separates each resilient member 10 from one another to form device l.
- the elastomeric material 21 may be subjected to a grinding process to improve the flatness of the surface thereof and during this process the level of resilient members 10 may be reduced somewhat below that of the surface of material 21 as shown. In such cases, it may be convenient to electrolessly plate a conductive material on the opposed contact faces 11 and 12, this material being shown as contacts 13, 18, 19, 20, 22 and 23.
- a conductive land portion 14 of micro-circuit 15 is arranged to form an electrical connection with contacts 13, 18 and 19.
- a raised conductor element 16 is arranged to electrically connect contacts 20, 22 and 23 with external electrical circuits (not shown).
- conductor 16 may be a conductive portion of a printed circuit board.
- conductor 16 is in contact with three contacts of respective resilient members 10
- conductor 16 could be in contact with a greater number of contacts, say five or six, without affecting the connection existing between conductor 16 and conductive land 14 as any other resilient members in contact with conductor 16 would not be in contact with either conductive land 14 or those resilient mem+ bers in contact with conductive land 14.
- domed contacts l3, l8 and 19 are shown it will be realised that such contacts may be flush with the surface of elastomeric material 21, and the domed contacts may be dispensed with.
- FIG. 4 An electrical assembly in which the resilient electrical connector device 1 is employed, is shown'in FIG. 4.
- a micro-circuit 15 is mounted on a liquid cooled heat sink 25 with the resilient connector device I mounted on circuit 15..
- a printed circuit board 17 is appropriately aligned with various micro-circuits 15 by means of dowel pins 26 and 27 while nut and bolt arrangements 28 and 29 act to hold circuitboard 17 in contact with device 1 and apply a steady pressure against the resilient connector device 1.
- Particular conductors 30 on the printed'circuit board 17 may then be connected to the resilient electrical connector device 1 by means of interconnecting elements 31 on the printed circuit board 17.
- a method for producing the resilient electrical connector device 1 shown in FIG. 3 will now'be described.
- a pattern in the form of a thin metal having aframe 32 with a plurality of resilient members 10 may be produced by a conventional chemical milling technique.
- a spacer member 33 which is shown in FIG. 6, is placed in registration with frame 32. Astack which alternately consists of frame 32 and spacer member 33 is then built up with the thickness of the spacer member accurately determining the spacing between any two frames.
- the assembly is clamped between end plates 34 and 35 by pins 37 as shown in FIG. 7 with the cavity containing a large number of accurately spaced resilient members '10.
- the cavity is then filled with a suitable liquid elastomer, which for example, may be silicone rubber.
- the elastomer is then polymerised and then end plates 34 and 35 and spacer members 33 are removed.
- the frames 32 are then removed by a chemical etching techniqueto leave a large numberof resilient members 10 (FIG. 1) accurately spaced in an elastomeric material 21.
- the surface of material 21 may be subjected to a grinding process to improve the flatness thereof. 7
- a resilient electrical connector device 1 is produced in which a large number of electrically conducting and mutually insulated paths are provided between one side of a sheet of flexible inaterial and another. In this way the device 1 attains an isotropically conductive characteristics as a high degree of conductance is achieved in one direction and a low or negligible degree of conductance is achieved in a direction orthogonal to the first direction.
- a microcircuit having contact or conductive lands, each of which encompasses a small number of resilient members 10 in elastomer 21 may be electrically connected with external circuitry, say, in the form of a printed cir cuit interconnecting network provided with similar contacts or conductive lands of the same geometry and displacement as the micro-circuit.
- external circuitry say, in the form of a printed cir cuit interconnecting network provided with similar contacts or conductive lands of the same geometry and displacement as the micro-circuit.
- resilient member 10 has been shown in two different forms in FIGS. 1 and 2 it will be appreciated that these forms are exemplary only and that other shapes may be employed. In each case however individual' resilient members .10 or 40 alone will haveinsufficient strength to support a micro-circuit elementlS but by being embedded in a elastomeric material 21, suffb cient strength is imparted to a number of such resilient members 10.
- Another method for producing the device of the present invention is toprovide a resilient porous member. Suitable metals are selectively deposited in the pores to provide a plurality of electrically conductive paths from one surface of the resilient member to another surface.
- FIG. 3 shows the domed contact portions 13, 18, etc., to project slightly beyond the surface of the block 21 of elastomericmaterial adjacent thereto. Such projections facilitate obtaining adequate contact pressure at the contact portions without unduly loading adjacent circuit elements to displace the elastomeric block. This is particularly so where the conductive contact areas of the associatedmicro-circuit and-.
- the elastomeric material is not readily displaceable in practice, because of soft material will tend to have a fairly high co-efficient of friction, with the result that the face of the block in contact with a circuit element tends to resist any lateral movement relative to the face of the element. This tendency increases as the pressure is increased with the result that practicable pressures applied to the elements tend only to produce a slight bulge at the ends of .the block 1.
- each of the ends of the embedded conductive members prefferably project slightly from the surface of the block. Pressure applied to the circuit elements is then more directly related only to the establishment of effective pressures between the embedded members and the conductive areas on the circuit elements.
- the contact portion it is preferred for the contact portion to have at least an outer layer 71 of a noble metal, e.g., gold. It may of course be necessary to use an intervening portion 70 of another conductive material to ensure good bonding, depending on the material used for the embedded conductive members 72.
- the intervening portion 70 may, conveniently, constitute the projections desired for the embedded members 72.
- the block 21 may support members 72 of, say, beryllium-copper, or phosphor-bronze alloy, bent into a V- shape to provide the required flexibility in the direction in which pressure is to be applied.
- the ends of the members 72 are initially arranged to be substantially level with faces 79, 79a respectively.
- a layer of, say, copper 70 is then formed over the ends of the members 72 by,-for example, electrolytic deposition. In the process of deposition the copper layer 70 forms a dome at each end ofa member 72.
- a second dome-like layer 71 of, say gold is then deposited over the copper domes 70 bya similar process, so that the contact forming layers of gold project from the surfaces 79, 79a respectively.
- FIG. 9 illustrates the effect of assembling a contact block similar to that of FIG. 8, between a pair of circuit elements 74 and 75 carrying conductive areas 76 and 77 respectively and applying pressure to urge the elements together. It will be seen that in addition to the formation of a bulge 72 at the ends of the block 21, the elastomeric material of the block is free to be displaced, as indicated at 73, for example, into the small spaces between the surfaces 74, 74a of the elements 74 and 75 and the originally flat surfaces 79, 79a of the block.
- the member designated 72a is in contact with a conductive area 77 in the element 75 but not with an area 76 in the element 74.
- the member designated 72b is in contact with an area 76 in element 74 but not with an element 77 in the element 75.
- a method of making an elastomeric electrical connector element comprising the steps of:
- a method of making an electrical connector element comprising the steps of:
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Push-Button Switches (AREA)
Abstract
An electrical connector comprises a plurality of elongated flexible conductors embedded in, and extending between surface of, a block of elastomeric insulating material.
Description
United States Patent Luttmer Mar. 5, 1974 ELECTRICAL CONNECTOR DEVICES [75] Inventor: Willem Luttmer, Romiley, England [56] References Cited [73] Assignee: International Computers Limited, UMTED STATES PATENTS London England 2,885,459 5/l959 Pulsifer Cl 3L l74/35 GC 3,391,456 7/1968 Gannoe 29/627 [22] Filed: Dec. 11, 1972 2,852,639 9/1958 3,056,195 10/1962 [21] Appl. No.. 311,602 3,613,230 0/1971 Related LSI Data 3,722,053 3/1973 Berry 61; 8| 29/l63.5
[62] Division of Ser. No. 135,674, April 20, 1971,
abandoned, Primary ExaminerCharles ,W. Lanham Assistant Examiner-James R. Duzan [30] Foreign Application P i ity D t Attorney, Agent, or Firm-Misegades, Douglas & Levy May 5, 1970 Great Britain 21609/70 Sept. 23, 1970 Great Britain 45196/70 [57] ABSTRACT An electrical connector comprises a plurality of elon- 52 us. Cl. 29/628, 29/629, 339/59 M, gated flexible conductors embedded in and extending 339/61 M between surface of, a block of elastomeric insulating [51] Int. Cl H0lr 43/00 materiaL [58] Field of Search.... 174/35 GC, 68,5; 339/59 M,
2 Claims, 9 Drawing Figures PATENTED 3,795,037
SHEET 1 [IF 2 VIIIIIIIIIIIIIIIIIIIIIIIII 2,2 ss- 0 F9] 0 o] K ig O 01 Pics. Fl 6.6.
PAIENIEDIMR 51914 3,795,037
SHEET 2 [If 2 1 ELECTRICAL CONNECTOR DEVICES CROSS-REFERENCES TO RELATED APPLICATIONS BACKGROUND OF THE INVENTION Field of the Invention and Cursory Prior Art The present invention is an improvement and a departure from at least the following:
Patent Patentee Class Subclass 2,885,459 Pulsifer et al. 174 35 GC 2,967,216 Zablocki et al. 339 59 M 2,454,567 Pierson, Jr. I74 35 CC 3,324,445 Miller 339 6| M 9405 I 8/63 I74 .68.5
Burndy (Gr. Britain) The invention relates to electrical connector devices.
Recent advances in micro-circuit techniques have allowed the size of individual micro-circuit elements to be significantly reduced. While a large number of circuits may be packaged in a very small volume by such techniques, a corresponding number of electrical connections must be made to such micro-circuit packages. One problem with forming such electrical connections is that the dimensions and physical tolerances of the connections to microcircuit packages are extremely small and such connections are difficult to produce by conventional techniques. Also, it is desirable thatmicro-circuit packages be easily replaceable and if such a micro-circuit has a large number of permanent connections to external circuitry, the time and effort to break and re-establish such electrical connections becomes extremely expensive. Thus, problems arise in replacing micro-circuit packages which are soldered to external circuits as the solder must be carefully removed from each lead or wire.
With conventional electrical components it is possible to secure electrical contact between components, many times by providing a spring made from an electrically conductive material and moulded in a suitable insulating material. Each end of such a spring is held in contact with anelectrically conducting portion of a component and when a pressure is exerted against one of the components the spring is compressed to assure an electrical connection therebetween. However, with the development with micro-circuit techniques, and the requirement of electrically connecting a large number of very small conductors on a micro-circuit device, it has been found that such spring contacts do not readily lend themselves to miniaturisation. In many cases it has become necessary to mount micro-circuit devices on subcarriers of much larger dimensions to make the devices compatible with conventional electrical connectors. This however, increases the cost of packaging and reduces many advantages of miniaturisation techniques.
SUMMARY or THE INVENTION According to one aspect of the invention there is provided an electrical connector comprising a plurality of elongated flexible conductive members embedded in, and each extending between surface areas of, a block of elastomeric insulating material with the extremities of the conductive members being exposed at said surface areas.
In use such a connector can provide several conductive paths between two conductors each in contact with an appropriate part of a different one of said surface areas. Conveniently, these surface areas are substantially parallel opposite faces of a slab constituting said block. Then, it is generally mostuseful for said appropriate parts to be in register with each other through the block. A small clamping pressure is sufficient for good contact.
Preferably, the extremities of the conductive members project from the block surface. The projection may be of a different material, e.g. an intermediate required for good bonding with a final layer of a noble metal.
According toanother aspect of the invention there is provided a method of making an electrical connector using metal blanks having side rails interconnected by uniformly spaced parallel strip members, comprising 'the steps of making a stack of said blanks in register with each other and disposed alternately with spacer blanks of similar shape to said metal blanks but without the strip members, and fillingthe space between the side rails of the stack with liquid, settable elastomeric, insulating material, setting said material, and removing said side rails.
BRIEF DESCRIPTION OF THE DRAWING A device for electrically connecting different electrical conductors embodying the present invention will now be described by way of example, with reference to the accompanying drawing which,
FIG. 1 shows a resilient member of the invention having a rectilinear configuration;
FIG. 2 shows a resilient member of the invention having a curvilinear configuration;
FIG. 3 shows resilient member of the invention em- DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1 there is shown a resilient connector 10 of the present invention having surfaces 11 and which serves as a tem- 12 at the top and bottom of the member, respectively.
, Member 10 may be formed from any suitable electri- A device 1 in which a plurality of resilient members or 40 may be employed is shown in FIG. 3. Each resilient member 10 is embedded in an elastomeric material 21 which both physically and electrically separates each resilient member 10 from one another to form device l. The elastomeric material 21 may be subjected to a grinding process to improve the flatness of the surface thereof and during this process the level of resilient members 10 may be reduced somewhat below that of the surface of material 21 as shown. In such cases, it may be convenient to electrolessly plate a conductive material on the opposed contact faces 11 and 12, this material being shown as contacts 13, 18, 19, 20, 22 and 23. A conductive land portion 14 of micro-circuit 15 is arranged to form an electrical connection with contacts 13, 18 and 19. Similarly, a raised conductor element 16 is arranged to electrically connect contacts 20, 22 and 23 with external electrical circuits (not shown). For example, conductor 16 may be a conductive portion of a printed circuit board. Thus, by maintaining conductor 16 on a rigid member and by applying a force of say, 50 grams, to micro-circuit 15, a resilient and reliable electrical connection between conducting land 14 and conductor 16 is formed by the device 1.
It will be appreciated that such a device 1 will not be subject to the requirement of accurately controlling the height of electrically conductive portions thereon, as is the case when pillars are used as electrical interconnection members. This problem is avoided as a result of the deivce 1 being completely resilient. Also, since no part of device 1 is bonded or fixedly attached to conductor lands l4 and 16, it will be seen that replacement of particular components such as micro-circuit 15, will be easily accomplished by removing the desired component from contact with the device 1.
While it is shown in FIG. 3 that conductor 16 is in contact with three contacts of respective resilient members 10, conductor 16 could be in contact with a greater number of contacts, say five or six, without affecting the connection existing between conductor 16 and conductive land 14 as any other resilient members in contact with conductor 16 would not be in contact with either conductive land 14 or those resilient mem+ bers in contact with conductive land 14. Also while domed contacts l3, l8 and 19 are shown it will be realised that such contacts may be flush with the surface of elastomeric material 21, and the domed contacts may be dispensed with.
An electrical assembly in which the resilient electrical connector device 1 is employed, is shown'in FIG. 4. A micro-circuit 15 is mounted on a liquid cooled heat sink 25 with the resilient connector device I mounted on circuit 15.. A printed circuit board 17 is appropriately aligned with various micro-circuits 15 by means of dowel pins 26 and 27 while nut and bolt arrangements 28 and 29 act to hold circuitboard 17 in contact with device 1 and apply a steady pressure against the resilient connector device 1. Particular conductors 30 on the printed'circuit board 17 may then be connected to the resilient electrical connector device 1 by means of interconnecting elements 31 on the printed circuit board 17.
A method for producing the resilient electrical connector device 1 shown in FIG. 3 will now'be described. A pattern in the form of a thin metal having aframe 32 with a plurality of resilient members 10 may be produced by a conventional chemical milling technique. A
hold or aperture 36 is provided in each corner of the frame for purposes of registration. By employing a chemical milling process, a large number of frames may be produced in one operation, all having accurate dimensions. Next, a spacer member 33 which is shown in FIG. 6, is placed in registration with frame 32. Astack which alternately consists of frame 32 and spacer member 33 is then built up with the thickness of the spacer member accurately determining the spacing between any two frames. The assembly is clamped between end plates 34 and 35 by pins 37 as shown in FIG. 7 with the cavity containing a large number of accurately spaced resilient members '10. The cavity is then filled with a suitable liquid elastomer, which for example, may be silicone rubber. The elastomer is then polymerised and then end plates 34 and 35 and spacer members 33 are removed. The frames 32 are then removed by a chemical etching techniqueto leave a large numberof resilient members 10 (FIG. 1) accurately spaced in an elastomeric material 21. As stated previously, the surface of material 21 may be subjected to a grinding process to improve the flatness thereof. 7
Thus it will be seen that a resilient electrical connector device 1 is produced in which a large number of electrically conducting and mutually insulated paths are provided between one side of a sheet of flexible inaterial and another. In this way the device 1 attains an isotropically conductive characteristics as a high degree of conductance is achieved in one direction and a low or negligible degree of conductance is achieved in a direction orthogonal to the first direction.
Also, as a result of such characteristics, a microcircuit having contact or conductive lands, each of which encompasses a small number of resilient members 10 in elastomer 21 may be electrically connected with external circuitry, say, in the form of a printed cir cuit interconnecting network provided with similar contacts or conductive lands of the same geometry and displacement as the micro-circuit. The required electrical connection between a micro-circuit and a printed circuit board is simply achieved by inserting the device 1 between the micro-circuit and printed circuit board and subjecting the assembly to a small pressure to 'ensure reliable electrical connections. a
While the resilient member 10 has been shown in two different forms in FIGS. 1 and 2 it will be appreciated that these forms are exemplary only and that other shapes may be employed. In each case however individual' resilient members .10 or 40 alone will haveinsufficient strength to support a micro-circuit elementlS but by being embedded in a elastomeric material 21, suffb cient strength is imparted to a number of such resilient members 10.
Another method for producing the device of the present invention is toprovide a resilient porous member. Suitable metals are selectively deposited in the pores to provide a plurality of electrically conductive paths from one surface of the resilient member to another surface.
It will be noted that FIG. 3 shows the domed contact portions 13, 18, etc., to project slightly beyond the surface of the block 21 of elastomericmaterial adjacent thereto. Such projections facilitate obtaining adequate contact pressure at the contact portions without unduly loading adjacent circuit elements to displace the elastomeric block. This is particularly so where the conductive contact areas of the associatedmicro-circuit and-.
/or circuit board are flush. The elastomeric material is not readily displaceable in practice, because of soft material will tend to have a fairly high co-efficient of friction, with the result that the face of the block in contact with a circuit element tends to resist any lateral movement relative to the face of the element. This tendency increases as the pressure is increased with the result that practicable pressures applied to the elements tend only to produce a slight bulge at the ends of .the block 1.
It is desirable for each of the ends of the embedded conductive members to project slightly from the surface of the block. Pressure applied to the circuit elements is then more directly related only to the establishment of effective pressures between the embedded members and the conductive areas on the circuit elements.
As shown in FIG. 8 it is preferred for the contact portion to have at least an outer layer 71 of a noble metal, e.g., gold. It may of course be necessary to use an intervening portion 70 of another conductive material to ensure good bonding, depending on the material used for the embedded conductive members 72. The intervening portion 70 may, conveniently, constitute the projections desired for the embedded members 72.
The block 21 may support members 72 of, say, beryllium-copper, or phosphor-bronze alloy, bent into a V- shape to provide the required flexibility in the direction in which pressure is to be applied. The ends of the members 72 are initially arranged to be substantially level with faces 79, 79a respectively. A layer of, say, copper 70 is then formed over the ends of the members 72 by,-for example, electrolytic deposition. In the process of deposition the copper layer 70 forms a dome at each end ofa member 72. A second dome-like layer 71 of, say gold is then deposited over the copper domes 70 bya similar process, so that the contact forming layers of gold project from the surfaces 79, 79a respectively.
FIG. 9 illustrates the effect of assembling a contact block similar to that of FIG. 8, between a pair of circuit elements 74 and 75 carrying conductive areas 76 and 77 respectively and applying pressure to urge the elements together. It will be seen that in addition to the formation ofa bulge 72 at the ends of the block 21, the elastomeric material of the block is free to be displaced, as indicated at 73, for example, into the small spaces between the surfaces 74, 74a of the elements 74 and 75 and the originally flat surfaces 79, 79a of the block.
It is also to be noted that because there is no initial contactbetween the surfaces 79, 79a of the block and the surfaces 74, 74a of the elements when they are initially assembled before pressure is applied, there is little friction to prevent some slight relative movement between the block and the elements 74 and 75.
It will be seen, therefore, that effective electrical contact between the conducting areas 76 and 77 is potentially improved in three ways. Firstly the individual contact pressures between the contact-forming ends of the members 72 and the areas 76 and 77 respectively are less dependent upon the resistance to compression of the elastomeric material of the block 21. Further, the deposition of a noble metal on the ends of the mem bers 72 secures a second improvement, and thirdly any tendency for lateral displacement of the block 21 produces a sliding action between the contact-forming ends of the members 72 and the conductive areas 76 and 77 respectively. It is also to be noted from FIG. 9 that a degree of tolerance in relative lateral positioning of the circuit elements 74 and 75 is permissible using this form of contact block assembly. For example, it will be seen that the member designated 72a is in contact with a conductive area 77 in the element 75 but not with an area 76 in the element 74. Conversely, the member designated 72b is in contact with an area 76 in element 74 but not with an element 77 in the element 75. Thus a lateral relative displacement of the order indicated in the figure between the elements 74 and 75 is permissible without either short-circuiting of adjacent areas 76 or 77 and without any corresponding areas 76 and 77 being unconnected.
I claim:
1. A method of making an elastomeric electrical connector element comprising the steps of:
a. providing a plurality of flat metal blanks of single thickness sheet metal each with rails interconnected by a row of uniformly spaced parallel strip members,
b. forming a rigid multi-layer stack of said blanks in which the rails arein register with each other and are separated from each other by spacers making face-to-face contact with the rails to define therewith opposed walls of a cavity traversed by a plurality of spaced rows of the strip members,
c. filling the cavity with a liquid to immerse the rows of strip members, the liquid being settable to an elastomeric electrically insulating material; and
I d. removing the rails to provide a connector element consisting of a plurality of spaced rows of metal strips embedded in the elastomeric material with the opposed ends of the strips of each row exposed.
2. A method of making an electrical connector element, comprising the steps of:
a. providing a plurality of first flat, metal blanks of single thickness sheet metal each having first and second side rails interconnected by uniformly spaced parallel strip members and an end rail,
b. providing a plurality of second metal blanks each having first and second side rails interconnected by an end rail to maintain the rails at a separation corresponding to the separation of the rails of the first metal blanks,
c. forming a stack of the first and second blanks such that the first and second blanks alternate with each other, and with the respective end and side rails aligned with each other to define side walls, and an end wall,
d. cramping the stack between side plates which coact with the end and side rails of the outermost blanks of the stack thereby to define with said walls a cavity open at one end and traversed in its interior by the spaced parallel strips,
e. filling the cavity with a liquid settable elastomer insulating material; and i f. removing, after the material has set, the side plates, end rails, and said side rails to provide a connector element consisting of a matrix of said parallel strips embedded in the elastomer material, with the ends of the strips exposed.
Claims (2)
1. A method of making an elastomeric electrical connector element comprising the steps of: a. providing a plurality of flat metal blanks of single thickness sheet metal each with rails interconnected by a row of uniformly spaced parallel strip members, b. forming a rigid multi-layer stack of said blanks in which the rails are in register with each other and are separated from each other by spacers making face-to-face contact with the rails to define therewith opposed walls of a cavity traversed by a plurality of spaced rows of the strip members, c. filling the cavity with a liquid to immerse the rows of strip members, the liquid being settable to an elastomeric electrically insulating material; and d. removing the rails to provide a connector element consisting of a plurality of spaced rows of metal strips embedded in the elastomeric material with the opposed ends of the strips of each row exposed.
2. A method of making an electrical connector element, comprising the steps of: a. providing a plurality of first flat, metal blanks of single thickness sheet metal each having first and second side rails interconnected by uniformly spaced parallel strip members and an end rail, b. providing a plurality of second metal blanks each having first and second side rails interconnected by an end rail to maintain the rails at a separation corresponding to the separation of the rails of the first metal blanks, c. forming a stack of the first and second blanks such that the first and second blanks alternate with each other, and with the respective end and side rails aligned with each other to define side walls, and an end wall, d. cramping the stack between side plates which co-act with the end and side rails of the outermost blanks of the stack thereby to define with said walls a cavity open at one end and traversed in its interior by the spaced parallel strips, e. filling the cavity with a liquid settable elastomer insulating material; and f. removing, after the material has set, the side plates, end rails, and said side rails to provide a connector element consisting of a matrix of said parallel strips embedded in the elastomer material, with the ends of the strips exposed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2160970 | 1970-05-05 | ||
GB4519670 | 1970-09-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3795037A true US3795037A (en) | 1974-03-05 |
Family
ID=26255424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00311602A Expired - Lifetime US3795037A (en) | 1970-05-05 | 1972-12-11 | Electrical connector devices |
Country Status (6)
Country | Link |
---|---|
US (1) | US3795037A (en) |
DE (1) | DE2119567C2 (en) |
FR (1) | FR2091247A5 (en) |
GB (1) | GB1341037A (en) |
PL (1) | PL81630B1 (en) |
SE (1) | SE384105B (en) |
Cited By (216)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3858958A (en) * | 1972-10-31 | 1975-01-07 | Int Computers Ltd | Methods and apparatus for forming electrical connections |
US3866319A (en) * | 1972-02-22 | 1975-02-18 | Trw Inc | Printed circuit edge connector |
JPS50118881U (en) * | 1974-03-13 | 1975-09-29 | ||
US3916513A (en) * | 1974-05-03 | 1975-11-04 | Ampex | Forming interconnections between circuit layers |
US3934959A (en) * | 1973-08-08 | 1976-01-27 | Amp Incorporated | Electrical connector |
US3954317A (en) * | 1974-02-27 | 1976-05-04 | Amp Incorporated | Elastomeric connector and its method of manufacture |
US4003621A (en) * | 1975-06-16 | 1977-01-18 | Technical Wire Products, Inc. | Electrical connector employing conductive rectilinear elements |
US4008519A (en) * | 1975-02-11 | 1977-02-22 | Amp Incorporated | Elastomeric connector and its method of manufacture |
US4016647A (en) * | 1974-07-22 | 1977-04-12 | Amp Incorporated | Method of forming a matrix connector |
DE2652683A1 (en) * | 1975-11-26 | 1977-06-08 | Shinetsu Polymer Co | ANISOTROPIC ELECTRICALLY CONDUCTIVE COMPOSITE PLATE-SHAPED BODIES AND PROCESS FOR THEIR PRODUCTION |
US4067104A (en) * | 1977-02-24 | 1978-01-10 | Rockwell International Corporation | Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components |
DE2740195A1 (en) * | 1976-09-09 | 1978-03-16 | Toray Industries | Elastomer sheet contg. wires parallel with sheet thickness - and used for connections in computers or other electronic appts. |
US4142780A (en) * | 1974-03-29 | 1979-03-06 | Sharp Kabushiki Kaisha | Exchangeable liquid crystal panel |
EP0001897A2 (en) * | 1977-10-21 | 1979-05-16 | The University Of Melbourne | Electrical connector including an elastomeric connecting element |
US4199209A (en) * | 1978-08-18 | 1980-04-22 | Amp Incorporated | Electrical interconnecting device |
US4257661A (en) * | 1977-10-28 | 1981-03-24 | Technical Wire Products, Inc. | Retainer for elastomeric electrical connector |
US4330165A (en) * | 1979-06-29 | 1982-05-18 | Shin-Etsu Polymer Co., Ltd. | Press-contact type interconnectors |
DE3133188A1 (en) * | 1980-08-22 | 1982-05-27 | Shin-Etsu Polymer Co., Ltd., Tokyo | Electrical connecting piece for pressure-contact holders |
US4344662A (en) * | 1979-04-30 | 1982-08-17 | Technical Wire Products, Inc. | Retainer for elastomeric electrical connector |
EP0066706A2 (en) * | 1981-06-04 | 1982-12-15 | International Business Machines Corporation | Semiconductor module circuit interconnection system |
EP0070136A1 (en) * | 1981-07-06 | 1983-01-19 | Honeywell Information Systems Inc. | Electrical connector for printed circuit board |
US4400234A (en) * | 1975-11-13 | 1983-08-23 | Tektronix, Inc. | Method of manufacturing electrical connector |
US4507341A (en) * | 1983-02-24 | 1985-03-26 | Westland Plc | Carbon fibre structures |
US4518648A (en) * | 1983-03-10 | 1985-05-21 | Alps Electric Co., Ltd. | Sheet material and production method thereof |
US4520562A (en) * | 1979-11-20 | 1985-06-04 | Shin-Etsu Polymer Co., Ltd. | Method for manufacturing an elastic composite body with metal wires embedded therein |
US4545647A (en) * | 1974-09-30 | 1985-10-08 | Sharp Kabushiki Kaisha | Resilient interconnection for exchangeable liquid crystal panel |
EP0159593A2 (en) * | 1984-04-27 | 1985-10-30 | International Business Machines Corporation | Electrical connector and method for making the same |
US4581679A (en) * | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
US4593961A (en) * | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
US4634199A (en) * | 1985-01-22 | 1987-01-06 | Itt Corporation | Connector assembly for making multiple connections in a thin space |
US4752231A (en) * | 1986-08-25 | 1988-06-21 | General Patent Counsel/ Amp Inc. | Electrical connector for use between spaced apart circuit boards |
US4764848A (en) * | 1986-11-24 | 1988-08-16 | International Business Machines Corporation | Surface mounted array strain relief device |
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4806104A (en) * | 1988-02-09 | 1989-02-21 | Itt Corporation | High density connector |
US4814857A (en) * | 1987-02-25 | 1989-03-21 | International Business Machines Corporation | Circuit module with separate signal and power connectors |
US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
US4871316A (en) * | 1988-10-17 | 1989-10-03 | Microelectronics And Computer Technology Corporation | Printed wire connector |
US4924353A (en) * | 1985-12-20 | 1990-05-08 | Hughes Aircraft Company | Connector system for coupling to an integrated circuit chip |
US4923404A (en) * | 1989-10-20 | 1990-05-08 | Amp Incorporated | Sealed chip carrier |
US4992053A (en) * | 1989-07-05 | 1991-02-12 | Labinal Components And Systems, Inc. | Electrical connectors |
US4998886A (en) * | 1989-07-07 | 1991-03-12 | Teledyne Kinetics | High density stacking connector |
US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
US5049084A (en) * | 1989-12-05 | 1991-09-17 | Rogers Corporation | Electrical circuit board interconnect |
US5069627A (en) * | 1990-06-19 | 1991-12-03 | Amp Incorporated | Adjustable stacking connector for electrically connecting circuit boards |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5127837A (en) * | 1989-06-09 | 1992-07-07 | Labinal Components And Systems, Inc. | Electrical connectors and IC chip tester embodying same |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5226823A (en) * | 1992-01-09 | 1993-07-13 | Teledyne Kinectics | Indexing mechanism for precision alignment of electrical contacts |
US5245751A (en) * | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
US5259767A (en) * | 1992-07-10 | 1993-11-09 | Teledyne Kinetics | Connector for a plated or soldered hole |
US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
EP0571879A2 (en) * | 1992-05-18 | 1993-12-01 | Japan Aviation Electronics Industry, Limited | Connector which is simple in structure and in which connection and disconnection can be readily carried out |
US5268815A (en) * | 1992-02-14 | 1993-12-07 | International Business Machines Corporation | High density, high performance memory circuit package |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US5299939A (en) * | 1992-03-05 | 1994-04-05 | International Business Machines Corporation | Spring array connector |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5378160A (en) * | 1993-10-01 | 1995-01-03 | Bourns, Inc. | Compliant stacking connector for printed circuit boards |
US5386344A (en) * | 1993-01-26 | 1995-01-31 | International Business Machines Corporation | Flex circuit card elastomeric cable connector assembly |
US5388996A (en) * | 1991-01-09 | 1995-02-14 | Johnson; David A. | Electrical interconnect contact system |
US5403194A (en) * | 1992-07-17 | 1995-04-04 | Shin-Etsu Polymer Co., Ltd. | Elastic interconnector |
US5455390A (en) * | 1994-02-01 | 1995-10-03 | Tessera, Inc. | Microelectronics unit mounting with multiple lead bonding |
US5474458A (en) * | 1993-07-13 | 1995-12-12 | Fujitsu Limited | Interconnect carriers having high-density vertical connectors and methods for making the same |
US5485351A (en) * | 1989-06-09 | 1996-01-16 | Labinal Components And Systems, Inc. | Socket assembly for integrated circuit chip package |
WO1996002068A1 (en) * | 1994-07-07 | 1996-01-25 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation |
WO1996002959A1 (en) * | 1994-07-19 | 1996-02-01 | Tessera, Inc. | Electrical connections with deformable contacts |
WO1996016440A1 (en) * | 1994-11-15 | 1996-05-30 | Formfactor, Inc. | Interconnection elements for microelectronic components |
US5597313A (en) * | 1986-06-19 | 1997-01-28 | Labinal Components And Systems, Inc. | Electrical connectors |
WO1997011486A1 (en) * | 1995-09-22 | 1997-03-27 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
US5634801A (en) * | 1991-01-09 | 1997-06-03 | Johnstech International Corporation | Electrical interconnect contact system |
US5672062A (en) * | 1991-01-30 | 1997-09-30 | Labinal Components And Systems, Inc. | Electrical connectors |
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5688716A (en) * | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5811982A (en) * | 1995-11-27 | 1998-09-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US5810607A (en) * | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US5830782A (en) * | 1994-07-07 | 1998-11-03 | Tessera, Inc. | Microelectronic element bonding with deformation of leads in rows |
US5838160A (en) * | 1994-04-07 | 1998-11-17 | International Business Machines Corporation | Integral rigid chip test probe |
US5859472A (en) * | 1996-09-12 | 1999-01-12 | Tessera, Inc. | Curved lead configurations |
US5876215A (en) * | 1995-07-07 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Separable electrical connector assembly having a planar array of conductive protrusions |
US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
US5937276A (en) * | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
US5953214A (en) * | 1994-03-07 | 1999-09-14 | International Business Machines Corporation | Dual substrate package assembly coupled to a conducting member |
US5994152A (en) * | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US6028498A (en) * | 1997-09-05 | 2000-02-22 | Hewlett-Packard Company | Low inductance interconnect having a comb-like resilient structure |
US6030856A (en) * | 1996-06-10 | 2000-02-29 | Tessera, Inc. | Bondable compliant pads for packaging of a semiconductor chip and method therefor |
US6049976A (en) * | 1993-11-16 | 2000-04-18 | Formfactor, Inc. | Method of mounting free-standing resilient electrical contact structures to electronic components |
US6078500A (en) * | 1998-05-12 | 2000-06-20 | International Business Machines Inc. | Pluggable chip scale package |
DE19856083A1 (en) * | 1998-12-04 | 2000-06-21 | Siemens Ag | Electrical connection arrangement for data communications equipment e.g. between contact pads especially of electro=optical module and terminals of circuit board |
EP1022813A1 (en) * | 1999-01-22 | 2000-07-26 | Shin-Etsu Polymer Co., Ltd. | Press-contact connector |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
US6133627A (en) * | 1990-09-24 | 2000-10-17 | Tessera, Inc. | Semiconductor chip package with center contacts |
US6133072A (en) * | 1996-12-13 | 2000-10-17 | Tessera, Inc. | Microelectronic connector with planar elastomer sockets |
US6188028B1 (en) | 1997-06-09 | 2001-02-13 | Tessera, Inc. | Multilayer structure with interlocking protrusions |
US6247228B1 (en) | 1996-08-12 | 2001-06-19 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US6274823B1 (en) | 1993-11-16 | 2001-08-14 | Formfactor, Inc. | Interconnection substrates with resilient contact structures on both sides |
US20010030370A1 (en) * | 1990-09-24 | 2001-10-18 | Khandros Igor Y. | Microelectronic assembly having encapsulated wire bonding leads |
US6361959B1 (en) | 1994-07-07 | 2002-03-26 | Tessera, Inc. | Microelectronic unit forming methods and materials |
US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
US6426638B1 (en) | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
US6429112B1 (en) | 1994-07-07 | 2002-08-06 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US6434817B1 (en) | 1999-12-03 | 2002-08-20 | Delphi Technologies, Inc. | Method for joining an integrated circuit |
US6444921B1 (en) | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
US20020155728A1 (en) * | 1990-09-24 | 2002-10-24 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US6525551B1 (en) * | 1997-05-22 | 2003-02-25 | International Business Machines Corporation | Probe structures for testing electrical interconnections to integrated circuit electronic devices |
US20030048108A1 (en) * | 1993-04-30 | 2003-03-13 | Beaman Brian Samuel | Structural design and processes to control probe position accuracy in a wafer test probe assembly |
US20030071346A1 (en) * | 1994-07-07 | 2003-04-17 | Tessera, Inc. | Flexible lead structures and methods of making same |
US6586684B2 (en) * | 2001-06-29 | 2003-07-01 | Intel Corporation | Circuit housing clamp and method of manufacture therefor |
US6598290B2 (en) * | 1998-01-20 | 2003-07-29 | Micron Technology, Inc. | Method of making a spring element for use in an apparatus for attaching to a semiconductor |
US6604950B2 (en) | 2001-04-26 | 2003-08-12 | Teledyne Technologies Incorporated | Low pitch, high density connector |
US20030199179A1 (en) * | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
US20030232520A1 (en) * | 2002-05-28 | 2003-12-18 | Achammer Daniel G. | Connector packaging and transport assembly |
US6686015B2 (en) | 1996-12-13 | 2004-02-03 | Tessera, Inc. | Transferable resilient element for packaging of a semiconductor chip and method therefor |
US6703640B1 (en) | 1998-01-20 | 2004-03-09 | Micron Technology, Inc. | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching |
US20040105244A1 (en) * | 2002-08-06 | 2004-06-03 | Ilyas Mohammed | Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
US6783370B2 (en) * | 2000-02-23 | 2004-08-31 | Citizen Electronics Co., Ltd. | Connecting member for a sound generator |
US20040209439A1 (en) * | 1996-12-13 | 2004-10-21 | Tessera, Inc. | Method for forming a multi-layer circuit assembly |
US20050014394A1 (en) * | 2003-05-28 | 2005-01-20 | Infineon Technologies | Contact-connection device for electronic circuit units and production method |
US6846115B1 (en) * | 2001-01-29 | 2005-01-25 | Jds Uniphase Corporation | Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US20050155223A1 (en) * | 1994-07-07 | 2005-07-21 | Tessera, Inc. | Methods of making microelectronic assemblies |
US20050176273A1 (en) * | 2004-02-10 | 2005-08-11 | International Business Machines Corporation | Integrated circuit redistribution package |
US20060033517A1 (en) * | 1994-11-15 | 2006-02-16 | Formfactor, Inc. | Probe for semiconductor devices |
DE102004061853A1 (en) * | 2004-12-22 | 2006-03-02 | Infineon Technologies Ag | Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board |
US7084656B1 (en) | 1993-11-16 | 2006-08-01 | Formfactor, Inc. | Probe for semiconductor devices |
US20070040565A1 (en) * | 2005-08-19 | 2007-02-22 | National University of Singapore, Agency For Science, Technology and Research | Compliant probes and test methodology for fine pitch wafer level devices and interconnects |
US20070075717A1 (en) * | 2005-09-14 | 2007-04-05 | Touchdown Technologies, Inc. | Lateral interposer contact design and probe card assembly |
US20070126443A1 (en) * | 2001-07-11 | 2007-06-07 | Formfactor, Inc. | Method of Manufacturing A Probe Card |
US7254889B1 (en) * | 2000-09-08 | 2007-08-14 | Gabe Cherian | Interconnection devices |
US7276919B1 (en) * | 1995-04-20 | 2007-10-02 | International Business Machines Corporation | High density integral test probe |
US7282945B1 (en) * | 1996-09-13 | 2007-10-16 | International Business Machines Corporation | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof |
US20080048688A1 (en) * | 2000-03-17 | 2008-02-28 | Formfactor, Inc. | Methods for planarizing a semiconductor contactor |
US20090104736A1 (en) * | 2004-11-03 | 2009-04-23 | Tessera, Inc. | Stacked Packaging Improvements |
US20090179336A1 (en) * | 2006-01-30 | 2009-07-16 | Valeo Etudes Electroniques | Electronic Module and a Method of Assembling Such a Module |
US7601039B2 (en) | 1993-11-16 | 2009-10-13 | Formfactor, Inc. | Microelectronic contact structure and method of making same |
US20090309098A1 (en) * | 2006-03-16 | 2009-12-17 | Eles Semiconductor Equipment S.P.A. | Interconnection of electronic devices with raised leads |
US20100171227A1 (en) * | 2007-06-07 | 2010-07-08 | Commissariat A L'energie Atomique | Method of producing a via in a reconstituted substrate |
US20100219550A1 (en) * | 2009-03-02 | 2010-09-02 | Tsinghua University | Method for making thermal interface material |
US20110057018A1 (en) * | 1995-05-26 | 2011-03-10 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
US20110074009A1 (en) * | 2009-09-29 | 2011-03-31 | Bae Systems Information & Electronic Systems Integration Inc. | Isostress grid array and method of fabrication thereof |
US20110165733A1 (en) * | 2005-12-23 | 2011-07-07 | Tessera, Inc. | Microelectronic packages and methods therefor |
US7982305B1 (en) * | 2008-10-20 | 2011-07-19 | Maxim Integrated Products, Inc. | Integrated circuit package including a three-dimensional fan-out / fan-in signal routing |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US20110273857A1 (en) * | 2010-05-07 | 2011-11-10 | Oracle International Corporation | Contact springs for silicon chip packages |
WO2011160138A3 (en) * | 2010-06-18 | 2012-03-15 | Zenith Investments Llc | Dual orientation connector with side contacts |
US8373428B2 (en) | 1993-11-16 | 2013-02-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US8404520B1 (en) * | 2011-10-17 | 2013-03-26 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8461465B2 (en) | 2010-05-28 | 2013-06-11 | Apple Inc. | Conductive frame for an electrical connector |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
US8517766B2 (en) | 2011-11-07 | 2013-08-27 | Apple Inc. | Plug connector with external contacts |
US8618659B2 (en) | 2011-05-03 | 2013-12-31 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US8623706B2 (en) | 2010-11-15 | 2014-01-07 | Tessera, Inc. | Microelectronic package with terminals on dielectric mass |
US20140068933A1 (en) * | 2012-09-11 | 2014-03-13 | Apple Inc. | Connectors and methods for manufacturing connectors |
US8777666B2 (en) | 2012-09-07 | 2014-07-15 | Apple Inc. | Plug connector modules |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US8878353B2 (en) | 2012-12-20 | 2014-11-04 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
US8883563B1 (en) | 2013-07-15 | 2014-11-11 | Invensas Corporation | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
US8882524B2 (en) | 2010-06-21 | 2014-11-11 | Apple Inc. | External contact plug connector |
US8911260B2 (en) | 2010-06-21 | 2014-12-16 | Apple Inc. | External contact plug connector |
US8975738B2 (en) | 2012-11-12 | 2015-03-10 | Invensas Corporation | Structure for microelectronic packaging with terminals on dielectric mass |
US9023691B2 (en) | 2013-07-15 | 2015-05-05 | Invensas Corporation | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
US9034696B2 (en) | 2013-07-15 | 2015-05-19 | Invensas Corporation | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation |
US9054477B2 (en) | 2012-09-11 | 2015-06-09 | Apple Inc. | Connectors and methods for manufacturing connectors |
US9059531B2 (en) | 2012-09-11 | 2015-06-16 | Apple Inc. | Connectors and methods for manufacturing connectors |
US9082753B2 (en) | 2013-11-12 | 2015-07-14 | Invensas Corporation | Severing bond wire by kinking and twisting |
US9087815B2 (en) | 2013-11-12 | 2015-07-21 | Invensas Corporation | Off substrate kinking of bond wire |
US9093803B2 (en) | 2012-09-07 | 2015-07-28 | Apple Inc. | Plug connector |
US9112327B2 (en) | 2011-11-30 | 2015-08-18 | Apple Inc. | Audio/video connector for an electronic device |
US9124048B2 (en) | 2010-06-09 | 2015-09-01 | Apple Inc. | Flexible TRS connector |
US20150263450A1 (en) * | 2014-03-13 | 2015-09-17 | Apple Inc. | Elastomeric connectors |
US9142925B2 (en) | 2010-05-28 | 2015-09-22 | Apple Inc. | D-shaped connector |
US9214454B2 (en) | 2014-03-31 | 2015-12-15 | Invensas Corporation | Batch process fabrication of package-on-package microelectronic assemblies |
US9224717B2 (en) | 2011-05-03 | 2015-12-29 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US9324681B2 (en) | 2010-12-13 | 2016-04-26 | Tessera, Inc. | Pin attachment |
US9325097B2 (en) | 2012-11-16 | 2016-04-26 | Apple Inc. | Connector contacts with thermally conductive polymer |
US9350125B2 (en) | 2013-01-24 | 2016-05-24 | Apple Inc. | Reversible USB connector with compliant member to spread stress and increase contact normal force |
US9349706B2 (en) | 2012-02-24 | 2016-05-24 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
US9412714B2 (en) | 2014-05-30 | 2016-08-09 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US20170005427A1 (en) * | 2014-04-18 | 2017-01-05 | Yazaki Corporation | Conductive elastic member and connector |
US9553076B2 (en) | 2010-07-19 | 2017-01-24 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US9601454B2 (en) | 2013-02-01 | 2017-03-21 | Invensas Corporation | Method of forming a component having wire bonds and a stiffening layer |
US9646917B2 (en) | 2014-05-29 | 2017-05-09 | Invensas Corporation | Low CTE component with wire bond interconnects |
US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
US9691679B2 (en) | 2012-02-24 | 2017-06-27 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US9728527B2 (en) | 2013-11-22 | 2017-08-08 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
US9812402B2 (en) | 2015-10-12 | 2017-11-07 | Invensas Corporation | Wire bond wires for interference shielding |
US9842745B2 (en) | 2012-02-17 | 2017-12-12 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US9852969B2 (en) | 2013-11-22 | 2017-12-26 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US9911718B2 (en) | 2015-11-17 | 2018-03-06 | Invensas Corporation | ‘RDL-First’ packaged microelectronic device for a package-on-package device |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US10008477B2 (en) | 2013-09-16 | 2018-06-26 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
US10008469B2 (en) | 2015-04-30 | 2018-06-26 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US10026717B2 (en) | 2013-11-22 | 2018-07-17 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
US10392033B2 (en) * | 2016-07-12 | 2019-08-27 | Amsted Rail Company, Inc. | Railway truck with improved bearing adapter |
US10460958B2 (en) | 2013-08-07 | 2019-10-29 | Invensas Corporation | Method of manufacturing embedded packaging with preformed vias |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US20200072871A1 (en) * | 2017-03-31 | 2020-03-05 | Intel Corporation | Ultra low-cost, low leadtime, and high density space transformer for fine pitch applications |
US10600739B1 (en) * | 2017-09-28 | 2020-03-24 | Hrl Laboratories, Llc | Interposer with interconnects and methods of manufacturing the same |
US20210104854A1 (en) * | 2017-05-18 | 2021-04-08 | Shin-Etsu Polymer Co., Ltd. | Electrical connector and method for producing same |
CN113453418A (en) * | 2021-06-28 | 2021-09-28 | 浙江挚领科技有限公司 | Heat conduction device and manufacturing method thereof |
USRE49287E1 (en) | 2009-04-15 | 2022-11-08 | Kiwi Connection, Llc | Socket structure with duplex electrical connection |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE794428A (en) * | 1972-01-29 | 1973-07-23 | Amp Inc | ELECTRICAL CONNECTOR AND ITS MANUFACTURING PROCESS |
JPS5836513B2 (en) * | 1974-05-10 | 1983-08-09 | 東レ株式会社 | Laminated piece connector and its manufacturing method |
JPS5915376B2 (en) * | 1977-10-18 | 1984-04-09 | 信越ポリマ−株式会社 | electronic circuit parts |
FR2519228A1 (en) * | 1981-12-29 | 1983-07-01 | Inst Kolloidnoi Khim | Electric connector e.g. for integrated circuits - has matrix of contacts designed as springy pieces of wire arranged in rows |
DE3151933C2 (en) * | 1981-12-30 | 1984-09-06 | Institut Kolloidnoj Chimii i Chimii Vody imeni A.V. Dumanskogo Akademii Nauk Ukrainskoj SSR, Kiev | Electrical connector |
US4533205A (en) * | 1982-09-30 | 1985-08-06 | Burndy Corporation | Collapsible wedge for electrical connector |
GB8330391D0 (en) * | 1983-11-15 | 1983-12-21 | Gen Electric Co Plc | Electrical interface arrangement |
GB2153160B (en) * | 1984-01-20 | 1988-03-16 | Sharp Kk | Connection between power supply and printed circuit board |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
JP3063839B2 (en) * | 1997-11-18 | 2000-07-12 | 日本電気株式会社 | Mounting structure and mounting method of mounted components |
DE20019641U1 (en) * | 2000-11-18 | 2001-04-05 | Amrhein, Herbert, 74321 Bietigheim-Bissingen | Contacting device for establishing an electrically conductive connection |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2852639A (en) * | 1954-11-08 | 1958-09-16 | Leach Corp | Relay |
US2885459A (en) * | 1955-11-02 | 1959-05-05 | Pulsifer Verne | Sealing and conducting gasket material |
US3056195A (en) * | 1959-06-04 | 1962-10-02 | Western Gold And Platinum Comp | Method of brazing |
US3391456A (en) * | 1965-04-30 | 1968-07-09 | Sylvania Electric Prod | Multiple segment array making |
US3613230A (en) * | 1969-04-29 | 1971-10-19 | Bunker Ramo | Method of fabricating coaxial circuitry |
US3722053A (en) * | 1971-07-26 | 1973-03-27 | Dresser Ind | Method of making well pressure sealing cup reinforcing structure |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3126440A (en) * | 1964-03-24 | Shielding and sealing gasket material | ||
GB940518A (en) * | 1961-01-03 | 1963-10-30 | Burndy Corp | Tape cable interconnection |
US3509296A (en) * | 1967-10-23 | 1970-04-28 | Ncr Co | Resilient variable-conductivity circuit controlling means |
-
1971
- 1971-04-22 DE DE2119567A patent/DE2119567C2/en not_active Expired
- 1971-04-24 PL PL1971147758A patent/PL81630B1/pl unknown
- 1971-04-28 GB GB2160970A patent/GB1341037A/en not_active Expired
- 1971-05-05 FR FR7116226A patent/FR2091247A5/fr not_active Expired
- 1971-05-05 SE SE7105861A patent/SE384105B/en unknown
-
1972
- 1972-12-11 US US00311602A patent/US3795037A/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2852639A (en) * | 1954-11-08 | 1958-09-16 | Leach Corp | Relay |
US2885459A (en) * | 1955-11-02 | 1959-05-05 | Pulsifer Verne | Sealing and conducting gasket material |
US3056195A (en) * | 1959-06-04 | 1962-10-02 | Western Gold And Platinum Comp | Method of brazing |
US3391456A (en) * | 1965-04-30 | 1968-07-09 | Sylvania Electric Prod | Multiple segment array making |
US3613230A (en) * | 1969-04-29 | 1971-10-19 | Bunker Ramo | Method of fabricating coaxial circuitry |
US3722053A (en) * | 1971-07-26 | 1973-03-27 | Dresser Ind | Method of making well pressure sealing cup reinforcing structure |
Cited By (446)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3866319A (en) * | 1972-02-22 | 1975-02-18 | Trw Inc | Printed circuit edge connector |
US3858958A (en) * | 1972-10-31 | 1975-01-07 | Int Computers Ltd | Methods and apparatus for forming electrical connections |
US3934959A (en) * | 1973-08-08 | 1976-01-27 | Amp Incorporated | Electrical connector |
US3954317A (en) * | 1974-02-27 | 1976-05-04 | Amp Incorporated | Elastomeric connector and its method of manufacture |
JPS50118881U (en) * | 1974-03-13 | 1975-09-29 | ||
JPS5519981Y2 (en) * | 1974-03-13 | 1980-05-13 | ||
US4142780A (en) * | 1974-03-29 | 1979-03-06 | Sharp Kabushiki Kaisha | Exchangeable liquid crystal panel |
US3916513A (en) * | 1974-05-03 | 1975-11-04 | Ampex | Forming interconnections between circuit layers |
US4016647A (en) * | 1974-07-22 | 1977-04-12 | Amp Incorporated | Method of forming a matrix connector |
US4545647A (en) * | 1974-09-30 | 1985-10-08 | Sharp Kabushiki Kaisha | Resilient interconnection for exchangeable liquid crystal panel |
US4008519A (en) * | 1975-02-11 | 1977-02-22 | Amp Incorporated | Elastomeric connector and its method of manufacture |
US4003621A (en) * | 1975-06-16 | 1977-01-18 | Technical Wire Products, Inc. | Electrical connector employing conductive rectilinear elements |
US4400234A (en) * | 1975-11-13 | 1983-08-23 | Tektronix, Inc. | Method of manufacturing electrical connector |
DE2652683A1 (en) * | 1975-11-26 | 1977-06-08 | Shinetsu Polymer Co | ANISOTROPIC ELECTRICALLY CONDUCTIVE COMPOSITE PLATE-SHAPED BODIES AND PROCESS FOR THEIR PRODUCTION |
US4199637A (en) * | 1975-11-26 | 1980-04-22 | Shin-Etsu Polymer Co., Ltd. | Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof |
DE2740195A1 (en) * | 1976-09-09 | 1978-03-16 | Toray Industries | Elastomer sheet contg. wires parallel with sheet thickness - and used for connections in computers or other electronic appts. |
US4067104A (en) * | 1977-02-24 | 1978-01-10 | Rockwell International Corporation | Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components |
EP0001897A2 (en) * | 1977-10-21 | 1979-05-16 | The University Of Melbourne | Electrical connector including an elastomeric connecting element |
EP0001897A3 (en) * | 1977-10-21 | 1979-05-30 | The University Of Melbourne | Electrical connector including an elastomeric connecting element |
US4257661A (en) * | 1977-10-28 | 1981-03-24 | Technical Wire Products, Inc. | Retainer for elastomeric electrical connector |
US4199209A (en) * | 1978-08-18 | 1980-04-22 | Amp Incorporated | Electrical interconnecting device |
US4344662A (en) * | 1979-04-30 | 1982-08-17 | Technical Wire Products, Inc. | Retainer for elastomeric electrical connector |
US4330165A (en) * | 1979-06-29 | 1982-05-18 | Shin-Etsu Polymer Co., Ltd. | Press-contact type interconnectors |
US4520562A (en) * | 1979-11-20 | 1985-06-04 | Shin-Etsu Polymer Co., Ltd. | Method for manufacturing an elastic composite body with metal wires embedded therein |
DE3133188A1 (en) * | 1980-08-22 | 1982-05-27 | Shin-Etsu Polymer Co., Ltd., Tokyo | Electrical connecting piece for pressure-contact holders |
EP0066706A3 (en) * | 1981-06-04 | 1984-04-25 | International Business Machines Corporation | Semiconductor module circuit interconnection system |
EP0066706A2 (en) * | 1981-06-04 | 1982-12-15 | International Business Machines Corporation | Semiconductor module circuit interconnection system |
EP0070136A1 (en) * | 1981-07-06 | 1983-01-19 | Honeywell Information Systems Inc. | Electrical connector for printed circuit board |
US4507341A (en) * | 1983-02-24 | 1985-03-26 | Westland Plc | Carbon fibre structures |
US4518648A (en) * | 1983-03-10 | 1985-05-21 | Alps Electric Co., Ltd. | Sheet material and production method thereof |
US4581679A (en) * | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
EP0159593A2 (en) * | 1984-04-27 | 1985-10-30 | International Business Machines Corporation | Electrical connector and method for making the same |
EP0159593A3 (en) * | 1984-04-27 | 1988-06-01 | International Business Machines Corporation | Electrical connector and method for making the same |
US4593961A (en) * | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
US4634199A (en) * | 1985-01-22 | 1987-01-06 | Itt Corporation | Connector assembly for making multiple connections in a thin space |
US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
US4924353A (en) * | 1985-12-20 | 1990-05-08 | Hughes Aircraft Company | Connector system for coupling to an integrated circuit chip |
US5597313A (en) * | 1986-06-19 | 1997-01-28 | Labinal Components And Systems, Inc. | Electrical connectors |
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4752231A (en) * | 1986-08-25 | 1988-06-21 | General Patent Counsel/ Amp Inc. | Electrical connector for use between spaced apart circuit boards |
US4764848A (en) * | 1986-11-24 | 1988-08-16 | International Business Machines Corporation | Surface mounted array strain relief device |
US4814857A (en) * | 1987-02-25 | 1989-03-21 | International Business Machines Corporation | Circuit module with separate signal and power connectors |
US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
US4806104A (en) * | 1988-02-09 | 1989-02-21 | Itt Corporation | High density connector |
US4871316A (en) * | 1988-10-17 | 1989-10-03 | Microelectronics And Computer Technology Corporation | Printed wire connector |
US5761036A (en) * | 1989-06-09 | 1998-06-02 | Labinal Components And Systems, Inc. | Socket assembly for electrical component |
US5485351A (en) * | 1989-06-09 | 1996-01-16 | Labinal Components And Systems, Inc. | Socket assembly for integrated circuit chip package |
US5127837A (en) * | 1989-06-09 | 1992-07-07 | Labinal Components And Systems, Inc. | Electrical connectors and IC chip tester embodying same |
US4992053A (en) * | 1989-07-05 | 1991-02-12 | Labinal Components And Systems, Inc. | Electrical connectors |
US4998886A (en) * | 1989-07-07 | 1991-03-12 | Teledyne Kinetics | High density stacking connector |
US4923404A (en) * | 1989-10-20 | 1990-05-08 | Amp Incorporated | Sealed chip carrier |
US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
US5049084A (en) * | 1989-12-05 | 1991-09-17 | Rogers Corporation | Electrical circuit board interconnect |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5245751A (en) * | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
US5069627A (en) * | 1990-06-19 | 1991-12-03 | Amp Incorporated | Adjustable stacking connector for electrically connecting circuit boards |
US7291910B2 (en) | 1990-09-24 | 2007-11-06 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US20010030370A1 (en) * | 1990-09-24 | 2001-10-18 | Khandros Igor Y. | Microelectronic assembly having encapsulated wire bonding leads |
US5950304A (en) * | 1990-09-24 | 1999-09-14 | Tessera, Inc. | Methods of making semiconductor chip assemblies |
US5682061A (en) * | 1990-09-24 | 1997-10-28 | Tessera, Inc. | Component for connecting a semiconductor chip to a substrate |
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5346861A (en) * | 1990-09-24 | 1994-09-13 | Tessera, Inc. | Semiconductor chip assemblies and methods of making same |
US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
US20050087855A1 (en) * | 1990-09-24 | 2005-04-28 | Tessera, Inc. | Microelectronic component and assembly having leads with offset portions |
US20030168253A1 (en) * | 1990-09-24 | 2003-09-11 | Tessera, Inc. | Microelectronic component and assembly having leads with offset portions |
US7098078B2 (en) | 1990-09-24 | 2006-08-29 | Tessera, Inc. | Microelectronic component and assembly having leads with offset portions |
US6433419B2 (en) | 1990-09-24 | 2002-08-13 | Tessera, Inc. | Face-up semiconductor chip assemblies |
US6133627A (en) * | 1990-09-24 | 2000-10-17 | Tessera, Inc. | Semiconductor chip package with center contacts |
US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US7271481B2 (en) | 1990-09-24 | 2007-09-18 | Tessera, Inc. | Microelectronic component and assembly having leads with offset portions |
US20020155728A1 (en) * | 1990-09-24 | 2002-10-24 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US6465893B1 (en) | 1990-09-24 | 2002-10-15 | Tessera, Inc. | Stacked chip assembly |
US6372527B1 (en) | 1990-09-24 | 2002-04-16 | Tessera, Inc. | Methods of making semiconductor chip assemblies |
US6392306B1 (en) | 1990-09-24 | 2002-05-21 | Tessera, Inc. | Semiconductor chip assembly with anisotropic conductive adhesive connections |
US5634801A (en) * | 1991-01-09 | 1997-06-03 | Johnstech International Corporation | Electrical interconnect contact system |
US5388996A (en) * | 1991-01-09 | 1995-02-14 | Johnson; David A. | Electrical interconnect contact system |
US5672062A (en) * | 1991-01-30 | 1997-09-30 | Labinal Components And Systems, Inc. | Electrical connectors |
US5704795A (en) * | 1991-01-30 | 1998-01-06 | Labinal Components And Systems, Inc. | Electrical connectors |
US5570504A (en) * | 1991-12-31 | 1996-11-05 | Tessera, Inc. | Multi-Layer circuit construction method and structure |
US5583321A (en) * | 1991-12-31 | 1996-12-10 | Tessera, Inc. | Multi-layer circuit construction methods and structures with customization features and components for use therein |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5640761A (en) * | 1991-12-31 | 1997-06-24 | Tessera, Inc. | Method of making multi-layer circuit |
US5558928A (en) * | 1991-12-31 | 1996-09-24 | Tessera, Inc. | Multi-layer circuit structures, methods of making same and components for use therein |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US5226823A (en) * | 1992-01-09 | 1993-07-13 | Teledyne Kinectics | Indexing mechanism for precision alignment of electrical contacts |
US5268815A (en) * | 1992-02-14 | 1993-12-07 | International Business Machines Corporation | High density, high performance memory circuit package |
US5299939A (en) * | 1992-03-05 | 1994-04-05 | International Business Machines Corporation | Spring array connector |
EP0571879A2 (en) * | 1992-05-18 | 1993-12-01 | Japan Aviation Electronics Industry, Limited | Connector which is simple in structure and in which connection and disconnection can be readily carried out |
EP0571879A3 (en) * | 1992-05-18 | 1996-06-26 | Japan Aviation Electron | Connector which is simple in structure and in which connection and disconnection can be readily carried out |
US5259767A (en) * | 1992-07-10 | 1993-11-09 | Teledyne Kinetics | Connector for a plated or soldered hole |
US5403194A (en) * | 1992-07-17 | 1995-04-04 | Shin-Etsu Polymer Co., Ltd. | Elastic interconnector |
US20100045321A1 (en) * | 1992-10-19 | 2010-02-25 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080106285A1 (en) * | 1992-10-19 | 2008-05-08 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US20090315579A1 (en) * | 1992-10-19 | 2009-12-24 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20100052715A1 (en) * | 1992-10-19 | 2010-03-04 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US7538565B1 (en) * | 1992-10-19 | 2009-05-26 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20090128176A1 (en) * | 1992-10-19 | 2009-05-21 | Brian Samuel Beaman | High density integrated circuit apparatus, test probe and methods of use thereof |
US5821763A (en) * | 1992-10-19 | 1998-10-13 | International Business Machines Corporation | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof |
US20070271781A9 (en) * | 1992-10-19 | 2007-11-29 | Beaman Brian S | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080129319A1 (en) * | 1992-10-19 | 2008-06-05 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080048690A1 (en) * | 1992-10-19 | 2008-02-28 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080132094A1 (en) * | 1992-10-19 | 2008-06-05 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080129320A1 (en) * | 1992-10-19 | 2008-06-05 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080123310A1 (en) * | 1992-10-19 | 2008-05-29 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080121879A1 (en) * | 1992-10-19 | 2008-05-29 | Brian Samuel Beaman | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080117611A1 (en) * | 1992-10-19 | 2008-05-22 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080117613A1 (en) * | 1992-10-19 | 2008-05-22 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20100045266A1 (en) * | 1992-10-19 | 2010-02-25 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20100045320A1 (en) * | 1992-10-19 | 2010-02-25 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US5635846A (en) * | 1992-10-19 | 1997-06-03 | International Business Machines Corporation | Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer |
US20080116913A1 (en) * | 1992-10-19 | 2008-05-22 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080116912A1 (en) * | 1992-10-19 | 2008-05-22 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080117612A1 (en) * | 1992-10-19 | 2008-05-22 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080048697A1 (en) * | 1992-10-19 | 2008-02-28 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080048691A1 (en) * | 1992-10-19 | 2008-02-28 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080112146A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080112144A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080111570A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080112149A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080111569A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080112148A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080047741A1 (en) * | 1992-10-19 | 2008-02-28 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080112147A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080112145A1 (en) * | 1992-10-19 | 2008-05-15 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080106283A1 (en) * | 1992-10-19 | 2008-05-08 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080106872A1 (en) * | 1992-10-19 | 2008-05-08 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080106281A1 (en) * | 1992-10-19 | 2008-05-08 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20100045317A1 (en) * | 1992-10-19 | 2010-02-25 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20100045324A1 (en) * | 1992-10-19 | 2010-02-25 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080106282A1 (en) * | 1992-10-19 | 2008-05-08 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US5531022A (en) * | 1992-10-19 | 1996-07-02 | International Business Machines Corporation | Method of forming a three dimensional high performance interconnection package |
US20080106284A1 (en) * | 1992-10-19 | 2008-05-08 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080106291A1 (en) * | 1992-10-19 | 2008-05-08 | Beaman Brian S | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080100317A1 (en) * | 1992-10-19 | 2008-05-01 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080100316A1 (en) * | 1992-10-19 | 2008-05-01 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20100045318A1 (en) * | 1992-10-19 | 2010-02-25 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US6334247B1 (en) | 1992-10-19 | 2002-01-01 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US20020014004A1 (en) * | 1992-10-19 | 2002-02-07 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US20080100318A1 (en) * | 1992-10-19 | 2008-05-01 | International Business Machines Corporation | High density integrated circuit apparatus, test probe and methods of use thereof |
US5386344A (en) * | 1993-01-26 | 1995-01-31 | International Business Machines Corporation | Flex circuit card elastomeric cable connector assembly |
US20030048108A1 (en) * | 1993-04-30 | 2003-03-13 | Beaman Brian Samuel | Structural design and processes to control probe position accuracy in a wafer test probe assembly |
US5474458A (en) * | 1993-07-13 | 1995-12-12 | Fujitsu Limited | Interconnect carriers having high-density vertical connectors and methods for making the same |
US5378160A (en) * | 1993-10-01 | 1995-01-03 | Bourns, Inc. | Compliant stacking connector for printed circuit boards |
US5466161A (en) * | 1993-10-01 | 1995-11-14 | Bourns, Inc. | Compliant stacking connector for printed circuit boards |
US20060286828A1 (en) * | 1993-11-16 | 2006-12-21 | Formfactor, Inc. | Contact Structures Comprising A Core Structure And An Overcoat |
US6818840B2 (en) | 1993-11-16 | 2004-11-16 | Formfactor, Inc. | Method for manufacturing raised electrical contact pattern of controlled geometry |
US20030199179A1 (en) * | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US7601039B2 (en) | 1993-11-16 | 2009-10-13 | Formfactor, Inc. | Microelectronic contact structure and method of making same |
US8373428B2 (en) | 1993-11-16 | 2013-02-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US20050028363A1 (en) * | 1993-11-16 | 2005-02-10 | Formfactor, Inc. | Contact structures and methods for making same |
US6049976A (en) * | 1993-11-16 | 2000-04-18 | Formfactor, Inc. | Method of mounting free-standing resilient electrical contact structures to electronic components |
US20070176619A1 (en) * | 1993-11-16 | 2007-08-02 | Formfactor, Inc. | Probe For Semiconductor Devices |
US6956174B2 (en) | 1993-11-16 | 2005-10-18 | Formfactor, Inc. | Tip structures |
US6538214B2 (en) | 1993-11-16 | 2003-03-25 | Formfactor, Inc. | Method for manufacturing raised electrical contact pattern of controlled geometry |
US6252175B1 (en) | 1993-11-16 | 2001-06-26 | Igor Y. Khandros | Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
US20030062398A1 (en) * | 1993-11-16 | 2003-04-03 | Formfactor, Inc. | Method for manufacturing raised electrical contact pattern of controlled geometry |
US6274823B1 (en) | 1993-11-16 | 2001-08-14 | Formfactor, Inc. | Interconnection substrates with resilient contact structures on both sides |
US6215670B1 (en) | 1993-11-16 | 2001-04-10 | Formfactor, Inc. | Method for manufacturing raised electrical contact pattern of controlled geometry |
US7082682B2 (en) | 1993-11-16 | 2006-08-01 | Formfactor, Inc. | Contact structures and methods for making same |
US7084656B1 (en) | 1993-11-16 | 2006-08-01 | Formfactor, Inc. | Probe for semiconductor devices |
US5455390A (en) * | 1994-02-01 | 1995-10-03 | Tessera, Inc. | Microelectronics unit mounting with multiple lead bonding |
US5794330A (en) * | 1994-02-01 | 1998-08-18 | Tessera, Inc. | Microelectronics unit mounting with multiple lead bonding |
US5953214A (en) * | 1994-03-07 | 1999-09-14 | International Business Machines Corporation | Dual substrate package assembly coupled to a conducting member |
US6046911A (en) * | 1994-03-07 | 2000-04-04 | International Business Machines Corporation | Dual substrate package assembly having dielectric member engaging contacts at only three locations |
US5838160A (en) * | 1994-04-07 | 1998-11-17 | International Business Machines Corporation | Integral rigid chip test probe |
US5959354A (en) * | 1994-07-07 | 1999-09-28 | Tessera, Inc. | Connection components with rows of lead bond sections |
US20050155223A1 (en) * | 1994-07-07 | 2005-07-21 | Tessera, Inc. | Methods of making microelectronic assemblies |
US20020148639A1 (en) * | 1994-07-07 | 2002-10-17 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
WO1996002068A1 (en) * | 1994-07-07 | 1996-01-25 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation |
US6429112B1 (en) | 1994-07-07 | 2002-08-06 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US7166914B2 (en) | 1994-07-07 | 2007-01-23 | Tessera, Inc. | Semiconductor package with heat sink |
US20030071346A1 (en) * | 1994-07-07 | 2003-04-17 | Tessera, Inc. | Flexible lead structures and methods of making same |
US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US6361959B1 (en) | 1994-07-07 | 2002-03-26 | Tessera, Inc. | Microelectronic unit forming methods and materials |
US6265765B1 (en) | 1994-07-07 | 2001-07-24 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US6194291B1 (en) * | 1994-07-07 | 2001-02-27 | Tessera, Inc. | Microelectronic assemblies with multiple leads |
US5688716A (en) * | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
US6104087A (en) * | 1994-07-07 | 2000-08-15 | Tessera, Inc. | Microelectronic assemblies with multiple leads |
US5801441A (en) * | 1994-07-07 | 1998-09-01 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US6828668B2 (en) | 1994-07-07 | 2004-12-07 | Tessera, Inc. | Flexible lead structures and methods of making same |
US6965158B2 (en) | 1994-07-07 | 2005-11-15 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US6080603A (en) * | 1994-07-07 | 2000-06-27 | Tessera, Inc. | Fixtures and methods for lead bonding and deformation |
US5830782A (en) * | 1994-07-07 | 1998-11-03 | Tessera, Inc. | Microelectronic element bonding with deformation of leads in rows |
US6635553B1 (en) | 1994-07-07 | 2003-10-21 | Iessera, Inc. | Microelectronic assemblies with multiple leads |
US5913109A (en) * | 1994-07-07 | 1999-06-15 | Tessera, Inc. | Fixtures and methods for lead bonding and deformation |
US6239386B1 (en) | 1994-07-19 | 2001-05-29 | Tessera, Inc. | Electrical connections with deformable contacts |
WO1996002959A1 (en) * | 1994-07-19 | 1996-02-01 | Tessera, Inc. | Electrical connections with deformable contacts |
US6274820B1 (en) | 1994-07-19 | 2001-08-14 | Tessera, Inc. | Electrical connections with deformable contacts |
US5590460A (en) * | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
US7200930B2 (en) | 1994-11-15 | 2007-04-10 | Formfactor, Inc. | Probe for semiconductor devices |
WO1996016440A1 (en) * | 1994-11-15 | 1996-05-30 | Formfactor, Inc. | Interconnection elements for microelectronic components |
US20060033517A1 (en) * | 1994-11-15 | 2006-02-16 | Formfactor, Inc. | Probe for semiconductor devices |
US7276919B1 (en) * | 1995-04-20 | 2007-10-02 | International Business Machines Corporation | High density integral test probe |
US8485418B2 (en) | 1995-05-26 | 2013-07-16 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
US20110057018A1 (en) * | 1995-05-26 | 2011-03-10 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
US5876215A (en) * | 1995-07-07 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Separable electrical connector assembly having a planar array of conductive protrusions |
US5810607A (en) * | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US6286208B1 (en) * | 1995-09-13 | 2001-09-11 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
WO1997011486A1 (en) * | 1995-09-22 | 1997-03-27 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
US5798286A (en) * | 1995-09-22 | 1998-08-25 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5811982A (en) * | 1995-11-27 | 1998-09-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US5994152A (en) * | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
US6030856A (en) * | 1996-06-10 | 2000-02-29 | Tessera, Inc. | Bondable compliant pads for packaging of a semiconductor chip and method therefor |
US6373141B1 (en) | 1996-06-10 | 2002-04-16 | Tessera, Inc. | Bondable compliant pads for packaging of a semiconductor chip and method therefor |
US6247228B1 (en) | 1996-08-12 | 2001-06-19 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US5859472A (en) * | 1996-09-12 | 1999-01-12 | Tessera, Inc. | Curved lead configurations |
US7282945B1 (en) * | 1996-09-13 | 2007-10-16 | International Business Machines Corporation | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof |
US6191473B1 (en) | 1996-12-13 | 2001-02-20 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
US6133072A (en) * | 1996-12-13 | 2000-10-17 | Tessera, Inc. | Microelectronic connector with planar elastomer sockets |
US6686015B2 (en) | 1996-12-13 | 2004-02-03 | Tessera, Inc. | Transferable resilient element for packaging of a semiconductor chip and method therefor |
US6706973B2 (en) | 1996-12-13 | 2004-03-16 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US6700072B2 (en) | 1996-12-13 | 2004-03-02 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US6820330B1 (en) | 1996-12-13 | 2004-11-23 | Tessera, Inc. | Method for forming a multi-layer circuit assembly |
US6978538B2 (en) | 1996-12-13 | 2005-12-27 | Tessera, Inc. | Method for making a microelectronic interposer |
US7036222B2 (en) | 1996-12-13 | 2006-05-02 | Tessera, Inc. | Method for forming a multi-layer circuit assembly |
US5937276A (en) * | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
US20040209439A1 (en) * | 1996-12-13 | 2004-10-21 | Tessera, Inc. | Method for forming a multi-layer circuit assembly |
US6541867B1 (en) | 1996-12-13 | 2003-04-01 | Tessera, Inc. | Microelectronic connector with planar elastomer sockets |
US20060040522A1 (en) * | 1996-12-13 | 2006-02-23 | Tessera, Inc. | Method for making a microelectronic interposer |
US20040045159A1 (en) * | 1996-12-13 | 2004-03-11 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US6525551B1 (en) * | 1997-05-22 | 2003-02-25 | International Business Machines Corporation | Probe structures for testing electrical interconnections to integrated circuit electronic devices |
US6188028B1 (en) | 1997-06-09 | 2001-02-13 | Tessera, Inc. | Multilayer structure with interlocking protrusions |
US6028498A (en) * | 1997-09-05 | 2000-02-22 | Hewlett-Packard Company | Low inductance interconnect having a comb-like resilient structure |
US6598290B2 (en) * | 1998-01-20 | 2003-07-29 | Micron Technology, Inc. | Method of making a spring element for use in an apparatus for attaching to a semiconductor |
US6939145B2 (en) | 1998-01-20 | 2005-09-06 | Micron Technology, Inc. | Spring element for use in an apparatus for attaching to a semiconductor and a method of making |
US7011532B2 (en) | 1998-01-20 | 2006-03-14 | Micron Technology, Inc. | Spring element for use in an apparatus for attaching to a semiconductor and a method of making |
US20050191876A1 (en) * | 1998-01-20 | 2005-09-01 | Hembree David R. | Spring element for use in an apparatus for attaching to a semiconductor and a method of making |
US6806493B1 (en) * | 1998-01-20 | 2004-10-19 | Micron Technology, Inc. | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching |
US6703640B1 (en) | 1998-01-20 | 2004-03-09 | Micron Technology, Inc. | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching |
US6078500A (en) * | 1998-05-12 | 2000-06-20 | International Business Machines Inc. | Pluggable chip scale package |
DE19856083A1 (en) * | 1998-12-04 | 2000-06-21 | Siemens Ag | Electrical connection arrangement for data communications equipment e.g. between contact pads especially of electro=optical module and terminals of circuit board |
US6176708B1 (en) | 1999-01-22 | 2001-01-23 | Shin-Etsu Polymer Co., Ltd. | Press-contact connector |
EP1022813A1 (en) * | 1999-01-22 | 2000-07-26 | Shin-Etsu Polymer Co., Ltd. | Press-contact connector |
US6434817B1 (en) | 1999-12-03 | 2002-08-20 | Delphi Technologies, Inc. | Method for joining an integrated circuit |
US6444921B1 (en) | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
US6783370B2 (en) * | 2000-02-23 | 2004-08-31 | Citizen Electronics Co., Ltd. | Connecting member for a sound generator |
US7737709B2 (en) | 2000-03-17 | 2010-06-15 | Formfactor, Inc. | Methods for planarizing a semiconductor contactor |
US20100263432A1 (en) * | 2000-03-17 | 2010-10-21 | Formfactor, Inc. | Methods for planarizing a semiconductor contactor |
US20110193583A1 (en) * | 2000-03-17 | 2011-08-11 | Formfactor, Inc. | Methods for planarizing a semiconductor contactor |
US20080048688A1 (en) * | 2000-03-17 | 2008-02-28 | Formfactor, Inc. | Methods for planarizing a semiconductor contactor |
US8427183B2 (en) | 2000-03-17 | 2013-04-23 | Formfactor, Inc. | Probe card assembly having an actuator for bending the probe substrate |
US6617865B2 (en) | 2000-05-02 | 2003-09-09 | Decision Track Llc | Compliant probe apparatus |
US6771084B2 (en) | 2000-05-02 | 2004-08-03 | Decision Track Llc | Single-sided compliant probe apparatus |
US20040246010A1 (en) * | 2000-05-02 | 2004-12-09 | Decision Track Llc (A Limited Liability Corporation Of The State Of California) | Probe tip in single-sided compliant probe apparatus |
US6426638B1 (en) | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
US20020180473A1 (en) * | 2000-05-02 | 2002-12-05 | Decision Track Llc | Single-sided compliant probe apparatus |
US20090181560A1 (en) * | 2000-09-08 | 2009-07-16 | Gabe Cherian | S&p3 cww2 connectors with wipe |
US8167626B2 (en) * | 2000-09-08 | 2012-05-01 | Gabe Cherian | Probes with wipe |
US7254889B1 (en) * | 2000-09-08 | 2007-08-14 | Gabe Cherian | Interconnection devices |
US7771210B2 (en) * | 2000-09-08 | 2010-08-10 | Gabe Cherian | Connector with wipe |
US20100255691A1 (en) * | 2000-09-08 | 2010-10-07 | Gabe Cherian | Cww3 connectors with wipe |
US6846115B1 (en) * | 2001-01-29 | 2005-01-25 | Jds Uniphase Corporation | Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor |
US6733303B2 (en) | 2001-04-26 | 2004-05-11 | Teledyne Technologies Incorporated | Low pitch, high density connector |
US6604950B2 (en) | 2001-04-26 | 2003-08-12 | Teledyne Technologies Incorporated | Low pitch, high density connector |
US20030173111A1 (en) * | 2001-06-29 | 2003-09-18 | Intel Corporation | Printed circuit board housing clamp |
US6975518B2 (en) * | 2001-06-29 | 2005-12-13 | Intel Corporation | Printed circuit board housing clamp |
US6586684B2 (en) * | 2001-06-29 | 2003-07-01 | Intel Corporation | Circuit housing clamp and method of manufacture therefor |
US20070126443A1 (en) * | 2001-07-11 | 2007-06-07 | Formfactor, Inc. | Method of Manufacturing A Probe Card |
US20080272794A1 (en) * | 2001-07-11 | 2008-11-06 | Formfactor, Inc.. | Method of manufacturing a probe card |
US7948252B2 (en) | 2001-07-11 | 2011-05-24 | Formfactor, Inc. | Multilayered probe card |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US6811408B2 (en) * | 2002-05-28 | 2004-11-02 | Molex Incorporated | Connector packaging and transport assembly |
US20030232520A1 (en) * | 2002-05-28 | 2003-12-18 | Achammer Daniel G. | Connector packaging and transport assembly |
US20050090126A1 (en) * | 2002-05-28 | 2005-04-28 | Achammer Daniel G. | Connector packaging and transport assembly |
US7134554B2 (en) | 2002-05-28 | 2006-11-14 | Molex Incorporated | Connector packaging and transport assembly |
US20070138607A1 (en) * | 2002-08-06 | 2007-06-21 | Tessera, Inc. | Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
US20040105244A1 (en) * | 2002-08-06 | 2004-06-03 | Ilyas Mohammed | Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
US20050014394A1 (en) * | 2003-05-28 | 2005-01-20 | Infineon Technologies | Contact-connection device for electronic circuit units and production method |
US6945791B2 (en) * | 2004-02-10 | 2005-09-20 | International Business Machines Corporation | Integrated circuit redistribution package |
US20050176273A1 (en) * | 2004-02-10 | 2005-08-11 | International Business Machines Corporation | Integrated circuit redistribution package |
US8531020B2 (en) | 2004-11-03 | 2013-09-10 | Tessera, Inc. | Stacked packaging improvements |
US20110042810A1 (en) * | 2004-11-03 | 2011-02-24 | Tessera, Inc. | Stacked packaging improvements |
US20090104736A1 (en) * | 2004-11-03 | 2009-04-23 | Tessera, Inc. | Stacked Packaging Improvements |
US8927337B2 (en) | 2004-11-03 | 2015-01-06 | Tessera, Inc. | Stacked packaging improvements |
US9153562B2 (en) | 2004-11-03 | 2015-10-06 | Tessera, Inc. | Stacked packaging improvements |
US9570416B2 (en) | 2004-11-03 | 2017-02-14 | Tessera, Inc. | Stacked packaging improvements |
US8525314B2 (en) | 2004-11-03 | 2013-09-03 | Tessera, Inc. | Stacked packaging improvements |
DE102004061853A1 (en) * | 2004-12-22 | 2006-03-02 | Infineon Technologies Ag | Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board |
US20070040565A1 (en) * | 2005-08-19 | 2007-02-22 | National University of Singapore, Agency For Science, Technology and Research | Compliant probes and test methodology for fine pitch wafer level devices and interconnects |
US20070075717A1 (en) * | 2005-09-14 | 2007-04-05 | Touchdown Technologies, Inc. | Lateral interposer contact design and probe card assembly |
US9984901B2 (en) | 2005-12-23 | 2018-05-29 | Tessera, Inc. | Method for making a microelectronic assembly having conductive elements |
US9218988B2 (en) | 2005-12-23 | 2015-12-22 | Tessera, Inc. | Microelectronic packages and methods therefor |
US20110165733A1 (en) * | 2005-12-23 | 2011-07-07 | Tessera, Inc. | Microelectronic packages and methods therefor |
US8728865B2 (en) | 2005-12-23 | 2014-05-20 | Tessera, Inc. | Microelectronic packages and methods therefor |
US20090179336A1 (en) * | 2006-01-30 | 2009-07-16 | Valeo Etudes Electroniques | Electronic Module and a Method of Assembling Such a Module |
US8039973B2 (en) * | 2006-01-30 | 2011-10-18 | Valeo Etudes Electroniques | Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module |
US7892954B2 (en) | 2006-03-16 | 2011-02-22 | Marco Balucani | Interconnection of electronic devices with raised leads |
US20090309098A1 (en) * | 2006-03-16 | 2009-12-17 | Eles Semiconductor Equipment S.P.A. | Interconnection of electronic devices with raised leads |
US8159076B2 (en) * | 2007-06-07 | 2012-04-17 | Commissariat A L'energie Atomique | Method of producing a via in a reconstituted substrate |
US20100171227A1 (en) * | 2007-06-07 | 2010-07-08 | Commissariat A L'energie Atomique | Method of producing a via in a reconstituted substrate |
US7982305B1 (en) * | 2008-10-20 | 2011-07-19 | Maxim Integrated Products, Inc. | Integrated circuit package including a three-dimensional fan-out / fan-in signal routing |
US8921995B1 (en) | 2008-10-20 | 2014-12-30 | Maxim Intergrated Products, Inc. | Integrated circuit package including a three-dimensional fan-out/fan-in signal routing |
US8221667B2 (en) * | 2009-03-02 | 2012-07-17 | Tsinghua University | Method for making thermal interface material |
US20100219550A1 (en) * | 2009-03-02 | 2010-09-02 | Tsinghua University | Method for making thermal interface material |
USRE50307E1 (en) | 2009-04-15 | 2025-02-18 | Kiwi Intellectual Assets Corporation | Socket structure with duplex electrical connection |
USRE49287E1 (en) | 2009-04-15 | 2022-11-08 | Kiwi Connection, Llc | Socket structure with duplex electrical connection |
US8586417B1 (en) * | 2009-09-29 | 2013-11-19 | Bae Systems Information And Electronic Systems Integration Inc. | Isostress grid array and method of fabrication thereof |
US20110074009A1 (en) * | 2009-09-29 | 2011-03-31 | Bae Systems Information & Electronic Systems Integration Inc. | Isostress grid array and method of fabrication thereof |
US8519527B2 (en) * | 2009-09-29 | 2013-08-27 | Bae Systems Information And Electronic Systems Integration Inc. | Isostress grid array and method of fabrication thereof |
US20110273857A1 (en) * | 2010-05-07 | 2011-11-10 | Oracle International Corporation | Contact springs for silicon chip packages |
US8407888B2 (en) * | 2010-05-07 | 2013-04-02 | Oracle International Corporation | Method of assembling a circuit board assembly |
US10090619B2 (en) | 2010-05-28 | 2018-10-02 | Apple Inc. | Dual orientation connector with external contacts |
US9142925B2 (en) | 2010-05-28 | 2015-09-22 | Apple Inc. | D-shaped connector |
US9871319B2 (en) | 2010-05-28 | 2018-01-16 | Apple Inc. | Dual orientation connector with external contacts |
US8461465B2 (en) | 2010-05-28 | 2013-06-11 | Apple Inc. | Conductive frame for an electrical connector |
US9478905B2 (en) | 2010-05-28 | 2016-10-25 | Apple Inc. | Dual orientation connector with external contacts |
US8517751B1 (en) | 2010-05-28 | 2013-08-27 | Apple Inc. | Dual orientation connector with external contacts and conductive frame |
US8998632B2 (en) | 2010-05-28 | 2015-04-07 | Apple Inc. | Dual orientation connector with external contacts |
US10637192B2 (en) | 2010-05-28 | 2020-04-28 | Apple Inc. | Dual orientation connector with external contacts |
US9124048B2 (en) | 2010-06-09 | 2015-09-01 | Apple Inc. | Flexible TRS connector |
WO2011160138A3 (en) * | 2010-06-18 | 2012-03-15 | Zenith Investments Llc | Dual orientation connector with side contacts |
US8931962B2 (en) | 2010-06-18 | 2015-01-13 | Apple Inc. | Dual orientation connector with side contacts |
US8882524B2 (en) | 2010-06-21 | 2014-11-11 | Apple Inc. | External contact plug connector |
US8911260B2 (en) | 2010-06-21 | 2014-12-16 | Apple Inc. | External contact plug connector |
US9123664B2 (en) | 2010-07-19 | 2015-09-01 | Tessera, Inc. | Stackable molded microelectronic packages |
US8907466B2 (en) | 2010-07-19 | 2014-12-09 | Tessera, Inc. | Stackable molded microelectronic packages |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
US9570382B2 (en) | 2010-07-19 | 2017-02-14 | Tessera, Inc. | Stackable molded microelectronic packages |
US9553076B2 (en) | 2010-07-19 | 2017-01-24 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
US10128216B2 (en) | 2010-07-19 | 2018-11-13 | Tessera, Inc. | Stackable molded microelectronic packages |
US8623706B2 (en) | 2010-11-15 | 2014-01-07 | Tessera, Inc. | Microelectronic package with terminals on dielectric mass |
US8957527B2 (en) | 2010-11-15 | 2015-02-17 | Tessera, Inc. | Microelectronic package with terminals on dielectric mass |
US8637991B2 (en) | 2010-11-15 | 2014-01-28 | Tessera, Inc. | Microelectronic package with terminals on dielectric mass |
US8659164B2 (en) | 2010-11-15 | 2014-02-25 | Tessera, Inc. | Microelectronic package with terminals on dielectric mass |
US9324681B2 (en) | 2010-12-13 | 2016-04-26 | Tessera, Inc. | Pin attachment |
US10062661B2 (en) | 2011-05-03 | 2018-08-28 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US9224717B2 (en) | 2011-05-03 | 2015-12-29 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US11424211B2 (en) | 2011-05-03 | 2022-08-23 | Tessera Llc | Package-on-package assembly with wire bonds to encapsulation surface |
US9691731B2 (en) | 2011-05-03 | 2017-06-27 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US10593643B2 (en) | 2011-05-03 | 2020-03-17 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US8618659B2 (en) | 2011-05-03 | 2013-12-31 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US9093435B2 (en) | 2011-05-03 | 2015-07-28 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US11735563B2 (en) | 2011-10-17 | 2023-08-22 | Invensas Llc | Package-on-package assembly with wire bond vias |
US9252122B2 (en) | 2011-10-17 | 2016-02-02 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US9761558B2 (en) | 2011-10-17 | 2017-09-12 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8836136B2 (en) | 2011-10-17 | 2014-09-16 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8404520B1 (en) * | 2011-10-17 | 2013-03-26 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US10756049B2 (en) | 2011-10-17 | 2020-08-25 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US11189595B2 (en) | 2011-10-17 | 2021-11-30 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US20130095610A1 (en) * | 2011-10-17 | 2013-04-18 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US9041227B2 (en) | 2011-10-17 | 2015-05-26 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US9105483B2 (en) | 2011-10-17 | 2015-08-11 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8708745B2 (en) | 2011-11-07 | 2014-04-29 | Apple Inc. | Dual orientation electronic connector |
US8647156B2 (en) | 2011-11-07 | 2014-02-11 | Apple Inc. | Plug connector with external contacts |
US9979139B2 (en) | 2011-11-07 | 2018-05-22 | Apple Inc. | Dual orientation electronic connector |
US9647398B2 (en) | 2011-11-07 | 2017-05-09 | Apple Inc. | Dual orientation electronic connector |
US9106031B2 (en) | 2011-11-07 | 2015-08-11 | Apple Inc. | Dual orientation electronic connector |
US10056719B1 (en) | 2011-11-07 | 2018-08-21 | Apple Inc. | Dual orientation electronic connector |
US8573995B2 (en) | 2011-11-07 | 2013-11-05 | Apple Inc. | Dual orientation connector with external contacts and conductive frame |
US9437984B2 (en) | 2011-11-07 | 2016-09-06 | Apple Inc. | Dual orientation electronic connector |
US10476214B2 (en) | 2011-11-07 | 2019-11-12 | Apple Inc. | Dual orientation electronic connector |
US8517766B2 (en) | 2011-11-07 | 2013-08-27 | Apple Inc. | Plug connector with external contacts |
US9112327B2 (en) | 2011-11-30 | 2015-08-18 | Apple Inc. | Audio/video connector for an electronic device |
US9842745B2 (en) | 2012-02-17 | 2017-12-12 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US9349706B2 (en) | 2012-02-24 | 2016-05-24 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US9691679B2 (en) | 2012-02-24 | 2017-06-27 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US10510659B2 (en) | 2012-05-22 | 2019-12-17 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9953914B2 (en) | 2012-05-22 | 2018-04-24 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US10170412B2 (en) | 2012-05-22 | 2019-01-01 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
US9917073B2 (en) | 2012-07-31 | 2018-03-13 | Invensas Corporation | Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package |
US10297582B2 (en) | 2012-08-03 | 2019-05-21 | Invensas Corporation | BVA interposer |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US8777666B2 (en) | 2012-09-07 | 2014-07-15 | Apple Inc. | Plug connector modules |
US9093803B2 (en) | 2012-09-07 | 2015-07-28 | Apple Inc. | Plug connector |
US20140068933A1 (en) * | 2012-09-11 | 2014-03-13 | Apple Inc. | Connectors and methods for manufacturing connectors |
US9059531B2 (en) | 2012-09-11 | 2015-06-16 | Apple Inc. | Connectors and methods for manufacturing connectors |
US9160129B2 (en) * | 2012-09-11 | 2015-10-13 | Apple Inc. | Connectors and methods for manufacturing connectors |
US9054477B2 (en) | 2012-09-11 | 2015-06-09 | Apple Inc. | Connectors and methods for manufacturing connectors |
US8975738B2 (en) | 2012-11-12 | 2015-03-10 | Invensas Corporation | Structure for microelectronic packaging with terminals on dielectric mass |
US9325097B2 (en) | 2012-11-16 | 2016-04-26 | Apple Inc. | Connector contacts with thermally conductive polymer |
US9615456B2 (en) | 2012-12-20 | 2017-04-04 | Invensas Corporation | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface |
US9095074B2 (en) | 2012-12-20 | 2015-07-28 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
US8878353B2 (en) | 2012-12-20 | 2014-11-04 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
US9350125B2 (en) | 2013-01-24 | 2016-05-24 | Apple Inc. | Reversible USB connector with compliant member to spread stress and increase contact normal force |
US9601454B2 (en) | 2013-02-01 | 2017-03-21 | Invensas Corporation | Method of forming a component having wire bonds and a stiffening layer |
US9633979B2 (en) | 2013-07-15 | 2017-04-25 | Invensas Corporation | Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
US8883563B1 (en) | 2013-07-15 | 2014-11-11 | Invensas Corporation | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
US9023691B2 (en) | 2013-07-15 | 2015-05-05 | Invensas Corporation | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
US9034696B2 (en) | 2013-07-15 | 2015-05-19 | Invensas Corporation | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation |
US10460958B2 (en) | 2013-08-07 | 2019-10-29 | Invensas Corporation | Method of manufacturing embedded packaging with preformed vias |
US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
US10008477B2 (en) | 2013-09-16 | 2018-06-26 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
US9893033B2 (en) | 2013-11-12 | 2018-02-13 | Invensas Corporation | Off substrate kinking of bond wire |
US9082753B2 (en) | 2013-11-12 | 2015-07-14 | Invensas Corporation | Severing bond wire by kinking and twisting |
US9087815B2 (en) | 2013-11-12 | 2015-07-21 | Invensas Corporation | Off substrate kinking of bond wire |
US10290613B2 (en) | 2013-11-22 | 2019-05-14 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9852969B2 (en) | 2013-11-22 | 2017-12-26 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
US9728527B2 (en) | 2013-11-22 | 2017-08-08 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
USRE49987E1 (en) | 2013-11-22 | 2024-05-28 | Invensas Llc | Multiple plated via arrays of different wire heights on a same substrate |
US10629567B2 (en) | 2013-11-22 | 2020-04-21 | Invensas Corporation | Multiple plated via arrays of different wire heights on same substrate |
US10026717B2 (en) | 2013-11-22 | 2018-07-17 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US10529636B2 (en) | 2014-01-17 | 2020-01-07 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US11990382B2 (en) | 2014-01-17 | 2024-05-21 | Adeia Semiconductor Technologies Llc | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US11404338B2 (en) | 2014-01-17 | 2022-08-02 | Invensas Corporation | Fine pitch bva using reconstituted wafer with area array accessible for testing |
US9837330B2 (en) | 2014-01-17 | 2017-12-05 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US20150263450A1 (en) * | 2014-03-13 | 2015-09-17 | Apple Inc. | Elastomeric connectors |
US9484699B2 (en) * | 2014-03-13 | 2016-11-01 | Apple Inc. | Elastomeric connectors |
US9214454B2 (en) | 2014-03-31 | 2015-12-15 | Invensas Corporation | Batch process fabrication of package-on-package microelectronic assemblies |
US9356006B2 (en) | 2014-03-31 | 2016-05-31 | Invensas Corporation | Batch process fabrication of package-on-package microelectronic assemblies |
US9812433B2 (en) | 2014-03-31 | 2017-11-07 | Invensas Corporation | Batch process fabrication of package-on-package microelectronic assemblies |
US20170005427A1 (en) * | 2014-04-18 | 2017-01-05 | Yazaki Corporation | Conductive elastic member and connector |
US9653832B2 (en) * | 2014-04-18 | 2017-05-16 | Yazaki Corporation | Conductive elastic member and connector |
US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
US9646917B2 (en) | 2014-05-29 | 2017-05-09 | Invensas Corporation | Low CTE component with wire bond interconnects |
US10475726B2 (en) | 2014-05-29 | 2019-11-12 | Invensas Corporation | Low CTE component with wire bond interconnects |
US10032647B2 (en) | 2014-05-29 | 2018-07-24 | Invensas Corporation | Low CTE component with wire bond interconnects |
US9412714B2 (en) | 2014-05-30 | 2016-08-09 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
US9947641B2 (en) | 2014-05-30 | 2018-04-17 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
US10806036B2 (en) | 2015-03-05 | 2020-10-13 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US10008469B2 (en) | 2015-04-30 | 2018-06-26 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
US9812402B2 (en) | 2015-10-12 | 2017-11-07 | Invensas Corporation | Wire bond wires for interference shielding |
US10559537B2 (en) | 2015-10-12 | 2020-02-11 | Invensas Corporation | Wire bond wires for interference shielding |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US10115678B2 (en) | 2015-10-12 | 2018-10-30 | Invensas Corporation | Wire bond wires for interference shielding |
US11462483B2 (en) | 2015-10-12 | 2022-10-04 | Invensas Llc | Wire bond wires for interference shielding |
US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US9911718B2 (en) | 2015-11-17 | 2018-03-06 | Invensas Corporation | ‘RDL-First’ packaged microelectronic device for a package-on-package device |
US10043779B2 (en) | 2015-11-17 | 2018-08-07 | Invensas Corporation | Packaged microelectronic device for a package-on-package device |
US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US10325877B2 (en) | 2015-12-30 | 2019-06-18 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US10392033B2 (en) * | 2016-07-12 | 2019-08-27 | Amsted Rail Company, Inc. | Railway truck with improved bearing adapter |
US10658302B2 (en) | 2016-07-29 | 2020-05-19 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
US20200072871A1 (en) * | 2017-03-31 | 2020-03-05 | Intel Corporation | Ultra low-cost, low leadtime, and high density space transformer for fine pitch applications |
US11637406B2 (en) * | 2017-05-18 | 2023-04-25 | Shin-Etsu Polymer Co., Ltd. | Electrical connector and method for producing same |
US20210104854A1 (en) * | 2017-05-18 | 2021-04-08 | Shin-Etsu Polymer Co., Ltd. | Electrical connector and method for producing same |
US10600739B1 (en) * | 2017-09-28 | 2020-03-24 | Hrl Laboratories, Llc | Interposer with interconnects and methods of manufacturing the same |
CN113453418A (en) * | 2021-06-28 | 2021-09-28 | 浙江挚领科技有限公司 | Heat conduction device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
PL81630B1 (en) | 1975-08-30 |
DE2119567C2 (en) | 1983-07-14 |
SE384105B (en) | 1976-04-12 |
FR2091247A5 (en) | 1972-01-14 |
DE2119567A1 (en) | 1971-11-25 |
GB1341037A (en) | 1973-12-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3795037A (en) | Electrical connector devices | |
US3638163A (en) | Connector for electrically interconnecting two parallel surfaces | |
US4453795A (en) | Cable-to-cable/component electrical pressure wafer connector assembly | |
US5140405A (en) | Semiconductor assembly utilizing elastomeric single axis conductive interconnect | |
US6042387A (en) | Connector, connector system and method of making a connector | |
TW506166B (en) | Carrier for land grid array connectors | |
US3904262A (en) | Connector for leadless integrated circuit packages | |
US3676748A (en) | Frame structures for electronic circuits | |
US3685002A (en) | Socket device for connecting circuit components with a circuit board | |
US5129833A (en) | Low-force, high-density gel connector | |
JP2894662B2 (en) | Flexible tape structure and flexible tape forming process | |
GB1443338A (en) | Method of fabricating spaced electrically-insulated through- connection in a conductive sheet | |
JP2738498B2 (en) | Electrical interconnection of supported protruding structures | |
US3118016A (en) | Conductor laminate packaging of solid-state circuits | |
US3193789A (en) | Electrical circuitry | |
US3270399A (en) | Method of fabricating semiconductor devices | |
JPH08195234A (en) | Interconnection element of circuit element and its application method | |
US3399452A (en) | Method of fabricating electrical connectors | |
US3002169A (en) | Electrical interconnection device | |
GB1429078A (en) | Component wafer for an electrical circuit packaging structure | |
JPH08287983A (en) | Elastomer connector | |
US4555152A (en) | Leadless integrated circuit connector | |
JP4459421B2 (en) | Semiconductor device | |
US3365619A (en) | Component mounting apparatus with improved terminal strip means | |
JP2002298950A (en) | Electric connector |